BiTS Poster Session. March 5-8, Hilton Phoenix / Mesa Hotel Mesa, Arizona. Archive Poster BiTS Workshop Image: tonda / istock

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1 March 5-8, 2017 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive Poster 2017 BiTS Workshop Image: tonda / istock

2 Copyright Notice The presentation(s)/poster(s) in this publication comprise the Proceedings of the 2017 BiTS Workshop. The content reflects the opinion of the authors and their respective companies. They are reproduced here as they were presented at the 2017 BiTS Workshop. This version of the presentation or poster may differ from the version that was distributed in hardcopy & softcopy form at the 2017 BiTS Workshop. The inclusion of the presentations/posters in this publication does not constitute an endorsement by BiTS Workshop or the workshop s sponsors. There is NO copyright protection claimed on the presentation/poster content by BiTS Workshop. However, each presentation/poster is the work of the authors and their respective companies: as such, it is strongly encouraged that any use reflect proper acknowledgement to the appropriate source. Any questions regarding the use of any materials presented should be directed to the author(s) or their companies. The BiTS logo and are trademarks of BiTS Workshop. All rights reserved.

3 Air Cooled Thermal Tool for System Level High Volume Manufacturing Testing Rahima Mohammed, Ridvan Sahan, Ying-feng Pang, Amy Xia, Hagai Wertheim Intel Corporation Thermal Margining tools are used to: Accelerate Fault Detection Identify Bugs Test and Validate Silicon Reduce Escapes INTRODUCTION Thermal Design Power Extraction Cooling and Margining capability Air-cooled thermal tools (ACTT) remove the liquid detection, harness management issues, and lab infrastructure needs Goal Design a new low cost high volume manufacturing (HVM) ACTT solution for System level testing automation environment for Client Multi-dies with Central Processing Unit (CPU) and Peripheral Component Hub (PCH) for 2 in 1 s, laptop etc. Thermal Design Target : CPU Cold Plate Temp (Tcp ) W CPU Tcp 60 C to W Keep Out Zone (KOZ) of the ACTT: Active Heatsink (HS) Keep out volume (KOV) of 45 mm x 60 mm x 26 mm, Single-staged Thermoelectric cooler (TEC) and the pedestal Kit Active HS design with 2 central heat pipes (HP) (CFD Model (left), actual design (right)) 2 Fans Pushing 2 Fans ing

4 Lowest Temp of CPU (TDP=26.8 W) and PCH (TDP = 3.2 W) 25 CPU Tcp ( C) PCH Tcp ( C) No Heatpipe Y (2 5mm Diagonal) Y (2 of 5mm Center) Y (2 of 5mm Center) Y (2 of 5mm Y (2 of 5mm Center) Center) IcoolPSC 40x40x28 (1) Sun Tai (2) Push Sun Tai I II III IV V VI Final Design for TDP = 30 W with 1 30x30 mm TEC, 2 of 5 mm heatpipe, Fan Size: 30 x 30 x 15 mm (Sun Tai 24 V) 2 PUSH 2 PULL (QUAD FAN) Temperature Profile for 30 W TDP CPU PCH Temperature Profile for 65 W TDP CPU PCH Uniform TDP (W) Tcp ( C) CPU PCH CPU PCH Same Finalized Design HVM Air Cooled Thermal Tool for 65 W also meets the requirements BiTS 2017 Air Cooled Thermal Tool for System Level High Volume Manufacturing Testing 2

5 Finalized Mechanical Design and Actual Prototype 74.9 mm Gimbaling Mechanism for HVM Automation Environment New Pedestal Kit design Active HS design Actual Prototypes of HVM Client ACTT Received, Functional Testing and Characterization Complete Performance of HVM ACTT latest design w/ updated cold plate/pedestal and all TIM layers w/ 30 x 30 x 15 mm fan w/pedestal Uniform TDP (W) Tcp ( C) CPU PCH CPU PCH Summary New HVM ACTT meets all the design requirements removing the liquid detection, harness management issues and lab infrastructure needs Reduces the cost by 80% compared to the existing liquid cooled thermal tools Next step is to collect the field testing data at HVM BiTS 2017 Air Cooled Thermal Tool for System Level High Volume Manufacturing Testing 3