A market report for High Functional Dielectric Films

Transcription

1 The key material for IC packaging in high speed, high density era English Version A market report for High Functional Dielectric Films Summary of the survey (Indispensable information for your planning) - Introduction to new films Description of material, properties, applications, manufacturers *Polyimide, Epoxy, LCP, Olefin, PEEK, PEN, PPE, Multifunctional Aromatic Vinyl - Analysis of application and forecast of market size Description, analysis and market share by type of resin and application * Interlayer Dielectric Film for Rigid PCB * Application for high frequency application * Capacitor Embedded Sheet * Photosensitive Solder Resist and Cover-lay * FPC with new films - Case Study Report on the status of 18 major film manufacturers DuPont-Toray, Ajinomoto Fine-Techno, Kaneka, Kuraray, Nippon Steel Chemical, Hitachi Chemical, Kolon, SKC, Namics, Mitsubishi Plastics, etc. Published on: October 20, 2007 Style/page: A4, 375 pages Price: 525,000 JPY (Incl. Shipping & Handling Service) Sunrize Tachibana Bldg., , Higashi-Nihonbashi, Chuo-ku Tokyo, Japan Marketing Survey Co., Ltd. TEL: FAX: URL:

2 Contents Conclusion A~E Section 1, Summary 1. Summary of the market of film for PCB 1.1 Forecast of market size of film by application Ranking of film manufacturers (for overall film market) Price trend Price of films for rigid PCB Price of films for FPC 7 2. Trend of films for rigid PCB 2.1 Surveyed rigid PCB materials and their category Manufacturers and their products Manufacturers and products and product form Film manufacturers by type of resin Specifications Market size forecast of films for rigid PCB ( ) Status of manufacturer Comparative table of major films for PCB Price trend of films for rigid PCB Price of various 6-layer boards Price of rigid boards made of film Trend of films for FPC 3.1 Market size forecast for films for FPC Market size forecast by type of resin Market size forecast by application Status of manufacturers of film for FPC Price trend of films for various FPC board Price of major films in Trend of average film price 1) Price of base films and cover-lay films 28 2) Price of photosensitive cover-lay films 29 3) Price of adhesive sheet films 30 Section 2, Trend of resin film market I. Market trend of polyimide film 1. Status of the product 1.1 Introduction to polyimide resin Outline of polyimide film and FCCL Outline of polyimide based film Major manufacturer of polyimide film Property of polyimide film 3.1 Film (thermo-set type, with thermoplastic layer type) Casting type (with copper foil) Film (low CTE type, adhesion type) Major manufacturers polyimide film and final application Market size of polyimide film by type (2006) Manufacturers share for polyimide film (2006) Market share of polyimide film by manufacturer and application (2006) Price of polyimide film 8.1 Price trend of polyimide film Estimated market size of resin used for polyimide film Future market trend 9.1 Typical property of polyimide film Potential applications for polyimide film Issues of polyimide firm by application Relationship between polyimide film and substrate 55 II. Market trend of epoxy film 1. Status of the product 1.1 The market of epoxy resin 59

3 1.2 Introduction to epoxy film Product outline of epoxy based film Major manufacturer of epoxy based film Property of epoxy film 3.1 Interlayer dielectric film for build up PCB Photosensitive film for solder resist Bonding sheet for FPC Market size of epoxy film (2006) 4.1 Market size of film by application Estimated market size of epoxy resin used for film Price of epoxy resin and film Supply chain Market potentiality of epoxy film by application 71 III. Market trend of LCP film 1. Status of the product 1.1 Production status of LCP resin Introduction to LCP film (including aramid) Status of LCP film manufacturer 2.1 Manufacturers of LCP film Manufacturer of FCCL and CCL made with LCP resin Introduction to application and product of LCP film Property of LCP film Market size of LCP film by application (2006) Manufacturers share of LCP film2006) Price trend of LCP materials 7.1 Price range of LCP based materials Market size of raw material resin for LCP used for circuit materials Future market trend 8.1 Key property of LCP film Comparison of LCP and polyimide film Promising applications in the future Issues for LCP in the future Supply chain 94 IV. Market trend of olefin film 1. Introduction of product and market of cycloolefinpolymer Major manufacturer of PCB material with olefin film 2.1 Manufacturer Comparison of olefin films Market trend of olefin film Case study for R&D on olefin film 4.1 Research on PCB manufacturing process using cycloolefinpolymer film Examples of PCB made of olefin film 100 V. Market trend of PEEK film 1. Introduction to PEEK resin and film Application of PEEK film Manufacturer of PEEK film and PCB material Property of PEEK film Market size of PEEK film by application (2006) Price trend of PEEK resin and film Supply chain of PEEK film Future market trend of PEEK film 8.1 Advantages of PEEK film Comparison of PEEK film and other films Issues on PEEK film Example of application using PEEK film (PALAP type FC-BGA vs. conventional FC-BGA) 111 VI. Market trend of PEN film 1. Introduction to PEN and PEN film Application of PEN film Manufacturer of PEN film and laminate materials 116

4 4. Property of PEN film Market size of PEN film (2006) Price trend of PEN resin and film 6.1 Price range or resin and film Estimated market size of resin for FPC Supply chain Future market trend of PEN film 8.1 Comparison of PEN film and other films Issues on PEN film 120 VII. Market trend of PPE film 1. Introduction to PPE resin and film Manufacturer of thermo-set type PPE film and CCL Property of thermo-set type PPE film Market size of thermo-set type PPE film and PCB materials (CCL, RCC) (2006) Future market trend of thermo-set type PPE film 5.1 Applications Advantages of thermo-set type PPE film Issues on thermo-set type PPE film 128 VIII. Market trend of multi-functional aromatic vinyl based films 1. Introduction to resin and film Property of multi functional aromatic vinyl film Sales status of resin and film products Supply of film and resin 133 Section 3, Trend of application I. Interlayer dielectric film 1. Trend of interlayer dielectric films for build-up type package substrate 1.1 Outline of IC package substrate Build-up type package substrate Technical trends of build-up type package substrate Status of major manufacturer 2.1 Property of interlayer dielectric films Manufacturers share (2006) Status of business and development of major manufacturers Technical trend of interlayer dielectric film for build-up type package substrate Demand forecast for interlayer dielectric film for build-up type package substrate ( ) 4.1 Demand forecast for FC-BGA substrate and interlayer dielectric materials Demand forecast by type Assumptions for the forecast 150 II. Films for high frequency 1. Classification of materials for high frequency application Market size of high frequency materials by type (volume and amount) for High frequency applications and material used, structure of PCB and possibility of substitution by film Demand forecast of film for high frequency PCB and high frequency application ( ) 164 III. Capacitor embedded film 1. Capacitor embedded material manufacturers Introduction to capacitor embedded film Market size of capacitor embedded materials Demand forecast of laminate type capacitor embedded materials 172 IV. Photosensitive dry film solder resist and photosensitive cover-lay 1. Market trend of photosensitive dry film solder resist and photosensitive cover-lay 1.1 Products surveyed Manufacturers Demand forecast of photosensitive dry film solder resist and photosensitive cover-lay Price trend of photosensitive dry film solder resist and photosensitive cover-lay Photosensitive dry film solder resist (for rigid PCB) 2.1 Manufacturer of photosensitive dry film solder resist for rigid PCB 180

5 2.2 Product outline of photosensitive dry film resist for rigid PCB Market size of photosensitive dry film solder resist (2006) Manufacturers share of photosensitive dry film solder resist (2006) Breakdown of application for photosensitive dry film solder resist (2006) Needs analysis for type of PCB and photosensitive dry film solder resist Demand forecast of photosensitive dry film solder resist ( ) Background and assumptions for the forecast of photosensitive dry film solder resist for FC- BGA Technical requirements for photosensitive dry film solder resist for FC-BGA substrate Photosensitive cover-lay (for FPC) 3.1 Manufacturer of photosensitive cover-lay for FPC Outline of photosensitive cover-lay for FPC Market size of photosensitive cover-lay (2006) Manufacturers share of photosensitive cover-lay (2006) Comparison of cover-lay and process Comparison of process for cover-lay of FPC Promising applications and opportunity for photosensitive cover-lay Demand forecast of photosensitive cover-lay by application and assumptions Market size forecast of photosensitive cover-lay for FPC by type of resin 198 V. FPC 1. Classification of film for FPC Typical properties of plastic film used for FPC Comparison of major film for FPC Manufacturer of film for FPC 4.1 Manufacturer and type of resin Manufacturers and application Technical and market trend of film for FPC 5.1 Market trend of overall films for FPC Market size forecast by type of resin (2006) Manufacturers share Breakdown by manufacturers brand Market size forecast ( ) Market trend of base film for FPC Summary Market size (2006) Breakdown by manufacturer and type of resin Competitive analysis of various materials 1) Market share by type of FCCL (2-layer/3-layer) 227 2) For 2layer FCCL 229 3) For 3layer FCCL Market size forecast 1) Market size forecast of base film by resin type and application 231 2) Price of base film type and application 232 3) Market size forecast of base film Technical and market trend of cover-lay film Introduction Market size of cover-lay film for Manufacturers share of cover-lay film for Market size forecast of cover-lay film 1) Market size forecast of cover-lay by type 244 2) Price trend of cover-lay film Adhesive sheet Introduction to adhesive sheet Market size of adhesive sheet Manufacturers share of adhesive film Market size forecast of adhesive sheet Price trend of adhesive sheet Price trend 254

6 Section 4, Case study for film manufacturers Ajinomoto Fine-Techno Co., Ltd. 257 Ube Industries Co., Ltd. 260 Kaneka Co., Ltd. 265 Kuraray Co., Ltd. 275 Japan Goretex Co., Ltd. 279 Nippon Steel Chemical Co. Ltd. 285 Sumitomo Chemicals Co., Ltd. 291 Taiyo Ink Manufacturing Co., Ltd. 293 Tamura Kaken Co., Ltd. 300 Teijin Advanced Film Co., Ltd. 304 Teijin DuPont Film Co., Ltd. 307 Namics Co., Ltd. 311 Hitachi Chemical Co., Ltd. 314 Mitsubishi Plastics Co., Ltd. 320 Dupont Group (Toray DuPont Co., Ltd.) 324 Kolon Industries, Inc. 329 SKC Co., Ltd. 334 Toyobo Co., Ltd. 338 Section1, Summary Sample Data Forecast of market size of film by application Ranking of film manufacturers (for overall film market)

7 Status of manufacturer Section2, Trend of film market: Polyimide Market share of polyimide film by manufacturer and application (2006) Section3, Trend of application High frequency applications and material used, structure of PCB and possibility of substitution by film Market size forecast of base film by resin type and application

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