MPXHZ6130A, 15 to 130 kpa, Absolute, Integrated Pressure Sensor
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1 Freescale Semiconductor Document Number: Data Sheet: Technical Data Rev. 1.2, 06/2015, 15 to 130 kpa, Absolute, Integrated Pressure Sensor The series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The sensor's packaging has been designed to provide resistance to high humidity conditions as well as common automotive media. The small form factor and high reliability of on-chip integration make this pressure sensor a logical choice for the system designer. The series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Features 1.5% maximum error over 0 C to 85 C Resistant to high humidity and common automotive media Improved accuracy at high temperature Ideally suited for microprocessor or microcontroller-based systems Temperature compensated from -40 C to +125 C Durable thermoplastic (PPS) surface mount package Typical applications Aviation altimeters Industrial controls Engine control/manifold absolute pressure (MAP) Weather stations and weather reporting devices Super small outline packages 6U Case 98ARH99066A Top view C6U Case 98ARH99089A V OUT GND V S Pin 1 identification, chamfered corner Pinout Ordering information Part number Shipping Package # of Ports Pressure type Device None Single Dual Gauge Differential Absolute marking Small Outline Package ( series) 6U Rail 98ARH99066A C6U Rail 98ARH99089A Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products , 2012, 2015 Freescale Semiconductor, Inc. All rights reserved.
2 Contents 1 General Description Block diagram Pinout Mechanical and Electrical Specifications Maximum ratings Operating characteristics On-chip Temperature Compensation and Calibration Package Information Minimum recommended footprint for super small packages Package dimensions Revision History Related Documentation The device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: 2. In the Keyword search box at the top of the page, enter the device number. 3. In the Refine Your Result pane on the left, click on the Documentation link. 2 Freescale Semiconductor, Inc.
3 1 General Description 1.1 Block diagram Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. V S Sensing Element Thin Film Temperature Compensation and Gain Stage #1 Gain Stage #2 and Ground Reference Shift Circuitry V OUT GND Pins 1, 5, 6, 7, and 8 are internal device connections. Do. not connect to external circuitry or ground. Figure 1. Fully integrated pressure sensor schematic 1.2 Pinout V OUT GND 7 2 V S 8 1 Pin 1 identification, chamfered corner Figure 2. Device pinout (top view) Table 1. Pin functions Pin Name Function 1 Do not connect to external circuitry or ground. Pin 1 is denoted by chamfered corner. 2 V S Voltage supply 3 GND Ground 4 V OUT Output voltage 5 Do not connect to external circuitry or ground. 6 Do not connect to external circuitry or ground. 7 Do not connect to external circuitry or ground. 8 Do not connect to external circuitry or ground. Freescale Semiconductor, Inc. 3
4 2 Mechanical and Electrical Specifications 2.1 Maximum ratings Table 2. Maximum ratings (1) Rating Symbol Value Units Maximum pressure (P1 > P2) P max 400 kpa Storage temperature T stg -40 to +125 C Operating temperature T A -40 to +125 C Output source full-scale output (2) I o madc Output sink minimum pressure offset (2) I o madc 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.Maximum output current is controlled by effective impedance from V OUT to Gnd or V OUT to V S in the application circuit. 2.2 Operating characteristics Table 3. Operating characteristics (V S = 5.0 Vdc, T A = 25 C unless otherwise noted, P1 > P2). Characteristic Symbol Min Typ Max Unit Pressure range P OP kpa Supply voltage (1) 1.Device is ratiometric within this specified excitation range. V S Vdc Supply current I o madc Minimum pressure offset V S = 5.0 Volts (0 C to 85 C) Full-scale output V S = 5.0 Volts (0 C to 85 C) Full-scale span V S = 5.0 Volts (0 C to 85 C) Accuracy V S = 5.0 Volts (0 C to 85 C) 2.Offset (V off ) is defined as the output voltage at the minimum rated pressure. 3.Full-scale output (V FSO ) is defined as the output voltage at the maximum or full rated pressure. V off Vdc V FSO Vdc V FSS Vdc 4.Full-scale span (V FSS ) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the minimum rated pressure. 5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25 C due to all sources of error including the following: Linearity: Temperature Hysteresis: Pressure Hysteresis: TcSpan: TcOffset: ±1.5 %V FSS Sensitivity V/P 39.2 mv/kpa Response time (6) Warm-up time (7) Offset stability (8) t R 1.0 ms 20 ms ±0.25 %V FSS Output deviation from a straight line relationship with pressure over the specified pressure range. Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25 C. Output deviation over the temperature range of 0 C to 85 C, relative to 25 C. Output deviation with minimum pressure applied, over the temperature range of 0 C to 85 C, relative to 25 C. 6.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to at specified step change in pressure. 7. Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8.Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. 4 Freescale Semiconductor, Inc.
5 3 On-chip Temperature Compensation and Calibration Figure 5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85 C temperature range. The output will saturate outside of the rated pressure range. A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The gel die coat and durable polymer package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as environments containing common automotive media. Contact the factory for more information regarding media compatibility in your specific application. Fluorosilicone Gel Die Coat Wire Bond P1 Die Stainless Steel Cap Thermoplastic Case Lead Frame Absolute Element Die Bond Sealed Vacuum Reference Figure 3. Cross-sectional diagram SSOP (not to scale) +5 V V S 100 nf V OUT to ADC GND 47 pf 51 K Figure 4. Recommended power supply decoupling and output filtering Transfer Function: V out = V S x ( x P (kpa) ) ±(PE x TM x V S x ) MAX Output (Volts) 3.5 PE = ±1.725 kpa 3.0 TM = 0 to 85 C 2.5 V S = 5.0 Vdc TYP MIN Pressure (ref: to sealed vacuum) in kpa Figure 5. Output vs. absolute pressure Freescale Semiconductor, Inc. 5
6 Nominal Transfer Value: V OUT = V S x ( x P (kpa) ) ± (Pressure Error x Temp. factor x x V S ) V S = 5.0 ± 0.25 Vdc Figure 6. Transfer function Temperature Error Factor Break Points Temp Multiplier to Temperature in C NOTE: The temperature multiplier is a linear response from 0 C to -40 C and from 85 C to 125 C Figure 7. Temperature error band 3.0 Error Limits for Pressure 2.0 Pressure Error (kpa) Pressure (in kpa) Pressure Error (Max) 15 to 130 (kpa) ±1.725 (kpa) Figure 8. Pressure error band 6 Freescale Semiconductor, Inc.
7 4 Package Information 4.1 Minimum recommended footprint for super small packages Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts TYP TYP 8X TYP 8X 1.35 inch mm Figure 9. SSOP footprint Freescale Semiconductor, Inc. 7
8 4.2 Package dimensions This drawing is located at Case 98ARH99066A, 8-lead super small outline package 8 Freescale Semiconductor, Inc.
9 Case 98ARH99066A, 8-lead super small outline package Freescale Semiconductor, Inc. 9
10 Case 98ARH99066A, 8-lead super small outline package 10 Freescale Semiconductor, Inc.
11 This drawing is located at Case 98ARH99089A, 8-lead ported super small outline package Freescale Semiconductor, Inc. 11
12 Case 98ARH99089A, 8-lead ported super small outline package 12 Freescale Semiconductor, Inc.
13 5 Revision History Table 4. Revision history Revision number Revision date Description /2012 Updated package drawing 98ARH99066A was Rev. F, updated to Rev. H /2015 Updated format. Updated package drawing 98ARH99089A was Rev D, updated to Rev G. Freescale Semiconductor, Inc. 13
14 How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including typicals, must be validated for each customer application by customer s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners , 2012, 2015 Freescale Semiconductor, Inc. Document Number: Rev /2015
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