MP3V5050V, -50 to 0 kpa, Gauge Pressure Sensor
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1 Freescale Semiconductor Document Number: Data Sheet: Technical Data Rev. 3.0, 09/2015, -50 to 0 kpa, Gauge Pressure Sensor The piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. The is optimized to perform with vacuum pressures on the P1 port. Small outline package Features 2.5% maximum error over 0 C to 85 C Ideally suited for microprocessor or microcontroller-based systems Temperature compensated over -40 C to +125 C Patented silicon shear stress strain gauge Durable thermoplastic (PPS) surface mount package Ideal for automotive and non-automotive applications Case 98ASB17757C Top view Application examples Pump/motor control Robotics Level detectors Medical diagnostics Pressure switching Blood pressure measurement Pin 1 identification: notch Pinout 4 V OUT 3 GND 2 V S 1 Ordering Information Part number Shipping Package # of Ports Pressure type Device None Single Dual Gauge Differential Absolute marking C6U Rail 98ASB17757C Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 2008, 2010, 2015 Freescale Semiconductor, Inc. All rights reserved.
2 Contents 1 General Description Block diagram Pinout Mechanical and Electrical Specifications Maximum Ratings Operating Characteristics On-chip Temperature Compensation and Calibration Package Information Minimum recommended footprint for surface mounted applications Package dimensions Revision History Related Documentation The device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: 2. In the Keyword search box at the top of the page, enter the device number. 3. In the Refine Your Result pane on the left, click on the Documentation link. 3 Freescale Semiconductor, Inc.
3 1 General Description 1.1 Block diagram Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. V S 2 Sensing Element Thin Film Temperature Compensation and Gain Stage #1 Gain Stage #2 and Ground Reference Shift Circuitry 4 V OUT 3 GND Pins 1, 5, 6, 7, and 8 are NO CONNECTS Figure 1. Fully integrated pressure sensor block diagram 1.2 Pinout 5 4 V OUT 6 3 GND 7 2 V S 8 1 Pin 1 identification: notch Figure 2. Device pinout (top view) Table 1. Pin functions Pin Name Function 1 Do not connect to external circuitry or ground. Pin 1 is notated by the notch in the lead. 2 V S Voltage supply 3 GND Ground 4 V OUT Output voltage 5 Do not connect to external circuitry or ground. 6 Do not connect to external circuitry or ground. 7 Do not connect to external circuitry or ground. 8 Do not connect to external circuitry or ground. Freescale Semiconductor, Inc. 5
4 2 Mechanical and Electrical Specifications 2.1 Maximum ratings Table 2. Maximum ratings (1) Rating Symbol Value Unit Maximum pressure (P1 > P2) P max 200 kpa Storage temperature T stg -40 to +125 C Operating temperature T A -40 to +125 C 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.2 Operating characteristics Table 3. Operating characteristics (V S = 3.0 V DC, T A = 25 C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure range P OP 50 0 kpa Supply voltage (1) V S V DC Supply current I O madc Full-scale output (2) (0 to 85 V S = 3.0 Volts, (P diff = 0 kpa) Full-scale span (3) (0 C to 85 V S = 3.0 Volts Accuracy (4) (0 C to 85 C) V FSO V DC V FSS 2.7 V DC ±2.5 %V FSS Sensitivity V/P 54 - mv/kpa Response time (5) Warm-up time (6) Offset stability (7) t R ms 20 - ms ±0.5 - %V FSS Pressure offset (8) 1.Device is ratiometric within this specified excitation range. 2.Full-scale output (V FSO ) is defined as the output voltage at the maximum or full-rated pressure. 3.Full-scale span (V FSS ) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the minimum rated pressure. 4.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25 C due to all sources of errors, including the following: Linearity: Temperature hysteresis: Pressure hysteresis: TcSpan: TcOffset: (0 C to 85 C) Output deviation from a straight line relationship with pressure over the specified pressure range. Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25 C. Output deviation over the temperature range of 0 C to 85 C, relative to 25 C. Output deviation with minimum pressure applied, over the temperature range of 0 C to 85 C, relative to 25 C. 5. Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7.Offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test. 8.Offset (V OFF ) is defined as the output voltage at the minimum rated pressure. V OFF V DC 6 Freescale Semiconductor, Inc.
5 3 On-chip Temperature Compensation and Calibration Figure 3 illustrates the differential/gauge sensing chip in the basic chip carrier. Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 C to 85 C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. The is optimized to perform in vacuum pressures applied to port P1. The sensor is calibrated and temperature compensated to give a positive electrical output upon measuring a vacuum pressure up to the rated pressure of up to -50 kpa where the output will be the full-scale voltage listed in Table 3. Wire Bond Fluorosilicone Gel Die Coat P1 Die Stainless Steel Cap Thermoplastic Case Lead Frame P2 Differential Sensing Element Die Bond Figure 3. Cross-sectional diagram SOP (not-to-scale) 3 V V OUT OUTPUT V S 0.01 μf or 0.1 μf 1.0 μf IPS GND 470 pf Figure 4. Recommended power supply decoupling and output filtering Freescale Semiconductor, Inc. 7
6 3 2 Transfer Function: V OUIT = V S x (0.018 x P ) ± (PE x TM x x V S ) V S = 3.0 ± 0.30 V DC PE = 1.25 TM = 1 Temperature = 0 to 85 C Output Voltage (V) 1 MAX MIN TYPICAL Span Range (Typ) Output Range (Typ) Pressure (kpa) Offset (Typ) Figure 5. Output vs. pressure differential Nominal Transfer Value: V OUT = V S x (0.018 x P ) ± (Pressure Error x Temp Multi x x V S ) V S = 3.0 ± 0.3 V Figure 6. Transfer function Temperature Error Factor Temp Break Points Multiplier to Temperature in C NOTE: The Temperature Multiplier is a linear response from 0 C to -40 C and from 85 C to 125 C. Figure 7. Temperature error band 8 Freescale Semiconductor, Inc.
7 Error Limits for Pressure 1.25 Pressure Error (kpa) Pressure (in kpa) Pressure Error (Max) 50 to 0 kpa ±1.25 kpa Figure 8. Pressure error band Freescale Semiconductor, Inc. 9
8 4 Package Information 4.1 Minimum recommended footprint for surface mounted applications Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts TYP TYP 8X TYP 8X 2.54 inch mm Figure 9. SOP footprint 10 Freescale Semiconductor, Inc.
9 4.2 Package dimensions This drawing is located at N B J 5 8 A S V 4 1 G C D 8 PL 0.25 (0.010) M T B S A S W H T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MILLIMETERS DIM MIN MAX MIN MAX A B C D G BSC 2.54 BSC H J K M N S V W K M PIN 1 IDENTIFIER SEATING PLANE Case 98ASB17757C, small outline package Freescale Semiconductor, Inc. 11
10 5 Revision History Table 4. Revision history Revision number Revision date /2015 Updated format. Deleted part number C6T1. Added vacuum pressure information to section 3. Description 12 Freescale Semiconductor, Inc.
11 How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including typicals, must be validated for each customer application by customer s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. 2008, 2010, 2015 Freescale Semiconductor, Inc. Document Number: Rev /2015
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