AMD64 with Direct Connect Architecture A Solid Foundation for Dense Compute Environments Jeff Underhill HPC Business Development (CPG)

Transcription

1 64 with Direct Connect Architecture A Solid Foundation for Dense Compute Environments Jeff Underhill HPC Business Development (CPG) August 04

2 Agenda 1. Corporate Overview 2. Dense Computing Overview (some driving factors) 3. What s s Role In Dense Compute Environments? Product Overview & Positioning 5. What is 64 with Direct Connect Architecture? 6. Power, Performance & Density What s Next? 7. Examples Built On an 64 Technology Foundation 8. Q&A A test that you were all listening! 9. Ed Gasiorowski Opteron Power Advantage August 13, 2004 Computation Products Group - High Density Data Center Committee 2

3 Corporate Overview

4 Overview 35 years of Innovation Founded: 1969 Headquarters: Sunnyvale, Calif. Employees: 14,400 worldwide Sales Mix: >75% international Business Units Q2 04 Revenue($M) Microprocessors $554 Flash Memory $673 Other $34 Total: $1.262 billion 2003 Revenue: $3.5 billion Major Operations Sunnyvale, CA Austin, TX Dresden, Germany Penang, Malaysia Aizu-Wakamatsu, Japan Bangkok, Thailand Singapore Suzhou, China August 13, 2004 Computation Products Group - High Density Data Center Committee 4

5 Worldwide Operations Boston, Mass. Boston Design Center Sunnyvale, California Global HQ Submicron Development Center FASL LLC (Spansion brand) HQ Frimley, UK European Service Center Bangkok, Thailand Flash Memory Assembly and Test Aizu-Wakamatsu/Tokyo, Japan Flash Memory Fabs: JV1, 2, 3 FASL Japan HQ Austin, Texas Fab 25 Flash Memory Computations Product Group Personal Connectivity Solutions Group Dresden, Germany Fab 30 Microprocessors Dresden Design Center Penang/Kuala Lumpur, Malaysia Microprocessor and Flash Assembly, Test and Packaging Suzhou, China Flash Memory Assembly and Test Singapore Microprocessor Assembly, Test and Packaging August 13, 2004 Computation Products Group - High Density Data Center Committee 5

6 Industry Leadership is a global supplier of integrated circuits for the personal and enterprise computing, communications and consumer electronic markets 1. CPG - Leading the industry s transition to pervasive 64-bit computing with the 64 family of microprocessors 2. FASL - #1 in NOR Flash memory* with a goal to become the world s overall Flash memory leader 3. PCSG - Delivering innovative embedded x86 system-on-chip solutions for internet and wireless applications Broadens s product portfolio and access to high-growth and profitable emerging markets August 13, 2004 Computation Products Group - High Density Data Center Committee 6 * isuppli Corporation, Q303 NOR Flash market share estimate

7 Transistor Count / Process Migration Bits Integer FPU, SIMD Vector 1/3 Issue 9 Issue Trivial Cache 1MB Cache CPU SOC Am386 Processor Am486 Processor K6 -III Processor Athlon Processor Opteron Processor Opteron Processor 0.8µ 200K transistors 48mm µ 1.2M transistors 35mm µ 9M transistors 78mm µ 37M transistors 120mm µ 100M transistors 193mm 2 90nm 100M transistors 114mm 2 August 13, 2004 Computation Products Group - High Density Data Center Committee 7

8 Leads Pervasive 64-bit Computing August 13, 2004 Computation Products Group - High Density Data Center Committee 8

9 is a Product Powerhouse Cisco President's Customer Satisfaction Award Flash 2004 CeBIT Highlights 2002: Hardware Category Opteron and Athlon INSIGHT Award for Most Innovative Memory Device MirrorBit 2002 Samsung Best Supplier Award Flash August 13, 2004 Computation Products Group - High Density Data Center Committee 9

10 Driving Brand Awareness Product Placement in in Spy Spy Kids III III August 13, 2004 Computation Products Group - High Density Data Center Committee 10

11 Dense Computing Overview Some Driving Factors

12 Dense Computing Overview Some Driving Factors Business functions are increasingly digital & distributed! CRM, ERP, Commerce, Communications, Inventory Management, Invoices, Risk analysis, EDA, DCC, ESD, Media Content Delivery (Akimbo, Netflix & Tivo) etc We live in an increasingly digital personal world too Electronic banking, investing, billing, shopping, communicating, filing taxes, photography, home movies, MP3 s etc All of these functions require additional resources at the various service providers! With this migration comes an ever increasing need for storage and compute power! August 13, 2004 Computation Products Group - High Density Data Center Committee 12

13 Dense Computing Overview A case in point Businesses accounting is now subject to the Sarbanes-Oxley Act of 2002 stating: - The Board must require registered public accounting firms to "prepare, and maintain for a period of not less than 7 years, audit work papers, and other information related to any audit report, in sufficient detail to support the conclusions reached in such report." Think of the storage & retrieval implications of this single accounting act! August 13, 2004 Computation Products Group - High Density Data Center Committee 13

14 Dense Computing Overview Another case in point Transport Security Administration The TSA are considering next generation scanning technology that would allow them to dissect baggage in 3D They are also considering the need to keep baggage scans on file for some period of time in order to review should the need arise Again - Think of the storage & retrieval implications August 13, 2004 Computation Products Group - High Density Data Center Committee 14

15 Dense Computing Overview Another case in point Distribution & security More and more business functions require availability on a worldwide scale There s a definite need to securely and reliably process and distribute ever increasing datasets This translates into a direct need for large memory models and increased compute power to execute complex encryption & compression algorithms some at wire speed! August 13, 2004 Computation Products Group - High Density Data Center Committee 15

16 RAS (Reliability, Availability, Serviceability) Increasing dependence on these business functions drives RAS requirements most functions are becoming, or are already - mission critical! The promise of increased availability and manageability are among the incentives driving migration to dense rack and blade architectures. OEM s and integrators are layering RAS features on commodity server platforms closing the feature gap on big iron systems at a fraction of the cost. RAS features are essential and allow vendors to innovate and differentiate their offerings! August 13, 2004 Computation Products Group - High Density Data Center Committee 16

17 Dense Computing Overview What does this mean? In order to address increasing demands you can generally: - Work Harder Faster Components Work Smarter Process Innovation Get Help Scale Out / Parallelize Over the past decades there have been advances in each of these areas from an electronics perspective, but now more so than ever Get Help seems to be required to meet the dramatic increases ahead! August 13, 2004 Computation Products Group - High Density Data Center Committee 17

18 Dense Computing Overview In order to Get Help More compute devices are required to cooperatively address increasingly complex and sizeable tasks. This in turn drives the need to fit more and more compute devices within ideally the same or at least moderately increased space. With increased compute devices comes increased power consumption, the increased heat generated demands additional environmental requirements (cooling, filtering etc ) Before too long the datacenter infrastructure could be stretched to the point that it s a limiting factor for the required growth! August 13, 2004 Computation Products Group - High Density Data Center Committee 18

19 Dense Computing Overview Migration from rack mount to blade servers? There s a lot of activity within the computer industry to address the infrastructure issues while providing solutions that IT organizations can deploy and manage (virtualization etc ) in order to maximize density and utilization of resources. Virtualization of pooled resources with remote management capabilities increase the number of nodes per administrator (30:1 vs. 15:1) Reduce cabling by up to 87% - leading to increased reliability at lower cost. Improved availability with enough space to include N+1 redundancy within a blade shelf. Up to 24% reduction in data center floor space using blades over rack mount servers (48 vs. 30) Source - HP ProLiant Blade Systems White Paper August 13, 2004 Computation Products Group - High Density Data Center Committee 19

20 Dense Computing Overview A quick look at the blade market Blades an explosive growth market? Rack 2002 Rack 2008 Blade 2002 Blade 2008 Shipments (000) 1,376 2, ,671 Dollars ($M) $8,104 $11,261 $91 $7,071 Growth Shipments (000) Growth Dollars ($M) 110% 6987% 39% 7616% Linux & Windows Servers IDC Q August 13, 2004 Computation Products Group - High Density Data Center Committee 20

21 What s s Role In Dense Compute Environments?

22 s Role In Dense Computing Environments? Primarily a component vendor - however advancements in density require that the industry as a whole play their part in addressing the issues. CPU and Chipset components play a large role in addressing the needs for ever increasing performance at price and power points that are compelling for next generation compute devices. has already made advances in this area and continues to innovate, enhancing the price / power / performance metric that s so important to realizing the dense data center model. August 13, 2004 Computation Products Group - High Density Data Center Committee 22

23 64 Product Overview & Positioning

24 64 A quick show of hands Who s heard of or x86-64 Architecture? 2. Opteron with Direct Connect Architecture? 3. Hyper Transport? 4. Glue less multi-processing? 5. SMP / CC-NUMA architectures? 6. Intel? August 13, 2004 Computation Products Group - High Density Data Center Committee 24

25 64 Brand Architecture Customer-Centric Innovation Your Link To The Future Of Computing Athlon32 Mobile Athlon64 Athlon64 Athlon64 FX Opteron Leading Value and Performance x86-32 Leading Mobile Performance Leading Performance 64 Capable Cinematic Computing on 64 Simplifying Business August 13, 2004 Computation Products Group - High Density Data Center Committee 25

26 64 Solutions from Mobile to Server serves the mid-range, high-volume server space by supporting the best of both scale-up and scale-out approaches Performance 1P Server & Workstation 2P/4P Servers Workstation 4P+ Servers/HPC Cluster Provide Server-class CPUs & components to build balanced, highperformance 1P to 8P Scale-Up systems; Design these CPUs and components to fit in the cost and complexity envelope of simple Scale-Out systems; Lower pricing with PC volumes Remove the complexity and price barrier between Scale-up & Scale-out 1P Desktop & Mobile Price Leverage & extend the Industry investment and expertise in x86 while extending it to 64-bit. August 13, 2004 Computation Products Group - High Density Data Center Committee 26

27 64 Innovative Approach to 64-bit Computing is leading the way to the 64-bit future with 64 technology The first platform designed for high-end server, mainstream client, and mobile markets With 64 technology Preserve existing x86 32-bit investment Industry leading 32-bit performance Evolutionary ability to migrate to 64-bit HyperTransport technology Increase overall system performance by reducing I/O bottlenecks and increasing bandwidth Integrated DDR memory controller Improved application performance PowerNow! & Cool n Quiet technology Power Management Solutions to reduce power consumption & system noise Enhanced security technology virus protection to prevent buffer overflow attacks with Microsoft Windows XP SP2 August 13, 2004 Computation Products Group - High Density Data Center Committee 27

28 Athlon 64 Processor 64: Desktop / Mobile Processor 8 Byte memory controller supporting DDR200, DDR266, DDR333 & DDR400 Memory Drive up to 4 unbuffered DIMMs 4 DIMMs <=DDR266 (PC2100) 2 DIMMs >=DDR333 (PC2700) 2 DIMMs DDR400 (PC3200) Future memory support as it is defined Up to 4GB x4 DRAMS (4GB DIMMs) One 16-bit non-coherent HyperTransport I/O link On chip L1 & L2 cache 64KB L1 ICache, 64KB L1 DCache 512K / 1M ECC protected L2 Cache 754-pin µpga Package 72 DDR Memory Controller 64 Processor Core 16 L1 Instruction Cache L1 Data Cache HyperTransport L2 Cache Replaces Address, Data and Control Bus August 13, 2004 Computation Products Group - High Density Data Center Committee 28

29 1P Athlon 64 System System Strengths: 72b DDR w/ ECC USB, EIDE, SATA FDC, and GbE BIOS BIOS TPM TPM Athlon Athlon Opt l Opt l BMC BMC PCI-X PCI-X I/O I/O Hub Hub SIO SIO PCI KVM PCI-X 2.0 Opt l Opt l SCSI SCSI Dual Dual GbE GbE Ideal for low cost, small footprint designs that still require excellent compute & I/O performance Examples: Storage / network appliances Small form factor modular designs (1P blades) Application specific compute products August 13, 2004 Computation Products Group - High Density Data Center Committee 29

30 Athlon 64 FX High-end consumer (939 pin 1xHT) 16 Byte memory controller supporting DDR200, DDR266, DDR333 & DDR400 Memory Drive up to 8 DIMMs 8 DIMMs <= DDR266 (PC2100) 4 DIMMs >= DDR333 (PC2700) 4 DIMMs DDR400 (PC3200) Up to 4GB x4 DRAMS (4GB DIMMs) One 16-bit non-coherent HyperTransport Technology Link On chip L1 & L2 cache 64KB L1 ICache, 64KB L1 DCache Up to 1M ECC protected L2 Cache 939-pin µpga Package 72/144 DDR Memory Controller 64 Processor Core L1 Instruction Cache L1 Data Cache HyperTransport 16 L2 Cache Replaces Address, Data and Control Bus August 13, 2004 Computation Products Group - High Density Data Center Committee 30

31 1P Athlon 64 FX 128b DDR Reg ECC USB, EIDE, SATA FDC, and GbE BIOS BIOS TPM TPM Athlon Athlon FX FX Opt l Opt l BMC BMC AGP 8x 8x I/O I/O Hub Hub SIO SIO PCI KVM System Strengths: Outright client performance Lots of compute, memory and I/O bandwidth. Examples: Ultimate Gaming PC 1P Graphics workstation Audio / Visual content creation August 13, 2004 Computation Products Group - High Density Data Center Committee 31

32 1P Opteron 100 Series 64: 1 way Value Workstation, storage & networking applications 16 Byte memory controller supporting DDR200, DDR266, DDR333 & DDR400 Memory CHIPKILL ECC with x4 DRAMs 18 CAS lines for 32GB of memory 72/144 DDR Memory Controller Drive up to 8 registered DIMMs 8 DIMMs <= DDR266 (PC2100) 4 DIMMs >= DDR333 (PC2700) 4 DIMMs DDR400 (PC3200) Up to 4GB x4 DRAMS (4GB DIMMs) Three 16-bit non-coherent HyperTransport Technology Links On chip L1 & L2 cache 64KB L1 ICache, 64KB L1 DCache Up to 1M ECC protected L2 Cache 940-pin µpga Package 64 Processor Core L1 Instruction Cache L1 Data Cache HyperTransport L2 Cache Replaces Address, Data and Control Bus August 13, 2004 Computation Products Group - High Density Data Center Committee 32

33 1P Opteron 100 PCI-X PCI-X PCI-X 2.0 Opt l Opt l SCSI SCSI Dual Dual GbE GbE System Strengths: 128b DDR Reg ECC Opteron Opteron Series Series AGP 8x 8x Ideal for cost sensitive designs system where I/O and memory are critical commodities USB, EIDE, SATA FDC, and GbE BIOS BIOS TPM TPM Opt l Opt l BMC BMC I/O I/O Hub Hub SIO SIO PCI KVM Examples: Storage servers Mid-range workstations Blade server Network switch / router August 13, 2004 Computation Products Group - High Density Data Center Committee 33

34 2P - Opteron 200 Series 64: 2 Way Performance Workstation / Server, high performance storage & networking. 16 Byte memory controller supporting DDR200, DDR266, DDR333 & DDR400 Memory CHIPKILL ECC with x4 DRAMs 18 CAS lines for 32GB of memory 72/144 DDR Memory Controller Drive up to 8 registered DIMMs 8 DIMMs <= DDR266 (PC2100) 4 DIMMs >= DDR333 (PC2700) 4 DIMMs DDR400 (PC3200) Up to 4GB x4 DRAMS (4GB DIMMs) One coherent and two 16-bit non- Coherent HyperTransport Technology Links On chip L1 & L2 cache 64KB L1 ICache, 64KB L1 DCache 1MB ECC protected L2 Cache 64 Processor Core L1 Instruction Cache L1 Data Cache HyperTransport L2 Cache 940-pin µpga Package Replaces Address, Data and Control Bus August 13, 2004 Computation Products Group - High Density Data Center Committee 34

35 Advanced Opteron MP System Architecture Opteron System PCI-X DDR PCI-X PCI-X PCI-X Opteron Opteron PCI-X PCI-X IDE, FDC, USB, Etc. PCI PCI Exp Exp Opteron Opteron I/O I/O Hub Hub PCI PCI Express DDR System Strengths: Ideal for performance dense scale-out systems where node and overall system scalability are important Examples: Scalable memory and I/O bandwidth Each processor adds up to 32GB of memory Each processor adds two HyperTransport buses for more PCI-X/PCI Express and other I/O bridges Fewer chips required 1U rack mount server DCC Workstation Mid high end network / storage processor August 13, 2004 Computation Products Group - High Density Data Center Committee 35

36 4P - 8P Opteron : 4-8 Way Performance Server 16 Byte memory controller supporting DDR200, DDR266, DDR333 & DDR400 Memory CHIPKILL ECC with x4 DRAMs Drive up to 8 registered DIMMs 8 DIMMs <= DDR266 (PC2100) 4 DIMMs >= DDR333 (PC2700) 4 DIMMs DDR400 (PC3200) Up to 4GB x4 DRAMS (4GB DIMMs) Three 16-bit Coherent HyperTransport Technology Links On chip L1 & L2 cache 64KB L1 ICache, 64KB L1 DCache 1M ECC protected L2 Cache 18 CAS lines for 32GB of memory 72/144 DDR Memory Controller 64 Processor Core L1 Instruction Cache L1 Data Cache HyperTransport L2 Cache 940-pin µpga Package Replaces Address, Data and Control Bus August 13, 2004 Computation Products Group - High Density Data Center Committee 36

37 Advanced Opteron MP System Architecture Opteron System System Strengths: DDR DDR Opteron Opteron Opteron Opteron Opteron Opteron Opteron Opteron DDR DDR Ultimate performance for scale-up and scale-out systems where density, memory, compute and I/O performance are essential PCI-X PCI-X PCI-X PCI PCI Exp Exp PCI Express Examples: Other I/O Other Other IDE, FDC, USB, Etc. I/O I/O Hub Hub Scalable memory and I/O bandwidth Multi processor systems without glue logic Each processor adds 32GB of memory Fewer chips required PCI 4U rack mount server Ultimate HPC Cluster node Dedicated network file server August 13, 2004 Computation Products Group - High Density Data Center Committee 37

38 Contrast to a typical MP system Opteron System Typical MP System DDR Opteron Opteron Opteron Opteron DDR Processor Processor Processor Processor Processor Processor Processor Processor DDR PCI-X Opteron Opteron PCI-X PCI-X Opteron Opteron PCI PCI Exp Exp DDR PCI Express DDR DDR Memory Memory Expander Expander Memory Memory Expander Expander Memory Memory Ctlr Ctlr Hub Hub (MCH) (MCH) PCI-X PCI-X PCI-X PCI-X PCI-X PCI-X PCI-X PCI-X PCI-X Other I/O Other Other IDE, FDC, USB, Etc. I/O I/O Hub Hub PCI IDE, FDC, USB, Etc. I/O I/O Hub Hub PCI Opteron with Direct Connect Architecture? Hyper Transport? Glue less multi-processing? SMP / CC-NUMA architectures? System scalability limited by MCH ports Maximum of 4 processors o Processors compete for FSB bandwidth with memory and I/O accesses Memory size and bandwidth are limited Limited number of bridges Additional chips required August 13, 2004 Computation Products Group - High Density Data Center Committee 38

39 Advanced Opteron 8P System Architecture Opteron System PCI-X Other I/O DDR DDR DDR DDR Opteron Opteron Opteron Opteron Opteron Opteron Opteron Opteron PCI-X PCI-X Other Other IDE, FDC, USB, Etc. Opteron Opteron Opteron Opteron Opteron Opteron Opteron Opteron PCI PCI Exp Exp I/O I/O Hub Hub Scalable memory and I/O bandwidth Up to 8 processors without glue logic Each processor adds 32GB of memory Fewer chips required PCI DDR DDR DDR DDR PCI Express System Strengths: Ultimate performance for dense scale-up and scale-out systems where memory, compute and I/O performance are essential Enough memory (256GB), compute and I/O bandwidth to accommodate even the most intense applications August 13, 2004 Computation Products Group - High Density Data Center Committee 39

40 Athlon 64 and Opteron Feature Enhanced Virus Protection with 64 VIRUS X ENHANCED VIRUS PROTECTION + Upcoming Service Pack 2 Enhanced Virus Protection Helps prevent buffer overflow virus attacks from harming the PC and spreading through the network Activated in 32-bit Windows XP with Service Pack 2 Just Released! Designed to be native to 64-bit Windows XP and Windows Longhorn client OS August 13, 2004 Computation Products Group - High Density Data Center Committee 40

41 Register Extension bit integer registers 40-bit Physical Address 48-bit Virtual Address Register Extensions Sixteen 64-bit integer registers Sixteen 128-bit SSE registers S S E In x86 Added by x XMM0 RAX G P R 31 EAX EAX 15 AH x AL 0 0 Vector Math Instruction Set 3DNow! SSE & SSE2 support Done in such a way as to not alter the IA32 instruction set. XMM7 XMM8 XMM8 EDI R8 EIP XMM15 R15 August 13, 2004 Computation Products Group - High Density Data Center Committee 41

42 s Solution is an Evolutionary Approach: Backward compatible to IA32 : Single Platform (< 3GB Limit) (4GB Limit) Designed to maintain legacy compatibility Leverage existing infrastructure thermal, enclosures, power, and BIOS Run existing 32-bit applications natively Allow 64-bit migration according to your schedule Low learning curve for users and support staff and obey the Immutable Laws. August 13, 2004 Computation Products Group - High Density Data Center Committee 42

43 Opteron TM Software A Word on Architectural Feedback Code size is only up about 5% Mostly due to 64-bit literals Instruction count is down about 15% Additional registers really paying off Many spill/fill memory references eliminated Call-Exit sequences vastly improved Reduced instruction count and increased Instructions Per Cycle (IPC) mean substantial performance gains Opteron IPC improves about 5% 64 instruction count down about 15% Net improvement about 20% Your mileage will vary August 13, 2004 Computation Products Group - High Density Data Center Committee 43

44 64 With Direct Connect Architecture

45 Advanced Opteron Direct Connect Architecture The 64 family of products leverage the low latency high bandwidth HyperTransport bus to achieve a distributed architecture August 13, 2004 Computation Products Group - High Density Data Center Committee 45

46 HyperTransport Technology Consortium August 13, 2004 Computation Products Group - High Density Data Center Committee 46

47 Advanced Opteron Direct Connect Architecture The Opteron provides three 16-bit HyperTransport links providing 6.4GB/s bandwidth per link + dual channel DDR400 memory interfaces! 800MHz * 2(DDR) * 16(width) * 2(Bi-directional) = 51.2Gb/s /8 = 6.4GB/s 2 x PC3200 DDR interface = 6.4GB memory bandwidth 3 x HT links = 19.2GB/s Total I/O bandwidth + 6.4GB/s (memory bandwidth) = 25.6GB/s total CPU bandwidth! and Increasing! August 13, 2004 Computation Products Group - High Density Data Center Committee 47

48 Advanced Opteron Direct Connect Architecture Opteron System DDR Opteron Opteron DDR CPUs are connected directly to CPUs for more linear symmetrical multiprocessing DDR Opteron Opteron DDR Memory is connected directly to the CPU optimizing memory performance PCI-X Other I/O PCI-X PCI-X Other Other IDE, FDC, USB, Etc. PCI PCI Exp Exp I/O I/O Hub Hub Scalable memory and I/O bandwidth Up to 8 processors without glue logic Each processor adds 32GB of memory Fewer chips required Each HT link provides 6.4GB/s of I/O bandwidth PCI PCI Express I/O is directly connected to the CPU for balanced throughput and scaleable I/O Addresses and helps eliminate the real challenges and bottlenecks of a complete system architecture August 13, 2004 Computation Products Group - High Density Data Center Committee 48

49 Advanced Opteron Direct Connect Architecture Ease of design & layout DDR Opteron Opteron DDR DDR Opteron Opteron DDR Opteron PCI-X PCI-X PCI-X PCI PCI Exp Exp PCI Express Other I/O Other Other IDE, FDC, USB, Etc. I/O I/O Hub Hub PCI - 1P done in 4 layers 4.7mil nominal (FR ply) dielectric - 2P in as little as 6 layers! August 13, 2004 Computation Products Group - High Density Data Center Committee 49

50 Power, Performance & Density What s Next?

51 Low Power Opteron Processors Overview Lower wattage processors are expected to enable dense platforms where lower power requirements are essential. launched low power parts in February This is enabling vendors to effectively service additional market segments: Standard servers and Blades: In rack-mount chassis, lower power is needed to enable 1U/2P, 1U/4P, 2U/4P and other dense designs to meet end-user needs for overall lower power consumption Embedded controllers: In networking, mass storage, telecommunications and other markets low power is needed: Network attached storage (NAS) market needs full microprocessor capability with less power than standard parts consume Storage area networks (SAN) devices demand very high I/O bandwidth but cannot make provisions for custom thermal solutions August 13, 2004 Computation Products Group - High Density Data Center Committee 51

52 Low Power Opteron Processors Overview (con t) These low power parts are bringing 64 technology to a broad range of server, workstation and non-traditional enterprise products. These new products extend the current Opteron product line The full-power CPU roadmap is 89 watts 95 watts The mid-power CPU roadmap is 55 watts The low-power CPU roadmap is 30 watts There is no performance penalty when using low power parts. Low power parts perform exactly to equivalent speed grade full power parts Lower power Opteron processors leverage today s current infrastructure. Continuing the architecture (940 pin socket) 1xx, 2xx & 8xx parts are available in 55watt and 30watt today! Leverages existing infrastructure: MB, Cooling, Software August 13, 2004 Computation Products Group - High Density Data Center Committee 52

53 Low Power Product Positioning Rack Dense and Blade Servers (55 watt) Where performance per watt is a key criteria Designed for high-density without sacrificing highperformance Many end-user computing facilities cannot support full racks of full power processors Modular Environments (30 watt) Where I/O s per watt is a key criteria 3 HyperTransport links enable substantial I/O for demanding markets The Opteron feature set is a perfect fit for non-standard servers, networking, storage and appliances One architecture for all Opteron implementations 89w, 55w and 30w processors all leverage existing 940 infrastructure Layout design, thermal solutions, software, etc. August 13, 2004 Computation Products Group - High Density Data Center Committee 53

54 Opteron Processor HE (55 watt): Leading Performance Per Watt SPECcpu 2000 Performance SPECcpu 2000 Performance/Watt SPEC int_peak2000 SPEC fp_peak SPEC int_peak2000/watt SPEC fp_peak2000/watt Opteron Model 146 (89W) Opteron Model 146 HE (55W) The Opteron Processor Model 146 HE provides equivalent performance at almost 40% lower wattage compared to the full power Opteron Processor Model 146 August 13, 2004 Computation Products Group - High Density Data Center Committee 54

55 Typical Server Architecture Clients Internet / Intranet Enterprise View Firewall Basic web content Cache servers Load Balancing servers Web servers (1-2P) Java Application servers (2-4P) Database servers (4-8P) Tier 1 Tier 2 Tier 3 Storage Transactional content SMB View Clients Internet Network File & Print server (1-2P) Printer Clients Enterprise Key August 13, 2004 Computation Products Group - High Density Data Center Committee 55

56 64 architecture performance? Application-specific benchmarks demonstrate the value of the Opteron processor in: File and print Netbench Web infrastructure HP s published WebBench 5.0 benchmark shows one Opteron processor can outperform two Xeon processors! Web security - SpecWeb99_SSL Data Warehousing TPC-H demonstrates an Opteron processor-based cluster outperforms a Xeon processor-based cluster costing three times more!!! August 13, 2004 Computation Products Group - High Density Data Center Committee 56

57 Veritest File Serving Performance April commissioned VeriTest to conduct a series of tests comparing File Serving performance of and Intel-based servers running Windows 2003 Server, Standard Edition. August 13, 2004 Computation Products Group - High Density Data Center Committee 57

58 Opteron Processor File & Print Serving Performance File and print performance: Heavily I/O dependent Opteron edge: HyperTransport technology delivers superior I/O performance to make Opteron processor one of the best performing file and print servers Key take away: In the dual processor test, Opteron 248 CPUs outperformed Xeon 3.2GHz by 35% For price sensitive file server needs, a single Opteron processor is competitive with a dual Xeon configuration Samba Server File Sharing (Linux v kernel) MB/s Opteron 248 Xeon 3.06GHz Itanium 2 1.5GHz 64-bit 32-bit 64-bit NetBench % 106% 127% InfoWorld - January 30, 2004 August 13, 2004 Computation Products Group - High Density Data Center Committee 58

59 Opteron Processor Web Infrastructure Performance Clients Web server performance: Highly dependent on memory response and I/O performance Opteron processor edge: HyperTransport technology and the integrated memory controller of Opteron processors help to deliver great I/O performance and memory response time in handling large numbers of user connections and response times both on static and dynamic web pages. Key take away: Opteron processor s Direct Connect Architecture is perfect for web serving, delivering industryleading performance that is sustained as the client load increases. HP ProLiant DL140 (Xeon) vs. DL145 ( Opteron) Requests Per Second WebBench 5.0 (Windows Server 2003 Standard, 1-2P Servers) Opteron 2P wins by 57% Hewlett-Packard Results All scores 32-bit Number of Clients Opteron 248 2P Opteron 248 1P Xeon 3.2GHz 2P Xeon 3.2GHz 1P 1P Opteron processor can outperform 2P Xeon by over 20% 2P Opteron processor can outperform 2P Xeon by 57% August 13, 2004 Computation Products Group - High Density Data Center Committee 59

60 Opteron Processor Web Security Performance Clients Web security performance: Highly dependent on memory latency As encryption gets more complex, 64-bit processing will become necessary Opteron edge: The integrated memory controller of Opteron processor enhances the caching of secure data RSA Software is optimized for the Opteron processor to enable fast transaction response 64 technology enables seamless transition to 64-bit computing as encryption algorithms increase in complexity Key take away: Web security requirements will drive a migration to more complex algorithms best served by 64-bit technology The Opteron processor outperforms Xeon in today s 32-bit secure Web serving environment and helps make the transition to 64-bit computing easy Opteron 246 Itanium 2 1.5GHz 6MB L3 Xeon 3.2GHz 2MB L3 Xeon 3.2GHz 1MB L3 Xeon 3.06GHz 1MB L3 Xeon 3.06GHz SPECweb 99_SSL (2P Servers) % % % % Opteron % Opteron and Itanium 2 scores 64-bit Xeon scores 32-bit 100% 97% August 13, 2004 Computation Products Group - High Density Data Center Committee 60

61 Opteron Processor Application Server Application Server Performance Highly dependent on memory response and I/O sub system performance Opteron processor edge: HyperTransport technology and the integrated memory controller of Opteron processor delivers fantastic I/O performance and memory response time in handling large numbers of user connections and response times both on static and dynamic Web pages. Key take away: Opteron processors are costeffective for application servers Opteron processor s Direct Connect Architecture is able to drive high application server performance TOPS: Total Operations Per Second August 13, 2004 Computation Products Group - High Density Data Center Committee 61

62 Opteron Processor Data Warehousing Performance Clients Data Warehousing performance: Highly dependent on server scalability, efficiency and data throughput capacity Opteron edge: Direct Connect Architecture offers scalable memory bandwidth with very low latency for better data throughput as data requirements increase Key take away: Datasets are increasing at huge rates requiring more efficient data warehousing systems Opteron processor-based clusters can outperform a Xeon processor-based cluster at one third the cost! Opteron 246 Opteron 246 (16 CPUs) Pentium III Xeon 900MHz (64 CPUs) TPC-H (clustered 2P Servers) 100GB Database 300GB Database $863,410 $2,636,750 Opteron scores 64-bit Xeon score 32-bit % 100% August 13, 2004 Computation Products Group - High Density Data Center Committee 62

63 Opteron Dual Core Announces Technology Milestone With Its Multiple-Core Strategy First 64 dual-core solutions planned to be available in mid-2005 SUNNYVALE, CALIF. -- June 14, Today (NYSE: ) announced a technology milestone with the completed design of its 64 dual-core processors. plans to deliver high-performance dual-core products to the x86 server market in mid-2005 and introduce dual-core solutions for high-end client PCs in the second half of August 13, 2004 Computation Products Group - High Density Data Center Committee 63

64 Opteron Dual Core Highlights Dual core parts will launch in the Opteron processor line in 2005 and will enable to continue to drive technology leadership in the server and workstation market. These processors can be inserted into 90nm Opteron 940- pin sockets with a BIOS update, saving time and costs while increasing performance and value. Completely compatible with x86 and 64 applications while benefiting multi-threaded environments. CPU intensive applications will experience the greatest performance advantage. Examples include: Business Processing, Technical Computing, Network processing and Web Infrastructure. Opteron with dual core processing is another example of how is extending it s Direct Connect Architecture leadership and increasing density by connecting two CPUs on die. August 13, 2004 Computation Products Group - High Density Data Center Committee 64

65 Opteron Processor Single Core vs. Dual Core Performance Estimates PERFORMANCE Single Core Dual Core FREQUENCY Note the rate of incline is steeper with dual core as each speed increase benefits 2 CPU s! August 13, 2004 Computation Products Group - High Density Data Center Committee 65

66 Examples Built On an 64 Technology Foundation

67 Rackable Cx000 Servers High density with 176 processors per cabinet 2U half-depth chassis enables backto-back mounting for double density Front-facing I/O for easiest serviceability Choice of AC or DC power Supports fastest 64-bit processors Total component choice and flexibility August 13, 2004 Computation Products Group - High Density Data Center Committee 67

68 Sun Microsystems V20z One or two Opteron 200 Series processors (models 242, 244, 248) Up to 16 GB of registered DDR1-333 SDRAM (4 DIMM slots per processor for a total of 8 DIMM slots; 128 bit plus ECC databus) Two 10/100/1000-Mbps BaseT Ethernet ports Two 64-bit PCI-X slots: One full-length at 133 MHz One half-length at 66 MHz One or two 36 GB, 73 GB, or 146 GB Ultra320 SCSI disk drives (Internal) Operating System: Solaris 9 4/04 x86 Platform Edition (32-bit) Red Hat Enterprise Linux 3 for Opteron (32- bit/64-bit) SUSE Linux Enterprise Server 8 for Opteron (64-bit) SUSE Linux 9 Professional (64-bit) Microsoft Windows 2000 Microsoft Windows Server 2003 August 13, 2004 Computation Products Group - High Density Data Center Committee 68

69 HP ProLiant DL585 Best in class 4-way 32-bit performance supports the most complex, compute-intensive application environments Opteron Model 850 (2.4GHz/ 1MB), Model 848 (2.2GHz/ 1MB), Model 844 (1.8GHz/1MB), or Model 842 (1.6GHz/1MB) Up to 64GB of dual channel PC2100 DDR Smart Array 5i Plus controller, with 64MB memory and battery-backed write cache HP embedded NC7782 dual port PCI-X Gigabit Server Adapter 8 I/O slots: 6 x 64-bit/100 MHz PCI-X expansion slots and 2 x 64-bit/133MHz PCI-X slots HyperTransport (processor interconnect) runs at 800MHz with 6.4GB of bandwidth On-die memory controller which runs at processor core frequency 5.3 GB per processor of memory bandwidth August 13, 2004 Computation Products Group - High Density Data Center Committee 69

70 IBM eserver 325 1U rack-optimized chassis Up to 2 OpteronTM processors 1GB standard up to 12GB max PC2700 ECC DDR SDRAM memory Open-bay hot-swap Ultra320 SCSI or 40GB IDE drive standard; supports up to 2 hard disk drives Two 64-bit PCI-X slots Integrated dual Gigabit Ethernet ports Integrated systems management processor August 13, 2004 Computation Products Group - High Density Data Center Committee 70

71 Cray XD1 Exceptional Performance Chassis Each Rack Compute Processors Performance 53 GFLOPS* 633 GFLOPS* Aggregate Switching Capacity 96 GB/s 1152 GB/s Interprocessor Latency 1.6 µsec 1.8 µsec Aggregate Memory Bandwidth 77 GB/s 922 GB/s Maximum Memory 96 GB 1.2 TB Maximum Disk Storage 2 TB 24 TB * Peak theoretical performance with 2.2 GHz Opteron August 13, 2004 Computation Products Group - High Density Data Center Committee 71

72 Opteron Processor Thermally Tested Server Solutions Some Thermally Tested Server Barebones Solutions: AW171* (Pedestal 1P) R3122 (1U) BBATOA100-A01(1U/2P) BBATOC100-A01 (1U/2P Half Depth) BBATOM208S-A01 (2U/2P) BBATOM510S-A01 (5U/2P) Tyan S2880 (Pedestal/2P) Arima HDAMA (Pedestal/2P) MSI 9131 (Pedestal/2P) Transport GX28 (B2882) TS-1881 (1U/2P) Clusteron D (1U) RC-0103 (1U 1+1 Power Supplies) RC-0104 (1U) RC-0222 (2U) R4280A (2U/4P) 2100 (1U/2P) 4300 (3U/4P) K (1U/2P) Appro 1100H (1U/2P) Green font = passed Thermal Test *Available only in Europe August 13, 2004 Computation Products Group - High Density Data Center Committee 72

73 Validated Server Program Designed by manufactured by Celestica A2210 Available through the channel or direct (depending on volume). Current distributors in both NA and Europe. Validated for Opteron X50 series Support for 256MB up to 2GB memory modules A8440 A8440 US Support/Sales Phone: Support Europe: By Celestica Contact: Jon Green By phone: (512) August 13, 2004 Computation Products Group - High Density Data Center Committee 73

74 Infrastructure Information We encourage our customers & partners to visit s public website for infrastructure items including: Recommended Motherboards Thermal Solution Guidelines Thermally Tested Server Solutions Memory Guidelines Power Supply Guidelines Tower Chassis Guidelines Support Components -Online Processor Quick Reference Guide August 13, 2004 Computation Products Group - High Density Data Center Committee 74

75 Q&A A test that you were all listening!

76 Thank you! August 13, 2004 Computation Products Group - High Density Data Center Committee 76

77 August 13, 2004 Computation Products Group - High Density Data Center Committee 77