CSPEMI606/608. LCD EMI Filter Array with ESD Protection
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- Grant McDowell
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1 LD EMI Filter rray with ESD Protection Description The SPEMI606 and SPEMI608 are EMI filter arrays with ESD protection, which integrate six and eight Pi filters ( R ), respectively. The has component values of 15 pf pf. These devices include ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±15 kv, beyond the maximum requirement of the IE international standard. Using the MIL STD 883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30 kv. These devices are particularly well suited for portable electronics (e.g. wireless handsets, PDs, notebook computers) because of their small package format and easy to use pin assignments. They are ideal for EMI filtering and protecting data lines from ESD for the LD display in clamshell handsets. The SPEMI606 and SPEMI608 are available in space saving, low profile chip scale packages. Features Six and Eight hannels of EMI Filtering ±15 kv ESD Protection on each hannel (IE Level 4, ontact Discharge) ±30 kv ESD Protection on each hannel (HBM) Better than 30 db of ttenuation at 1 GHz to 3 GHz 15 Bump, mm x mm Footprint hip Scale Package (SPEMI606) 20 Bump, mm x mm Footprint hip Scale Package (SPEMI608) hip Scale Package Features Extremely Low Lead Inductance for Optimum Filter and ESD Performance These Devices are Pb Free and are RoHS ompliant pplications LD Data Lines in lamshell Wireless Handsets EMI Filtering & ESD Protection for High Speed I/O Data Ports Wireless Handsets / ell Phones Notebook omputers PDs / Handheld Ps EMI Filtering for High Speed Data Lines WLSP15 SE 567BS 606 SPEMI Bump SP MRKING DIGRM ORDERING INFORMTION Device Package Shipping SPEMI606G SPEMI608G 606 = SPEMI606 EMI608 = SPEMI608 SP 15 (Pb Free) SP 20 (Pb Free) WLSP20 SE 567BZ EMI608 SPEMI Bump SP 3500/Tape & Reel 3500/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Semiconductor omponents Industries, LL, 2011 May, 2011 Rev. 4 1 Publication Order Number: /D
2 ELETRIL SHEMTI FILTERn* pf 15 pf FILTERn* GND (Pins B1 Bn) 1 of 6 or 8 EMI Filtering + ESD hannels *See Package/Pinout Diagrams for expanded pin information. PKGE / PINOUT DIGRMS Orientation Marking + Top View (Bumps Down View) Bottom View (Bumps Up View) Orientation Marking + B Orientation Marking SPEMI606 SP Package B1 2 3 B B B Orientation Marking SPEMI608 SP Package B B2 4 5 B3 6 7 B4 8 Table 1. PIN DESRIPTIONS Pin(s) Pin(s) SPEMI606 SPEMI608 Name Description SPEMI606 SPEMI608 Name Description 1 1 FILTER1 Filter hannel FILTER1 Filter hannel FILTER2 Filter hannel FILTER2 Filter hannel FILTER3 Filter hannel FILTER3 Filter hannel FILTER4 Filter hannel FILTER4 Filter hannel FILTER5 Filter hannel FILTER5 Filter hannel FILTER6 Filter hannel FILTER6 Filter hannel 6 7 FILTER7 Filter hannel 7 7 FILTER7 Filter hannel 7 8 FILTER8 Filter hannel 8 8 FILTER8 Filter hannel 8 B1 B3 B1 B4 GND Device Ground 2
3 SPEIFITIONS Table 2. BSOLUTE MXIMUM RTINGS Parameter Rating Units Storage Temperature Range 65 to +150 D Power per Resistor 100 mw D Package Power Rating 500 mw Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating onditions is not implied. Extended exposure to stresses above the Recommended Operating onditions may affect device reliability. Table 3. STNDRD OPERTING ONDITIONS Parameter Rating Units Operating Temperature Range 40 to +85 Table 4. ELETRIL OPERTING HRTERISTIS (Note 1) Symbol Parameter onditions Min Typ Max Units R Resistance apacitance t 2.5 V D, 1 MHz, 30 mv pf V DIODE Diode Standoff Voltage I DIODE = V I LEK Diode Leakage urrent (reverse bias) V DIODE = 3.3 V 200 n V SIG Signal Voltage Positive lamp Negative lamp I LOD = 10 m V V ESD In system ESD Withstand Voltage a) Human Body Model, MIL STD 883, Method 3015 b) ontact Discharge per IE Level 4 (Notes 2 and 4) ±30 ±15 kv V L f lamping Voltage during ESD Discharge MIL STD 883 (Method 3015), 8 kv Positive Transients Negative Transients ut off Frequency Z SOURE = 50, Z LOD = 50 (Notes 2, 3 and 4) R = 100, = 15 pf 120 MHz 1. T = 25 unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. 3. lamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin 1, then clamping voltage is measured at Pin Unused pins are left open. V 3
4 PERFORMNE INFORMTION Typical Filter Performance (T = 25, D Bias = 0 V, 50 Environment) Figure 1. Insertion Loss vs. Frequency (1 1 to GND B1) Figure 2. Insertion Loss vs. Frequency (2 2 to GND B1) 4
5 PERFORMNE INFORMTION (ont d) Typical Filter Performance (T = 25, D Bias = 0 V, 50 Environment) Figure 3. Insertion Loss vs. Frequency (3 3 to GND B2) Figure 4. Insertion Loss vs. Frequency (4 4 to GND B2) 5
6 PERFORMNE INFORMTION (ont d) Typical Filter Performance (T = 25, D Bias = 0 V, 50 Environment) Figure 5. Insertion Loss vs. Frequency (5 5 to GND B3) Figure 6. Insertion Loss vs. Frequency (6 6 to GND B3) 6
7 PERFORMNE INFORMTION (ont d) Typical Filter Performance (T = 25, D Bias = 0 V, 50 Environment) Figure 7. Insertion Loss vs. Frequency (7 7 to GND B4, SPEMI608 Only) Figure 8. Insertion Loss vs. Frequency (8 8 to GND B4, SPEMI608 Only) 7
8 PERFORMNE INFORMTION (ont d) Figure 9. Filter apacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5 VD and 25 ) 8
9 PPLITION INFORMTION Parameter Value Pad Size on PB mm Pad Shape Round Pad Definition Non Solder Mask defined pads Solder Mask Opening mm Round Solder Stencil Thickness mm mm Solder Stencil perture Opening (laser cut, 5% tapered walls) mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No lean Pad Protective Finish OSP (Entek u Plus 106) Tolerance Edge To orner Ball ±50 m Solder Ball Side oplanarity ±20 m Maximum Dwell Time bove Liquidous 60 seconds Maximum Soldering Temperature for Lead free Devices using a Lead free Solder Paste 260 Non Solder Mask Defined Pad mm DI. Solder Stencil Opening mm DI. Solder Mask Opening mm DI. Figure 10. Recommended Non Solder Mask Defined Pad Illustration 250 Temperature ( ) :00.0 2:00.0 3:00.0 4:00.0 Time (minutes) Figure 11. Lead free (Sngu) Solder Ball Reflow Profile 9
10 PKGE DIMENSIONS WLSP15, 2.96x1.33 SE 567BS 01 ISSUE O PIN 1 REFERENE 2X 2X D TOP VIEW B E 2 NOTES: 1. DIMENSIONING ND TOLERNING PER SME Y14.5M, ONTROLLING DIMENSION: MILLIMETERS. 3. OPLNRITY PPLIES TO SPHERIL ROWNS OF SOLDER BLLS. MILLIMETERS DIM MIN MX REF b D 2.96 BS E 1.33 BS ed 0.50 BS ee BS NOTE SIDE VIEW SETING PLNE 1 REOMMENDED SOLDERING FOOTPRINT* PKGE OUTLINE 15X b 0.05 B 0.03 B ed/2 ed BOTTOM VIEW ee PITH 15X 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 10
11 PKGE DIMENSIONS WLSP20, 4.00x1.46 SE 567BZ 01 ISSUE O PIN 1 REFERENE 2X 2X ÈÈ D TOP VIEW 2 B E NOTES: 1. DIMENSIONING ND TOLERNING PER SME Y14.5M, ONTROLLING DIMENSION: MILLIMETERS. 3. OPLNRITY PPLIES TO SPHERIL ROWNS OF SOLDER BLLS. MILLIMETERS DIM MIN MX REF b D 4.00 BS E 1.46 BS ed 0.50 BS ee BS NOTE SIDE VIEW SETING PLNE ed/2 20X b 0.05 B 0.03 B ed ee BOTTOM VIEW 1 REOMMENDED SOLDERING FOOTPRINT* PKGE OUTLINE PITH 20X 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor omponents Industries, LL (SILL). SILL reserves the right to make changes without further notice to any products herein. SILL makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SILL assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SILL data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SILL does not convey any license under its patent rights nor the rights of others. SILL products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SILL product could create a situation where personal injury or death may occur. Should Buyer purchase or use SILL products for any such unintended or unauthorized application, Buyer shall indemnify and hold SILL and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SILL was negligent regarding the design or manufacture of the part. SILL is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLITION ORDERING INFORMTION LITERTURE FULFILLMENT: Literature Distribution enter for ON Semiconductor P.O. Box 5163, Denver, olorado US Phone: or Toll Free US/anada Fax: or Toll Free US/anada orderlit@onsemi.com N. merican Technical Support: Toll Free US/anada Europe, Middle East and frica Technical Support: Phone: Japan ustomer Focus enter Phone: ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative /D
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More informationIs Now Part of To learn more about ON Semiconductor, please visit our website at
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC
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