LCD & Camera EMI Filter Array with ESD Protection

Transcription

1 LD & amera EMI Filter rray with ESD Protection PRELIMINRY Features Six and eight channels of EMI filtering Utilizes Praetorian inductor-based design technology for true L- filter implementation OptiGuard coating for improved reliability ±15kV ESD protection on each channel (IE Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Better than 40dB of attenuation at 1GHz hip Scale Package features extremely low lead inductance for optimum filter and ESD performance 15-bump, 2.960mm x 1.330mm footprint hip Scale Package (-06S/P) 20-bump, 4.000mm x 1.458mm footprint hip Scale Package (-08S/P) Lead-free version available pplications LD and amera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDs, etc. EMI filtering for data phones in cell phones, PDs or notebook computerswireless handsets / cell phones Wireless Handsets Handheld Ps/PDs LD and camera modules Product Description The comprises a family of inductor-capacitor (L-) based EMI filter arrays with integrated ESD protection in SP form factor. The -06 and -08 are configured in 6 and 8 channel formats respectively. Each EMI filter channel of the is implemented as a 5-pole L- filter where the component values are 15pF-17nH-15pF-17nF-15pF. The 's roll-off frequency at -10dB attenuation is 300MHz and can be used in applications where the data rates are as high as 120Mbps while providing greater than 35dB over the 800MHz to 2.7GHz frequency range. The parts integrate ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±15kV, beyond the Level 4 requirement of the IE international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. This device is particularly well suited for portable electronics (e.g. wireless handsets, PDs) because of its small package format and easy-to-use pin assignments. In particular, the is ideal for EMI filtering and protecting data and control lines for the LD display and camera interface in wireless handsets. The incorporates OptiGuard which results in improved reliability at assembly. The is available in a space saving, low profile hip Scale Package with optional lead-free finishing.. Electrical Schematic FILTERn* L1 L2 FILTERn* (Pins B1-Bn) 1 of n EMI Filtering + ESD hannels (n = 6 for -06, 8 for -08) * See Package/Pinout Diagram for expanded pin information. 01/27/ N. Mcarthy Blvd., Milpitas, Tel: Fax:

2 Orientation Marking (see note 2) Orientation Marking (see note 2) B B 1 1 TOP VIEW (Bumps Down View) N N508 PKGE / PINOUT DIGRMS Orientation Marking Orientation Marking FILTER1 1 FILTER1 B1 FILTER1 FILTER1 FILTER2 2 FILTER2 2 FILTER2 FILTER2 FILTER3 3 FILTER3 3 B2 FILTER3 FILTER3-06S/P 15-Bump SP Package FILTER4 4 FILTER4-08S/P 20-Bump SP Package Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. 1 B1 BOTTOM VIEW (Bumps Up View) B2 FILTER4 4 FILTER4 4 FILTER5 5 FILTER5 5 B3 FILTER5 5 FILTER5 5 FILTER6 6 FILTER6 6 B3 FILTER6 6 FILTER6 6 FILTER7 7 FILTER7 7 B4 FILTER8 8 FILTER8 8 Ordering Information PIN DESRIPTIONS NME DESRIPTION NME DESRIPTION PIN(s) PIN(s) NME DESRIPTION PIN(s) PIN(s) NME DESRIPTION FILTER1 Filter hannel FILTER1 Filter hannel FILTER2 Filter hannel FILTER2 Filter hannel FILTER3 Filter hannel FILTER3 Filter hannel FILTER4 Filter hannel FILTER4 Filter hannel FILTER5 Filter hannel FILTER5 Filter hannel FILTER6 Filter hannel FILTER6 Filter hannel 6-7 FILTER7 Filter hannel 7-7 FILTER7 Filter hannel 7-8 FILTER8 Filter hannel 8-8 FILTER8 Filter hannel 8 B1-B3 B1-B4 Device Ground PRT NUMBERING INFORMTION Standard Finish Lead-free Finish 2 Ordering Part Ordering Part Bumps Package Number 1 Part Marking Number 1 Part Marking 15 SP -06S N506-06P N SP -08S N508-08P N508 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark N. Mcarthy Blvd., Milpitas, Tel: Fax: /27/05

3 Specifications BSOLUTE MXIMUM RTINGS PRMETER RTING UNITS Storage Temperature Range -65 to +150 D Power per Resistor 100 mw D Package Power Rating 500 mw STNDRD OPERTING ONDITIONS PRMETER RTING UNITS Operating Temperature Range -40 to +85 ELETRIL OPERTING HRTERISTIS (NOTE 1) SYMBOL PRMETER ONDITIONS MIN TYP MX UNITS L TOT Total hannel Inductance (L 1 + L 2 ) 34 nh L 1, L 2 Inductance 17 nh TOT Total hannel apcitance ( ) t 2.5V D, 1MHz, 30mV 1, 2, 3 apacitance t 2.5V D, 1MHz, 30mV pf pf f f ut-off Frequency Z SOURE =50Ω, Z LOD =50Ω 137 MHz Roll-off Frequency at -10dB ttenuation Z SOURE =50Ω, Z LOD =50Ω 300 MHz V DIODE Diode Standoff Voltage I DIODE =10µ 5.5 V I LEK Diode Leakage urrent (reverse bias) V DIODE =+3.3V 100 n V SIG Signal Voltage Positive lamp Negative lamp I LOD = 10m V V V ESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) ontact Discharge per IE Level 4 Notes 2,4 and 5 ±30 ±15 kv kv V L lamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3,4 and V V Note 1: T =25 unless otherwise specified. Note 2: ESD applied to input and output pins with respect to, one at a time. Note 3: lamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin, then clamping voltage is measured at Pin 1. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization. 01/27/ N. Mcarthy Blvd., Milpitas, Tel: Fax:

4 Performance Information Typical Filter Performance (T =25, D Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (-1 to B1) Figure 2. Filter apacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VD and 25 ) N. Mcarthy Blvd., Milpitas, Tel: Fax: /27/05

5 pplication Information Refer to pplication Note P-217, "The hip Scale Package", for a detailed description of hip Scale Packages offered by alifornia Micro Devices. PRINTED IRUIT BORD REOMMENDTIONS PRMETER VLUE Pad Size on PB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125mm mm Solder Stencil perture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No lean Pad Protective Finish OSP (Entek u Plus 106) Tolerance Edge To orner Ball +50µm Solder Ball Side oplanarity +20µm Maximum Dwell Time bove Liquidous (183 ) 60 seconds Soldering Maximum Temperature 260 Non-Solder Mask Defined Pad 0.275mm DI. Solder Stencil Opening 0.330mm DI. Solder Mask Opening 0.325mm DI. Figure 3. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature ( ) Figure 4. Eutectic (SnPb) Solder Ball Reflow Profile 0 1:00.0 2:00.0 3:00.0 4:00.0 Time (minutes) Figure 5. Lead-free (Sngu) Solder Ball Reflow Profile 01/27/ N. Mcarthy Blvd., Milpitas, Tel: Fax:

6 Mechanical Details devices are supplied in custom hip Scale Packages (SP). Dimensions for each of these devices are presented in the following pages. Mechanical Package Diagrams -06S/P Mechanical Specifications The package dimensions for the -06S/P are presented below. 1 BOTTOM VIEW B2 B1 B4 B3 SIDE VIEW Package Dim PKGE DIMENSIONS ustom SP Bumps 15 Millimeters Inches Min Nom Max Min Nom Max B B B B D D # per tape and 3500 pieces reel ontrolling dimension: millimeters B DI. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/g/u (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS Package Dimensions for -06S/P hip Scale Package 2 D1 D N. Mcarthy Blvd., Milpitas, Tel: Fax: /27/05

7 Mechanical Details (cont d) -08S/P Mechanical Specifications The package dimensions for the -08S/P are presented below. 1 Mechanical Package Diagrams B1 BOTTOM VIEW B2 B4 B3 SIDE VIEW Package Dim PKGE DIMENSIONS ustom SP Bumps 20 Millimeters Inches Min Nom Max Min Nom Max B B B B D D # per tape and 3500 pieces reel ontrolling dimension: millimeters B DI. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/g/u (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS Package Dimensions for -08S/P hip Scale Package 2 D1 D2 2 01/27/ N. Mcarthy Blvd., Milpitas, Tel: Fax:

8 Mechanical Details (cont d) SP Tape and Reel Specifications PRT NUMBER HIP SIZE (mm) POKET SIZE (mm) B 0 X 0 X K 0 TPE WIDTH W REEL DIMETER QTY PER REEL P 0 P X 1.33 X X 1.45 X mm 178mm (7") mm 4mm X 1.46 X X 1.57 X mm 178mm (7") mm 4mm P o 10 Pitches umulative Tolerance On Tape ±0.2 mm Top over Tape o W B o K o For Tape Feeder Reference Only including Draft. oncentric round B. Embossment P 1 User Direction of Feed enter Lines of avity Figure 6. Tape and Reel Mechanical Data N. Mcarthy Blvd., Milpitas, Tel: Fax: /27/05