MPXHZ6400A. Freescale Semiconductor Technical Data. MPXHZ6400A Rev 0, 08/2005
|
|
|
- Emily Rodgers
- 6 years ago
- Views:
Transcription
1 Freescale Semiconductor Technical Data Media Resistant and High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The Freescale series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale pressure sensor a logical and economical choice for the system designer. The series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Features Improved Accuracy at High Temperature Available in Small and Super Small Outline Packages 1.5% Maximum Error over 0 to 85 C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from 40 to +125 C Durable Thermoplastic (PPS) Surface Mount Package Typical Applications Industrial Controls Engine Control/Liquified Petroleum Gas (LPG) ORDERING INFORMATION Rev 0, 08/2005 INTEGRATED PRESSURE SENSOR 20 TO 400 kpa (3.0 TO 58 psi) 0.2 TO 4.8 V OUTPUT (3.0 TO 58 psi) SUPER SMALL OUTLINE PACKAGE C6T1 CASE 1317A-03 PIN NUMBERS (1) 1 N/C 5 N/C 2 V S 6 N/C 3 GND 7 N/C 4 V OUT 8 N/C 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. Device Type Options Case No. MPX Series Order No. Packing Options Device Marking Ported Element Absolute, Axial Port 1317A C6T1 Tape & Reel Freescale Semiconductor, Inc., All rights reserved.
2 V S Sensing Element Thin Film Temperature Compensation and Gain Stage #1 Gain Stage #2 and Ground Reference Shift Circuitry V out GND Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package devices Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings (1) Rating Symbol Value Unit Maximum Pressure P MAX 1600 kpa Storage Temperature T STG 40 to +125 C Operating Temperature T A 40 to +125 C Output Source Full Scale Output (2) I o madc Output Sink Minimum Pressure Offset 2 I o 0.5 madc 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from V out to GND or V out to V S in the application circuit. 2 Freescale Semiconductor
3 Table 2. Operating Characteristics (V S = 5.0 Vdc, T A = 25 C.) Characteristic Symbol Min Typ Max Unit Pressure Range P OP kpa Supply Voltage (1) V S Vdc Supply Current I o madc Minimum Pressure V S = 5.0 Volts (2) Full Scale V S = 5.0 Volts (3) Full Scale V S = 5.0 Volts (4) Accuracy (5) (0 to 85 C) (0 to 85 C) (0 to 85 C) (0 to 85 C) V off Vdc V FSO Vdc V FSS Vdc ±1.5 %V FSS Sensitivity V/P 12.1 mv/kpa Response Time (6) Warm-Up Time (7) Offset Stability (8) t R 1.0 ms 20 ms ±0.25 %V FSS 1. Device is ratiometric within this specified excitation range. 2. Offset (V off ) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25 C due to all sources of error including the following: Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 C. TcSpan:Output deviation over the temperature range of 0 to 85 C, relative to 25 C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 C, relative to 25 C. Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of V FSS, at 25 C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Semiconductor 3
4 Figure 2 illustrates a typical application circuit (output source current operation). Figure 3 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85 C temperature range. The output will saturate outside of the rated pressure range. A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application V 100 nf V S Pin 2 V OUT Pin 4 To ADC GND Pin 3 47 pf 51 K Figure 2. Typical Application Circuit (Output Source Current Operation) Transfer Function: V OUT = V S x ( xP ± Error V S = 5.0 V DC Temperature = 0 to 85 C Output (Volts) MAX TYP MIN Pressure (Reference to Sealed Vacuum) in kpa Figure 3. Output versus Absolute Pressure 4 Freescale Semiconductor
5 Transfer Function () Normal Transfer Value: V OUT = V S x ( x P ) ± Pressure Error x Temp. Factor x x V S V S = 5.0 ± 0.36 V DC Temperature Error Band 4.0 Temperature Error Factor Temperature in C NOTE: The Temperature Multiplier is a linear response from 0 C to -40 C and from 85 C to 125 C Break Points Temp Multiplier to Pressure Error Band Pressure Error (kpa) Error Limits for Pressure ±5.5 (kpa) Pressure (in kpa) Pressure Error (Max) 20 to 400 (kpa) ±5.5 (kpa) Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. SURFACE MOUNTING INFORMATION Minimum Recommended Footprint for Super Small Outline Packages TYP 8X TYP 8X inch 1.35 mm Figure 4. SSOP Footprint (Case 1317A) Freescale Semiconductor TYP
6 PACKAGE DIMENSIONS CASE 1317A-03 ISSUE C SUPER SMALL OUTLINE PACKAGE PAGE 1 OF 2 6 Freescale Semiconductor
7 PACKAGE DIMENSIONS CASE 1317A-03 ISSUE C SUPER SMALL OUTLINE PACKAGE PAGE 2 OF 2 Freescale Semiconductor 7
8 How to Reach Us: Home Page: USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH N. Alma School Road Chandler, Arizona or Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen Muenchen, Germany (English) (English) (German) (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo Japan or support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado or Fax: LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals, must be validated for each customer application by customer s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. Freescale Semiconductor, Inc All rights reserved. Rev. 0 08/2005
MPXH6250A SERIES. Freescale Semiconductor Technical Data MPXH6250A. Rev 2, 01/2007
Freescale Semiconductor Technical Data High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The
Freescale Semiconductor
Freescale Semiconductor High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The Freescale MPXxx6400A
Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated
Freescale Semiconductor Technical Data Rev 1, 05/2005 Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated The
ORDERING INFORMATION. Device Type Options Case No. MPX Series Order No. Packing Options Device Marking
Freescale Semiconductor Technical Data High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
Freescale Semiconductor Technical Data Rev 5, 05/2005 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The piezoresistive transducer is a state-of-the-art
ORDERING INFORMATION # of Ports Pressure Type Device Name
Freescale Semiconductor Data Sheet: Technical Data High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and
Freescale Semiconductor Data Sheet: Technical Data
Freescale Semiconductor Data Sheet: Technical Data High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
Freescale Semiconductor Technical Data Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The series piezoresistive transducer is a state-of-the-art monolithic
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
Freescale Semiconductor Technical Data Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The series piezoresistive transducers are state-of-the-art monolithic
MPXA6115A MPXH6115A SERIES. Freescale Semiconductor Technical Data MPXA6115A. Rev 3, 01/2007
Freescale Semiconductor Technical Data High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The
Freescale Semiconductor. Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MP3V5050.
Freescale Semiconductor Integrated Silicon Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The series piezoresistive transducer is a state-of-the-art monolithic silicon pressure
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
Freescale Semiconductor Technical Data Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The series piezoresistive transducers are state-of-the-art monolithic
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
Freescale Semiconductor Technical Data Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The series piezoresistive transducers are state-of-the-art monolithic
MPXH6300A, 20 to 300 kpa, Absolute, Integrated, Pressure Sensor
Freescale Semiconductor Document Number: Data Sheet: Technical Data Rev. 6.0, 09/2015, 20 to 300 kpa, Absolute, Integrated, Pressure Sensor Freescale's series sensor integrates on-chip, bipolar op amp
Freescale Semiconductor. Integrated Silicon Pressure Sensor, On-Chip Signal Conditioned, Temperature Compensated and Calibrated MP3V5004G.
Freescale Semiconductor Integrated Silicon Pressure Sensor, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The series piezoresistive transducer is a state-of-the-art monolithic silicon
MPXHZ6130A, 15 to 130 kpa, Absolute, Integrated Pressure Sensor
Freescale Semiconductor Document Number: Data Sheet: Technical Data Rev. 1.2, 06/2015, 15 to 130 kpa, Absolute, Integrated Pressure Sensor The series sensor integrates on-chip, bipolar op amp circuitry
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
Freescale Semiconductor Technical Data Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The /MPXV5050G series piezoresistive transducer is a state-of-theart
PCB Layout Guidelines for the MC1321x
Freescale Semiconductor Application Note Document Number: AN3149 Rev. 0.0, 03/2006 PCB Layout Guidelines for the MC1321x 1 Introduction This application note describes Printed Circuit Board (PCB) footprint
Upgrade the Solution With No Changes 2 Upgrade the Solution With No Changes If a Codebase does not contain updates to its properties, it is possible t
Freescale Semiconductor Application Note Document Number: AN3819 Rev. 0.0, 02/2009 Methods for Upgrading Freescale BeeStack Codebases 1 Introduction This note describes how to upgrade an existing Freescale
MP3V5050V, -50 to 0 kpa, Gauge Pressure Sensor
Freescale Semiconductor Document Number: Data Sheet: Technical Data Rev. 3.0, 09/2015, -50 to 0 kpa, Gauge Pressure Sensor The piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned,
MP3V5050, 0 to 50 kpa, Differential, and Gauge Pressure Sensor
NXP Semiconductors Document Number: Data Sheet: Technical Data Rev. 1.3, 11/2017, 0 to 50 kpa, Differential, and Gauge Pressure Sensor The series piezoresistive transducer is a state-of-the-art, monolithic
Freescale Semiconductor
Freescale Semiconductor High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXxx6115A series
Using the Multi-Axis g-select Evaluation Boards
Freescale Semiconductor Application Note Rev 2, 10/2006 Using the Multi-Axis g-select Evaluation Boards by: Michelle Clifford and John Young Applications Engineers Tempe, AZ INTRODUCTION This application
Mechanical Differences Between the 196-pin MAP-BGA and 196-pin PBGA Packages
Freescale Semiconductor Engineering Bulletin EB360 Rev. 1, 10/2005 Mechanical Differences Between the 196-pin MAP-BGA and 196-pin PBGA Packages This document describes the differences between the 196-pin
ORDERING INFORMATION. Device Marking MPXC2011DTI Tape and Reel 423A Date Code, Lot ID MPXC2012DTI Tape and Reel 423A Date Code, Lot ID
Freescale Semiconductor High Volume Sensor for Low Pressure Applications Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub-module
Using the Project Board LCD Display at 3.3 volts
Freescale Semiconductor SLK0100AN Application Note Rev. 0, 1/2007 By: John McLellan Applications Engineering Austin, TX 1 Introduction This document guides you through the steps necessary to use the LCD
MPC8349E-mITX-GP Board Errata
Freescale Semiconductor Document Number: MPC8349EMITX-GPBE Rev. 2, 01/2007 MPC8349E-mITX-GP Board Errata This document describes the known errata and limitations of the MPC8349E-mITX-GP reference platform.
Electrode Graphing Tool IIC Driver Errata Microcontroller Division
Freescale Semiconductor User Guide Addendum TSSEGTUGAD Rev. 1, 03/2010 Electrode Graphing Tool IIC Driver Errata by: Microcontroller Division This errata document describes corrections to the Electrode
HC912D60A / HC912Dx128A 0.5µ Microcontrollers Mask sets 2K38K, 1L02H/2L02H/3L02H & K91D, 0L05H/1L05H/2L05H
Freescale Semiconductor Engineering Bulletin EB664 Rev. 6, 08/2006 HC912D60A / HC912Dx128A 0.5µ Microcontrollers Mask sets 2K38K, 1L02H/2L02H/3L02H & K91D, 0L05H/1L05H/2L05H by: Devaganesan Rajoo HC12
Freescale Semiconductor. Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPX5010
Freescale Semiconductor Integrated Silicon Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPxx5010 series piezoresistive transducers are state-of-the-art monolithic silicon
ColdFire Convert 1.0 Users Manual by: Ernest Holloway
Freescale Semiconductor CFCONVERTUG Users Guide Rev.0, 09/2006 ColdFire Convert 1.0 Users Manual by: Ernest Holloway The ColdFire Convert 1.0 (CF) is a free engineering tool developed to generate data
56F8300 BLDC Motor Control Application
56F8300 BLDC Motor Control Application with Quadrature Encoder using Processor Expert TM Targeting Document 56F8300 16-bit Digital Signal Controllers 8300BLDCQETD Rev. 2 08/2005 freescale.com Document
Component Development Environment Installation Guide
Freescale Semiconductor Document Number: PEXCDEINSTALLUG Rev. 1, 03/2012 Component Development Environment Installation Guide 1. Introduction The Component Development Environment (CDE) is available as
Power Cycling Algorithm using the MMA73x0L 3-Axis Linear Accelerometer
Freescale Semiconductor Application Note Rev 1, 06/2007 Power Cycling Algorithm using the MMA73x0L 3-Axis Linear Accelerometer by: Kimberly Tuck Accelerometer Systems and Applications Engineering Tempe,
Using IIC to Read ADC Values on MC9S08QG8
Freescale Semiconductor Application Note AN3048 Rev. 1.00, 11/2005 Using IIC to Read ADC Values on MC9S08QG8 by Donnie Garcia Application Engineering Microcontroller Division 1 Introduction The MC9S08QG8
MC33696MODxxx Kit. 1 Overview. Freescale Semiconductor Quick Start Guide. Document Number: MC33696MODUG Rev. 0, 05/2007
Freescale Semiconductor Quick Start Guide Document Number: MC33696MODUG Rev. 0, 05/2007 MC33696MODxxx Kit by: Laurent Gauthier Toulouse, France 1 Overview This document provides introductory information
56F805. BLDC Motor Control Application with Quadrature Encoder using Processor Expert TM Targeting Document. 56F bit Digital Signal Controllers
56F805 BLDC Motor Control Application with Quadrature Encoder using Processor Expert TM Targeting Document 56F800 6-bit Digital Signal Controllers 805BLDCQETD Rev. 08/2005 freescale.com BLDC Motor Control
Ordering Information Industry standard SOT343R package Device weight = g (typical) Available only in tape and reel packaging Available only in
Freescale Semiconductor Technical Data Document Number: MBC13916/D Rev. 2.2, 05/2006 MBC13916 MBC13916 General Purpose SiGe:C RF Cascode Low Noise Amplifier 1 Introduction The MBC13916 is a costeffective,
MC33794 Touch Panel System Using E-Field Sensor Setup Instructions
Freescale Semiconductor MC33794SIUG User s Guide Rev. 1.0, 09/2005 MC33794 Touch Panel System Using E-Field Sensor Setup Instructions Reference Design Documentation for RDMC33794 This document contains
Gallium Arsenide PHEMT RF Power Field Effect Transistor
Technical Data Available at http://www.freescale.com/rf, Go to Tools Rev., 6/2005 Reference Design Library Gallium Arsenide PHEMT Power Field Effect Transistor Device Characteristics (From Device Data
Design Recommendations to Implement Compatibility Between the MC13783VK and the MC13783VK5
Freescale Semiconductor Application Note Document Number: AN3417 Rev. 0.1, 01/2010 Design Recommendations to Implement Compatibility Between the MC13783VK and the MC13783VK5 by: Power Management and Audio
Updating the Firmware on USB SPI Boards (KITUSBSPIEVME, KITUSBSPIDGLEVME)
Freescale Semiconductor User s Guide Document Number: KTUSBSPIPRGUG Rev. 1.0, 7/2010 Updating the Firmware on USB SPI Boards (KITUSBSPIEVME, KITUSBSPIDGLEVME) Figure 1. KITUSBSPIEVME and KITUSBSPIDGLEVME
USB Bootloader GUI User s Guide
Freescale Semiconductor User s Guide Document Number: MC9S08JS16UG Rev. 0, 10/2008 USB Bootloader GUI User s Guide by: Derek Liu Applications Engineering China 1 Overview The MC9S08JS16 (JS16) supports
MC33897 Single-Wire CAN Transceiver Reliability and Quality Documents
Freescale Semiconductor Reliability & Qualifications RQA33897 Rev. 2.0, 8/2006 MC33897 Single-Wire CAN Transceiver Reliability and Quality Documents The device(s) in this document successfully completed
SGTL5000 I 2 S DSP Mode
Freescale Semiconductor Application Note Document Number: AN3664 Rev. 2, 11/2008 SGTL5000 I 2 S DSP Mode by Name of Group Freescale Semiconductor, Inc. Austin, TX 1 Description SGTL5000 supports multiple
Functional Differences Between the DSP56307 and DSP56L307
Freescale Semiconductor Engineering Bulletin EB361 Rev. 3, 10/2005 Functional Differences Between the DSP56307 and DSP56L307 The DSP56307 and DSP56L307, two members of the Freescale DSP56300 family of
MPC7410 RISC Microprocessor Hardware Specifications Addendum for the MPC7410TxxnnnLE Series
Freescale Semiconductor Technical Data Document Number: MPC7410ECS08AD Rev. 1, 11/2010 MPC7410 RISC Microprocessor Hardware Specifications Addendum for the MPC7410TxxnnnLE Series This document describes
MC56F825x/MC56F824x (2M53V) Chip Errata
Freescale Semiconductor MC56F825XE_2M53V Chip Errata Rev. 1, 05/2012 MC56F825x/MC56F824x (2M53V) Chip Errata The following errata items apply to devices of the maskset 2M53V. 2012 Freescale Semiconductor,
Optically-Isolated Multilink BDM Interface for the S08/S12 Microcontrollers by Michael A. Steffen
Freescale Semiconductor Application Note AN3589 Rev. 0, 02/2008 Optically-Isolated Multilink BDM Interface for the S08/S12 Microcontrollers by Michael A. Steffen 1 Introduction This application note explains
MBC13720 SiGe:C Low Noise Amplifier with Bypass Switch Device
Freescale Semiconductor Data Sheet: Technical Data Document Number: MBC13720 Rev. 4, 09/2011 MBC13720 MBC13720 SiGe:C Low Noise Amplifier with Bypass Switch Device MBC13720NT1 1 1 Refer to Table 1. Package
etpu General Function Set (Set 1) David Paterson MCD Applications Engineer
Freescale Semiconductor Application Note Document Number: AN2863 Rev. 0, 12/2007 etpu General Function Set (Set 1) by David Paterson MCD Applications Engineer 1 Introduction This application note complements
Interfacing MPC5xx Microcontrollers to the MFR4310 FlexRay Controller David Paterson MCD Applications, East Kilbride
Freescale Semiconductor Application Note Document Number: AN3256 Rev. 2, 2/2008 Interfacing MPC5xx Microcontrollers to the MFR4310 FlexRay Controller by: David Paterson MCD Applications, East Kilbride
Functional Differences Between DSP56302 and DSP56309 (formerly DSP56302A)
Freescale Semiconductor Engineering Bulletin EB346 Rev. 3, 10/2005 Functional Differences Between DSP56302 and DSP56309 (formerly DSP56302A) To meet the increasing demands for higher performance and lower
MPC8260 IDMA Timing Diagrams
Freescale Semiconductor Application Note Document Number: AN2177 Rev. 4, 07/2006 MPC8260 IDMA Timing Diagrams By DSD Applications, NCSG Freescale Semiconductor, Inc. The MPC8260 PowerQUICC II integrated
MPC5200(b) ATA MDMA, UDMA Functionality BestComm Setup Recommendations
Freescale Semiconductor Engineering Bulletin Document Number: EB711 Rev. 0, 05/2009 MPC5200(b) ATA MDMA, UDMA Functionality BestComm Setup Recommendations by: Peter Kardos Application Engineer, Roznov
EchoRemote Evaluation Software for Windows
Freescale Semiconductor Application Note Document Number: AN2953 Rev.1, 05/2007 EchoRemote Evaluation Software for Windows 1 Overview EchoRemote is a Microsoft Windows program that communicates with the
etpu Automotive Function Set (Set 2)
Freescale Semiconductor Application Note Document Number: AN3768 Rev. 0, 05/2009 etpu Automotive Function Set (Set 2) by: Geoff Emerson East Kilbride U.K. 1 Introduction This application note complements
56F805. Digital Power Factor Correction using Processor Expert TM Targeting Document. 56F bit Digital Signal Controllers. freescale.
56F805 Digital Power Factor Correction using Processor Expert TM Targeting Document 56F800 6-bit Digital Signal Controllers 805DPFCTD Rev. 0 08/2005 freescale.com Digital Power Factor Correction This
Using the PowerQUICC II Auto-Load Feature
Freescale Semiconductor Application Note Document Number: AN3352 Rev. 0, 01/2007 Using the PowerQUICC II Auto-Load Feature by David Smith/Patrick Billings Field Application Engineering/DSD Applications
Symphony SoundBite: Quick Start with Symphony Studio. Installation and Configuration
Symphony SoundBite: Quick Start with Symphony Studio Installation and Configuration Document Number: DSPB56371UGQS Rev. 2 September 2008 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com
MCF5216 Device Errata
Freescale Semiconductor Device Errata MCF5216DE Rev. 1.7, 09/2004 MCF5216 Device Errata This document identifies implementation differences between the MCF5216 processor and the description contained in
Freescale BeeStack Documentation Overview Document Number: BSDO Rev /2008
Freescale BeeStack Documentation Overview Document Number: BSDO Rev. 1.0 04/2008 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale
Interfacing HCS12 Microcontrollers to the MFR4200 FlexRay Controller
Freescale Semiconductor Application Note AN3216 Rev. 0, 2/2006 Interfacing HCS12 Microcontrollers to the MFR4200 FlexRay Controller by: David Paterson MCD Applications, East Kilbride 1 Introduction Freescale
Managing Failure Detections and Using Required Components to Meet ISO7637 pulse 1 on MC33903/4/5 Common Mode Choke Implementation
Freescale Semiconductor Application Note AN3865 Rev. 1.0, 2/2010 Managing Failure Detections and Using Required Components to Meet ISO7637 pulse 1 on MC33903/4/5 Common Mode Choke Implementation 1 Overview
56F Phase AC Induction Motor V/Hz Control using Processor ExpertTM Targeting Document 56F bit Digital Signal Controllers
56F8300 3-Phase AC Induction Motor V/Hz Control using Processor Expert TM Targeting Document 56F8300 16-bit Digital Signal Controllers 8300ACIMTD Rev. 1 08/2005 freescale.com Document Revision History
Introduction to LIN 2.0 Connectivity Using Volcano LTP
Freescale Semiconductor White Paper LIN2VOLCANO Rev. 0, 12/2004 Introduction to LIN 2.0 Connectivity Using Volcano LTP by: Zdenek Kaspar, Jiri Kuhn 8/16-bit Systems Engineering Roznov pod Radhostem, Czech
Pad Configuration and GPIO Driver for MPC5500 Martin Kaspar, EMEAGTM, Roznov Daniel McKenna, MSG Applications, East Kilbride
Freescale Semiconductor Application Note Document Number: AN2855 Rev. 0, 2/2008 Pad Configuration and GPIO Driver for MPC5500 by: Martin Kaspar, EMEAGTM, Roznov Daniel McKenna, MSG Applications, East Kilbride
Clock Mode Selection for MSC8122 Mask Set K98M
Freescale Semiconductor Application Note AN2904 Rev. 0, 11/2004 Clock Mode Selection for MSC8122 Mask Set K98M By Donald Simon and Wes Ray This application note describes the MSC8122 clock modes for mask
MTIM Driver for the MC9S08GW64
Freescale Semiconductor Application Note Document Number: AN4160 Rev. 0, 8/2010 MTIM Driver for the MC9S08GW64 by: Tanya Malik Reference Design and Applications Group India IDC MSG NOIDA 1 Introduction
Affected Chips Description Impact and Workaround
Freescale Semiconductor MC56F8013E Rev. 3, 08/2007 56F8013 Preliminary Chip 56F8013 Digital Signal Controller numbers are in the form n.m, where n is the number of the errata item and m identifies the
Rating Symbol Value Unit Drain-Source Voltage V DSS 15 Vdc Total Device T C = 25 C Derate above 25 C
Technical Data Document Number: MRFG35003N Rev. 5, 1/2008 replaced by MRFG35003ANT1. Gallium Arsenide PHEMT RF Power Field Effect Transistor Designed for WLL/MMDS/BWA or UMTS driver applications with frequencies
MPR121 Jitter and False Touch Detection
Freescale Semiconductor Application Note Rev 1, 03/2010 MPR121 Jitter and False Touch Detection INTRODUCTION Touch acquisition takes a few different parts of the system in order to detect touch. The baseline
Contact Monitoring and Dual Low-Side Protected Driver
Freescale Semiconductor Technical Data Contact Monitoring and Dual Low-Side Protected Driver The interfaces between switch contacts and a microcontroller. Eight switch-to-battery (or switch-to-ground)
Migrating from the MPC852T to the MPC875
Freescale Semiconductor Application Note Document Number: AN2584 Rev. 1, 1/2007 Migrating from the MPC852T to the MPC875 by Ned Reinhold NCSD Applications Freescale Semiconductor, Inc. Austin, TX This
56F Phase Switched Reluctance Motor Control With Hall Sensors using Processor Expert Targeting Document
56F8300 3-Phase Switched Reluctance Motor Control With Hall Sensors using Processor Expert Targeting Document MC56F8300 16-bit Digital Signal Controllers 8300SRMHSTD Rev. 0 2/2005 freescale.com Document
Programming the Keyboard Interrupt Module (KBI) on HC(S)08 MCUs
Freescale Semiconductor Application Note AN2900 Rev. 0, 01/2005 Programming the Keyboard Interrupt Module (KBI) on HC(S)08 MCUs by: Gabriel Sanchez Barba RTAC Americas Mexico Overview This document is
XGATE Library: ATD Average Calculating a rolling average from ATD results
Freescale Semiconductor Application Note AN3226 Rev. 0, 2/2006 XGATE Library: ATD Average Calculating a rolling average from ATD results by: Steve McAslan MCD Applications, East Kilbride 1 Introduction
DSP56F827 Digital Signal Controller
Freescale Semiconductor DSP56F827E Rev. 8.0, 12/2005 56F827 Chip Errata DSP56F827 Digital Signal Controller This document reports errata information on chip revision B. Errata numbers are in the form n.m,
MCF5445x Configuration and Boot Options Michael Norman Microcontroller Division
Freescale Semiconductor Application Note Document Number: AN3515 Rev. 1, 04/2008 MCF5445x Configuration and Boot Options by: Michael Norman Microcontroller Division 1 Configuration Modes The Freescale
Using the Knock Window etpu Function
Freescale Semiconductor Application Note Document Number: AN3772 Rev. 0, 05/2009 Using the Knock Window etpu Function by: David Paterson 1 Introduction This application note provides simple C interface
2005: 0.5 PQ-MDS-PCIEXP
HW Getting Started Guide PQ-MDS-PCIEXP Adaptor December 2005: Rev 0.5 PQ-MDS-PCIEXP Adaptor HW Getting Started Guide Step 1:Check HW kit contents 1.PQ-MDS-PCIEXP Adaptor 2.PIB (Platform I/O Board) to PCIEXP
Implementing a Double-Precision (32-Bit) Complex FIR Filter on the MSC8101 Device
Freescale Semiconductor Application Note AN2208 Rev. 2, 12/2004 Implementing a Double-Precision (32-Bit) Complex FIR Filter on the MSC8101 Device By Tina Redheendran This document describes an optimized
MPR083 Proximity Evaluation Kit User s Guide
Freescale Semiconductor User s Guide Rev 2, 04/2008 MPR083 Proximity Evaluation Kit User s Guide by: Laura Salhuana Introduction This guide will aid you in connecting the MPR083 Evaluation Kit Board to
Using the CAU and mmcau in ColdFire, ColdFire+ and Kinetis
Freescale Semiconductor Document Number: AN4307 Application Note Rev. Rev.0, 5/ 2011 Using the CAU and mmcau in ColdFire, ColdFire+ and Kinetis by: Paolo Alcantara RTAC Americas Mexico 1 Introduction This
Freescale Semiconductor, I
SEMICONDUCTOR APPLICATION NOTE Order this document by AN65/D Prepared by: Bill Lucas and Warren Schultz A plug in module that is part of a systems development tool set for pressure sensors is presented
MPR121 Proximity Detection
Freescale Semiconductor Application Note Rev 0, 03/2010 MPR121 Proximity Detection INTRODUCTION MPR121 is a feature rich, second generation touch sensor controller after Freescale s initial release of
Introduction to the S12G Family EEPROM Including a Comparison between the S08DZ, S12XE, and S12P Families
Freescale Semiconductor Application Note Document Number: AN4302 Rev. 0, 04/2011 Introduction to the S12G Family EEPROM Including a Comparison between the S08DZ, S12XE, and S12P Families by: Victor Hugo
Utilizing Extra FC Credits for PCI Express Inbound Posted Memory Write Transactions in PowerQUICC III Devices
Freescale Semiconductor Application Note Document Number: AN3781 Rev. 0, 06/2009 Utilizing Extra FC Credits for PCI Express Inbound Posted Memory Write Transactions in PowerQUICC III Devices This application
XGATE Library: Using the Freescale XGATE Software Library Steve McAslan MCD Applications, East Kilbride
Freescale Semiconductor Application Note AN3145 Rev. 0, 2/2006 XGATE Library: Using the Freescale XGATE Software Library by: Steve McAslan MCD Applications, East Kilbride 1 Introduction The Freescale S12X
TLB Translation Setup for MPC745x and MPC744x in Non-Extended Mode
Freescale Semiconductor Application Note AN2796 Rev. 1, 5/2006 TLB Translation Setup for MPC745x and MPC744x in Non-Extended Mode by Amanuel Belay Computing Platform Division Freescale Semiconductor, Inc.
Mask Set Errata for Mask 2M40J
Mask Set Errata MSE9S08QE8_2M40J Rev. 3, 8/2010 Mask Set Errata for Mask 2M40J Introduction This report applies to mask 2M40J for these products: MC9S08QE8 MCU device mask set identification The mask set
16-bit MCU: S12XHY256 Automotive Cluster Demo by: Jose M. Cisneros Steven McLaughlin Applications Engineer Microcontroller Solutions Group, Scotland
Freescale Semiconductor Users Guide Document Number: S12XHY256ACDUG Rev. 0, 10/2010 16-bit MCU: S12XHY256 Automotive Cluster Demo by: Jose M. Cisneros Steven McLaughlin Applications Engineer Microcontroller
IIC Driver for the MC9S08GW64
Freescale Semiconductor Application Note Document Number: AN4158 Rev. 0, 8/2010 IIC Driver for the MC9S08GW64 by: Tanya Malik Reference Design and Applications Group Noida India 1 Introduction This document
Differences Between the DSP56301, DSP56311, and DSP56321
Freescale Semiconductor Engineering Bulletin Document Number: EB724 Rev. 0, 11/2009 Differences Between the DSP56301, DSP56311, and DSP56321 This engineering bulletin discusses the differences between
Use of PGA on MC56F800x Interaction of PDB, PGA and ADC
Freescale Semiconductor Document Number: AN4334 Application Note Rev. 0, 03/2012 Use of PGA on MC56F800x Interaction of PDB, PGA and ADC by: William Jiang System and Application, Microcontroller Solutions
Simplified Device Data Structures for the High-End ColdFire Family USB Modules Melissa Hunter Applications Microcontroller Solutions Group
Freescale Semiconductor Application Note Document Number: AN3631 Rev. 0, 03/2008 Simplified Device Data Structures for the High-End ColdFire Family USB Modules by: Melissa Hunter Applications Microcontroller
Mask Set Errata for Mask 5L35K
Freescale Semiconductor MSE908GR16_5L35K Mask Set Errata Rev. 2, 12/2010 Mask Set Errata for Mask 5L35K Introduction This report applies to mask 5L35K for these products: MC68HC908GR16 The mask set is
MPC7455 RISC Microprocessor Hardware Specifications Addendum for the XPC74n5RXnnnNx Series
Freescale Semiconductor Advance Information Document Number: MPC7455ECS02AD Rev. 1.2, 10/2005 MPC7455 RISC Microprocessor Hardware Specifications Addendum for the XPC74n5RXnnnNx Series This document describes
SynkroRF Network. User s Guide
SynkroRF Network User s Guide Document Number: SYNKROUG Rev. 1.2 06/2011 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor
MPC8260 SDRAM Timing Diagrams
Freescale Semiconductor Application Note Document Number: AN2178 Rev. 2, 07/2006 MPC8260 SDRAM Timing Diagrams The MPC8260 PowerQUICC II integrated communications processor provides one SDRAM interface