ERmet ZDplus.

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1 Katalog Catalog D E XXXXXX Ausgabe 09/3 3, 03/05 Edition 4

2 Catalog E XXXXXX 09/3 Edition 4

The ERmet ZDplus connector is an enhancement of the ERmet ZD family. This high-speed differential Hard Metric connector system enables data rates of 20 Gbit+.

3 The ERmet ZDplus connector is an enhancement of the ERmet ZD family. This high-speed differential Hard Metric connector system enables data rates of 20 Gbit+. The ERmet ZDplus is based on the principal mechanical design of the proven ERmet ZD with the same dimensions. To enable higher data rates ERNI Electronics has optimized the signal routing and the pressfit termination of the female connector. To benefit from the maximum performance of the new ERmet ZDplus the usage of backdrilling is recommended. Decreasing via stub length and the related stub effect by backdrilling significantly reduces the reflections and the overall BER (Bit Error Rate) of the interconnect. The first product of the ERmet ZD+ family is the 4-pair right angle female connector with pressfit termination. The ERmet ZDplus female connector is mating compatible to the existing ERmet ZD male connector. This means, that existing backplane designs do not need layout changes on the backplane side, if customers want to upgrade their systems. Of course the layout on the daughtercards has to be modified if using the new ERmet ZDplus female parts. Features Data rate performance per differential pair with standard ERmet ZD male connector 5+ Gbit/s (optional with ERmet ZDplus male connector 20+ Gbit/s) 40 differential pairs per inch Mating compatible to standard ERmet ZD male connectors, backwards compatible to existing backplane systems Improved crosstalk behaviour Improved layout on daughter cards Meets the performance requirements of next generation processor technology Catalog E XXXXXX 09/3 Edition 4 3

4 Electrical And Mechanical Characteristics Standard Pressfit Male- and Female Number of pins 4-pair Technical data Climate category DIN EN /25/56 test b Temperature range -55/25 C Air- and creepage distance 0.5 mm Operating voltage IEC The permissible operating voltages depends on the customer application and on the applicable or specified safety requirements. Insulation coordination according to IEC has to be regarded for the complete electrical device. Therefore, the maximum creepage and clearance distances of the mated connectors are specified for consideration as a part of the whole current path. In practice, reductions in creepage or clearance distances may occur due to the conductive pattern of the printed board or the wiring used, and have to be taken into account separately. As a result the creepage and clearance distances for the application may be reduced compared to those of the connector. Dielectric strength IEC 6052 test 4a Contact resistance IEC 6052 test 2a Insulation resistance IEC 6052 test 3a Vibration, sine IEC 6052 test 6d Contact interruption (while vibration test) IEC 6052 test 2e Shock, halfsine IEC 6052 test 6c Contact interruption (while shock test) Mechanical operation (mating cycles) Insertion and withdrawal force IEC 6052 test 2e IEC 6052 test 9a IEC 6052 test 3b Gauge retention force IEC 6052 test 6e contact pair - contact pair 500 V rms contact pair - shield 50 V rms contact - contact 50 V rms < 50 mω (Signal) < 5 mω (Shield) > 0 4 MΩ Hz 20 g < µs 50 g ms < µs > 250 mating cycles Insertion force: max. 0.7 N/pin (Signal) max. 0.9 N/pin (Shield) Withdrawal force: min. 0.5 N/pin > 0.2 N 4 Catalog E XXXXXX 09/3 Edition 4

5 Electrical And Mechanical Characteristics Standard Pressfit Male- and Female Number of pins 4-pair Signal transmission data Differential impedance 00 Ω Data rate per pair 5+ Gbit/s (with standard ERmet ZD male connector) 20+ Gbit/s (with ERmet ZDplus male connector) Housing materials Plastic material LCP CTI value IEC 2 CTI 75 UL flame rating UL 94 V-0 UL file E83005 Contact materials Base material Cu alloy Mating area Gold plated Termination area Sn Environment compatibility Recycling no flame-retardent additives, no toxic additives, allow easy recycling Product Approval UL/CSA E84703 Catalog E XXXXXX 09/3 Edition 4 5

6 Right Angle Female Connectors 4 Pair Dimensional Drawing 22,5 2,5 0,75 h g e f d c,5 9,4 b a 4,5 0 EN-Zone für durchkontaktierte Löcher 0.46 ± 0.05 compliant zone for through hole 0.46 ± ,95-0,,6 +0,2 5,7 Date Code Position 0,9 7,5,,2 GND h h g GND g GND f f e GND e GND d d c GND c GND b b a GND a ±0, 27,9,2 0,4 8,6 6,7 2,4-0, Oberfläche der Tochterplatine Top surface of daughter card Lochbild für Leiterplatte (Bestückungsseite) 9 x 2,5 = (22,5) 2,5 Board hole pattern (Component mounting side) ),2,2 alle Löcher 0.05 all holes ) 0.46 ± 0.05 Durchmesser des metallisierten Loches 0.46 ± 0.05 Diameter of finished plated-through hole GND h h g GND g GND f e f GND e GND d d c GND c GND b b a GND a, 4,5 0, ± 0.02 Bohrdurchmesser des Loches 0.55 ± 0.02 Diameter of drilled hole Schichtaufbau im metallisierten Loch siehe Zeichnung 3849 Metal plating of plated-through hole see drawing ,04 6 Catalog E XXXXXX 09/3 Edition 4

7 Standard Vertical Male Connectors 4 Pair Dimensional Drawing Date Code 23,4-0, 6,35 0, XXXXXXX ERNI EE-Zone für durchkontaktierte Löcher ø 0.6 ±0.05 compliant zone for through hol e ø 0.6 ±0.05 (,7 0,2 ) 3,4 0,05 3-0, ,7 a b ab c d cd e f ef g h gh,5 4,5 2,5 9x2.5= 22,5 0,75 24,95-0, Lochbild für Leiterplatte (Bestückungsseite) Board hole patter n (Component mounting side) a b ab c d cd e f ef g h gh 9 x 2.5 = 2.5 ( 22.5 ) ) alle Löcher - all holes ( 6.5 ) x.5 = ) ø 0.6 ±0.05 Durchmesser des metallisierten Loches ø 0.6 ±0.05 Diameter of finished plated-through hole ø 0.7 ±0.02 Bohrungsdurchmesser des Loches ø 0.7 ±0.02 Diameter of drilled hole Catalog E XXXXXX 09/3 Edition 4 7

8 Metal Plating of Plated Through-holes Hole design ø0.46 mm Durchmesser des metallisierten Loches Diameter of finished plated-through hole 0,46 ±0,05 0,55 ±0,02 min. 0,05 Bohrungsdurchmesser des Loches Diameter of drilled hole Restringbreite Restring width max. 0 µm Sn ) min. 25 µm Cu Hole design ø0.6 mm Durchmesser des metallisierten Loches Diameter of finished plated-through hole 0,6 0,05 0,7 0,02 min. 0,05 Bohrungsdurchmesser des Loches Diameter of drilled hole Restringbreite Restring width max. 5 m min. 25 m Cu Sn 8 Catalog E XXXXXX 09/3 Edition 4

9 Notes Catalog E XXXXXX 09/3 Edition 4 9

10 Notes 0 Catalog E XXXXXX 09/3 Edition 4

11 Member Katalog Catalog D E XXXXXX Ausgabe 09/3 3, 03/05 Edition 4

12 ERNI Electronics GmbH & Co. KG Seestrasse Adelberg/Germany Tel Fax info@erni.de Europe South America Africa Japan ERNI Electronics Inc. 220 Westwood Ave Richmond, VA 23230/USA Tel Fax info.usa@erni.com North America Canada Mexico ERNI Asia Holding Pte Ltd 23A Serangoon North Avenue 5 #04-Singapore Tel Fax info.sg@erni.com Asia Australia New Zealand ERNI Electronics GmbH & Co. KG 203 Printed in Germany. A policy of continuous improvement is followed and the right to alter any published data without notice is reserved. ERNI, MicroStac, MicroSpeed, MiniBridge, MaxiBridge, ERmet, ERmet ZD, ERbic and ERNIPRESS are trademarks (registered or applied for in various countries) of ERNI Electronics GmbH & Co. KG. Catalog E XXXXXX 09/3 Edition 4

1.27 mm SMC Board-to-Board Adapter.

1.27 mm SMC Board-to-Board Adapter www.erni.com Katalog Catalog D E 07518 07582 0/09 Ausgabe 3, 03/05 Edition www.erni.com 2 1 www.erni.com Catalog E 07582 0/09 Edition 2 Table of Contents General..............................................................................................2