APR-5000-DZ Series User Guide

Transcription

1 APR-5000-DZ Series User Guide Page 1 of , Rev. C

2 Copyright 2007 OK International, Inc Monarch Street Garden Grove, CA Visit us on the web at PROPRIETARY NOTICE: This document contains proprietary data of OK International, Inc. The receipt or possession of this document does not convey any rights to reproduce it, disclose its contents, or to manufacture the concepts and details disclosed by this document. This document may not be copied or disclosed in whole or in part to anyone without written permission of an officer of OK International, Inc. All rights reserved. Page 2 of , Rev. C

3 CONTENTS PREFACE... 5 SPECIFICATIONS... 8 INTRODUCTION AND GENERAL OVERVIEW SYSTEM FEATURES AND ACCESSORIES SET-UP PROCEDURES APR-5000-DZ Series Main System Controller and Software Setup Power-up Sequence SOFTWARE OPERATION Home Page File Export Import Edit...25 Cut Copy Copy Window Save Window Image Paste Curve Options Temp/Time Line Options Profile Options View Profile Time Display Data Table Display Main Control Buttons Process Setup New Removal Process New Placement Process Manual Process Run System Setup Security Software Languages Profile Camera TC Temperature Calibrations Closed loop options Calibration Test Airflow INSTALLATION GUIDELINES Reflow Airflow Calibration Head Alignment Camera-Centering Fixture Reflow Nozzle Centering Page 3 of , Rev. C

4 Reflow Nozzle Leveling Optical Calibration DEVELOPING PROFILES TAPE FEEDERS & THERMAL NOZZLES NOZZLES, VACUUM PICKUP NOZZLE & ACCESORIES CALIBRATION KIT & SPARE PARTS SITE PREPARATION TROUBLESHOOTING GUIDE & ERROR MESSAGES WARRANTY AND SERVICE Page 4 of , Rev. C

5 PREFACE SAFETY AND REGULATORY INFORMATION WARNING TO PREVENT FIRE OR SHOCK HAZARD, DO NOT EXPOSE SYSTEM TO MOISTURE. TO PREVENT FIRE OR SHOCK HAZARD, DO NOT USE FLAMMABLE SOLVENTS NEAR OR ON THE SYSTEM WHILE CONNECTED TO A POWER SOURCE. TO PREVENT POSSIBILITY OF INJURY OR DAMAGE TO THE SYSTEM, DO NOT OPERATE WITH ANY COVERS OR PANELS REMOVED. CHANGES OR MODIFICATIONS MADE TO THIS PRODUCT WITHOUT EXPRESS APPROVAL FROM OK INTERNATIONAL COULD VOID THE USERS AUTHORITY TO OPERATE THE EQUIPMENT. Read and understand the entire Operator s Manual before installation or operation of the APR-5000-DZ. Heed all warnings on the system and in the operating instructions. Vor Installation oder Inbetriebnahme des APR-5000-DZ muss die gesamte Bedienungsanleitung gelesen und verstanden worden sein. Beachten Sie alle Warnhinweise am System selbst, sowie die Sicherheitshinweise in diesem Handbuch. Use of the APR-5000-DZ is intended only for the removal and placement of electronic components on to printed circuit boards by properly trained personnel. If you are not familiar with the proper and safe operation of the APR-5000-DZ, do not operate it until proper training has been obtained. Das APR-5000-DZ darf nur zum Entlöten und Platzieren elektronischer Komponenten auf Leiterplatten durch entsprechend geschultes Personal eingesetzt werden. Wenn Sie mit dem ordnungsgemäßen und sicheren Betrieb des Systems nicht vertraut sind, sollten Sie zunächst in die Funktionen eingewiesen worden sein. The unit should be operated only from the type of power source indicated on the serial number label. Schließen Sie das Gerät nur an die Stromversorgung an, die auf dem Typenschild angegeben ist. Use only the supplied power cord. Avoid damage to the power cord. If damage should occur, replace it with the approved OK International replacement power cord. Page 5 of , Rev. C

6 Verwenden Sie nur die zum Lieferumfang gehörenden Netzkabel, und achten Sie darauf, dass Sie diese nicht beschädigen. Ersetzen Sie beschädigte Kabel durch Originalkabel des Lieferanten. This CAUTION symbol on the equipment refers the user to the user guide for additional information. This symbol appears next to the relevant information in the manual. Das Symbol Caution (Vorsicht) am Gerät verweist auf weitere Informationen im Handbuch. Dieses Symbol erscheint neben den entsprechenden Hinweisen in der Bedienungsanleitung. This HOT symbol on the equipment warns the user of a hot surface and potential injury if touched. Please refer to the Operator s Manual for additional information. This symbol appears next to the relevant information in the manual. Das Symbol Hot (Heiß) am Gerät warnt vor heißen Oberflächen und möglichen Personenverletzungen. Weitere Informationen finden Sie in der Bedienungsanleitung, in der die Hinweise entsprechend gekennzeichnet sind. This HEAVY LIFTING symbol on the packaging warns the user to team lift the APR DZ during removal from packaging and installation on the workbench. Please refer to the user guide for additional information. This symbol appears next to the relevant information in the manual. Mit dem Symbol Heavy lifting (schwer) auf der Verpackung wird der Bediener darauf aufmerksam gemacht, dass das Gerät nur von mehreren Personen aus der Verpackung genommen und an dem Arbeitsplatz installiert werden sollte. Weitere Informationen finden Sie in der Bedienungsanleitung, in der die Hinweise entsprechend gekennzeichnet sind. Page 6 of , Rev. C

7 Other Safety Tips Unplug the unit before cleaning. Clean the exterior of the system with a damp cloth. Do not use solvent-based cleaners. Slots and openings in the system are provided for ventilation and to ensure reliable operation and protection from overheating. The openings should never be blocked or covered. Do not overload power outlets and extension cords. This can result in fire or electric shock. SAFETY AND EMC INFORMATION Declaration of Conformity We declare our sole responsibility that the product APR-5000-DZ to which this declaration relates, is in conformity with the following standards and bears a CE mark: EN :2001 (2 nd Edition) + A1:92 + A1:95 Safety Standards The APR-5000-DZ is in conformity with international safety requirements and bears the following safety marks: cetlus EMC Standards Europe EN : 1995 EN : 1995 EN 61326: A1, 1998 North America 47 CFR parts 15 (FCC Class A), meets Class A limits Federal Communications Commission This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in an industrial installation. This equipment can generate, use and radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the system off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio / TV technician for help. Page 7 of , Rev. C

8 SPECIFICATIONS APR-5000-DZ / APR-5000-DZ-TAB Input Voltage VAC, 50/60Hz, 20 Amp Single Phase Power Consumption System Total 2600W Pre-Heater 1800W Inner Zone 900W Outer Zone 1800W Reflow Heater 550W Temperature Control Type Closed-Loop Control (RTD Sensors) Maximum Source Temperature Reflow Head 400 C (752 F) Pre-Heater (Inner/Outer) 350 C (662 F) Airflow Control Pre-Set to 8, 16 & 22 l/min Supply Self-Contained Pump Nitrogen Input Standard Feature (requires 65 psi or 4.6 bar) Component Handling Maximum Size 1.4" x 1.4" (35mm x 35mm) Minimum Size 0.020" x 0.010" (0.51mm x 0.25mm) Maximum Weight 1.94 oz (55 g) PCB Handling Capability Maximum Size 15" x 9" (381mm x 229mm) Maximum Thickness 0.25" (6mm) Vision Rework Area Optional DZ large rail kit Aligned inner preheater and reflow heater XY Table Maximum Field of View System Dimensions W x D x H Weight System Warranty 9" x 12" (229mm x 305mm) 12" x 12" (305mm x 305mm) w/ APR-LRK Large Rail Kit 8" x 8" (203 mm x 203 mm) Not suggested without XY table Std on APR-5000-DZ-TAB Optional on APR-5000-DZ 1.4" x 1.4" (35mm x 35mm) 19" x 30" x 30" (483mm x 762mm x 762mm) 130lbs (60kg) One-year parts & labor 90 days heaters & lamps Page 8 of , Rev. C

9 Basic Controller Operation Specification APR-CNTRL Base Unit Input Voltage 115VAC/230VAC, 50/60Hz Base Unit Power Consumption 300 watts Standards CE Mark, ETL Warranty 1 Year Video Display Resolution Minimum Requirement 1280 x 1024 System Part Numbers Part Number Item Description APR-5000-DZ-xx VAC Array Package Rework System with controller APR-5000-DZ-xxTAB VAC Array Package Rework System with controller APR-CNTRL-xx Array Package Rework Controller APR-TAB APR-5000, XY Table APR-LRK PCB Large Rail Kit (14 x14, 356mm x 356mm) Where -xx stands for multi-language Environmental Conditions (all models) Suitable for indoor use only at altitudes not exceeding 6500 ft (2km) All systems must be grounded Maximum relative humidity of 80% at 88 F (31 C) decreasing linearly to 50% at 104 F (40 C) Temperature range of 41 F (5 C) to 104 F (40 C) Main supply voltage fluctuations not to exceed ±10% of the nominal voltage Pollution degree 2 per IEC 644 Insulation category II Page 9 of , Rev. C

10 INTRODUCTION AND GENERAL OVERVIEW Thank you for your purchase of an APR-5000-DZ Array Package Rework System. Each unit has been inspected thoroughly by OK International prior to shipment, and with proper maintenance will give you years of reliable performance. This user guide is a valuable resource. It explains the systems options, features, specifications and the correct operation of your APR-5000-DZ Array Package Rework System. If any problems should occur during setup or operation of your system, contact OK International s Technical Service Department or you may contact your local Representative or you may us at support@okintl.com. The APR-5000-DZ Array Package Rework System provides both accurate component placement and specifically tailored reflow profiles (through OK International patented single component Micro Oven ) in one user friendly, single platform rework system. The challenges of Array Package Rework, and the inability to easily inspect placement accuracy (with BGAs in particular), call for a solution that allows for simultaneous viewing of PC board pads and component pads or balls for accurate placement. The APR-5000-DZ fills this need with quick, accurate placement through the use of an optical system employing dual image overlay technology. The image of the BGA solder balls is overlaid with that of the PC board pattern. The image is viewed on the computer monitor and the micrometers permit fine X, Y and Theta adjustment at up to 27X magnification. Finally, the part is placed and the vacuum is released automatically. After accurate component placement is achieved, the vacuum pickup tube is automatically retracted and the reflow nozzle is lowered into place. At this point, the component is subjected to a 5 zone, full convection reflow profile, specifically tailored to the requirements of that particular PCB, device and solder paste. Accurate duplication of original oven reflow parameters is achieved. During the course of the reflow profile, source temperatures and time intervals can be modified On the Fly, eliminating the need to wait for the current profile to terminate before modifications can be made. Precise solder joint temperatures are measured and displayed on a real time graphical display, thus providing the necessary data to accurately and easily establish the optimum reflow profile for each particular application within minutes. Page 10 of , Rev. C

11 When operating this equipment, please exercise caution. If this unit is used in a manner which it is not intended for, serious personal injury may occur. Please read this user guide thoroughly prior to use. Seien Sie während des Betriebs des Gerätes vorsichtig. Wird das System für einen anderen Verwendungszweck eingesetzt, kann es zu ernsthaften Personenschäden kommen. Lesen Sie diese Bedienungsanleitung vor der Inbetriebnahme sorgfältig. The main power cord is a means for disconnecting the APR-5000-DZ from an operating energy source. Equipment must not be positioned in a way that impedes the disconnection of the main power cord in case of an emergency. Für den Anwender ist die Benutzung eines Erdungsbandes während der Bedienung der APR-5000-DZ zwingend erforderlich. Mandatory use of a grounding strap is required when operating the APR DZ. Für den Anwender ist die Benutzung eines Erdungsbandes während der Bedienung der APR-5000-DZ zwingend erforderlich. Page 11 of , Rev. C

12 SYSTEM FEATURES AND ACCESSORIES APR-5000-DZ SYSTEM INCLUDES: 1 APR-5000-DZ Array Package Rework System Base Unit with adjustable size board holder 2 APR-5AK-DZ Accessory Kit 3 SOFT-APR-5000-DZ APR-5000-DZ Installation Software APR-5000-DZ-TAB SYSTEM INCLUDES: 1 APR-5000-DZ Array Package Rework System Base Unit 2 APR-TAB XY Table 3 APR-5AK Accessory Kit 4 SOFT-APR-5000-DZ APR-5000-DZ Installation Software APR-5AK-DZ, ACCESSORY KIT INCLUDES: Item Description Part Number Quantity 1 Cable, video Power Cord, APR-5000-DZ Allen key/hex wrench set Wrench hex 3/ Wrench hex Kit, Optical Calibration Kapton Tape, 200 X PRE-CUT Handle, squeegee Wrench hex 1/16in CSP-VB-Adjustment block Fine Gauge Multi-colored Thermocouples 12 Wrench hex 9/64, 4 blade Screwdriver, Slotted 3/16,7 blade Screwdriver, Phillips #2,7 blade Cable, EGA/CGA SER. MONITOR Nozzle Removal Pad AC-RP 1 17 PCB Finger Short Pack (2) FS-APR PCB Spring Finger Long (2) FSL-APR Under Board Support UBS-APR 1 21 Vacuum Nozzle Removal Tool APR-VRT 1 22 Nozzle 1mm O/D VNZ Nozzle 3mm O/D VNZ Nozzle 5mm O/D VNZ Nozzle 8mm O/D VNZ Nozzle 12mm O/D VNZ VNZ Pipette O-Ring Kit VNZ-ORINGK 1 28 Wrench, Hex, STD drive, ball point, 7/ Page 12 of , Rev. C

13 Figure 1A Figure 1B APR-5000-DZ, Main Unit Components 1. Power on LED 2. Reflow head Y axis release button 3. Camera & Lighting assembly 4. Y Axis micrometer 5. Reflow head up button 6. Reflow head down button 7. Type K thermocouple inputs (3) 8. Component Theta control 9. Reflow head X axis release button 10. Open Frame printed circuit board holder (Figure 1A) or XY Table printed circuit board holder (Figure 1B). 11. Large Preheater 12. Small Preheater (Funnel) 13. X Axis micrometer 14. Command "Enter" button Page 13 of , Rev. C

14 Figure 2A Figure 2B Main Unit Electrical Components, Rear View (Figure 2A) 1. RS Composite video output. 3. Head Controls. 4. Reflow heater. 5. Main power switch. 6. AC Power input A Circuit Breakers. Main Unit Pneumatic Components, Rear View (Figure 2B) 8. Vacuum pickup black. 9. Pneumatic cylinder, red for up. 10. Pneumatic cylinder, green for down. 11. Air for reflow head, white for hot 12. Nitrogen / Shop air input. 13. Air for Reflow head, blue for cold. Page 14 of , Rev. C

15 SET-UP PROCEDURES The main unit is very heavy. Please uncrate the unit with 2 people. DO NOT LIFT THE MAIN UNIT BY THE PCBA BOARD HOLDER RAILS. LIFTING BY THE RAILS WILL DAMAGE THEM! Das Basisgerät ist sehr schwer. Bitte nur mit 2 Personen auspacken. HEBEN SIE DAS HAUPTGERÄT NICHT AN DEN SCHIENEN AN. UB ESCHÄDIGUNGEN ZU VERMEIDEN! APR-5000-DZ Series Main System Prior to performing initial set-up, unpack all accessories from their shipping containers. Ensure your APR-5000-DZ has arrived complete by verifying all of the accessories listed on page 12 of this manual have been included. After all components are accounted for, setup can then begin. Remove the APR-5000-DZ Main Unit and all accessories from their shipping containers. Page 15 of , Rev. C

16 Note: When setting up this equipment, be sure to arrange it in a position that allows the user to operate this machine in a comfortable, well-spaced environment. IMPORTANT: Every APR-5000-DZ Rework System has been factory assembled and calibrated. Recalibration is not necessary after initial setup. However verifying calibration and product functionality is strongly recommended prior to initial use. This procedure is thoroughly discussed later in the manual in the section titled Installation Guidelines. Controller and Software Setup System Requirements APR-5000-DZ Series systems should be operated with controller series APR-CNTRL and a 17 flat panel display capable of 1280 x 1024 resolution and.28 dpi. APR- CNTRL controllers come with a language specific operating system and keyboard. They are pre-installed with application software and are fully tested. If the factory does not supply the controller and system, software compatibility is not guaranteed. Resulting repair costs for material and labor are not covered under warranty. The minimum controller requirements to operate an APR-5000-DZ system are: PC with Pentium 4 processor 512 MB of (RAM) memory 3.5 floppy disk drive Hard disk drive with at least 20 Megabytes of free space CD-ROM 32MB AGP video card or equivalent 17 Monitor (.28 dpi) Serial Port Windows 2000 or Windows NT operating system. (XP and Vista are not compatible.) Follow instructions on the supplied CD to install APR-5000-DZ application software Controller Set-up 1. Unpack the controller and all its accessories. 2. Using the documentation supplied by the Controller Manufacturer, make all the necessary connections and turn on the computer. 3. APR-5000-DZ software is pre-installed. 4. Connect the APR-5000-DZ serial port to the PC (Figure 3. #4) utilizing the supplied RS-232 cable. 5. Connect the video output to the video input on the PC (Figure 3. #5) utilizing the supplied RCA video cable. Page 16 of , Rev. C

17 Note: Before plugging in the AC cable, ensure the power switch is set to the correct voltage 115V or 230V failure to do so could damage the controller. 1 Controller connections 1. AC power input. 2. USB mouse and keyboard 3. Monitor. 4. RS RCA video inputs Figure 3 Power-up Sequence Attach an appropriate power plug to the stripped end of the power cord. Use recommended power plugs: Nema 6-20 Nema L6-20 IEC Use the following diagrams together with the manufacturer s recommended procedure for hooking up wires to a power plug: IMPORTANT Below are two different wire configurations for the US. Please have a qualified electrician wire in the machine. Page 17 of , Rev. C

18 Configuration 1 Measure from X to Y. This measurement should always be 208VAC to 240VAC Measure from G to X. This measurement will be 110VAC-125VAC Measure from G to Y. This measurement will be 110VAC-125VAC X 115VAC 240VAC G Y NEMA L6-20P 115VAC Configuration 2 Measure from X to Y. This measurement should always be 208VAC to 240VAC Measure from G to X. This measurement will be 0 VAC Measure from G to Y. This measurement will be 208VAC-240VAC X 0 VAC 240VAC G Y NEMA L6-20P 240VAC Page 18 of , Rev. C

19 1. Plug the power cord into the APR-5000-DZ power receptacle (Figure 2A, #6). 2. Set the APR-5000-DZ Main power switch to the on position. 3. On the desktop Double click the icon. Notes Your APR-5000-DZ Series Rework System is now ready for operation! Page 19 of , Rev. C

20 SOFTWARE OPERATION Once your system has been setup and your software has been installed you must follow this sequence for everyday operation of your APR-5000-DZ system. 1. Set the APR-5000-DZ Main power switch to the on position. 2. On the desktop Double click the icon. 3. It is highly recommended to power down the APR-5000-DZ and controller at the end of every shift. After the system has initialized and the head has homed, the home page will be displayed. Home Page The home page has two main windows, the Profile window and the Vision window. The user can toggle between the windows by clicking on the Profile or Vision bullets or by pulling the camera out. The Profile window displays the temperature profile and data table. These features will be described in detail later. Profile window Data table Page 20 of , Rev. C

21 The Vision window displays the camera view and includes all the controls required to make vision adjustments including lighting, focus, and zoom. Lighting Control Top Lamp The Top Lamp slider bar allows the user to adjust the intensity of the top lamp. Bottom Lamp The Bottom Lamp slider bar allows the user to adjust the intensity of the bottom lamp. Top Light Modulation The Top Light Modulation, when checked, allows the top lamp to strobe. Bottom Light Modulation The Bottom Light Modulation, when checked, allows the bottom lamp to strobe. When both light modulation check boxes are checked the top and bottom lamps will strobe alternately. Modulation Frequency The Modulation Frequency slider bar allows the user to adjust the speed of the strobe. Page 21 of , Rev. C

22 Camera Control Focus The Focus slider bar allows the user to focus the camera image. Zoom The Zoom slider bar allows the user to zoom the camera image in or out. Restore Defaults The Restore Defaults button allows the user to quickly restore the lighting and camera controls to the default settings. Save Image The Save Image button allows the user to save the camera image as a JPEG file. Copy Image The Copy Image button allows the user to copy the camera image to the clipboard. The image can then be pasted into another program such as a text document. The following section describes the toolbar features including. File, Edit, and View. Tool Bar Options and Features File Options in File are limited and are self explanatory with the exception of Export and Import. The Export and Import functions allow the user to export or import temperature profiles from a saved file. This function is the only way a temperature profile can be saved and ed. Page 22 of , Rev. C

23 Export The Export option allows the user to export a profile to a file folder to be imported later. To access the Export option, open the File window move the mouse pointer over Export and click on Profile. Save the profile in the desired file location. Import The Import option allows the user to import a profile. To access the Import option, open the File window, move the mouse pointer over Import and click on Profile. Select the desired profile to be imported. Page 23 of , Rev. C

24 When opened, a secondary profile window of the selected profile will appear directly over the primary profile window. To import the selected profile into the primary profile window left click anywhere within the secondary window and drag the cursor into the primary window. Note: When the user left clicks in the secondary window the mouse pointer will change to a symbol representing a temperature profile. Cursor changes to a profile When the cursor changes drag it into the primary profile window Page 24 of , Rev. C

25 Close the secondary window after dragging the selected profile into the primary profile window. The temperature profile has been imported. Note: The temperature curves will not be imported; only the profile will be imported. The temperature curves may be copied from the secondary profile window and pasted into the primary profile window by using the Copy and Paste Options under the Edit window as described in the next section. The profile has been imported into the primary profile window. Edit Options in Edit allow the user to copy or save the profile window, modify curve options, temp/time line options, and profile options. To open the Edit window Click on Edit in the tool bar or right click the mouse pointer anywhere in the profile window. The Edit window shown below will open. Page 25 of , Rev. C

26 Cut The Cut option allows the user to cut or remove a temperature curve previously copied into a profile. To access the cut option, open the Edit window and click on Cut. An option window will appear in the middle of the monitor screen and prompt the user to specify the curve to be cut from the profile window. Note: Only copied curves can be cut. The original five curves (Bottom Heat, Top Heat, TC1, TC2, and TC3) cannot be cut from the profile window. Copy The Copy option allows the user to copy a given temperature curve and superimpose it on another profile. This option can be used to verify an existing profile and test the APR-5000-DZ performance over time. To access the copy option, open the Edit window and click on Copy. An option window will appear in the middle of the monitor screen and prompt the user to pick from one of the five temperature curves. They are as follows: Bottom Heat, Top Heat, TC1, TC2, and TC3. Copy Window The Copy Window option allows the user to copy the profile window to the clipboard similar to using a print screen function. The user can then paste the profile into other programs such as text documents. Page 26 of , Rev. C

27 To access the copy window option, open the Edit window. Click on Copy Window to copy the profile window to the clipboard. Save Window Image The Save Window Image option allows the user to save the profile window as a JPEG image. To access the Save Window Image option, open the Edit window. Click on Save Window Image to save the profile window as a JPEG image. The user may save the JPEG image in any file or folder the user desires. Paste The Paste option allows the user to paste a copied curve into the profile window. To access the Paste option, open the Edit window. Click on Paste to paste the copied curve directly into the profile window. Curve Options The Curve Options allow the user to modify the curve characteristics to distinguish between multiple curves. Characteristics such as Display Name, Style, Width, Color, and Visibility can be modified. To access the curve options, open the Edit window. An option window will appear in the middle of the monitor screen. Click on Curve Options Select curve to be modified. Type in the name you wish to be displayed in the profile window. Select curve style, width, color, and visibility Page 27 of , Rev. C

28 Temp/Time Line Options The Temp/Time Line Options allow the user to modify the characteristics of the temperature and time reference lines. Characteristics such as Display Name, Style, Width, Color, and Visibility can be modified. To access the Temp/Time Line Options, open the Edit window. An option window will appear in the middle of the monitor screen. Click on Temp/Time Line Options Select Temp or Time line to be modified Select line style, width, and color. There are a total of four Temp lines and eight Time lines. The lines can be moved to any desired position in the profile window by clicking on a line and dragging it to the desired location. The four Temp lines will be visible when the machine initializes. The eight Time lines are initially hidden and are accessed by clicking on the line on the far right side of the profile window. Temp Lines Time Lines Page 28 of , Rev. C

29 Profile Options The Profile Options allow the user to change the temperature settings of a profile by typing in the desired values. To access the Profile Options, open the Edit window. An option window will appear in the middle of the monitor screen. Click on Profile Options Time, in seconds, for each heating Zone Reflow Head Airflow / Nitrogen-flow High, Medium, or Low Temperature of Reflow Head Temperature of PreHeater Click and Drag Temperature settings can also be set or changed by using the Click and Drag method. To set the temperature with the mouse, click on the temperature bar to be changed and drag it to the desired temperature. Time settings can also be set or changed using the mouse. To set the time click on the end of a temperature bar and drag it to the desired duration of time. Reflow airflow can also be set using the mouse. To toggle the reflow airflow between High, Medium and Low click on the H, M, or L at the end of each reflow heater temperature bar. Note: The letter a after H, M, or L denotes the airflow from the internal pump. If enabled, nitrogen flow can also be selected and is denoted by the letter n. For details on choosing between airflow and nitrogen-flow, refer to the System Setup section. The user may also toggle between the Large and Small preheater by clicking on the L and S at the end of each of the Preheater temperature bars. In the final cooling zone, cooling can be selected from S small preheater, L large preheater, B both inner and outer preheaters. Page 29 of , Rev. C

30 Click on a temperature bar and Drag it to the desired temperature Click on the end of the temperature bar and extend it to the desired time in seconds Click on the reflow airflow setting to toggle between High, Medium and Low. Click on the preheater setting to toggle between the Large and Small preheater Cooling can be selected from S small preheater L large preheater B both inner and outer preheaters. Note: The click and drag method is very useful and may be used to modify the temperatures and time, On the Fly, while a profile is running. Page 30 of , Rev. C

31 View Options in View allow the user to change data viewed during process. The two modifiable items are Profile Time Display and Data Table Display. Profile Time Display The Profile Time Display allows the user to view how much time has elapsed or is remianing in the profile or the current zone. To access the Profile Time Display open the View window and click on the desired time display. The end user may also toggle between time displays by clicking on the display. Click on the desired time display in the view window or toggle through the time displays by clicking directly on the display. Data Table Display The Data Table Display allows the user to view the Gradient and Temperature, Gradient Only, or Temperature Only. The temperature and gradient of a curve are recorded in the Data Table Display when the curve intersects a time line. Page 31 of , Rev. C

32 Curve intersects time line Gradient and Temperature are recorded in Data Table Display This concludes the review of the features contained in the software tool bar. Main Control Buttons The next section will describe the features of the three buttons located directly below the tool bar Process Run, Process Setup, and System Setup. Process Run allows the user to access and run processes. It is intended for repeated operation of pre-existing processes. The user can be provided with minor fine adjustment privileges. Process Setup is a step-by-step guide for developing and saving new processes. It is not intended for repeated operation. System Setup allows the user to access the system security and diagnostic windows. Page 32 of , Rev. C

33 GETTING STARTED What is a Process? A Process is a set of parameters or settings, defined by the user. The machine follows the process parameters to complete a placement or removal of a device or component from a PCBA. These parameters include temperature profile, airflow, and nozzle positions (head height). What is a Profile? A Profile is a set of temperatures and associated durations defined by the user for a particular device, component, and PCBA. To begin using your APR-5000-DZ system you will need to develop a Process, so we will discuss Process Setup first, followed by Process Run and finally System Setup. Process Setup Click on Process Setup In Process Setup, one of the following options can be chosen: New Removal Process Setup mode for developing a new removal process for shields, BGA, CSP, and micro-smd components. New Placement Process Setup mode for developing a new placement process for shields, BGA, CSP, and micro-smd components. Modify Existing Process Setup mode for modifying an existing placement or removal process for shields, BGA, CSP, and micro-smd components. Manual Manual mode allows the user to import existing thermal plots and operate the APR-5000-DZ manually. Manual Mode is initially disabled. Enabling Manual Mode is discussed in the System Setup section. Page 33 of , Rev. C

34 New Removal Process This section explains how to develop a New Removal Process. Click on New Removal Process and then click Next. The machine will initialize and the following screen will appear. This screen allows the user to include information about the component and PCB being reworked including, Chip Package, Component Reference, and PCB Description. Simply type the information in the fields provided. This screen also includes an Instruction button. The instruction button allows the user to attach a file in PDF format to a process. These instructions can be instructions, notes, or reference photographs for the operators to follow during a Process Run. When the process is run the selected PDF file will automatically appear on screen. To use the Instruction button click on Instruction and open the desired PDF file from the drop down menu. Page 34 of , Rev. C

35 The PDF file will be displayed. Select Next to continue. In this window, an option to enter information is prompted. It is recommended the Yes button be selected and data be entered in each of the three fields. This information will be displayed in Process Run when this particular process file is opened. After entering the required data, click Next. Selecting Yes. Information input into User Prompt Cup Part Number and Nozzle Part Number will be displayed below. Page 35 of , Rev. C

36 Pull out the camera to make vision adjustments. As prompted, center the vacuum tube (nozzle) to the component using the X/Y buttons on the head and move the head so the vacuum nozzle is centered over the component. If necessary, use the X/Y micrometers on the base to make fine adjustments. Using the zoom slider bar, zoom in on the component to the desired magnification. Focus the image of the component using the focus slider bar. Use the down action buttons to lower the head until the vacuum nozzle is in focus. The speed of the head can be controlled with two options, Coarse and Fine. Coarse allows the head to move in a slow steady speed. Fine allows the user to step the head up and down in one-thousandth inch increments by clicking on Fine and adjusting the fine slider bar to the desired increment. Use the top and bottom lamp slider bars to adjust the lamp intensity to get a good view of both the component and the vacuum nozzle as seen in the example below. Component to be reworked Vacuum Nozzle Page 36 of , Rev. C

37 Click Next and return the camera back to the Home position as prompted. The user will be prompted to set the Reflow nozzle height. IMPORTANT All movements are recorded during Process Setup. As a result, any and all mistakes will appear in the Process Run. A way to avoid editing Process Setup programs each time an error is discovered is by clicking the Enable operator control during process run. This will allow the end user to modify the programmed height in Process Run. Press the down action buttons. The head will go down quickly until the nozzle is approximately 1.5 (38mm) above the PCB and then automatically decelerate to a slower speed. The head will continue to go down until the nozzle is approximately 0.5 (12.5mm) above the PCB; at this point the user must click on Fine and step the head down in increments set by the slider bar. After the Reflow nozzle touches the PCB, click Next. Page 37 of , Rev. C

38 The user will be prompted to set the Reflow nozzle height again. This is known as a back step, the back step raises the head to provide the extra clearance needed should the PCB flex upward while it is being heated. The user has the option to include a back step in the process by checking the Use this step check box or omitting the back step by leaving the check box unchecked. To set the back step height, raise the head in small increments by pressing the up action buttons just until the vacuum level indicator drops. Raise the head until vacuum level drops. Nozzle has been raised above the PCB Page 38 of , Rev. C

39 When done with adjustments, press Next. In Lift, the option to lift the component during the removal process is provided. This option was designed to allow for four distinct methods of lifting the component from the PCB. Retract vacuum tube Retracts only the vacuum tube. Designed to minimize adjacent component heating that may occur after removal. Raise head Raises the entire head approximately 0.25 (6.35mm). Raise head high Raises the entire head approximately 4 (101mm). Designed for use with high I/O removable such as large BGA components or CBGA. Tweezers Nozzle Raises the entire head approximately 0.25 (6.35mm) using the optional Tweezers Nozzle. Designed to rework components with limited or no surface area such as package-on-package BGA, sockets, connectors, potentiometers, inductors and even through-hole parts. Click Next after selecting the desired lift method. It is now time to create the temperature profile. Two buttons are available for selection: Start and Cycle Advance. Start - Starts the profile. After clicking on the Start button it will change to a Stop button. Clicking on the Stop button will abort the profile. Cycle Advance - allows the end user to cycle to the next zone. Page 39 of , Rev. C

40 While the profile is running the user can change the temperatures in each zone by using the Click and Drag method described on pages 29 and 30 of this User Guide. Once the profile has been completed click Next. As prompted raise the head to the home position by pressing the up action buttons. As prompted click Next to release the component. Note: The component should be at the temperature set in the cooling zone (zone 5) before it is released. The cooling time in the cooling zone should not be less than 100 seconds. If the cooling zone is set incorrectly be careful the component can be hot when it is released. After the component is released the user will be prompted to save the process. Save the process in the desired location. Page 40 of , Rev. C

41 After saving the process you will be taken back to the home page. The New Removal Process is now complete. Page 41 of , Rev. C

42 New Placement Process This section explains how to develop a New Placement Process. Click on New Placement Process and then click Next. The machine will initialize and the following screen will appear. This screen allows the user to include information about the component and PCB being reworked including: Chip Package; Component Reference; and PCB Description. Simply type the information in the fields provided. This screen also includes an Instruction button. The instruction button allows the user to attach a file in PDF format to a process. These instructions can be instructions, notes, or reference photographs for the operators to follow during a Process Run. When the process is run, the selected PDF file will automatically appear on screen. To use the Instruction button click on Instruction and open the desired PDF file from the drop down menu. Click Next to continue. Page 42 of , Rev. C

43 In this window, an option to enter information is prompted. It is recommended the Yes button be selected and data be entered in each of the three fields. This information will be displayed in Process Run when this particular process file is opened. After entering the required data, click Next. Select Yes. Information inputted into User Prompt, Cup Part Number, and Nozzle Part Number data will be displayed below. After entering the required data, click Next. The next window prompts the user to choose a pick-up method. Three different pickup methods are available. Component pick up - Designed for use with the adjustable centering nest. Although not preferred, this option also allows the user to prepare the rework site with liquid flux instead of gel flux or solder paste. Note: Liquid flux from flux pens etc. is not recommended for convection rework, the flux dries up quickly and becomes inactive during convection rework applications. Page 43 of , Rev. C

44 Pickup with paste - Designed for use with the OK International component stenciling plate. This method along with the correct stencil allows the user to recreate OEM standoff height. This process is preferred over both flux methods. Pickup with flux dip - Designed for use with OK International Dip Transfer Plates or Blocks, this process allows the user to transfer gel flux onto the solder balls only, increasing success rate and minimizing the amount of flux residue. Component Pickup Select Component Pickup and click Next. Pull out the camera as prompted. Place the component in the centering nest and place the nest on the centering fixture. Use the thumbscrew to adjust the size of the centering nest to accept the component being reworked. Be careful not to over tighten the thumbscrew or the vacuum nozzle will not be able to lift the component from the nest. Insert the centering nest over the pins on the centering fixture. Page 44 of , Rev. C

45 To set the component pick up height, use the down action buttons to lower the head until the vacuum nozzle comes in contact with the component. Vacuum nozzle is in contact with the component. Click Next to continue As prompted press the up action buttons to lift the component from the centering nest. When the head stops at the home position remove the centering nest and push the centering fixture back. Be careful not to bump the component while removing the centering fixture. Click Next to continue. Page 45 of , Rev. C

46 The next screen will prompt the user to zoom in on the component and adjust the focus. Use the camera and lighting controls to obtain a clear image of both the PCB and component. The following sequence is an easy way to get a clear image. 1. Zoom in on the PCB. 2. Raise the bottom lamp intensity to the maximum. 3. Lower the top lamp intensity to the minimum. 4. Focus on the PCB. 5. Lower the bottom lamp intensity to the minimum. 6. Raise the top lamp intensity to the maximum. 7. Use the down action buttons to lower the component until the solder balls are in focus. Note: Do not use the focus slider bar to focus the component. The focus slider bar is only used to focus on the PCB. Page 46 of , Rev. C

47 If the images are not aligned correctly use the X, Y, and Theta adjustments to align the component with the layout on the PCB. Component is miss-aligned with the PCB layout. Component is aligned with the PCB layout. Page 47 of , Rev. C

48 After you are satisfied with the component and PCB alignment click Next and return the camera to the home position as prompted. Press the down action buttons. The head will go down quickly until the nozzle is approximately 1.5 above the PCB and then automatically decelerate to a slower speed. The head will continue to go down until the nozzle is approximately 0.5 above the PCB. At this point the user must click on Fine and step the head down in increments set by the slider bar. Note: To avoid problems with crushed solder balls it is recommended to use increments of 10 mils or less while lowering the component to the PCB. Lower the component just until it touches the PCB. To prevent the component from moving when it is released from the vacuum pick-up tube it is recommended to set the Puff Off Time. Page 48 of , Rev. C

49 Puff Off Time Puff Off Time is an amount of time, in milliseconds. A puff of air is blown out the end of the vacuum pick-up tube for this duration to gently release the component without moving it. Set Puff Off time according to the recommendations below. Component Size Puff Off Time milliseconds 1mm 3mm 120 Small CSP 200 BGA 27mm 35mm Larger than 35mm Note: These are recommendations only; it may be necessary to experiment to find the best Puff Off Time for your application. Click Next to continue. Use the action buttons to set the Reflow nozzle height. Note: The reflow nozzle does not have to come in contact with the PCB. An alternative safe method is to leave the nozzle 2-3mm above the PCB; this method may reflow adjacent components but will not blow them off the PCB. Page 49 of , Rev. C

50 Click Next to continue. It is now time to create the temperature profile. Two buttons are available for selection; Start and Cycle Advance. Start - Starts the profile. After clicking on the Start button it will change to a Stop button. Clicking on the Stop button will abort the profile. Cycle Advance - allows the end user to cycle to the next zone. While the profile is running the user can change the temperatures in each zone by using the Click and Drag method described on pages 29 and 30 of this User Guide. Once the profile has been completed click Next. As prompted, raise the head to the home position by pressing the up action buttons. Save the process in the desired location. Page 50 of , Rev. C

51 After saving the process you will be taken back to the home page. The New Placement Process is now complete. The previous section described how to develop a New Placement Process using the Component pick up method. The following section will describe the remaining pick up methods; Pickup with Paste; Pickup with Flux Dip; and the use of a Tape Feeder. Pickup with Paste Pickup with Paste is identical to Component Pickup except instead of being placed in the adjustable centering nest the component will be placed in an OK International component stenciling plate and stenciled with solder paste. The stenciling plate replaces the adjustable centering nest. OK International component stenciling plates are optional accessories. Contact Technical support at support@okinternational.com for more information. Solder Paste Application using the Component Stenciling Templates: Select the correct solder paste plate for your component and application. Position the component onto the component side of the plate (the side with the smaller cut out or etched component corners.) Secure the component with the supplied clamp assembly. Be careful not to overtighten the clamp as this can cause the plate to bend, which will affect stencil quality. Apply solder paste to the solder balls using the supplied spatula. When printing, make sure the stencil face remains clean after your print. This ensures correct solder paste volume. Page 51 of , Rev. C

52 Carefully remove the component clamp assembly and position the solder paste plate onto the component pick-up plate aligning it with the two tooling pins. Continue with the New Placement Process. Pickup with flux dip Pickup with flux dip is similar to Component pickup with an additional step. After the component has been lifted from the adjustable centering nest, the nest is removed and replaced with a Dip Transfer Plate (DTP) or a Dip Transfer Block (DTB) that has been filled with gel flux. The component is then lowered and dipped in the gel flux. Dip Transfer Plates and Dip Transfer Blocks are optional accessories contact Technical support at support@okinternational.com for more information. DTP Plate DTB Block Page 52 of , Rev. C

53 To use the Pickup with flux dip method, follow the same sequence as described in the New Placement Process until prompted to Select component pickup method. Select Pickup with flux dip and click Next. Follow the same sequence as described in the New placement Process until prompted to Move forward centering fixture, Insert plate and set component pick up height. Place the component in the adjustable centering nest and insert the nest on the centering fixture. Then set the component pickup height as described in the New Placement Process. Click Next to continue. Press the up action buttons to lift the component until the head stops at the home position. Remove the adjustable centering nest from the centering fixture and click Next to continue. Insert the DTP or DTB on the centering fixture. Checking this box allows the user to make additional height adjustments during the Process Run. Use the down action buttons to lower the component into the DTP or DTB, actively dipping the solder balls into the gel flux. Click Next to continue. Page 53 of , Rev. C

54 Lift the component from the DTP or DTB by pressing the up action buttons until the head stops at the home position. Remove the DTP or DTB from the centering fixture and push the centering fixture back. Click Next to continue. The next screen will prompt the user to set the zoom and focus of the PCB and component. Complete the remainder of the process as described in the New Placement Process. Note: Flux Dip is recommended for micro-smd components. Dip thickness should be half the height of the solder balls and requires the use of a Dip Transfer Block (DTB). Note: Flux Dip does not always work well with 0201 or smaller chips. For these applications it is recommended to use an alternative flux application method that applies gel flux directly to the PCB. Use feeder to pickup The final pickup option is to pick the component from an optional tape feeder. This option allows the user to pick the component from a tape feeder instead of the adjustable centering nest. Tape feeders are optional accessories. Contact Technical support at support@okinternational.com for more information. Page 54 of , Rev. C

55 Install the tape feeder by sliding it over a board holder rail and tightening the thumbscrew. Slide tape feeder over a board holder rail. Tighten thumbscrew Tape feeder installed on machine. Page 55 of , Rev. C

56 To use the tape feeder option, follow the same sequence as described in the New Placement Process until prompted to Select component pickup method. Check the Use feeder to pickup check box and click Next. Pull out the camera as prompted. The vision window will zoom in on the tape feeder. Use the camera and motor controls to focus the image of the tape feeder and vacuum cup (nozzle). Use the X/Y adjustments to center the vacuum nozzle with the opening in the tape feeder as shown below. Click Next to continue. Page 56 of , Rev. C

57 Return the camera to the home position. Use the down action buttons and motor speed controls to lower the vacuum nozzle until it comes in contact with the component in the tape feeder. Click Next to continue. Press the up action buttons to lift the component from the tape feeder until the head stops at the home position. Pull out the camera as prompted. At the next screen remove the tape feeder and install the PCB to be reworked. Follow the prompts and complete the remainder of the process as described in New Placement Process. Note: The tape feeder can only be used with Component pickup and Pickup with flux dip. The Pickup with paste process is not possible with the tape feeder. Page 57 of , Rev. C

58 Manual Manual mode gives the user complete control over the machine including Z-axis motor control, Vacuum pick-up tube, Vacuum, and Puff Off Time. The user can also Import and Export profiles. Note: In Manual Mode the user has full control over the machine. To prevent damaging the PCB and component being reworked the user must have a thorough understanding of the controls. Manual Mode is initially disabled and will not appear under Process Setup Manual Mode is not available To enable Manual Mode open the Software tab in System Setup and click on the Manual Mode Enable bullet. Then click Apply and OK. Open Process Setup, click on Manual and then click Next. Page 58 of , Rev. C

59 Manual Mode is now available The machine will initialize and the Manual screen will open as seen below. While in Manual Mode the user has control over the following: Z-axis control The user can raise and lower the head in three speeds. Fast The head will move very quickly. Coarse The head will move slowly. Fine The head will move in increments set by the slider bar from 1 to 50 thousandths of an inch. Note: Only Coarse and Fine speeds can be used when the camera is pulled out. Note: In manual Mode there is no software stop for the head movement. The head will not stop when the camera is pulled out. If not careful, the user can run the head into the camera. Page 59 of , Rev. C

60 Tube Control The user can raise and lower the vacuum pickup tube. Lock Vacuum pick-up tube down or locked position. Up Raises or retracts the vacuum pick-up tube. Free Releases the vacuum pick-up tube so it floats freely. Vac Control The user can turn the pick-up vacuum on and off. Off Vacuum is turned off. On Vacuum is turned on. Drop When the user clicks on the Drop button the Puff Off Time will be activated and the Vacuum Pick-up Tube will be retracted. This is used to Drop or place the component being reworked on the PCB. Note: Do not catch the component in your hand it may be hot! Puff Off Time - The amount of time a puff of air is blown out the end of the Vacuum Pick-up Tube. Puff Off time can be set from 0 to 1000 milliseconds. Camera Control The user has full control of the camera. The camera controls are discussed under Vision in the Home Page section of this manual. While in Manual Mode the user also has full control of the profile window including Export, Import, and all the features in the Edit and View windows. These features are discussed in the Software Operation section of this manual. Note: Only profiles can be exported or imported in Manual Mode. Full processes, which include head positions, camera settings, and lamp settings, cannot be saved in Manual Mode. Page 60 of , Rev. C

61 Process Run Now that we have discussed how to develop processes we can apply them. Process run is the method the operator will use to run repeated processes. Click on Process Run on the main software screen or choose Process Run from the File menu. Open the desired process. To run the process, simply follow the software prompts. When the process has completed, the operator will have three choices: Save, Repeat, and Finish. Page 61 of , Rev. C

62 Save - Allows the operator to save any changes made to the process while it was running. Repeat - Allows the operator to repeat the entire process. Finish Finishes the process and returns to the home page. Process run is now complete. System Setup System setup allows the user to access the security and diagnostic windows. Note: To save changes made in any of the System Setup tabs click Apply before exiting the tab. The changes will only take affect upon exiting System Setup by clicking OK. When the software is first initialized the home page will open and the user will have limited access to System Setup. Click on System Setup A window will open giving the user access to the following tabs: Security; Software; and Languages. Page 62 of , Rev. C

63 Security The security tab allows the user to set three security levels, Operator, Engineer, and Unlimited. Operator Allows access to Process Run only, this is the recommended level for the end user or operator. Engineer Allows access to Process Run, Process Setup, and System setup. The engineer level can develop and modify processes. Unlimited Allows full access to Process Run, Process Setup, and System setup including the diagnostics tabs. To set up the security levels, open the Security window by clicking on the Security tab. Click on Add and enter a Login name and Password in the fields provided. Then choose the access level. Page 63 of , Rev. C

64 Click OK when done. The new login and password will appear in the security window. Status refers to access level. 1 = Engineer 0 = Operator To activate the passwords click on the Password bullet, Apply, and then close and re-initialize the software. When the software initializes the user will be prompted to enter a Login and Password to proceed. Note: If No Password is chosen the user will not be prompted to enter a password and the access level will be the same as Engineer. Note: Logins and Passwords are Case Sensitive. Page 64 of , Rev. C

65 Software The software tab allows the user to customize the software preferences. Process File Allows the user to set up how a Process Run is accessed. Operator Selects Allows the user to choose the process from a file during Process Run. Last Used Runs the last process run. Serial Port Allows the user to set the serial port. It is recommended to leave this set to automatic. Action Prompt The action prompt will prompt the user to continue with a pending action if the user has not completed the action within the set amount of time. The time can be set from 10 seconds to 100 seconds. Measurement Units Allows the user to set the measuring units to either inches or metric. Temperature Units Allows the user to set the temperature unit to either Celsius or Fahrenheit. Manual Mode Allows the user Enable or Disable Manual Mode. Nitrogen Allows the user to Enable or Disable the house nitrogen option. When enabled the reflow airflow will come from an external nitrogen source instead of the internal reflow pump. Page 65 of , Rev. C

66 Languages Allows the user to set the software to the language of the operating system. This completes the Review of System Setup under the first two access levels. As discussed earlier, the Unlimited access level gives full access including the diagnostic tabs. Unlimited The following section will review the unlimited access level. To gain access to the unlimited level enter OKInt for the login and for the password. Click OK. Open System Setup. The user now has access to eleven tabs. The three tabs discussed previously plus eight: more Profile, Camera, TC, Temperature Calibrations, Closed loop options, Calibration, Test, and Airflow. Page 66 of , Rev. C

67 Profile The profile tab contains the heater offsets set during heater calibration for each zone: Top (reflow) heater; Large bottom heater (preheater); and Small bottom heater (preheater). These offsets are initially set at the factory and should not be adjusted except during heater calibration. Note: Heater calibration can only be performed using the optional APR- CALKIT. Contact Technical support at for more information. Camera The camera tab allows the user to set the White balance and Aperture settings. These settings are set at the factory and should not be adjusted. Page 67 of , Rev. C

68 TC The TC tab contains the thermocouple offsets established during thermocouple calibration. These offsets are initially set at the factory and should not be adjusted except when performing thermocouple calibration. Note: Thermocouple calibration can only be performed using the optional APR-CALKIT. Contact Technical support at for more information. Temperature Calibrations The Temperature Calibrations tab contains the calibration procedures for calibrating the heaters and airflows. The heaters and airflows are initially set at the factory and should not need further adjustment except for the reflow airflow. Refer to the section titled Installation Guidelines for instructions on adjusting the reflow airflow. Note: Due to differences in source input voltage and frequency the Flow of Reflow Head procedure must be run when the machine is installed at the end user site. An air meter is included in the accessory kit shipped with the machine. Note: Heater and Airflow calibrations must be done using the optional APR- CALKIT. Contact Technical support at for more information. Page 68 of , Rev. C

69 Closed loop options The Closed loop options tab contains the Gain and Integration information for the heaters. The Closed loop options are set at the factory and should not be changed under any circumstance. Calibration The Calibration tab contains the calibration procedures for Head Alignment and Optical calibration. Though the machine has been calibrated at the factory, due to vibration during shipping, it is recommended that these procedures be performed upon initial setup of the machine. The Head Alignment and Optical Calibration will be discussed in detail later in this manual in the section titled Installation Guidelines Page 69 of , Rev. C

70 Test The test tab is the main diagnostic tab and displays all the software digital and analog inputs and outputs. This tab is a very useful troubleshooting tool. Digital Input The digital input section displays the status of the machine s user interface devices such as action buttons, head position, camera position, etc. Press the action buttons. A check mark should appear in each of the associated boxes. Check mark indicates head position. Home = Top most position. EOT = End Of Travel, bottom most position. Gently lift the head; the check mark for the Head Safety Switch should disappear. Press the X/Y brake release buttons. A check mark should appear in the Solenoid Lock Switch box. Check mark indicates Camera position. Home = Fully retracted EOT = End Of Travel, Fully Extended. Check mark indicates the Reflow Heater has over heated. Indicates input voltage. Check mark = 220v No check mark = 110v Page 70 of , Rev. C

71 Analog Input The analog input section displays the status of the thermocouple inputs, RTD inputs and vacuum pressure. CJ Cold Junction, typically 35 C - 45 C. TC1, TC2, and TC3 display the raw temperature readings, before offsets have been applied, from the three-thermocouple inputs on the front of the machine. Helpful Troubleshooting Hint A reading as seen in TC1 indicates a thermocouple is plugged into TC1 and is measuring a temperature of C. A reading as seen in TC2 of indicates there is no thermocouple plugged in. A reading as seen in TC3, a negative number, indicates a possible short to ground. HRTD Head RTD, displays the temperature reading of the Reflow heater. SRTD Safety RTD, displays the temperature reading of the over temperature RTD in the Reflow head. PRTD1 displays the temperature reading of the large preheater. PRTD4 displays the temperature reading of the small preheater. Vacc Displays the vacuum pressure reading of the vacuum pick-up tube. Page 71 of , Rev. C

72 Nitrogen flow. N2 Off- Nitrogen is off N2 L Low 8 lpm N2 M Medium 16 lpm N2 H High 22 lpm Reflow Head The reflow head section allows the user to test the operation of the reflow head. Use the slider bar to increase and decrease flow rate of the pump. The read-out displays the power of the pump from 0 to 100%. Turns the bypass valve on and off. Heater Airflows through the reflow heating elements. Bypass Airflow bypasses the heating elements for cooling. Use the slider bar to increase and decrease the temperature of the reflow heater. The read out displays the temperature. Main Preheater The Main Preheater section allows the user to test the operation of the Main (Large) Preheater. Use the slider bar to increase and decrease the large preheater airflow. The readout displays the power of the blower from 0 to 100%. Use the slider bar to increase and decrease the large preheater temperature. The read out displays the temperature. Page 72 of , Rev. C

73 Small Preheater The Small Preheater section allows the user to test the operation of the Small Preheater. Use the slider bar to increase and decrease the small preheater airflow. The readout displays the power of the blower from 0 to 100%. Use the slider bar to increase and decrease the small preheater temperature. The read out displays the temperature. Pipe and Cup The pipe and cup sections allow the user to test the operation of the vacuum tube assembly. Click on the bullets to test the pneumatic cylinder. Off No pneumatic pressure to the air cylinder Up Pneumatic pressure sends the vacuum tube up Down Pneumatic pressure sends the vacuum tube down Free Pneumatic pressure releases the vacuum tube to float freely Click on the bullets to test the vacuum pump. Off Vacuum is off Vac Vacuum pressure should be present at the end of the vacuum pickup tube. Blow Air should be blowing out the end of the vacuum tube. Page 73 of , Rev. C

74 Camera The camera section allows the user to test the operation of the camera and lamps. Power - Pull the camera out and click on the Power check box, a video image should appear on the screen. LUp Top lamp intensity slider bar. LDn Bottom lamp intensity slider bar. Airflow The Airflow section displays the settings set during airflow calibration. Reflow pump power settings. High 22 lpm Medium 16 lpm Low 8 lpm Puff time blows a puff of air out of the end of the vacuum tube, when the tube is lifted from the component, to release the vacuum pressure. The puff off time can be set from 0 to 1000 milliseconds. Large preheater blower power setting All Large preheater blowers are set to 90%. Small preheater blower power setting Set to achieve a flow rate of 220 ft/min. This concludes the review of System Setup. Page 74 of , Rev. C

75 INSTALLATION GUIDELINES The following section will discuss the steps and procedures to follow during the initial installation including: Reflow Airflow Head Alignment Optical Calibration Reflow Airflow Calibration Note: Due to differences in source input voltage and frequency the Flow of Reflow Head procedure must be ran when the machine is installed at the end user site. An air meter is included in the accessory kit shipped with the machine. Tools Required: APR CALIBRATION AIR FLOW METER Open system setup and click on the Temperature Calibrations tab. Click on Flow Reflow Head and click OK. Follow the software prompts. Flow Reflow Head Page 75 of , Rev. C

76 When prompted, disconnect the white-banded pipe from the rear of the machine chassis and connect it to the top fitting on the back of the air flow meter Then connect the pipe from the bottom fitting on the back of the flow meter to the fitting on the back of the APR-5000-DZ chassis. Back of flow Pipe from back of machine chassis goes to top of flow meter Pipe from bottom fitting on flow meter goes to machine chassis. Once the flow meter has been installed click Next to proceed with the airflow calibration. Follow the on screen prompts and set the airflow for Low, Mid, and Hi to the following specifications. Click Next after each setting. Adjust the slider to increase or decrease the airflow. APR Software Low Medium High Meter Setting +2liters 8 liters 16 liters 22 liters Finally click Finish after all three airflow settings have been set. Page 76 of , Rev. C

77 Note: You must click Finish at the end of the process for the APR DZ to save the calibration data. Note: The airflow meter is read from the center of the ball inside the meter. Take the reading from the center of the ball. This concludes the Reflow airflow calibration. Head Alignment Included in the APR accessory kit Tools required; Optical calibration kit PCB Finger Short Pack FS-APR-2 PCB Spring Finger Long FSL-APR-2 Nozzle 12mm VNZ-12 9/64 hex wrench /64 hex wrench /16 hex wrench Install the four fingers on the board holder by sliding the blocks into the board holder rails. Hold the fingers in place with the thumbscrews. Slide block in rails Hold fingers in place with thumbscrews. Page 77 of , Rev. C

78 Install the bottom plate of the optical calibration kit upside down between the four fingers. Tighten black knobs to secure the rails. Push the rails together and tighten the black knobs to secure the rails. The plate should be held snuggly in place. Place the top plate on top of the bottom plate. Take a VNZ-12 vacuum nozzle, remove the o-ring, and insert it in the vacuum pick-up tube. Remove the o-ring from a VNZ- 12 vacuum nozzle Page 78 of , Rev. C

79 Open the Calibration tab in System Setup and select Head Alignment and click OK. Click Next to continue Follow the prompts until prompted to Set applicable zoom As prompted use the camera controls to focus on the mirror (top plate). Use the down action buttons to lower the vacuum nozzle until it is in focus. Finally, use the X/Y adjustments to center the vacuum nozzle with the top plate as seen below. Page 79 of , Rev. C

80 Return the camera to the Home position. Use the action buttons to lower the head just until the vacuum nozzle comes in contact with the top plate. Lower head until vacuum nozzle touches the glass plate. Use the up action buttons to raise the head. If the top plate is lifted with the head, no adjustment is needed. If the calibration plate is not lifted with the head continue with the next section. Carefully remove the front cover from the reflow head and secure it to the side of the head casting with a tie-wrap or piece of tape. Page 80 of , Rev. C

81 Remove the vacuum pick-up tube shield and set it aside. Vacuum pick-up tube shield Remove screws using a 1/16 hex wrench. Note the location of the lockdown and front-to-back adjustment screws behind the vacuum tube. Page 81 of , Rev. C

82 Place the Top Plate against the vacuum nozzle so the vacuum will hold it in place. Use the down action buttons to lower the top plate until it nearly touches the bottom plate. Loosen the lockdown screws and tilt the head manually until the top plate is parallel with the bottom plate. Front-to-back adjustment screws Lockdown screws Page 82 of , Rev. C

83 The front-to-back adjustment screws act as adjustable legs and tilt the head front and back. It is recommended to adjust both screws the same amount. To tilt the head left and right, grasp the head casting and gently tilt it from side to side. Continue to make small adjustments until the top plate and bottom plate are parallel with each other on all four sides. Must be parallel on all four sides. When the plates are parallel tighten the lockdown screws. For a final test, lower the top plate to the bottom plate, release the top plate and attempt to pick-up it up again. If aligned correctly, the vacuum nozzle will pick up the top plate. Repeat the process until the top plate can be lifted from the bottom plate. When satisfied with the head alignment, click Next and return the head to the home position. Page 83 of , Rev. C

84 Click Next to release the top plate from the vacuum pick-up tube. Be ready to catch the top plate when it is released. Click Finish to complete the head alignment. Finally, reinstall the vacuum pick-up tube shield and front cover. Camera-Centering Fixture Now that the Head is level with the board holder, the camera-centering fixture needs to be leveled and centered to the head. Included in the APR accessory kit Tools required; Optical calibration kit Nozzle 12mm VNZ hex wrench Open Manual mode in Process Setup. Set the manual controls as follows: Motor Control Coarse Tube Control Free Vac Control On Page 84 of , Rev. C

85 Pull out the camera and place the top plate from the Optical Calibration kit on top of the Camera Leveling Fixture. Use the down action buttons to lower the nozzle just until it comes in contact with the top plate. Use the up action buttons to lift the head. If the top plate is lifted with the nozzle no adjustments are necessary. If the top plate is not lifted with the nozzle, the camera-centering fixture needs to be leveled. Follow the steps in the next section to level the fixture. Use a 1.5mm hex wrench to loosen the two lock screws on the right side of the centering fixture. Lock Screws There are three adjustment screws for leveling the centering fixture, one on the left side of the fixture and two on the rear of the fixture. Page 85 of , Rev. C

86 The three screws in combination act as a tripod for leveling the centering fixture. Side-to-Side Adjustment Front-to-Rear Adjustment Place the top plate on the vacuum pick-up tube so the vacuum holds it in place and lower the head until the plate is slightly above the centering fixture. Use a 0.05 hex wrench to adjust the three adjustment screws until the fixture is parallel to the top plate. Page 86 of , Rev. C

87 Must be parallel on all four sides. When the centering fixture is parallel with the top plate tighten the lock screws. As a final test, release the top plate from the vacuum pick-up tube and try to lift it again. If the top plate is lifted with the vacuum pick-up tube no further adjustments are needed. Centering the nest Insert a VNZ-1 vacuum nozzle in the vacuum pick-up tube and install a centering nest on the fixture and lower the head until the vacuum nozzle is slightly above the nest. Verify the vacuum nozzle is centered in the nest. Vacuum nozzle is centered in nest. If the vacuum nozzle is not centered in the nest continue with the next section. Page 87 of , Rev. C

88 To center the nest use a 0.05 hex wrench to adjust the screws on the right hand side of the camera-centering fixture. Centering adjustment screws. Reflow Nozzle Centering Check to see the reflow nozzle is centered with the vacuum pick-up tube. Insert a vacuum nozzle in the vacuum pick-up tube and install a reflow nozzle corresponding to the size of the vacuum nozzle on the reflow heater. Open Manual Mode in process setup. Pull out the camera and lower the head to bring the nozzles in focus. If the vacuum nozzle is centered within the reflow nozzle no adjustments are needed. Vacuum nozzle is centered within reflow nozzle. Page 88 of , Rev. C

89 If the vacuum nozzle is not centered within the reflow nozzle continue with the next section. Vacuum nozzle is not centered within reflow nozzle. Loosen the four acorn nuts on the reflow heater heat shield with a 5/16 wrench. Four acorn nuts, two on the right and two on the left. Note: It is only necessary to loosen the nuts about ¾ of a turn. Do not completely remove the acorn nuts. Page 89 of , Rev. C

90 Grasp the reflow heater heat shield and slide the heater assembly to center the nozzles. Re-tighten the four acorn nuts. Tighten the acorn nuts in a star pattern to help maintain the centering. Put the vacuum pick-up tube in Free mode and verify the tube floats freely without binding. Reflow Nozzle Leveling Check to see the Reflow nozzle is level with the board holder. Open Manual Mode and install a reflow nozzle on the reflow heater. Install the bottom plate of the optical calibration kit in the board holder. Lower the head until the reflow nozzle is slightly above the surface of the calibration plate. Check to see the reflow nozzle is level with the calibration plate on all four sides. Reflow nozzle is level. If the reflow nozzle is not level with the calibration plate continue with the next section. Page 90 of , Rev. C

91 Level the reflow nozzle by adjusting the three leveling screws, with a 3/32 hex wrench. The screws are located through the access holes on the underside of the reflow heater assembly. Leveling screw access holes When the nozzle is level put the vacuum pick-up tube in Free mode and verify the tube floats freely without binding. Note: Leveling the reflow nozzle will affect the Reflow Nozzle Centering. If any leveling adjustments are made the centering must be re-checked. Page 91 of , Rev. C

92 Optical Calibration Tools Required (Included in the APR accessory kit) Description Part Number Optical Calibration Kit Nozzle 12mm VNZ-12 7/64 ball point hex wrench /16 hex wrench hex wrench /32 hex wrench PCB Finger Short Pack FS-APR-2 PCB Spring Finger Long FSL-APR-2 Open the Calibration tab in System Setup and select Optical and click OK. The following screen will appear: Page 92 of , Rev. C

93 As prompted, place the calibration fixture ( ), right side up, with the top plate removed in the board holder and insert vacuum nozzle VNZ-12 into the vacuum tube as shown below. VNZ-12 inserted in Bottom plate of optical calibration fixture placed in the board holder. Ensure the VNZ-12 nozzle is fully inserted in the vacuum tube as seen below: Page 93 of , Rev. C

94 Note the orientation of the optical calibration bottom plate. Click Next to continue with the optical calibration. The machine will initialize and the Setup screen will open. Pull out camera and move back the centering fixture as prompted. Pull out camera Page 94 of , Rev. C

95 Move back centering fixture The Camera Center screen will open along with the camera image. Insert the VNZ-12 vacuum nozzle, included in the accessory kit, in the vacuum tube and follow the prompts on the screen. Page 95 of , Rev. C

96 When prompted to Align camera position to match this is prompting the user to center the image of the vacuum nozzle in the vision window. To center the image from top to bottom loosen the four stop block screws on either side of the camera assembly with a 3/32 hex wrench. Loosen stop block screws. Page 96 of , Rev. C

97 Slide the stop blocks front to back to center the image in the vision window from top to bottom. Adjust both stop blocks the same amount and tighten the screws. To center the image from left to right remove the camera heat shield by removing the six screws on the underside of the camera with a 1/16 hex wrench. Remove the six screws on under side of the camera. Slightly loosen the four camera plate lock screws with a 1/16 hex wrench. Four camera plate lock screws Page 97 of , Rev. C

98 Use a 1/8 hex wrench to adjust the two screws on the left side of the camera to center the image from left to right. Left to right adjustment screws Adjust both screws the same amount and tighten the four camera plate lock screws on the underside of the camera. When satisfied with the image centering, click Next to continue. Zoom in on the bottom plate and use the focus slider bar to focus the image. Lower the head using the action buttons until the nozzle is in focus. Center the pattern on the optical calibration plate with the nozzle using the X/Y adjustments. The images in the vision window should now be centered as seen below. Page 98 of , Rev. C

99 Return the camera to the home position as prompted. Push camera back to its home position Place the top plate on the bottom plate so the patterns on both plates match. Page 99 of , Rev. C

100 Lower the head by pressing the down action buttons. The head will go down quickly until it is approximately 1.5 (38mm) above the board holder and then automatically decelerate to a slower speed. The head will continue to go down until it is approximately 0.5 (13mm) above the board holder. When the head stops click on the Fine bullet on the screen to allow the head to step down in increments. Continue lowering the head until the vacuum cup comes in contact with the optical calibration top plate. Click Next to continue Press the up action buttons. The head will rise lifting the top plate to the home position. Click Next to continue. Pull out the camera again and push the centering fixture back. Use the slider bar to focus the image of the bottom plate then lower the head, using the action buttons, to bring the image of the top plate in focus. Page 100 of , Rev. C

101 Helpful tip: When focusing on the bottom plate increase the intensity of the bottom lamp and decrease the intensity of the top lamp. When focusing on the top plate decrease the intensity of the bottom lamp and increase the intensity of the top lamp. Continue making focusing and lamp adjustments until both images are in focus. Helpful tip: If there is difficulty distinguishing the image of the bottom plate from the image of the top plate, try this helpful tip. Place a piece of blank white paper underneath the bottom plate over the preheater screen. Lower the intensity of the bottom lamp to minimum and increase the intensity of the top lamp. The white paper will show through the etching in the bottom plate making the pattern to appear white. The pattern of the top plate will remain dark making it very easy to distinguish the two images as seen in the example below. Dark pattern is the top image. White pattern is the bottom image. Page 101 of , Rev. C

102 Using a 7/64 hex wrench, adjust the four prism screws to align the pattern on the top plate with the pattern on the bottom plate. The prism screws are located on either side of the camera, two on the left and two on the right. Prism adjustment screws Adjust each screw individually until both patterns are aligned with each other. When the patterns are aligned click Next. The following screen will open click Next again. Page 102 of , Rev. C

103 To verify the optical calibration, use the board holder to purposely misalign the top and bottom plates. Insert the frame from the optical calibration kit then, with the board holder, re-align the top and bottom plates. Use board holder to misalign plates Insert the frame from the Optical Calibration Kit in the recess of the bottom plate. Insert frame from optical calibration Page 103 of , Rev. C

104 Use board holder to realign the plates. Click Next to continue. Return the camera to home. Use the down action buttons to lower the top plate onto the bottom plate. Click Next to continue, the vacuum tube will retract leaving the top plate on top of the bottom plate. Depress the up action buttons to raise the head to the home position. Pull out the camera and push the centering fixture back. Page 104 of , Rev. C

105 Place the flashlight, included in the optical calibration kit, underneath the bottom plate and shine the light up through the etchings. If the light is visible through the etchings in both plates the optics have been calibrated correctly. Note: The prism screw adjustments may affect the centering of the image in the vision window. It is recommended to re-check the centering after aligning the top and bottom plates. Click Next and return the camera to the home position. Click Finish to complete the optical calibration. Re-install the camera heat shield. Page 105 of , Rev. C

106 If the light is not visible through both etchings, as seen below, the Optical calibration needs to be repeated. Repeat the process until the light is equally visible through the etchings in both plates. Page 106 of , Rev. C

107 DEVELOPING PROFILES Inner and outer preheating can be used independently or together within the same profile. Dual stage preheating, when both inner and outer preheaters are used together, is designed for rework applications where higher reflow temperatures, tighter temperature control, and minimized damage to adjacent components are required, as shown in the diagram below. The Large preheater is capable of 1800W and is best used for ramping up the PCB temperature uniformly above the glass transition temperature during the Preheat Zone Z1 and Soak Zone Z2. The glass transition temperature of current PCB substrate material, FR4, is 135 C and new lead free substrate material is 170 C The Small preheater is capable of 900W and is best used for ramping up the temperature of the component or device being reworked during the Ramp Zone Z3 and the Reflow Zone Z4. In dual preheating, it is common to see a higher temperature set point for the bottom heater than the top reflow heater, especially when dual preheating. Page 107 of , Rev. C

108 The example below illustrates a typical profile containing 5 zones. The temperatures shown will vary depending on PCB size and thickness. Z1 Z2 Z3 Z4 Z5 Page 108 of , Rev. C

109 Dual Preheating Profiling Examples These examples illustrate reduced heating power to the underside of the PCB and allow for focused thermal energy to be placed on the reworked components/devices during ramp and reflow zones. Measure temperature at the solder balls by placing a thermocouple under the chip. Three 36 gauge color-coded thermocouples are included in accessory kit. Drilling into the pads from the underside of the PCB is also an option for inserting thermocouples. For a Medium PCB with 6-8 layers substrate 10 inches by 12 inches (254mm by 350mm) set the profile up as shown in the table. Z1 Z2 Z3 Z4 PREHEAT LARGE 350 C LARGE 350 C SMALL 260 C SMALL 245 C REFLOW MEDIUM 180 C MEDIUM 220 C MEDIUM 255 C MEDIUM 270 C TRANSITION TEMP 120 C -150 C 160 C -190 C 220 C -230 C 240 C -245 C (Transition temperature is depicted as red vertical lines in the profile graph) Observations in Z3: a) The preheater is set at a higher temperature than the reflow heater. b) There is a 10 second lag before the temperature transition occurs. c) The temperature rise is fast after the lag; hence, the temperature set points for both the top and bottom heaters do not need to be set much higher than 255 C. In Z5, select B for maximum cooling. Z1 Z2 Z3 Z4 Z5 Page 109 of , Rev. C

110 For a Larger PCB and 90 mill (2.1mm) thick substrate, layers, 16 inch by 16 inch (450mm by 450mm), P5 socket set the profile up as shown in the table. Z1 Z2 Z3 Z4 PREHEAT LARGE 340 C LARGE 350 C SMALL 300 C SMALL 270 C REFLOW MEDIUM 150 C MEDIUM 220 C HIGH 250 C HIGH 250 C TRANSITION TEMP 120 c -150 C 160 c -190 C 220 C -230 C 240 C -245 C (Transition temperature is depicted as red vertical lines in the profile graph) Although the time from ambient to C is not specified for lead-free rework, it is recommended to use a longer soak time (time in Z2) for a thick PCB. The additional soak time allows temperatures to equalize across the chip and PCB, which will yield in better profile delta. It is recommended to use the transitional temperature of 230 C in Z3 so that Z4 temperatures can be achieved easier and quicker. In Z5, select B for maximum cooling. Z1 Z2 Z3 Z4 Z5 Page 110 of , Rev. C

111 TAPE FEEDERS & THERMAL NOZZLES The APR-5000 Series Array Package Rework System offers optional tape feeders to work with small chip packages such as 0603, 0402 and 0201 which are available on tape: TF-1T for 0603 TF-2T for 0402 TF-3T for 0201 Example of a tape feeder mounted on a board holder front rail. The use of a VNZ-005 nozzle is recommended: Operating a tape feeder: A. Tape feeder header feeds into the first slot by pushing the tape from the rear of the feeder to this position. B. Pull the tape with tweezers until enough of the tape header is available to hold, by hand, on thumb wheel. Page 111 of , Rev. C

112 C. Tape header can be taped down. Roll thumb wheel to position components in the pick up window. Tweezers Nozzles The APR-5000 Series Array Package Rework System offers the user the ability to pickup devices mechanically without the use of vacuum pick-up as an integral part of a profile. These mechanical tweezer nozzles are designed to rework components with limited or no surface area such as package-on-package BGA, sockets, connectors, potentiometers, inductors and even through-hole components. Example of a tweezers nozzle. Page 112 of , Rev. C

113 Examples of odd shaped components that can be reworked with Tweezers Nozzles. Connectors: Sockets: Double stack CSP/BGA: Inductors and potentiometers Pin grid array/through-hole: Page 113 of , Rev. C

114 NOZZLES, VACUUM PICKUP NOZZLE & ACCESORIES Nozzles APR-NK APR-NK-CSP NZA CGA NZA CGA NZA CGA NZA CGA NZA * NZA NZA * NZA * NZA NZA * NZA NZA * NZA ** NZA *** NZA ** NZA *** NZA *** NZA *** NZA ** NZA *** NZA-030-ROUND NZA-TW NZA-TW NZA-TW NZA-TW NZA-TW NZA-TW Nozzle Kit (*includes one of each) CSP and Micro SMD Nozzle Kit (**includes one of each) Reflow Column Grid Array Nozzle 55.5mm x 55.5mm Reflow Column Grid Array Nozzle 47mm x 47mm Reflow Column Grid Array Nozzle 35.5mm x 45.5mm Reflow Column Grid Array Nozzle 35mm x 35mm Reflow Nozzle 49mm x 49mm Reflow Nozzle 45mm x 45mm Reflow Nozzle 40mm x 40mm Reflow Nozzle 35mm x 35mm Reflow Nozzle 30mm x 30mm Reflow Nozzle 27mm x 27mm Reflow Nozzle 25mm x 29mm Reflow Nozzle 23mm x 23mm Reflow Nozzle 20mm x 20mm Reflow Nozzle 18mm x 18mm Reflow Nozzle 15mm x 15mm Reflow Nozzle 13mm x 13mm Reflow Nozzle 10mm x 10mm Reflow Nozzle 8mm x 9.5mm Reflow Nozzle 8mm x 8mm Reflow Nozzle 6mm x 6mm Reflow Nozzle 3mm ID round Tweezer Nozzle18mm x 18mm Tweezer Nozzle15mm x 15mm Tweezer Nozzle13mm x 13mm Tweezer Nozzle10mm x 10mm Tweezer Nozzle 8mm x 8mm Tweezer Nozzle 6mm x 6mm (*** Included in both kits) (NZA-TW-xxx-xxx designates tweezers nozzle) Page 114 of , Rev. C

115 Vacuum Pick-Up Nozzle VNZ-005 VNZ-01 VNZ-03 VNZ-05 VNZ-08 VNZ-12 VNZ-19 APR Vacuum pick up nozzle 0.5mm O/D APR Vacuum pick up nozzle 1mm O/D APR Vacuum pick up nozzle 3mm O/D APR Vacuum pick up nozzle 5mm O/D APR Vacuum pick up nozzle 8mm O/D APR Vacuum pick up nozzle 12mm O/D APR Vacuum pick up nozzle 19mm O/D Accessories AC-RP Nozzle Removal Pad APR-VRT Vacuum Nozzle Removal Tool FP-17 17" Flat Panel Display APR-DK1 Demonstration PCB with BGA & CSP Component Kit APR-DK2 Alignment Demo PCB with BGA & CSP Component Kit FL-APR-2 PCB Finger Long (Pack 2) FLL-APR-2 Thick PCB Finger Long (Pack 2) FLS-APR-2 Thick PCB Finger Short (Pack 2) FLSL-APR-2 Thick PCB Spring Finger Long (Pack 2) FLSS-APR-2 Thick PCB Spring Finger Short (Pack 2) FS-APR-2 PCB Finger Short (Pack 2) FSL-APR-2 PCB Spring Finger Long (Pack 2) FSS-APR-2 PCB Spring Finger Short (Pack 2) PF-1 KIT, Solder Paste/Flux Prep Plate PICK-APR Component Pick Up Plate TF-1T Tape Feeder, Micro SMD with thumbwheel TF-2T Tape Feeder, 0603 and 0402 with thumbwheel TF-3T Tape Feeder, 0201 with thumbwheel UBS-APR Under Board Support APR-5000-DZ VNZ-ORINGK VNZ Pipette O-Ring Kit APR-5AK APR-5000-DZ Accessory Kit APR-VA Internal Video Adaptor, PCI VNZ12-ORING VNZ-12 O-ring replacement kit (Qty 50) VNZ19-ORING VNZ-19 O-ring replacement kit (Qty 50) VAC-P100 Vacuum Assist Plate (double sided Kapton tape) (Qty 100) Page 115 of , Rev. C

116 CALIBRATION KIT & SPARE PARTS Calibration Kit APR-CALKIT Spare Level 1 APR-AH APR-VF APR-CF APR-PAC APR-CL APR-PHK-DZ APR-VPUK Spare Level 2 APR-ABK APR-XALSK APR-AS APR-VPC APR-YALSK-N APR-XAA Spare Level 3 APR-PCGC APR-PHO APR-THK APR-XLPHB APR-HCA APR-YAK APR-TAB Spare Level 4 APR-HHP APR-ACPCB APR-LCPCB-DZ APR-MC APR-HHA APR-CA APR-5000 Calibration Kit Air Hose Kit Vacuum Filter Camera Cooling Fan Pneumatic Cylinder, Head Camera Lamp Preheater Kit (2 heaters) Vacuum Pick-up Kit Action Button Kit X-Axis Lock Solenoid Kit Air Solenoid Vacuum Pump/Compressor Y-Axis Lock Solenoid Kit X-Axis Assembly Kit Protective Camera Glass Cover Preheater O-ring Table Hardware Kit Preheater Blower Head Cover Assembly Y-Axis Kit XY Table Heater Head Pump AC Power PCB Logic Control PCB Motor Control Heater Head Replacement Camera Page 116 of , Rev. C

117 SITE PREPARATION Solder Removal: Prepare the site to receive a new component by removing all of the residual solder. This can be accomplished by using an MX-500 Series Rework System with blade cartridge assembly. Employing OK International Smart Heat Technology into your rework process will virtually eliminate the potential of accidentally removing any pads when removing residual solder. This is because OK International patented Smart Heat technology ensures that tip temperature is constantly maintained, regardless of the thermal demand of the assembly that is being reworked. For more information on OK International Smart Heat Technology, please contact your local OK International representative or visit support@okintl.com for more information. The following blade style tips are available for the MX-500 Series Rework System: SMTC-x60 (.410 length) SMTC-x61 (.620 length) SMTC-x62 (.870 length) SMTC-x110 (1.55 length) Please note that x denotes tip temperature. All cartridges are available in 500, 600 and 700 series styles. (5 = 500 F, 0=600 F and 1=700 F). As an option, you can utilize a desoldering system such as the MFR-SDI (with internal vacuum pump) or the MFR-SDX (venturi system that requires shop air). NOTE ON CLEANING: Although isopropyl rubbing alcohol and cotton swab work satisfactory for removing flux residue, it is strongly recommended you contact your solder paste manufacturer for recommendations for cleaning the residue left by their products. SOLDER PASTE DEPOSITION and FLUX APPLICATION Component Stenciling Templates The application of new solder paste or flux directly to the component s solder balls can be accomplished with OK International Component Stenciling Templates. The templates allow the precise application of solder paste without concern for surrounding parts on your PCB. Since the component is pasted rather than the board, operators find this to be a much faster and simpler solution. Please contact your local representative for information and availability. Custom sizes and styles are available. Solder Paste Application using the Component Stenciling Templates: 1. Select the correct solder paste plate for your component and application. 2. Position the component onto the component side of the plate (the side with the smaller cut out or etched component corners.) 3. Secure the component with the supplied clamp assembly. Please be careful not to over-tighten the clamp as this can cause the plate to bend, which will affect print quality. Page 117 of , Rev. C

118 4. Apply solder paste to the solder balls using the supplied spatula. When printing, make sure the stencil face remains clean after your print; this ensures correct solder paste volume. 5. Carefully remove the component clamp assembly and position the solder paste plate onto the component pick-up plate aligning it with the two tooling pins. 6. Using the vacuum pipette lift the component from the solder paste plate and continue with your alignment process. Body Recognition Plate Two types of paste deposition plates are available for the APR-5000-DZ: 1. BST -To print on balled devices, balled stencil templates are available. 2. BRP -To print on flat components such as LLP or LGA (Land Grid Array), the body recognition plates are available. This is the only recommended method to rework these components. Type 1 Balled Stencil Plate Type 2 Body Recognition Plate Dip Transfer Plates The application of high viscosity paste flux can be accomplished with OK International Dip Transfer Plates. These plates allow for a simple, controlled application of paste flux to the solder balls of your BGA or CSP component. They are available in many sizes and depths. Please contact your local representative for information and availability. Custom sizes and configurations are available. OK International has pioneered the application of high viscosity paste flux using specialized fixtures to ensure consistent repeatable results. Page 118 of , Rev. C

119 1. Select the Dip Transfer Plate that meets your component s requirements for size and depth. 2. Using the supplied spatula fill the cavity with paste flux. Use the spatula to smooth the flux level with the sides of the transfer plate. This ensures a repeatable deposit. 3. Place your component into the component pick up plate and pick it up with the vacuum pipette. 4. Using the micrometers, align the component in the X, Y and Theta axes. 5. Remove the adjustable component fixture and replace it with the flux transfer plate. 6. Follow the screen prompts to lower the component into the flux transfer plate so the solder balls contact the bottom plate of the flux transfer plate. Press UP action buttons to return the component to the focus position. 7. Remove the component pick up plate and inspect the impression left in the flux to ensure all the solder balls have been coated. 8. Check component alignment and adjust as required. 9. Follow the screen prompts, push in the camera and click Next. 10. Place the component as directed by the screen prompts, and continue with the placement process that you have selected. Flux Dip plates BGA and CSP Page 119 of , Rev. C