PCB Report Movements on the global markets for PCB-related products. Purpose: To provide basic data on the global PCB-related markets.

Transcription

1 PCB Report 14 Movements on the global markets for PCB-related products Purpose: To provide basic data on the global PCB-related markets. Publication Date: May 29, 14 Format: A4 Size 364 Pages Prices: 0,000 JPY (a Bound Book) 10,000 JPY (a CD) The CD can be sold only to those who purchase a bound book. The price for both a bound book and a CD is 2,000 JPY. Chapter 1, Global market size of PCB, actual and forecast Chapter 2, Major manufacturers market share in the global PCB market Chapter 3, Global market trend of PCB materials Chapter 4, Global market trend of PCB manufacturing equipment Chapter 5, Disassembly of Galaxy S4 Chapter 6, Case study *Global market size of PCB: *Major manufacturers market share in the global PCB market: 13 *PCB materials (Copper clad laminate, Electro deposited copper foil, Dry film photoresist for the patterning, Photosensitive solder resist, UV or thermo-set type solder resist) *PCB manufacturing equipment (Direct Imaging System, Full-automatic exposure system, Laser drilling machine, Drilling machine, Bare-board tester, Automatic optical inspection systems) *Disassembly of Galaxy S4: (Exterior dimensions, X-ray imaging, Disassembly study, etc.) *Case study: Manufacturers Japan Marketing Survey Co., Ltd Higashi-Nihonbashi, Chuo, Tokyo, JAPAN TEL: FAX: info@jms.co.jp Web Site:

2 Table of contents Chapter 1, Global market size of PCB, actual and forecast The market size of global PCB industry in 13 in amount 4 Cyclic market shrinkages in the past 6 Price trend of PCB and major PCB material 7 Global market size of PCB actual and forecast for 11 through 18 1 Global market size of PCB by layer-count for 11 through Total market SS PCB market DS PCB market Conventional ML PCB market (4-10 layers) 1-5 Conventional ML PCB market (12- layers) Conventional ML PCB market (22 layers and above) Build-up PCB market Other PCBs market IC package substrate market FPC and R-F PCB market 44 2 Global market size of PCB by application, actual and forecast for 11 through Total market Market of PCBs for computer related products Market of PCBs for communication infrastructure related equipment Market of PCBs for cellular phones Market of PCBs for consumer electronics Market of PCBs for automotive electronics Market of PCBs for industry, medical and office appliances Market of PCBs for military and aerospace equipment Market of substrates for IC package 80 Chapter 2, Major manufacturers market share in the global PCB market Major manufacturers market share in the global PCB market in 13 1 Major manufacturers share in the global PCB market by layer-count for 13 in amount Total market Motherboard market Conventional ML PCB market SS PCB market DS PCB market Conventional ML PCB market: 4 10 layers Conventional ML PCB market: 12 layers Conventional ML PCB market: 22 layers and above Build-up PCB market Other PCBs market IC package substrate market FPC and Rigid-Flex PCB market Major manufacturers share in the global PCB market by layer-count for 13 in volume Total market Motherboard market Conventional ML PCB market SS PCB market DS PCB market Conventional ML PCB market (4-10 layers) Conventional ML PCB market (12- layers) Conventional ML PCB market (22 layers and above) Build-up PCB market Other PCBs market 113

3 2-11 IC package substrate market FPC and Rigid-Flex PCB market Major manufacturers share in global PCB market by application for 13 in amount Total market PCB market for computer related products PCB market for telecommunication infrastructure related equipment PCB market for cellular phones PCB market for consumer electronics PCB market for automotive electronics PCB market for industry, medical and office appliances PCB market for military and aerospace related equipment IC package substrate market Major manufacturers share in the global market by application for 13 in volume Total market PCB market for computer related products PCB market for communication infrastructure related equipment PCB market for cellular phones PCB market for consumer electronics PCB market for automotive electronics PCB market for industry, medical and office appliances PCB market for military and aerospace related equipment IC package substrate market 137 Chapter 3, Global market trend of PCB materials 1 Copper clad laminate (CCL) 1-1 Classification and description of CCL Manufacturing site and capacity of major CCL manufacturers Market size of CCL, actual and forecast Sales status of major CCL manufacturers (13) Electro deposited copper foil (ED copper) 2-1 Major manufacturers Price range by thickness (13) Market size, actual and forecast for 11 through Manufacturers market share by application Breakdown by region - only for PCB application Dry film photoresist for the patterning 3-1 Manufacturers Price range (13) Market size, actual and forecast for 11 through Manufacturers share Breakdown by type Breakdown by region Photosensitive solder resist 4-1 Manufacturers and their products by application and type of resist Production site and capacity of major manufacturers Price range (13) Market size, actual and forecast for 11 through Manufacturers share Breakdown by region UV or thermo-set type solder resist 5-1 Manufacturers Price range (13) Market size, actual and forecast for 11 through Market share by manufacturer and type Breakdown by region 172

4 Chapter 4, Global market trend of PCB manufacturing equipment 1 Direct Imaging System 1-1 Market overview Major manufacturers and their systems Global market size of DI system, actual and forecast for 10 through Major DI system manufacturers sales and market share in 12 and Full-automatic exposure system 2-1 Market overview Major manufacturers and their systems Global market size of full-automatic exposure system, actual F/C for Sales of major full automatic exposure system manufacturers In unit In amount Laser drilling machine 3-1 Global market size of laser drilling machine, actual forecast for 10 to Sales and market share of laser drilling machine manufacturers Sales and market share of laser drilling machine manufacturers for Sales and market share of laser drilling machine manufacturers for Regional breakdown of sales of laser drilling machines Regional breakdown of sales of laser drilling machines for Regional breakdown of sales of laser drilling machines for Drilling machine 4-1 Global market size of drilling machine, actual F/C for 10 through Sales and market share of drilling machine manufacturers Sales and market share of drilling machine manufacturer for Sales and market share of drilling machine manufacturer for Regional breakdown of sales of drilling machines Regional breakdown of sales of drilling machines for Regional breakdown of sales of drilling machines for Bare-board tester 5-1 Market overview Major manufacturers and their testers Global market size of bare board tester, actual and forecast for 10 through Major bare board tester manufacturers sales and market share for In unit In amount Automatic optical inspection systems (AOI) 6-1 Market overview Major manufacturers and their systems Global market size of AOI system, actual and forecast for 10 through Major AOI system manufacturers sales and market share 228 Chapter 5, Disassembly of Galaxy S4 1 Exterior and dimensions X-ray imaging 2-1 Front side Backside Disassembly and study 3-1 Process 1 (Battery section) Process 2, (Battery plane) Main board (1)) Main board (2) FPC Connectors (1) Connectors (2) 240

5 4 Disassembly of main board 4-1 Observation of cross section Overall Detail observation of layer cross sections Observation of via holes in the layer Observation of the surface layer Observation of L/S and land (1) Observation of L/S and land (2) Observation of L/S and land (3) Observation of L/S and land (4) Observation of L/S and land (5) Observation of L/S and land (6) 250 Chapter 6, Case study CMK Corporation 253 Compeq Manufacturing Co. Ltd. 256 Daeduck Group 261 Gold Circuit Electronics Ltd. 265 HannStar Board Co., Ltd. 269 Ibiden Co/ Ltd. 279 Kingboard Chemical Holdings Ltd. 283 Kinsus Interconnect Technology Corp. 290 Kyoden Co., Ltd. 294 Meiko Electronics Co., Ltd. 297 Nippon Mektron Ltd. 300 Samsung Electro-Mechanics Co., Ltd. 305 Shinko Electric Industries Co., Ltd. 312 Tripod Technology Corporation 316 TTM technologies, Inc. 324 Unitech Printed Circuit Board Corporation 329 Viasystems Group, Inc. 339 WUS Printed Circuit Co., Ltd. 344 Young Poong Group 351 Zhen Ding Technology Holding Limited 356 Sample Contents PCB Application Fields Computer Products Communication Dev ices Consumer Electronics Automotiv e Electronics IC Packages Inf rastructure Cellular Phones Industry, Medical, Of f ice Appliances Military Aerospace PCB Application Fields Computer Products Communication Dev ices Consumer Electronics Automotiv e Electronics IC Packages Inf rastructure Cellular Phones Industry, Medical, Of f ice Appliances Military Aerospace

6 PCB Lay er Count Single-Sided Motherboards Double-Sided Motherboards Conv entional Multilay er Motherboards Laser Microv ia Motherboards The Other Motherboards* IC Package Substrates FPC R-F PCB 4-Lay er to 10-Lay er Boards 12-Lay er to -Lay er Boards 22-Lay er Higher-Lay er Boards PCB Lay er Count Single-Sided Motherboards Double-Sided Motherboards Conv entional Multilay er Motherboards Laser Microv ia Motherboards The Other Motherboards* IC Package Substrates FPC R-F PCB 4-Lay er to 10-Lay er Boards 12-Lay er to -Lay er Boards 22-Lay er Higher-Lay er Boards Corporate Name Headquarters Location Single- Sided Double- Sided Motherboards *α Conventional Multilayer 4L l 10L 12L l L 22L and Abov e Subtotal Laser Microv ia Others *β Subtotal IC Package Substrates FPC R-F PCB The Other Manufacturers - - Corporate Name Headquarters Location Single- Sided Double- Sided Motherboards *α Conventional Multilayer 4L l 10L 12L l L 22L and Abov e Subtotal Laser Microv ia Others *β Subtotal IC Package Substrates FPC R-F PCB The Other Manufacturers - -

7 Corporate Name Headquarters Location Computer Products Communication Devices Inf rastructure Cellular Phones Consumer Electronics Automotiv e Electronics Industry, Medical, Of f ice Appliances Military Aerospace IC Packages The Other Manufacturers The Other Manufacturers - Corporate Name Headquarters Location - Computer Products Communication Devices Inf rastructure Cellular Phones Some Contents of a Case Study Consumer Electronics Automotiv e Electronics Industry, Medical, Of f ice Appliances Military Aerospace IC Packages Single-Sided Double-Sided Computer Products Communication Devices Inf rastructure Cellular Phones Consumer Automotiv e Electronics Electronics Industry, Medical, Of f ice Appliances Military Aerospace IC Packages in MUSD Single-Sided Double-Sided Computer Products Communication Devices Inf rastructure Cellular Phones Consumer Automotiv e Electronics Electronics Industry, Medical, Of f ice Appliances Military Aerospace IC Packages in TSQM Printed Circuit Boards Motherboards *α Conv entional Multilay er IC Package Substrates FPC R-F PCB Laser Microvia Others *β SUB 4L - 10L 12L - L 22L and Above SUB 4L - 10L Conv entional 12L - L Motherboards *α Multilay er Printed 22L and Above Circuit SUB Boards Laser Microvia Others *β IC Package Substrates FPC R-F PCB SUB

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