PAGE 1/6 ISSUE SERIES Micro-SPDT PART NUMBER R516 X3X 10X R 516 _ 1 0 _
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1 PAGE 1/6 ISSUE SERIES Micro-SPDT PART NUMBER R516 X3X 10X R516 series: the RAMSES concept merges with the SLIM LINE technology, breaking up the frequency limits of SMT switches : - FULL SMT TECHNOLOGY COMPATIBLE - High frequency - High life span - High repeatability - High power applications (All dimensions are in mm [inches]) ACTUAL SIZE PART NUMBER SELECTION TYPICAL OUTLINE DRAWING R 516 _ 1 0 _ Frequency range : 3 : DC 8GHz 4 : DC 18GHz 7 : DC 26.5GHz Actuator terminals : 0 : Not soldered T : Soldered on a connectorized test fixture (1) TYPE : 3 : Latching, 2 coils ACTUATOR VOLTAGE : 1 : 6Vdc 2 : 12Vdc 3 : 24Vdc (1) See details about test fixture RF characteristics on page 3
2 PAGE 2/6 ISSUE SERIES Micro-SPDT PART NUMBER R516 X3X 10X GENERAL SPECIFICATION Operating mode Latching (Type 3) Nominal operating voltage (Vdc) (across operating temperature range) 6 (on request) (5.1 to 6.6) 12 (10.2 to 13) 24 (20.5 to 30) Coil resistance (+/-10%) (Ohms) Operating current at 23 C (ma) Switching time (Nomial voltage) Life RF and command ports Making contacts Breaking contacts Cold switching (Max 120 cycles/min) Hot switching (Max 20 cycles/min) Insulation Environmental protection gold plated access, infrared reflow, forced air oven or hand soldering (Compatible with lead free soldering processes) Max 5ms, including contact bounce time 3ms 3 million cycles (5 million cycles typical at low level) cycles (1W, impedance 50, V.S.W.R. <1.25) Dielectric test voltage 300Vrms Insulation resistance at 500Vdc > 100MOhms LEAD FREE» construction Waterproofness according to IEC / IP64 immersion resistance 10min / 1m Mass 7.5g Operating temperature range ( C) (With no icing nor condensation) -40 to +85 Storage temperature range ( C) -55 to +85 Shocks (According to MIL STD 202, method 213B, Cond C) 100g / 6ms, ½ sine No change of state Sine vibration (MIL STD 202, method 204) Random vibration (MIL STD 202, method 214A, Profile I) Condition D : Hz, 20g Operating Condition G : Hz, 30g Non Operating - Condition F : Hz, 20.71grms Operating - Condition H : Hz, 29.28grms Non-operating PIN IDENTIFICATION (TOP VIEW) Latching model (TYPE 3) Voltage RF Continuity C C 2
3 Isolation Technical Data Sheet PAGE 3/6 ISSUE SERIES Micro-SPDT PART NUMBER R516 X3X 10X RF PERFORMANCES (1) Frequency Range (GHz) DC 8 DC 18 DC 26.5 V.S.W.R IL Isolation (max) (max) db (min) db Average power W hot switching DC Third order Inter modulation -110 dbc 1730 MHz (2 carriers 20W) Impedance Ohms 50 (1) : at high frequency, manual soldering may generate spikes and RF characteristics degradation, due to air gaps between PC board and relay ground. TYPICAL RF PERFORMANCE - MEASUREMENT METHOD USING UOSM 2.92mm CALIBRATION (2) Inputs/Outputs of the calibration board and test fixture are equipped with coaxial type receptacle connectors. The length of the RF tracks is the same on the calibration board and the test fixture circuits. The insertion loss of the relay itself is calculated by subtracting the insertion loss of the calibration board to the insertion loss of the relay welded on the test fixture. Relay soldered on test fixture (2) (2): Relay soldered on Test Fixture is available. To order, please use the suffix "T" (part number R T), as explained in page 1. Calibration board All dimensions are in millimeters [inches]
4 PAGE 4/6 ISSUE SERIES Micro-SPDT PART NUMBER R516 X3X 10X RF POWER RATING FOR COLD SWITCHING USE (Impedance 50 Ohms, V.S.W.R. < 1.25) Power level depends on environmental conditions : - R516 series have been designed to be used without a cooling fan even for high power applications. However, the power capability may be still improved by using the appropriate cooling fan. RELAY PACKAGING According to IEC standard For quantities up to 50 relays: packaged in tape without reel For upper quantities: packaged in tape and reel, maximum 200 relays per reel MATERIALS Reel : polyester Carrier tape : PVC Cover tape : polyester
![PAGE 5/6 ISSUE 13-08-18 SERIES Micro-SPDT PART NUMBER R516 X3X 10X Video shadow of the relay Aspiration area All dimensions are in millimeters [inches].](/docs-images/91/105756205/images/5-0.jpg "PC BOARD MOUNTING Substrate Types Recommended substrates are ROGERS RO4003., Thickness 0.508 mm Cu double side 17.5µm.")
5 PAGE 5/6 ISSUE SERIES Micro-SPDT PART NUMBER R516 X3X 10X Video shadow of the relay Aspiration area All dimensions are in millimeters [inches]. PC BOARD MOUNTING Substrate Types Recommended substrates are ROGERS RO4003., Thickness mm Cu double side 17.5µm. Recommended total thickness of RF tracks (copper over thickness + plating) : 40µm. Other substrates may be used (1) Board layout general outline DXF or GERBER format file available upon request (1) Relay soldering DXF format file available upon request (1) Optionnal fixing system : 2 screws M1.2 (see details on page 7 / B-4) (1) : Please contact us by switchingproducts@radiall.com
6 PAGE 6/6 ISSUE SERIES Micro-SPDT PART NUMBER R516 X3X 10X RECOMMENDED SOLDERING PROCEDURE A (2) Soldering procedure using automatic pick and place equipment (3) (4) 1-Solder (5) paste : (6) R516 (7) series are «Lead Free», and Lead Free Sn-Ag3.5-Cu0.7 solder (8) cream may be used as well as standard Sn63 Pb35 Ag2. (9) RADIALL recommends using a «no clean - low residue» solder (10) cream (5% solid residue of flux quantity) that will permit the (11) elimination of the cleaning operation step after soldering. Note (12) : Due to the gold plating of the switch PCB interface, it is important (13) to use a paste made with silver. This will help in avoiding (14) formation of intermetallics as part of the solder joint. (15) 2-Solder (16) paste deposition : Solder (17) cream may be applied on the board with screen printing or (18) dispenser technologies. For either method, the solder paste must (19) be coated to appropriate thickness and shapes to achieve good (20) solder wetting. Please optically verify that the edges of the zone (21) are clean and without contaminates, and that the PCB zoned (22) areas have not oxydated. The design of the mounting pads (23) and the stenciling area are available upon request, for a thickness (24) of the silk-screen printing of 0.15 mm (0.006 ). (25) 3-Placement (26) of the component : For (27) small lightweight components such as chip components, a self-alignment (28) effect can be expected if small placement errors exist. (29) However, this effect is not as expected for relays components (30) and they require a accurate positioning on their soldering (31) pads, typically +/- 0.1mm (+/ ). Place (32) the relay onto the PCB with automatic pick and place equipment. (33) Various types of suction can be used. RADIALL (34) does not recommend using adhesive agents on the component (35) or on the PCB. (36) 4-Soldering (37) : infra-red process Please (38) follow the RADIALL recommended max temperature profile (39) for infra-red reflow or forced air convection : (40) (41) (42) (43) (44) (45) (46) (47) (48) (49) (50) (51) (52) (53) (54) (55) (56) (57) Higher temperature (>260 C) and longer process duration would damage permanently the switches. 5-Cleaning procedure : On miniature relays, high frequency cleaning may cause the contacts to stick. If cleaning is needed, please avoid ultrasonic cleaning and use alcohol based cleaning solutions. In-line cleaning process, spraying, immersion, especially under temperature, may cause a risk of degradation of internal contacts. For such cleaning process please contact us. 6-Quality check : Verify by visual inspection that the component is centred on the mounting pads. Solder joints : verify by visual inspection that the formation of meniscus on the pads are proper. B Soldering procedure by manual operation : manual soldering is not recommended for high frequencies, as it generates resonance and lower RF characteristics due to gaps between PC board and relay grounds,. 1-Solder paste and flux deposition : Refer to procedure A 1 Deposit a thin layer of flux on solder pad area. Allow the flux to evaporate a few seconds before applying the solder paste, it will prevent dilution of the paste. 2-Solder paste deposition : RADIALL recommends depositing a small amount of solder paste on solder pad area by syringe, according to the manual soldering pattern (available upon request). Be careful, not to apply solder paste outside of the zone area. 3-Placement of the component : During manipulation, avoid contaminating gold surfaces by contact with fingers. Place the component on the mounting zone by pressing on the top of the relay lid. 4-Hand soldering : Iron wattage 30 to 60 W. To keep better RF characteristics, apply pressure on the relay lid during all the soldering stage, so as to reduce the air gap between the PC board and the relay. If possible, fix the ground plane of the relay on the board with two M1.2 screws before the soldering stage. On each side of the central RF access, the RF body edge must be soldered to the ground of the PC board. To improve RF characteristics and avoid soldering the RF body on the ground, a conductive gasket may be used (please contact us for detailed application note). 5-Cleaning procedure : Refer to procedure A 5. 6-Quality check: Verify by visual inspection that component is centred on the mounting pads. Solder joints : verify by visual inspection that there is no solder excess on the RF pads.
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