Xinetics Deformable Mirror Technology 10 April 2003

Size: px

Start display at page:

Download "Xinetics Deformable Mirror Technology 10 April 2003"

Louise McCoy
6 years ago
Views:

1 Xinetics Deformable Mirror Technology 10 April 2003

2 Facility Vision & Roadmap Integrated Operations & Future Expansion 2 nd Floor Engr, Admin, & Special Mfg 60,000-sqft: COMPLETE 1 st Floor Manufacturing & Laboratories 23-Acre Master Building Layout Company Overview ξ

3 NGST Cryogenic Deformable Mirror Cryogenic Deformable Mirrors with Cofired Actuators Stroke (um) Cryoceramic Materials Discrete, Cofired Actuator Set 349-Ch Cryogenic Discrete Actuator DM Weighs 13 lbs 349-Ch Cryogenic Modular DM Weighs 3 lbs XiMUX Set and Forget Electronics Advanced Materials ξ

4 Conventional versus Modular Designs 1-mm 1 Actuator Spacing with Increased Reliability Transverse Module Discrete Array

5 SBIR Based 42 x 42 Mirror Pathfinder Mirror Towards Space Qual Mirror

42x42 Array with Facesheet Successfully Polished Square Optic Using Custom Polish Fixturing Concerned about affect of conductive

6 SBIR Funded High Density 42 x 42 Mirror Evolution of Module Towards Integrated Arrays 1764 Actuators in Four Modules Aligned within Rows and the Facesheet Plane Addressed with Custom Interconnect Expected population of defects due to reuse of flex cables 42x42 Array with Facesheet Successfully Polished Square Optic Using Custom Polish Fixturing Concerned about affect of conductive epoxy properties on stability of figure Unprotected Gold Coating Applied without Affecting Figure Polished and Gold Coated 42x42 Mirror

Lessons Learned Applied to Next Generation Roadmap Towards Space Qualifiable Component Epoxy Effects Conductive epoxy has significant disadvantages compared to

Flex Circuits First generation interconnect was reworked, with considerable thermal cycling Defects exist at several points in two of the flex cables due to the

7 Lessons Learned Applied to Next Generation Roadmap Towards Space Qualifiable Component Epoxy Effects Conductive epoxy has significant disadvantages compared to structural epoxy for attaching the facesheet - Thicker, nonuniform, bond joint - Weaker than structural epoxy and more moisture sensitive - Potential shorting path Flex Circuits First generation interconnect was reworked, with considerable thermal cycling Defects exist at several points in two of the flex cables due to the repeated bonding and removal of the flex from the BGA and underfill 42x42 Array Without Facesheet Module Effects Dicing debris leads to low parallel resistance and potential shorts

1,764 Channel 1-mm 1 Deformable Mirror Modular Mirror Technology for Future Space Instruments 1764-Channel Deformable Mirror Significant advance

21 x 21 1-mm Module Format Modular Actuator Arrays Allow Scaling to Large Channel Counts PMN-Based Electroceramic Enables Angstrom Level

8 1,764 Channel 1-mm 1 Deformable Mirror Modular Mirror Technology for Future Space Instruments 1764-Channel Deformable Mirror Significant advance in demonstration of module technology for correction of stray light in coronagraph applications. 21 x 21 1-mm Module Format Modular Actuator Arrays Allow Scaling to Large Channel Counts PMN-Based Electroceramic Enables Angstrom Level Dimensional Control. Conductive Adhesive Enables Integrated Ground of All Actuators Multiple Layer Flex Circuit Replaces Thousands of Individual Wire Leads 42 x 42 Mirror 21 x 21 Module on Flex Cable

9 ECLIPSE Based 64 x 64 Mirror Engineering Model Towards TRL 5

binder composition being used for parts while transition to more favorable

10 Greenware Processing at 4 x 4 Level Enables Production Yields Larger greenware format allows increase in number of modules produced Baseline binder composition being used for parts while transition to more favorable binder system is in progress 2 Modules per Block Transitioned to 10 Modules per Block Format

11 Simplified Circuit to Enhance Connectivity Space Qual Level Compatibility & Reliability 32x32 Module Module with 32x34 Connections 32x34 Header Flex Cable.050 inch pitch connection to electronics Conductive Epoxy Bond approx. 7.5 cm Flex cables are a highly reliable, single layer design with 500 micron trace width fully tested before attached to a module Replaces 8 layer single flex with 75 micron traces Attach process developed and characterized

Facesheet Production and Bonding Enhanced Dimensional Stability & Shape Control Grounds out the back design

uniform, more reliable and moisture resistant bond joints than conductive epoxy.

12 Facesheet Production and Bonding Enhanced Dimensional Stability & Shape Control Grounds out the back design allows structural epoxy, the baseline on all Xinetics deformable mirrors, to be used to bond the facesheet to the modules. Modules can also be tested before incorporation into a mirror Structural epoxy will provide thinner, more uniform, more reliable and moisture resistant bond joints than conductive epoxy. 64x64 Array Facesheet MicroMachined Pusher Pads Facesheet fabrication demonstrated on facesheets with 15,000+ pusher pads. Polishing Pathfinders Built from Pyrex Developed to Advance Polishing Process Polishing Pathfinder Hardware

High Authority Demo At Elevated Fields Proof Test, Cycle Life & Bandwidth Cycle Testing Parameters 70 V DC, ± 16V AC, 500 Hz, 30 minutes (900,000 cycles) 120 V DC, ± 30V AC, 500 Hz, 30 minutes (

13 High Authority Demo At Elevated Fields Proof Test, Cycle Life & Bandwidth Cycle Testing Parameters 70 V DC, ± 16V AC, 500 Hz, 30 minutes (900,000 cycles) 120 V DC, ± 30V AC, 500 Hz, 30 minutes ( 900,000 cycles) 70V DC, ± 2V AC, 4 khz, 30 minutes (7.2 million cycles) Results: No noticeable change in Stroke, Capacitance or Parallel resistance after several million cycles No visual sign of degradation Only 1 degree temperature increase during most intense testing. Module Cycle Testing 1mm Module Reliability Testing Flex qualify continuity of all connections in flex and confirm that no shorts exist. Module confirm that all actuators are active and individually addressable. Flex to Module Interface establish integrity of bond between flex and module, confirm that no shorts exist between actuators or from signal to ground

14 1,024-Channel Single Module Mirror Delivery in December Channel Mirror Heath Kit Preparation for 4,096 Channel Mirror in Spring 2003 Polishing Ring Support Structure Aperture Mask Module 32x32 Facesheet 32x34 Interconnect

4,096-Channel 1-mm 1 Deformable Mirror Delivery in May 2003 4,096-Channel Deformable Mirror Enables Phase Correction in both Coronagraphic Instruments and High Resolution WFOV Telescopes; Establishes

15 4,096-Channel 1-mm 1 Deformable Mirror Delivery in May ,096-Channel Deformable Mirror Enables Phase Correction in both Coronagraphic Instruments and High Resolution WFOV Telescopes; Establishes Component and System Technology to TRL Level 5/6 in JPL Test Bed Simulations. Roadmap Towards ECLIPSE & TPF: Pre- Planned Product Improvements Modular Array Size Increased to 32 x 32 Format to Enable Direct Scaling to 64 x 64 Array Structural Adhesive Replaces Conductive Adhesive and Enables Angstrom Level Dimensional Stability Ground Connectivity at Modular Interconnect Enables In-Process Testing Large Format Interconnect Allows Simple, Actuator Line Addressing 32 x 32 Modular Actuator Array 1,024-Channel Interconnect Header

16 Xinetics XiMUX Driver Electronics Enables High Density Mirror Control

Inverting Sample & Hold S&H Switch "D" N

channel Analog Mux +40 Volts -70 Volts 2 1

System 448 Channels Concept NOV 98 Voltage

17 Analog Input Monitor 1 Volt/Amp Analog Switch "A" Analog Switch "E" Current feedback Analog -40 Volts Switch "B" +15 Volts -15 Volts Driver Amplifier Analog Switch "C" 1 2 Current Monitor 3 ohms 2 1 Inverting Sample & Hold S&H Switch "D" N channel Power Mux 2 1 Actuator -70 Volts N channel Analog Mux +40 Volts -70 Volts 2 1 XiMux Development Path Low Power &Vacuum Compatible Power Mux Hybrid 40 and 59 Channels 1 Bd. System 4 Bd. System 448 Channels Concept NOV 98 Voltage feedback Breadboard 37 Channels SEPT 99 P.C. Board 112 Channels JUN 00 1 Bd. Backplane JAN 01 4 Bd. Backplane MAR 01 DEC 01

18 40 Channel Hybrid Power Mux Size reduced by 86% with Hybrid XiMUX The Hybrid is functionally 21 Sq. in. of a XiMux board space. 40 Ch. Hybrid First Article 6.0 x x Ch. XiMux Driver

19 100 Channel Low Noise High Resolution Proof-of of-concept Circuit Board Low Power and Being Tailored for Vacuum Operation

20 16-Bit High Resolution Multiplex Driver Proof-of of-concept Lab Setup Sw. Leakage Current ~ 0.22 µa 1-LSB Between adj. Channels A D LSB = mv 3X LSB = mv 10.09X LSB = 9.23 mv Low Pass Filter Feedback 16 Bit Data Mode Control Programmable Digital Controller Power Mux Control

Switches 16 Digital Controllers Connectors for:

21 1,024 Channel XiMux Driver System Integrated Hybrid Components Cold Plate 1024 High Voltages Switches 16 Digital Controllers Connectors for: Actuator Drive Digital Commands Power 16 Power Amplifiers

37 (19) - channel piezoelectric deformable mirror system technical passport

37 (19) - channel piezoelectric deformable mirror system technical passport F L E X I B L E Flexible Optical B.V. Adaptive Optics Optical Microsystems Wavefront Sensors O P T I C A L Oleg Soloviev Chief Scientist Röntgenweg 1 BD, Delft The Netherlands Tel: +1 - Fax: +1 - oleg@okotech.com