TOUGH. FAST. WHITE. introducing WHITEspeed. The groundbreaking Computer On Module. Designed & assembled by ERNI in Germany.

Transcription

1 TOUGH. FAST. WHITE. introducing WHITEspeed The groundbreaking Computer On Module. Designed & assembled by ERNI in Germany.

2 introducing WHITEspeed TOUGH. FAST. WHITE. Computer On Module with Baseboard ERNI presents ARM-based COM (Computer On Module) solutions with reliable MicroSpeed connectors for harsh industrial environments. ERNI WHITEspeed is a powerful, reliable and space-saving embedded computer. In developing these COM products, ERNI has been able to draw on its extensive experience in the field of board and backplane design in addition to its core competency in compact and high performance connectors. The implementation of the new WHITEspeed interface standard benefits from the high speed and reliability of the MicroSpeed connectors. With this, the ERNI company is in particular addressing applications in harsh and demanding industrial environments such as in the field of transport, heavy engineering and automation exposed to high shock and vibration loads. The popular ARM technology has now attained a level of performance that makes it attractive also for sophisticated embedded computing applications. Comprehensive operating systems and software support simplifies the development of software for numerous applications. With a new standard for ARM-based Computer On Modules, ERNI simplifies system development on hardware level and offers high signal integrity leveraging from the benefits of the MicroSpeed connectors. 2

3 Next Generation of Computer On Module The portfolio comprises a WHITEspeed family of pin-compatible ARM-based mezzanine modules, which differentiate in terms of the CPU performance (clock rate, number of cores, coprocessors) and I/Os and memory capacity. In addition, a fully equipped, adaptable baseboard is available, which can be supplied also with an optional display. This carrier board is the development platform for the application software and, at the same time, the basis for customer-specific boards. Using four MicroSpeed signal connectors and one MicroSpeed Power Module, ERNI realises the new standardised interface (WHITEspeed 1.0) of the modules to the baseboard, which supports the following: Ethernet 10 MB/100 MB/1GB, SATA, PCI Express x1/x4 Gen2, Express Card, UART, USB 2.0 High Speed, CAN, I2C, SMB (System Management Bus), SPI, LVDS for LCD displays, HDMI (alternatively SDVO or display port), HDA (High Definition Audio), Secure Digital memory card interface, GPIOs, RESET, Watchdog and PWM. On a credit card format (85mm x 55mm), the new mezzanine boards offer a powerful i.mx537 CPU from Freescale with an ARM Cortex-A8 core. To permit high-speed and reliable connection to the baseboard and I/Os, two-row 50-pin MicroSpeed connectors are available. The MicroSpeed connectors are characterised by the proven dual-leaf spring contact and the effective shielding. This allows high data rates (up to 10Gbps and more) to be transmitted reliably. This makes extremely compact, high-speed and reliable connections possible also in harsh industrial environments. The use of MicroSpeed connectors offers decisive advantages with regard to reliability and robustness compared with alternatives using card-edge connectors or connectors with only one contact point. Thanks to the dual-leaf contacts, the MicroSpeed connectors not only offer high contact reliability but also an excellent mating tolerance. ERNI initially offers modules with ARM Cortex-A8 CPU (Freescale i.mx537). The on-board memories include DDR3-RAM, reliable NOR flash for the boot code, NAND flash and I2C-EEPROM with up to 128 kb for the configuration data. The CPUs also offer comprehensive power management functions. As additions in the near future there will be two new modules: an implementation with a Cortex-A5 single-core CPU and a module featuring i.mx6 processors (Cortex-A9) with single, dual, and quad CPU cores. For hardware support there is a Linux Board Support Package (BSP). Windows Embedded and other operating systems are to follow. ERNI Computer On Module in its full-size 3

4 CPU-module "CA8-1/MIN" / "CA8-1/MAX" Part number / CPU Processor i.mx537 ARM Cortex -A8 CPU ( C bis +85 C) Memory DDR3-SDRAM 512 MB / 1 GB working memory NOR-Flash 64 / 128 MB for Bootloader NAND-Flash - / 256 MB operating system and application software I2C-EEPROM - / 128 kb configuration memory Mass storage off-module SD/MMC memory card storage Display LVDS / HDMI display interfaces 2 x LVDS or 1 x LVDS / 1 x HDMI Multimedia High Definition Audio (HDA) 1 Interfaces Ethernet 10/100 (MDI) 1 Ethernet via RMII / RGMII 1 RS232 / RS USB 2.0 High Speed Host respectively USB OnTheGo 3+1 (Host/peripheral) CAN 2 I2C 1 Serial Peripheral Interface (SPI) Master with two Slave Chipselects 1 Additional Interfaces Debug Interface JTAG 1 GPIOs up to 22 Mechanical Specifications Connector 4 x 50-pin ERNI MicroSpeed (female) and 1 x ERNI MicroSpeed Power Module (female) Dimensions credit card format - 85 mm x 55 mm drawing/3d models available upon request Electric and Environmental Specifications Module Power Supply V Current Consumption/Power Dissipation operating mode-dependent Cooling free convection or heatsink/conduction-cooled Storage and Operating Temperature -40 C to +85 C Vibration Hz/3.5 mm / Hz / 9.8 m/s² / 10 cyclea all axes / 1 min/cctave Shock 150 m/s² / 11 ms / halfsine 3 x + /- all axes Humidity 10 % to 90 % non-condensing Operating restrictions of USB USB3 only without HDMI use CA8-1 without PCIe, esata and GigE function 4

5 Standardized WHITEspeed 1.0-Interface between module and baseboard via 4 x ERNI MicroSpeed + 1 x ERNI MicroSpeed Power Module Ethernet 10/100/1000 (MDI) 1 Ethernet via RMII / RGMII 1 SATA (1,5 and 3,0 GBit/s) 2 PCIe x1/x4 Gen 1 & 2 + Express Card 1 (optional) RS232 / RS USB 2.0 High Speed Host respectively USB OnTheGo (Host/peripheral) 3+1 CAN 2 I2C 1 System Management Bus (SMB) 1 (optional) Serial Peripheral Interface (SPI) Master with two Slave Chipselects 1 LVDS LCD display Interface 2 Serial Digital Video Out / Displayport / High Definition Multimedia Interface (SDVO/DP/HDMI) 1 Memory Card Interface (SD/MMC/MMCplus) 1 High Definition Audio (HDA) 1 GPIOs up to 22 Debug Interface JTAG 1 Auxiliary signals (RESET, Watchdog, PWM...) 1 Clock Reset Smart DMA GPT PWM x 2 System Control Timers System Debug Secure JTAG Temp Monitor System Buses Watchdog x 2 EPIT x 2 Power Mgmt. and Analog LDO Supply 32 khz Osc x 2 PLL x 4 efuses Sahara v4 TrustZone Security RTIC SCC v2 SRTC Block diagram Freescale i.mx537 Cache Neon ROM ESAI SSI/I 2 S x 3 Core/Internal Memory ARM Cortex TM -A8 Multimedia GPU Audio ETM VFP RAM OpenGL ES 2.0 OpenVG 1.1 Video Encode/ Decode Rezising and Blending Inversion and Rotation De-Interlacing/ Combining VPU IPU TV Out Image Enhancement Camera Interface SPDIF Tx/Rx ASRC Standard Connectivity Fast IrDA UART x 5 CSPI Keypad I 2 C x 3 GPIO Advanced Connectivity HS USB OTG + PHY Ethernet + IEEE 1588 HS Host + PHY CAN x2/mlb 50 HS ULPI Host x 2 Camera Interface External Memory I/F 2 GB DDR2/DDR3/LV-DDR2/LP-DDR2 External Storage I/F SLC/MLC NAND NOR PATA Display I/F SATA emmc/sd Analog VGA Out Parallel (from IPU) LVDS (picture Freescale) Number cruncher and multimedia processing capabilities Vector floating point coprocessor VFPv3 NEON SIMD media accelerator Graphics acceleration with 2D and 3D functionality Watchdog Advanced hardware-enabled security features Smart speed on-chip power management features On-module Power Management support with LTC3589 5

6 CPU-module "CA5" Preliminary information CPU Processor ARM Cortex -A5 CPU, 500 MHz Memory DDR3-SDRAM MB working memory NOR-Flash 16 MB for Bootloader NAND-Flash MB operating system and application software I2C-EEPROM 1 kb (optional) Mass storage off-module SD/MMC memory card storage Display LVDS / HDMI display interfaces 1 x LVDS or 1 x HDMI or RGB (Off-board connector) Multimedia High Definition Audio (HDA) 1 Interfaces Ethernet 10/100 (MDI) 1 Ethernet via RMII / RGMII 1 RS232 / RS USB 2.0 High Speed Host respectively USB OnTheGo 3+1 (Host/peripheral) CAN 2 I2C 1 Serial Peripheral Interface (SPI) Master with two Slave Chipselects 1 Additional Interfaces Debug Interface JTAG 1 GPIOs up to 22 System Management Bus (SMB) 1 (option) Mechanical Specifications Connector 4 x 50-pin ERNI MicroSpeed (female) and 1 x ERNI MicroSpeed Power Module (female) Dimensions credit card format - 85 mm x 55 mm drawing/3d models available upon request Electric and Environmental Specifications Module Power Supply V Current Consumption/Power Dissipation operating mode-dependent Cooling free convection or heatsink/conduction-cooled Storage and Operating Temperature -40 C to +85 C Vibration Hz/3.5 mm / Hz / 9.8 m/s² / 10 cyclea all axes / 1 min/octave Shock 150 m/s² / 11 ms / halfsine 3 x + /- all axes Humidity 10 % to 90 % non-condensing 6

7 Standardized WHITEspeed 1.0-Interface between module and baseboard via 4 x ERNI MicroSpeed + 1 x ERNI MicroSpeed Power Module Ethernet 10/100/1000 (MDI) 1 Ethernet via RMII / RGMII 1 SATA (1,5 and 3,0 GBit/s) 2 PCIe x1/x4 Gen 1 & 2 + Express Card 1 (optional) RS232 / RS USB 2.0 High Speed Host respectively USB OnTheGo (Host/peripheral) 3+1 CAN 2 I2C 1 System Management Bus (SMB) 1 (optional) Serial Peripheral Interface (SPI) Master with two Slave Chipselects 1 LVDS LCD display Interface 2 Serial Digital Video Out / Displayport / High Definition Multimedia Interface (SDVO/DP/HDMI) 1 Memory Card Interface (SD/MMC/MMCplus) 1 High Definition Audio (HDA) 1 GPIOs up to 22 Debug Interface JTAG 1 Auxiliary signals (RESET, Watchdog, PWM...) 1 Cortex - A5 ARM CoreSight Multicore Debug and Trace ARMv7 32b CPU NEON Data Engine Floating PointUnit 32 kb I-Cache 32 kb D-Cache Core ACP SCU Block diagram CPU core Dual 64-bit AMBA3 AXI 7

8 CPU-module "CA9" Preliminary information CPU Processor i.mx6 ARM Cortex -A9 CPU, Industrial, 800 MHz Single / Dual / Quad Cores Memory DDR3-SDRAM MB working memory NOR-Flash 16 MB for Bootloader NAND-Flash MB operating system and application software I2C-EEPROM 4 kb (optional) Mass storage off-module SD/MMC memory card storage Display LVDS / HDMI display interfaces 1 x LVDS / 1 x HDMI Multimedia High Definition Audio (HDA) 1 Interfaces Ethernet 10/100 (MDI) 1 Ethernet via RMII / RGMII 1 RS232 / RS USB 2.0 High Speed Host respectively USB OnTheGo 3+1 (Host/peripheral) CAN 2 I2C 1 Serial Peripheral Interface (SPI) Master with two Slave Chipselects 1 SATA (1.5 and 3.0 GBit/s), PCI Express X1 / X4, Gen Additional Interfaces Debug Interface JTAG 1 GPIOs up to 22 System Management Bus (SMB) 1 (option) Mechanical Specifications Connector 4 x 50-pin ERNI MicroSpeed (female) and 1 x ERNI MicroSpeed Power Module (female) Dimensions credit card format - 85 mm x 55 mm drawing/3d models available upon request Electric and Environmental Specifications Module Power Supply V Current Consumption/Power Dissipation operating mode-dependent Cooling free convection or heatsink/conduction-cooled Storage and Operating Temperature -40 C to +85 C Vibration Hz/3.5 mm / Hz / 9.8 m/s² / 10 cyclea all axes / 1 min/octave Shock 150 m/s² / 11 ms / halfsine 3 x + /- all axes Humidity 10 % to 90 % non-condensing 8

9 Standardized WHITEspeed 1.0-Interface between module and baseboard via 4 x ERNI MicroSpeed + 1 x ERNI MicroSpeed Power Module Ethernet 10/100/1000 (MDI) 1 Ethernet via RMII / RGMII 1 SATA (1,5 and 3,0 GBit/s) 2 PCIe x1/x4 Gen 1 & 2 + Express Card 1 (optional) RS232 / RS USB 2.0 High Speed Host respectively USB OnTheGo (Host/peripheral) 3+1 CAN 2 I2C 1 System Management Bus (SMB) 1 (optional) Serial Peripheral Interface (SPI) Master with two Slave Chipselects 1 LVDS LCD display Interface 2 Serial Digital Video Out / Displayport / High Definition Multimedia Interface (SDVO/DP/HDMI) 1 Memory Card Interface (SD/MMC/MMCplus) 1 High Definition Audio (HDA) 1 GPIOs up to 22 Debug Interface JTAG 1 Auxiliary signals (RESET, Watchdog, PWM...) 1 Cortex - A9 ARM CoreSight Multicore Debug and Trace ARMv7 32b CPU NEON Data Engine Floating PointUnit 32 kb I-Cache 32 kb D-Cache Core 1 optional 2 optional 3 optional 4 ACP SCU Block diagram CPU Dual 64-bit AMBA3 AXI 9

10 "WHITEspeed Launch Board" - Baseboard Part number Interfaces/Features WHITEspeed modul bay 1 with 4 x 50-pin ERNI MicroSpeed (male) and 1 x ERNI MicroSpeed Power Module (male) Serial Interface RS232 (RxD, TxD) Serial Interface RS485 (bidirectional bus) USB DSUB 9-pin male DSUB 9-pin male 4 x USB-A receptacle/host Ethernet 1 x RJ45 10/100/1000 CAN PCIe 2 x interface assigned to single DSUB 9-pin male 1 expansion slot for standard PCIe slot cards as development time expansion (optional) JTAG Debug Interface 1 GPIO pin header up to 22 signals Mass Storage SATA 1 msata drive bay for msata SSD drive 1 esata connector Memory card combined socket for SD, MMC and MMCplus memory cards Display-Ports 2 x LVDS connectors 1 x Touch screen connection resistive 1 x HDMI 1.3 connector Type C (mini connector) Multimedia Audio-in / Microphone-in Mono 2 x 3.5mm jack plug Audio-out / Headphone out Stereo Electric and Environmental Specifications Power Supply Current Consumption/Power Dissipation Storage Temperature V without Display, e.g. HDMI operation 12 V +/- 5 % with local display operation depending on module and operation -40 C to +85 C Operating Temperature 0 C to +70 C (-40 C to +85 C for baseboard with components in target application grade) Vibration Shock Humidity installation-dependent on request installation-dependent on request 10 % to 90 % non-condensing Dimensions 241 mm x 147,5 mm (about DIN A5 size exluding PCIe expansion slot) Others Buttons Battery base/plinth Power On / Off / Reset for CR2032 Important remark: Please note, certain feature of the base board may only be used if attached Computer On Module does support them. 10

11 Entry level development system Part number Baseboard Baseboard with the characteristics of part number CPU module "CA8-1/MAX" CPU module with the characteristics of part number Others Linux BSP with bootable memory card on CD or cloud memory Plug-in power supply unit operational Complete development system Part number Baseboard Basic development system with the characteristics of part number Display TFT display Resolution 800x480 pixels with touch function mounted on base board ERNI Services Application support Customer-specific modules for best cost/performance ration Design services for application-specific basic boards and their manufacture On request 3D models and drawings of all components Availability Contractually guaranteed for ten years Optional extensions Software Power supply Order Informations CPU module "CA8-1/MIN" CPU module "CA8-1/MAX" "WHITEspeed Launch Board" - Baseboard without module Entry level development system Complete development system 11

12 ERNI Electronics GmbH & Co. KG Seestrasse Adelberg/Deutschland Tel Fax info@erni.de Europe South America Africa Japan ERNI Electronics, Inc Westwood Ave Richmond, VA 23230/USA Tel Fax info@erni.us North America Canada Mexico ERNI Asia Holding Pte Ltd. Blk 4008 Ang Mo Kio Avenue 10 #04-01/02 Techplace I Singapore Tel Fax info@erni-asia.com Asia ERNI Electronics GmbH & Co. KG 2014 Printed in Germany A policy of continuous improvement is followed and the right to alter any published data without notice is reserved.. ERNI, ERNI WoR&D, Act. Connect. Perfect, MicroCon, MicroStac, MicroSpeed, MiniBridge, MaxiBridge, ERmet, ERmet ZD, ERmet ZDplus, ERmet ZD HD, ERbic, ERNIPRESS, INTERact, BLUEcontact and WHITEspeed are trademarks (registered or applied for in various countries) of ERNI Electronics GmbH & Co. KG. Catalog E /14 Edition 4