AOZ8831. Ultra Low Capacitance One-line Bi-directional TVS Diode. Features. General Description. Applications. Signal Line

Transcription

1 Ultra Low Capacitance One-line Bi-directional TVS Diode General Description The OZ8831 is an ultra low capacitance one-line bi-directional transient voltage suppressor diode designed to protect high speed data lines and voltage sensitive electronics from high transient conditions and SD. This device incorporates one TVS diode in an ultra-small DFN 1.0 x 0.6 package. It may be used to meet the SD immunity requirements of IC , Level 4 (±15kV air, ±15kV contact discharge). The OZ8831 comes in an RoHS compliant DFN package and is rated over a -40 C to +85 C ambient temperature range. The ultra-small 1.0 x 0.6 x 0.5mm DFN package makes it ideal for applications where PCB space is a premium. The small size and high SD protection makes it ideal for protecting voltage sensitive electronics from high transient conditions and SD. Features SD protection for high-speed data lines: xceeds: IC (SD) ±15kV (air), ±15kV (contact) Human Body Model (HBM) ±15kV Small package saves board space Ultra low capacitance: 0.35pF Low clamping voltage Low operating voltage: 5.0V Pb-free device pplications Portable handheld devices Keypads, data lines, buttons Notebook computers Digital Cameras Portable GPS MP3 players Typical pplication Pin Configuration Signal Line 1 2 Bidirection Protection of Single Line Rev. 4.0 June Page 1 of 7

2 Ordering Information Part Number mbient Temperature Range Package nvironmental OZ8831DI C to +85 C DFN 1.0 x 0.6 Green Product OS Green Products use reduced levels of Halogens, and are also RoHS compliant. Please visit for additional information. bsolute Maximum Ratings xceeding the bsolute Maximum ratings may damage the device. Parameter VP VN Peak Pulse Current (I PP ), t P = 8/20µs Peak Pulse Power, t P = 8/20µs Storage Temperature (T S ) SD Rating per IC , Contact (1) SD Rating per IC , ir (1) SD Rating per Human Body Model (2) Rating 5V 2 40W -65 C to +150 C ±15kV ±15kV ±15kV Notes: 1. IC discharge with C Discharge = 150pF, R Discharge = 330Ω. 2. Human Body Discharge per MIL-STD-883, Method 3015 C Discharge = 100pF, R Discharge = 1.5kΩ. Maximum Operating Ratings Parameter Rating Junction Temperature (T J ) -40 C to +125 C Rev. 4.0 June Page 2 of 7

3 lectrical Characteristics T = 25 C unless otherwise specified. Symbol Parameter Diagram I PP Maximum Reverse Peak Pulse Current (3,4) V CL (3,4) Clamping I PP V RWM Working Peak Reverse Voltage I PP I I R V BR P PK Maximum Reverse Leakage Current Breakdown Voltage Peak Power Dissipation V CL V BR V RWM V I R V RWM V BR V CL IT C J V R = 0 and f = 1MHz (3,4) I PP Device Device Marking V RWM (V) V BR (V) Min. I R (µ) V CL C J (pf) I PP = 1 I PP = 2 I PP = 5 Min. Typ. OZ8831DI Notes: 3. Measurements performed using a 100ns Transmission Line Pulse (TLP) system. 4. These specifications are guaranteed by design and characterization. Rev. 4.0 June Page 3 of 7

4 Typical Performance Characteristics 25 Clamping Voltage vs. Peak Pulse Current (t period = 100ns, t r = 1ns) 5 Insertion Loss (S21) vs. Frequency Clamping Voltage, VCL (V) Insertion Loss (db) Peak Pulse Current, I PP () Frequency (MHz) Normalized Input Capacitance Typical Variation of C IN vs. V R (f = 1MHz, T = 25 C) Input Voltage (V) Rev. 4.0 June Page 4 of 7

5 Package Dimensions, DFN 1.0 x 0.6 2x aaa C 5 Index rea (/4xD) 3 e aaa C 2x D 2x b CB Pin#1 ID 0.125x45 B L2 CB TOP VIW BOTTOM VIW 6 2x ccc C SID VIW 7 1 C Seating Plane RCOMMNDD LND PTTRN x UNIT: mm Dimensions in millimeters Symbols 1 b D e L aaa ccc Min Nom BSC 1.00 BSC 0.65 BSC Dimensions in inches Symbols 1 b D e L aaa ccc Min Nom Notes: 1. Dimensions and tolerancing conform to SM Y ll dimensions are in milliteters. 3. e represents the terminal grid pitch. 4. N isthe total number of terminals. 5. visual index feature must be located within the hatched area. Typical index feature (chamfer) must be located on the edge of the Pin#1 feature. 6. This dimension includes stand-off height 1 and packaged body thickness, but does not include attached feature e.g. external heatsink or chip capacitors, an internal heatslug is not considered as attached feature. 7. Dimension 1 is primarily terminal plating, and does not include small metal protrusions. Rev. 4.0 June Page 5 of 7

6 Tape and Reel Dimensions, DFN 1.0 x 0.6 Carrier Tape T D1 P1 P2 1 2 B0 K0 UNIT: mm 0 D0 P0 Option Package DFN 1.0x0.6/ DFN 1.0x0.6 (8 mm) B K D D / P0 P P2 T 0.23 ±0.02 B DFN 1.0x0.6/ DFN 1.0x0.6 (8 mm) 0.65 ± ± ± / Reel W1 G S V M N K R H UNIT: mm W Tape Size 8mm Reel Size ø178 M ø178 ±0.5 N ø55 ±1 W /-0 W H ø13.0 ±0.5 K 10.1 S 2.0 ±0.5 G N/ R N/ V N/ Leader / Trailer & Orientation TVS Unit Per Reel: 10000pcs Trailer Tape 300mm Min. Components Tape Orientation in Pocket Leader Tape 500mm Min. Rev. 4.0 June Page 6 of 7

7 Part Marking X Product Number Code Date Code LGL DISCLIMR lpha and Omega Semiconductor makes no representations or warranties with respect to the accuracy or completeness of the information provided herein and takes no liabilities for the consequences of use of such information or any product described herein. lpha and Omega Semiconductor reserves the right to make changes to such information at any time without further notice. This document does not constitute the grant of any intellectual property rights or representation of non-infringement of any third party s intellectual property rights. LIF SUPPORT POLICY LPH ND OMG SMICONDUCTOR PRODUCTS R NOT UTHORIZD FOR US S CRITICL COMPONNTS IN LIF SUPPORT DVICS OR SYSTMS. s used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Rev. 4.0 June Page 7 of 7