Selective plastics metallization using primer technology
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1 Selective plastics metallization using primer technology Nürnberg, LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG / Sitz Nürnberg
2 SMT 2013 NÜRNBERG Table of Content Company Main Markets Product Portfolio MID Technology Primer Technology R&D activities LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 2
3 COMPANY Locations Nuremberg Headquarter 2-D,3-D Production - Weiden 3-D Production - Sonneberg Trading office - Shenzhen LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 3
4 COMPANY History Milestones Foundation as a print shop in Nuremberg Start of printed-circuit board production Start of operations at the production plant in Weiden in der Oberpfalz Certification: QM system in accordance with DIN ISO Start of 3-D MID production Start of serial production of 3-D MIDs Start of operations for Europe's first and to date only waste water free production plant for 3-D MID and POP in Sonneberg Foundation of Shenzhen Lüberg Technology Co. Ltd Certification: in accordance with DIN ISO Newly built 1000 m 2 production hall in Weiden Possible startup of logistic center in Shenzhen LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 4
5 SMT 2013 NÜRNBERG Table of Content Company Main Markets Product Portfolio MID Technology Primer Technology R&D activities LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 5
6 LÜBERG PRODUCT PORTFOLIO Main market areas Healthcare Space Aerospace Physics & Telecomunications (Large Hadron Collider) LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 6
7 LÜBERG PRODUCT PORTFOLIO Medical applications For the healthcare sector Lüberg Elektronik develops and manufactures high-end components that can be found in a variety of applications. The three main areas of medical applications expertise are: MRT-PET MRT CT LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 7
8 SMT 2013 NÜRNBERG Table of Content Company Main Markets Product Portfolio MID Technology Primer Technology R&D activities LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 8
9 LÜBERG PRODUCT PORTFOLIO Examples of XXL Boards XXL Board: 175 µm Cu on FR4 substrate 1220x1080 m XXL PTFE Board (length = 2750 mm) for CT application LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 9
10 SMT 2013 NÜRNBERG Table of Content Company Main Markets Product Portfolio MID Technology Primer Technology R&D activities LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 10
11 MOLDED INTERCONNECT DEVICES Molded Interconnect Device (MID) MID are injected molded thermoplastic parts with integrated circuit traces. This technology combines plastic substrate/housing with circuitry into a single part through selective metallization. Idea of MID going back to 1980s with great improvement of manufacturing capabilities since than. Very dynamic market growth with 10.7 million in 2004, 14.1 million in 2005 and 56.2 million in 2008 Source: LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 11
12 MOLDED INTERCONNECT DEVICES Advantages of MIDs DESIGN FLEXIBILITY Integration electronicsmechanics-optics High shape flexibility Miniaturization New functions ECONOMIZATION Less number of parts Shorter process chains Reduced use of material Increased reliability ENVIRONMENTAL COMPABILITY Reduction of material mix Recycling of materials Decreased use of material Uncritical disposal Source: LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 12
13 MOLDED INTERCONNECT DEVICES Advantages of MIDs DESIGN FLEXIBILITY Integration electronicsmechanics-optics High shape flexibility Miniaturization New functions ECONOMIZATION Less number of parts Shorter process chains Reduced use of material Increased reliability ENVIRONMENTAL COMPABILITY Reduction of material mix Recycling of materials Decreased use of material Uncritical disposal Up to 40% cost saving potential depending on the specific product, piece numbers and other boundary conditions. Source: LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 13
14 MOLDED INTERCONNECT DEVICES Manufacturing Processes MOLDED INTERCONNECTED DEVICES Molding of the circuit carrier Injection Molding Two Shot Molding Insert Molding Full surface metallization Chemical / Galvanic PVD subtractive Laser Direct Structuring Primer Technology Heated Die Molding Tool Conv. Flex-Foil (PI) Structuring 3D Photo Laser Resist Imaging Imaging Printing Additive metallization Technology -Flamecon -Aerosol-Jet -Inkjet -Tampon Chemical / Galvanic Hot Embossing SKW PCK PA Alternative Foil (PC) + Primer Source: LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 14
15 MOLDED INTERCONNECT DEVICES Examples of Lüberg MIDs Seatbelt safety component - First MID in series Lüberg MID IR-LED housing - 2-shot technology Selective metallization of 3-D structures LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 15
16 MOLDED INTERCONNECT DEVICES Examples of Lüberg MIDs Spirit level (Wasserwaage) - Demonstrator (MID-Tronic) - LDS technology Angled circuit relay - 2-shot technology Shielding application for healthcare sector - primer technology Selective metallization of 3-D structures LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 16
17 SMT 2013 NÜRNBERG Table of Content Company Main Markets Product Portfolio MID Technology Primer Technology R&D activities LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 17
18 MOLDED INTERCONNECT DEVICES Manufacturing Processes MOLDED INTERCONNECTED DEVICES Molding of the circuit carrier Injection Molding Two Shot Molding Insert Molding Full surface metallization Chemical / Galvanic PVD subtractive Laser Direct Structuring Primer Technology Heated Die Molding Tool Conv. Flex- Foil (PI) Structuring 3D Photo Laser Resist Imaging Imaging Printing Additive metallization Technology -Flamecon -Aerosol-Jet -Inkjet -Tampon Chemical / Galvanic Hot Embossing SKW PCK PA Alternative Foil (PC) + Primer Source: LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 18
19 PRIMER TECHNOLOGY Technology limitations All standard thermoplastic materials, as well as most of the high-performance thermoplastic materials are suitable for metallization using this method. Possible adaptability of technology to different material through mechanical/chemical pre-treatment methods. Material specific primer formulation. Different functional components available, such as: Pd, Cu, etc. Cu layer adhesion ranging from 0.5 up to 1.5 N/mm (depending on plastic substrate). Metallization layout detail level depending on plastic substrate. No quantity limitations already possible from 1 piece. LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 19
20 PRIMER TECHNOLOGY Primer application methods Spraying Dipping Screen printing in development Inkjet printing in development Painting Primer application example based on spraying, dipping and painting techniques -Substrate -Substrate -Substrate Substrate with a defined roughness (material dependent) 2D or 3D mask application Primer application Mask removal LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 20
21 PRIMER TECHNOLOGY Metal plating with primer technology Active bath 1 Active bath 2 (optional) Electroless plating of copper (1-2 µm) on primer germs Electroplating of copper up to it s final thickness Simplified scheme of primer based metallization process LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 21
22 LÜBERG PRODUCT PORTFOLIO Examples of primer technology applications Selective Plating-on-Plastic of security elements for medical industry produced with primer technology LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 22
23 LÜBERG PRODUCT PORTFOLIO Examples of primer technology applications Capacitive joystick Healthcare security component for medical imaging devices manipulation Selective Plating-on-Plastic of security elements for medical industry produced with primer technology LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 23
24 LÜBERG PRODUCT PORTFOLIO Examples of primer technology applications Capacitive joystick Healthcare security component for medical imaging devices manipulation Selective Plating-on-Plastic of security elements for medical industry produced with primer technology LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 24
25 SMT 2013 NÜRNBERG Table of Content Company Main Markets Product Portfolio MID Technology Primer Technology R&D activities LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 25
26 RESEARCH AND DEVELOPMENT Cryogenic storage systems Metallization of high-performance GF/CFR composite tanks for cryogenic fuel storage systems for automotive, aerospace and space industry. LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 26
27 RESEARCH AND DEVELOPMENT Cryogenic storage systems Metallization of high-performance GF/CFR composite tanks for cryogenic fuel storage systems for aircraft and aerospace industries using primer technology. LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 27
28 RESEARCH AND DEVELOPMENT Micro fuel cells Anode (LÜBERG Elektronik) FUEL CELL STACK (Fraunhofer IZM, Berlin) Katode (LÜBERG Elektronik) LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 28
29 THANK YOU FOR YOUR ATTENTION! LÜBERG ELEKTRONIK GmbH & Co. Rothfischer KG 29
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