24AA16/24LC16B. 16K I 2 C Serial EEPROM. Device Selection Table. Description: Features: Package Types. Block Diagram. Temp. Ranges.

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1 6K I C Serial EEPROM Device Selection Table Part Number Features: Vcc Range Max. Clock Frequency Temp. Ranges A khz () I LC6B khz I, E Note : 00 khz for <.V Single supply with operation down to.7v A6 devices,.v for LC6B devices Low-power CMOS technology: - Active current ma, typical - Standby current, μa, typical -wire serial interface, I C compatible Schmitt Trigger inputs for noise suppression Output slope control to eliminate ground bounce 00 khz (.V) and 00 khz clock compatibility Page write time ms max. Self-timed erase/write cycle 6-byte page write buffer Hardware write-protect ESD protection >,000V More than million erase/write cycles Data retention > 00 years Factory programming available Packages include 8-lead PDIP, SOIC, TSSOP, MSOP, DFN and SOT-- Pb-free and RoHS compliant Temperature ranges: - Industrial (I): -0 C to +8 C - Automotive (E): -0 C to + C Description: The Microchip Technology Inc. A6/LC6B (XX6*) is a 6 Kbit Electrically Erasable PROM. The device is organized as eight blocks of 6 x 8-bit memory with a -wire serial interface. Low-voltage design permits operation down to.7v with standby and active currents of only μa and ma, respectively. The XX6 also has a page write capability for up to 6 bytes of data. The XX6 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, x DFN and MSOP packages, and is also available in the -lead SOT- package. Package Types A0 VSS Vss Note: PDIP, MSOP SOT-- Block Diagram A0 VSS Vcc SOIC, TSSOP A0 VSS DFN Pins A0, and are not used by the XX6 (no internal connections). HV Generator I/O Control Logic Memory Control Logic XDEC EEPROM Array Page Latches I/O YDEC *XX6 is used in this document as a generic part number for the A6/LC6B devices. VSS Sense Amp. R/W Control 007 Microchip Technology Inc. DS70G-page

2 .0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings ( )...6.V All inputs and outputs w.r.t. VSS V to +.0V Storage temperature...-6 C to +0 C Ambient temperature with power applied...-0 C to + C ESD protection on all pins... kv NOTICE: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE -: DC CHARACTERISTICS DC CHARACTERISTICS Industrial (I): TA = -0 C to +8 C, = +.7V to +.V Automotive (E): TA = -0 C to + C, = +.V to +.V Param. No. Symbol Characteristic Min. Typ. Max. Units Conditions D VIH, and pins D High-level input voltage 0.7 V D VIL Low-level input voltage 0. V D VHYS Hysteresis of Schmitt.0 V (Note ) Trigger inputs D VOL Low-level output voltage 0.0 V IOL =.0 ma, =.V D6 ILI Input leakage current ± μa VIN = VSS or D7 ILO Output leakage current ± μa VOUT = VSS or D8 CIN, COUT Pin capacitance (all inputs/outputs) 0 pf =.0V (Note ) TA = C, FCLK = MHz D9 ICC write Operating current ma =.V, = 00 khz D0 ICC read 0.0 ma D ICCS Standby current 0..0 Note : This parameter is periodically sampled and not 00% tested. : Typical measurements taken at room temperature. μa μa Industrial Automotive = = = VSS DS70G-page 007 Microchip Technology Inc.

3 TABLE -: AC CHARACTERISTICS Param. No. AC CHARACTERISTICS Industrial (I): Automotive (E): TA = -0 C to +8 C, = +.7V to +.V TA = -0 C to + C, = +.V to +.V Symbol Characteristic Min. Max. Units Conditions FCLK Clock frequency THIGH Clock high time TLOW Clock low time TR and rise time (Note ) TF and fall time 00 ns (Note ) 6 THD:STA Start condition hold time TSU:STA Start condition setup time THD:DAT Data input hold time 0 ns (Note ) 9 TSU:DAT Data input setup time 00 0 TSU:STO Stop condition setup time TAA Output valid from clock (Note ) TBUF Bus free time: Time the bus must be free before a new transmission can start TOF Output fall time from VIH minimum to VIL maximum TSP Input filter spike suppression ( and pins) TWC Write cycle time (byte or page) CB khz.v.v (Note ) (Note ).7V <.V (A6) 0 ns (Notes and ) ms 6 Endurance M cycles C, (Note ) Note : Not 00% tested. CB = total capacitance of one bus line in pf. : As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 00 ns) of the falling edge of to avoid unintended generation of Start or Stop conditions. : The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation. : This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance Model which can be obtained from Microchip s web site 007 Microchip Technology Inc. DS70G-page

4 8-Lead Plastic Small Outline (SN or OA) Narrow,.90 mm Body [SOIC] D N e E E NOTE b h h α A φ c L L β Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e.7 BSC Overall Height A.7 Molded Package Thickness. Standoff Overall Width E 6.00 BSC Molded Package Width E.90 BSC Overall Length D.90 BSC Chamfer (optional) h Foot Length L Footprint L.0 REF Foot Angle φ 0 8 Lead Thickness c Lead Width b Mold Draft Angle Top α Mold Draft Angle Bottom β Notes:. Pin visual index feature may vary, but must be located within the hatched area.. Significant Characteristic.. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0. mm per side.. Dimensioning and tolerancing per ASME Y.M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C0-07B 007 Microchip Technology Inc. DS70G-page

5 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX Device Temperature Range: Temperature Range Package A6: =.7V, 6 Kbit I C Serial EEPROM A6T: =.7V, 6 Kbit I C Serial EEPROM (Tape and Reel) LC6B: =.V, 6 Kbit I C Serial EEPROM LC6BT: =.V, 6 Kbit I C Serial EEPROM (Tape and Reel) I E = -0 C to +8 C = -0 C to + C Package: MC = x DFN, 8-lead P = Plastic DIP (00 mil body), 8-lead SN = Plastic SOIC (.90 mm body), 8-lead ST = Plastic TSSOP (. mm), 8-lead MS = Plastic Micro Small Outline (MSOP), 8-lead OT = SOT-, -lead (Tape and Reel only) Examples: a) A6-I/P: Industrial Temperature,.7V, PDIP package b) A6-I/SN: Industrial Temperature,.7V, SOIC package c) A6T-I/OT: Industrial Temperature,.7V, SOT- package, Tape and Reel d) LC6B-I/P: Industrial Temperature,.V, PDIP package e) LC6B-E/SN: Automotive Temp.,.V SOIC package f) LC6BT-I/OT: Industrial Temperature,.V, SOT- package, Tape and Reel 007 Microchip Technology Inc. DS70G-page