AOZ8212. Two-line Bi-directional TVS Diode. General Description. Features. Applications

Transcription

1 Two-line Bi-directional TVS Diode General Description The OZ8212 is a two-line bi-directional transient voltage suppressor diode designed to protect voltage sensitive electronics from high transient conditions and SD. This device incorporates two TVS diodes in a small SOT-23 package. It may be used to meet the SD immunity requirements of IC , Level 4 (± 15 kv air, ± 8 kv contact discharge). The OZ8212 comes in a SOT-23 package and is rated over a -40 C to +85 C ambient temperature range. The small SOT-23 package makes the OZ8212 ideal for applications where PCB space is a premium. The small size and high SD protection is ideal for protecting voltage sensitive electronics from high transient conditions and SD. pplications Portable handheld devices Keypads, data lines, buttons Notebook computers Digital Cameras Portable GPS MP3 players Features SD protection for high-speed data lines: OZ8212CI-05L xceeds: IC (SD) ± 30 kv (air), ± 30 kv (contact) Human Body Model (HBM) ± 30 kv IC (Lightning) 9 (8/20 µs) OZ8212CI-12 xceeds: IC (SD) ± 30 kv (air), ± 30 kv (contact) Human Body Model (HBM) ± 30 kv IC (Lightning) 5 (8/20 µs) OZ8212CI-24 xceeds: IC (SD) ± 18 kv (air), ± 15 kv (contact) Human Body Model (HBM) ± 15 kv IC (Lightning) 2.5 (8/20 µs) Small package saves board space IC (FT) ± 40 Low insertion loss Low clamping voltage Low operating voltages: 5 V, 12 V, 24 V Typical pplication Pin Configuration I/O1 I/O SOT-23 (Top View) Bidirection Protection of Two Lines Rev. 1.1 March Page 1 of 6

2 Ordering Information Part Number mbient Temperature Range Package nvironmental OZ8212CI-05L OZ8212CI-12 OZ8212CI C to +85 C SOT-23 Green Product OS Green Products use reduced levels of Halogens, and are also RoHS compliant. Please visit for additional information. bsolute Maximum Ratings xceeding the bsolute Maximum ratings may damage the device. Parameter OZ8212CI-05L OZ8212CI-12 OZ8212CI-24 Peak Pulse Current, t P = 8/20 µs Peak Pulse Power, t P = 8/20 µs 125 W 100 W 100 W Storage Temperature (T S ) -65 C to +150 C -65 C to +150 C -65 C to +150 C SD Rating per IC , Contact (1) ± 30 kv ± 30 kv ± 15 kv SD Rating per IC , ir (1) ± 30 kv ± 30 kv ± 18 kv SD Rating per Human Body Model (2) ± 30 kv ± 30 kv ± 15 kv Notes: 1. IC discharge with C Discharge = 150 pf, R Discharge = 330 Ω. 2. Human Body Discharge per MIL-STD-883, Method 3015 C Discharge = 100 pf, R Discharge = 1.5 kω. Maximum Operating Ratings Parameter Rating Junction Temperature (T J ) -4 0 C to +85 C lectrical Characteristics T = 25 C unless otherwise specified. Symbol Parameter Symbol Parameter I PP Maximum Reverse Peak Pulse Current I F Forward Current V CL Clamping I PP V F Forward Voltage V RWM Working Peak Reverse Voltage P pk Peak Power Dissipation I R Maximum Reverse Leakage Current C J V R = 0 and f = 1 MHz V BR Breakdown Voltage lectrical Characteristics T = 25 C unless otherwise noted. Device Device Marking V RWM (V) V BR (V) 5m I R (µ) I PP = 1 V CL I PP = 10 C J (pf) Typ. C J (pf) OZ8212CI-05L H OZ8212CI-12 HC OZ8212CI-24 HT Rev. 1.1 March Page 2 of 6

3 Typical Performance Characteristics 50 Clamping Voltage vs. Peak Pulse Current (tperiod = 100ns, tr = 1ns) SD Clamping 8kV Contact per IC Clamping Voltage, VCL (V) V 12V 5V Peak Pulse Current, I PP () Note: Data was taken with a 10X attenuator Rev. 1.1 March Page 3 of 6

4 Package Dimensions, SOT-23, 3L D e c L3 (L1) L Optional e1 3x b θ1 L2 2 Seating Plane Gauge Plane Seating Plane 1 3x RCOMMNDD LND PTTRN UNIT: mm Dimensions in millimeters Symbols 1 2 b c D e e1 L L1 L2 L Nom BSC 1.90 BSC RF Dimensions in inches Symbols 1 2 b c D e e1 L Nom BSC BSC L1 L RF L θ1 0 8 θ1 0 8 Notes: 1. ll dimensions are in millimeters. 2. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. 3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.25mm per end. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side. 4. The package top may be smaller than the package bottom. Dimensions D and are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 5. Follow JDC TO-236H. Rev. 1.1 March Page 4 of 6

5 Tape and Reel Dimensions, SOT-23, 3L Tape P2 P1 D0 D1 K0 B0 2 P0 0 Unit: mm Feeding Direction Package 0 B0 K0 D0 D1 2 P0 P1 P2 T SOT23-5/6L LP ± / ± ± ± ±0.03 Reel W1 S R M N K J H Unit: mm Tape Size Reel Size M N W1 H S K R J 8mm ø177.8 ø / / Min ±0.1 Leader/Trailer and Orientation Trailer Tape 300mm min. Components Tape Orientation in Pocket Leader Tape 500mm min. Rev. 1.1 March Page 5 of 6

6 Part Marking Part Number Code 11 ssembly Lot Code Option Code Week Code This datasheet contains preliminary data; supplementary data may be published at a later date. lpha & Omega Semiconductor reserves the right to make changes at any time without notice. LIF SUPPORT POLICY LPH & OMG SMICONDUCTOR PRODUCTS R NOT UTHORIZD FOR US S CRITICL COMPONNTS IN LIF SUPPORT DVICS OR SYSTMS. s used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Rev. 1.1 March Page 6 of 6