Engineering Manual LOCTITE GC 3W T3 & T4 Solder Paste

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Joan Watts
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1 Engineering Manual LOCTITE GC 3W T3 & T4 Solder Paste Suitable for use with: Standard SAC Alloys GC 3W The Game Changer

2 Contents 1. Introduction: Basic Properties, Features & Benefits 2. Operating Parameters IPC Slump Tack Force Print Process Window & Capability Print Abandon Time Continuous Print Reflow Performance Humidity Resistance Surface Finish Voiding 3. Cleanability 4. Operating Parameters: Storage 5. Reliability and Specification Testing 6. Product Summary 2

3 1. Introduction Basic Solder Paste Properties Flux Description GC 3W GC 3W Alloy SAC305 SAC305 Henkel Powder Size Type 3 Type 4 Powder Size range, m Metal Content, % wt Malcom Viscosity, 10rpm (Typical) 150 Pa.s 150 Pa.s TI (Typical) IPC slump at182 C (0.33mm x 2.03mm) first space no bridge 0.20 mm 0.20 mm IPC Solder Balling Preferred Preferred 3

4 1. Introduction GC 3W Features & Benefits Product Attribute Process Benefit Halogen Free No added halogen Measured <900ppm chlorine and bromine and <1,500ppm total by oxygen (O 2 ) bomb test Halide Free Flux classification ORM0 in accordance to J-STD-004B Application Lead-free water-washable solder paste Halogen-free flux technology Designed for high-reliability applications Excellent humidity resistance and storage stability Storage stability: 5-25 o C for six months Excellent abandon time: 4 hours for 0.5 mm pitch ball devices or 0.4 mm pitch leaded devices (QFP) Cleanability Designed to be cleanable in deionized water Residues cleanable after double reflow Low corrosivity of flux residues- boards can be cleaned up to 1 week after soldering 4

5 1. Handling Guidelines For more detailed information on handling please refer to the Handling Guidelines document for GC 3W solder paste Storage: It is recommended that GC 3W solder paste is stored at temperatures below 25 o C (77 o F). Storage below this temperature down to a temperature of 0 C (32 o F) will have no negative effect on the material. Working Environment: GC 3W solder paste performs best when used in a controlled environment. Maintaining an ambient temperature of between 20 and 25 o C (68-77 o F) at a relative humidity of 30 60% RH will ensure consistent performance and maximum life of the paste. Stirring: To restore GC 3W solder paste to its specified rheology, it can be stirred using a non-metallic or round-edged spatula for 1 2 minutes before being applied to the printer. Solder paste dispensed from a cartridge does not require stirring as the rheology is restored during the dispensing and printing (knead) process. GC 3W solder paste packed in jars may show some separation after storage at higher temperatures, if this is observed the paste can be restored by stirring until it appears homogeneous. GC 3W solder paste can also be conditioned using commercially available solder paste autostirrer systems. A mixing time of 1 2 minutes is recommended. Paste Life: As a general rule GC 3W solder paste can be used on the stencil for at least 8 hours at 25 o C, 60% RH. Stencil life may be extended at lower ambient humidity. Paste which has been on the printer can be stored at room temperature for up to 72 hours before being re-used. 5

6 1. Paste Equilibration at Room Temperature Equilibration: If GC 3W is stored under refrigerated conditions a minimum time of two hours is required for paste to reach an acceptable use temperature, a time of four hours is recommended to ensure equilibration. Paste stored at room temperature required no equilibration. GC 3W solder paste equilibration Thermocouple placed in solder paste container during equilibration at room temperature 6

2. Operating Parameters IPC Slump Slump evaluation was performed in accordance with J-STD-005A,

35 First spacing with no bridge recorded after 10 minutes at 182 C (35 C below melting point 217 C)

03mm Pass mark 0.63mm 0.30mm 0.30mm 0.20mm 25 C 0.33mm 0.10mm 0.15mm 0.125mm 182 C 0.33mm 0.20mm 0.

7 2. Operating Parameters IPC Slump Slump evaluation was performed in accordance with J-STD-005A, IPC-TM First spacing with no bridge recorded after 10 minutes at 182 C (35 C below melting point 217 C) Stencil Design/ thickness GC 3W A m GC 3W A m Aperture 0.63 x 2.03mm 0.33 x 2.03mm 0.33 x 2.03mm 0.20 x 2.03mm Pass mark 0.63mm 0.30mm 0.30mm 0.20mm 25 C 0.33mm 0.10mm 0.15mm 0.125mm 182 C 0.33mm 0.20mm 0.15mm 0.125mm GC 3W o C 200 m GC 3W o C 100 m No bridging observed at 0.20 mm gap at 182 o C, this represents the typical spacing of 0.4 mm pitch leaded devices 7

44 (J-STD005) GC 3W tack-life >48hours Paste tested Loctite GC 3W SAC305 T4 895V Malcom TK1 Tackiness Tester Preload

8 2. Operating Parameters Tackiness Solder paste should remain tacky after deposition to hold components in place between placement and the reflow process Method IPC-TM (J-STD005) GC 3W tack-life >48hours Paste tested Loctite GC 3W SAC305 T4 895V Malcom TK1 Tackiness Tester Preload Preload time Retraction Speed Deposit diameter Deposit height 300g 5 secs 2.5mm/sec 5.1mm 0.25mm The tackiness of GC 3W solder paste does not show a marked decrease over a 48-hour period 8

2. Operating Parameters Print Process Window (example 0.5 mm CSP) Print Condition Value Stencil thickness 125 µm Separation Speed 0.

9 2. Operating Parameters Print Process Window (example 0.5 mm CSP) Print Condition Value Stencil thickness 125 µm Separation Speed mm/s GC 3W solder paste can be printed using a wide range of conditions, additional print pressure is required at achieve the best process at higher print speeds. As a general guide to process setup sufficient pressure should be applied to achieve good topside stencil wiping. GC 3W solder paste can be printed using a wide range of print conditions 9

10 2. Operating Parameters Print Process Window (example 0.4 mm QFP) Print Condition Value Stencil thickness 125 µm Separation Speed mm/s GC 3W solder paste can be printed using a wide range of conditions, additional print pressure is required at achieve the best process at higher print speeds. As a general guide to process setup sufficient pressure should be applied to achieve good topside stencil wiping. GC 3W solder paste can be printed using a wide range of print conditions 10

Smallest minimum aperture diameter (best process) 0.25 mm 0.22-0.

11 2. Operating Parameters Print capability (circular aperture, 100 micron stencil) Type 3 Powder Type 4 Powder Typical minimum aperture diameter Smallest minimum aperture diameter (best process) 0.25 mm mm 0.23 mm 0.20 mm T3 paste, 0.23 mm aperture T4 paste, 0.21 mm aperture 11

2. Operating Parameters Printer abandon time at 25 o C/ 50% RH Printer abandon time is the time the paste can be left on the printer and still produce an acceptable first print.

12 2. Operating Parameters Printer abandon time at 25 o C/ 50% RH Printer abandon time is the time the paste can be left on the printer and still produce an acceptable first print. The abandon time achievable with a solder paste is dependent on the finest pitch devices on the board. Initial 2 hours 4 hours Print volume data is presented for a typical 0.4 mm pitch leaded device and a 0.5 mm ball device. Print Condition Value No knead cycle done on recommencing printing Print Pressure 7kg Print Speed 50mm/s Separation Speed 10mm/s Stencil Thickness 125µm Aperture width TQFP 0.20 mm GC 3W shows long abandon time- no knead cycle required after 4 hrs abandon for 0.40 mm QFP apertures 12

13 2. Operating Parameters Printer abandon time at 25 o C/ 50% RH Print Condition Value Print Pressure 7kg Print Speed 50mm/s Separation Speed 10mm/s Stencil Thickness 125µm Aperture width TQFP 0.20 mm Initial 2 hours 4 hours No knead cycle done on recommencing printing GC 3W shows long abandon time - no knead cycle required after 4 hrs abandon for 0.5 mm CSP device 13

Pressure 7kg Print Speed 50mm/s Separation Speed 10mm/s Stencil Thickness 125µm Print time

14 2. Operating Parameters Continuous Printing, 8 hours at 25 o C/50% RH 0.4 mm TQFP 120, before and after 2000 cycle print (8 hrs) Print Condition Value Print Pressure 7kg Print Speed 50mm/s Separation Speed 10mm/s Stencil Thickness 125µm Print time 8 hrs Print cycles 1,200 GC 3W solder paste shows similar print performance after continuous printing for eight hours 14

63mm 0.30mm 0.63mm 0.30mm 25 C 0.33mm 0.10mm 0.33mm 0.10mm 182 C 0.33mm 0.20mm 0.33mm 0.20mm Initial slump 182 o C (0.

15 2. Operating Parameters Continuous Printing, 8 hours at 25 o C/50% RH IPC Slump Performance Stencil Design/ thickness GC 3W A m Initial GC 3W A m 8 Hours Aperture 0.63 x 2.03mm 0.33 x 2.03mm 0.63 x 2.03mm 0.33 x 2.03mm Pass mark 0.63mm 0.30mm 0.63mm 0.30mm 25 C 0.33mm 0.10mm 0.33mm 0.10mm 182 C 0.33mm 0.20mm 0.33mm 0.20mm Initial slump 182 o C (0.33 mm pad) Slump after 1,200 cycles (0.33 mm pad) GC 3W solder paste passes IPC slump before and after continuous printing for 8 hours 15

150 100 50 0 0 1 2 3 4 5 6 Time / minutes Reflow Condition Time Above 217 o C Peak Temperature Value

16 2. Operating Parameters Continuous Printing, 8 hours at 25 o C/50% RH, IPC Slump Solder Balling and Reflow (coalescence) Solder Ball Test CSP 56 coalescence 250 Reflow Profile Temperature (C) Time / minutes Reflow Condition Time Above 217 o C Peak Temperature Value 49s 244 o C GC 3W solder paste shows good reflow performance after continuous printing for 8 hours 16

17 2. Operating Parameters Reflow Process Guidelines, summary There is no single profile that works for all applications and processes should be assessed individually. During applications testing good results were achieved using profiles within the reflow guidelines below. Linear type profile Mean heating rate Peak temperature Time above liquidus (217 o C) o C/s o C 20 50s Reflow was assessed using a Heller 1826 forced convection reflow oven, example profiles are provided on the following slides 17

18 2. Operating Parameters Reflow Process Guidelines (aerobic reflow) The optimum reflow process range is shown by the green (solid line) profiles, this optimum range is summarized in the table Time above 217 o C 20-50s Peak temperature o C Ramp rate o C/s 18

19 2. Operating Parameters Reflow Process Guidelines (anaerobic reflow, N 2 ) The optimum reflow process range is shown by the green (solid line) profiles, this optimum range is summarized in the table Time above 217 o C 20-65s Peak temperature o C Ramp rate O 2 concentration o C/s <1000 ppm 19

GC 3W 2. Operating Parameters Solder Balling / Humidity Resistance A solder balling test is a method of assessing the ability of a solder paste to coalesce.

Results are presented below for the IPC solder balling test (IPC TM-650 2.4.

20 GC 3W 2. Operating Parameters Solder Balling / Humidity Resistance A solder balling test is a method of assessing the ability of a solder paste to coalesce. A circular deposit of paste is printed on a non-wettable substrate and the paste is reflowed in an oven, the paste should reflow into a single large solder ball with few or no satellite balls. Results are presented below for the IPC solder balling test (IPC TM ) IPC Solder Balling TM Stored 4 hours at 27 o C/60% RH Result: IPC Preferred category Paste tested initially and after storage of printed solder paste for four hours at 27 o C/ 60% RH Initial 27C/60%RH Temperature (C) Reflow Profile 2 3 Time / minutes GC 3W solder paste shows preferred category reflow after testing to the IPC solder balling test IPC TM

21 2. Operating Parameters Humidity Resistance- Reflow Solder balling and coalescence was also tested to an internal Henkel test method. Good coalescence was achieved after storage of printed FR4 substrates for 24 hours at 27 o C/80% RH Initial (Print) Initial (Reflow) 8hr 27 o C/80% RH 24hr 27 o C/80% RH 250 Reflow Profile Temperature (C) Time / minutes Reflow Condition Value T> 217 o C 49s Peak 244 o C GC 3W solder paste shows good solder balling performance after exposure to high humidity conditions 21

22 OSP Cu Au 2. Operating Parameters Placed Components Au & OSP Cu Print Condition Value Print Pressure 7kg Print Speed 50mm/s Separation Speed 10mm/s Stencil Thickness 125µm Component BGA196 SOIC Side 22

23 OSP Cu Au 2. Operating Parameters Reflow Au & OSP Cu (shown prior to cleaning) Reflow Condition Value 300 Reflow Profile Time Above 217 o C Peak Temperature 42s 243 o C Mean Slope 0.9 Temperature (C) C Time (minutes) Component BGA (Side) SOIC (Side) 23

24 2. Operating Parameters Voiding Void performance on unpopulated OSP-Cu & Au surfaces with different reflow profiles. Reflow Condition Profile 1 Profile 2 Time Above 217 o C 42s 49s Peak Temperature 243 o C 244 o C 25 Boxplot of IPC Voiding Percentage 20 Class 1 IPC Voiding % Class 2 Class Profile Finish Profile 1 Au Profile 2 Profile 1 Profile 2 OSP-Cu GC 3W meets voiding requirement IPC7095B Class 3 24

Reflow Condition Value Time Above 217 o C 42s Peak Temperature 243 o C Mean

25 2. Operating Parameters Voiding: 0.5mm CSP56 component Void performance on CSP component Boxplot of CSP56 voiding Reflow Condition Value Time Above 217 o C 42s Peak Temperature 243 o C Mean Slope 0.9 OSP copper board finish, SAC component ball Histogram of CSP56 voiding GC 3W meets voiding requirement IPC7095B Class 3 25

26 3. Operating Parameters Cleaning, Typical Parameters The post-reflow residues of GC 3W solder paste must be removed using a cleaning process after reflow. GC 3W solder paste residues can be removed using aqueous or semi-aqueous cleaning processes. Boards can be cleaned after a delay of up to seven days after soldering if required. There is no single cleaning process that can be recommended for all applications and assemblies as the processes and cleaning equipment used may vary. Guidelines based on laboratory testing of GC 3W solder paste in a representative batch aqueous cleaner are provided as a starting point for process setup. Parameter Typical Range Wash Temperature o C o F Wash Time 5-15minutes Rinse Temperature o C o F Number of Rinses (30s each) 2-6 *Typical range for batch aqueous cleaner, both wash and rinse stages deionized water 26

3. Operating Parameters Cleaning, Typical Parameters Parameter Wash/ rinse solution Wash Temperature Wash Time Rinse Temperature Number of Rinses Typical Range Deionized water 40-60 o C 5-15 minutes

27 3. Operating Parameters Cleaning, Typical Parameters Parameter Wash/ rinse solution Wash Temperature Wash Time Rinse Temperature Number of Rinses Typical Range Deionized water o C 5-15 minutes o C 2-6 (30s each) Visual cleanliness similar within above range Residues can be cleaned after a delay of up to 1 week (assessed by SIR testing) Number of rinses is the most influential factor for ionic cleanliness GC 3W shows acceptable cleaning under this range of conditions, ionic contamination <0.03 µg cm -2 (IPC ) 27

28 Double Reflow Single Reflow 3. Operating Parameters Single & Double Reflow after Cleaning Reflowed on OSP-Cu Aqueous batch cleaner Deionised water at 50 o C 5 minute Wash Cycle 4x30 seconds Rinse Cycle Reflow Condition Value Time Above 217 o C 42s Peak Temperature 243 o C Mean Slope 0.9 Temperature (C) Reflow Profile 3 4 Time (minutes) C Component BGA BGA (Removed) GC 3W residues can be removed after processing through two typical reflow cycles 28

one month at 40 o C Shows typical print performance and good appearance Malcom viscosity (mean of multiple batches)

29 Viscosity /Pa.s 4. Operating Parameters: Storage Storage Stability at 40 o C GC 3W paste shows little change in viscosity on storage for one month at 40 o C Shows typical print performance and good appearance Malcom viscosity (mean of multiple batches) Initially and after storage at 40 o C Initial 4 weeks 40C Speed /rpm GC 3W solder paste is tolerant to short-term high temperature storage (1 month at 40 o C) 29

5 mm CSP56 (Cp 3.4) Initial, 0.4 mm TQFP120 (Cp 5.

30 4. Operating Parameters: Storage Print Capability (initial) Print Condition Value Print Pressure 7kg Print Speed 50mm/s Separation Speed 10mm/s Stencil Thickness 125µm Initial, 0.5 mm CSP56 (Cp 3.4) Initial, 0.4 mm TQFP120 (Cp 5.8) GC 3W solder paste shows good print capability (Cp > 1.33 for 0.5 mm pitch ball components and 0.4 mm pitch leaded components) 30

31 4. Operating Parameters: Storage Print capability after storage for 4 weeks at 40 o C Print Condition Value Print Pressure 7kg Print Speed 50mm/s Separation Speed 10mm/s Stencil Thickness 125µm Stored, 0.5 mm CSP56 (Cp 3.3) Stored, 0.4 mm TQFP120 (Cp 5.8) Process Capability of CSP56 Volume Loctite GC 3W SAC305 T4 895V Paste, 4wks 40C Process Capability of TQFP Volume Loctite GC 3W SAC305 T4 895V Paste, 4wks 40C Process Data LSL e+006 Target * USL e+007 Sample Mean e+006 Sample N 2520 StDev (Within) StDev (O v erall) O bserv ed Performance PPM < LSL 0.00 PPM > USL 0.00 PPM Total 0.00 LSL Exp. Within Performance PPM < LSL 0.00 PPM > USL 0.00 PPM Total Exp. O v erall Performance PPM < LSL 0.00 PPM > USL 0.00 PPM Total USL Within Overall Potential (Within) C apability C p 3.34 C PL 3.60 C PU 3.08 C pk 3.08 O v erall C apability Pp 2.73 PPL 2.94 PPU 2.52 Ppk 2.52 C pm * Process Data LSL e+007 Target * USL e+007 Sample Mean e+007 Sample N 1800 StDev (Within) StDev (O v erall) e+006 O bserv ed Performance PPM < LSL 0.00 PPM > USL 0.00 PPM Total 0.00 LSL Exp. Within Performance PPM < LSL 0.00 PPM > USL 0.00 PPM Total Exp. O v erall Performance PPM < LSL 0.02 PPM > USL 0.00 PPM Total USL Within Overall Potential (Within) C apability C p 5.82 C PL 3.25 C PU 8.40 C pk 3.25 O v erall C apability Pp 3.30 PPL 1.84 PPU 4.76 Ppk 1.84 C pm * GC 3W solder paste shows good print capability after 1 month storage at 40 o C 31

32 4. Operating Parameters: Storage Print capability after storage for 6 months at 26.5 o C Print Condition Value Print Pressure 7kg Print Speed 50mm/s Separation Speed 10mm/s Stencil Thickness 125µm Stored, 0.5 mm CSP56 (Cp 3.3) Stored, 0.4 mm TQFP120 (Cp 5.6) GC 3W solder paste shows good print capability after 6 months storage at 26.5 o C 32

4. Operating Parameters: Storage Reflow after 6

5 o C (after cleaning) Reflow on OSP copper board

minute Wash Cycle 4x 30 seconds Rinse Cycle

33 4. Operating Parameters: Storage Reflow after 6 months storage at 26.5 o C (after cleaning) Reflow on OSP copper board Aqueous batch cleaner Deionised water at 50 o C 5 minute Wash Cycle 4x 30 seconds Rinse Cycle Reflow Condition Value Time Above 217 o C 42s Peak Temperature 243 o C Mean Slope 0.9 Temperature (C) Reflow Profile 3 4 Time (minutes) C Component SOIC GC 3W solder paste shows good reflow after six months storage at 25 o C 33

5. GC 3W Reliability & Specification Testing Summary Standard Test Result Cu Corrosion IPC TM-650 2.6.15C Pass ANSI/ J-STD-004B Cu Mirror IPC TM-650 2.3.32D Pass Control Halogen Pass (no added halogen) GC 3W Surface Insulation Resistance IPC TM-650 2.

34 5. GC 3W Reliability & Specification Testing Summary Standard Test Result Cu Corrosion IPC TM C Pass ANSI/ J-STD-004B Cu Mirror IPC TM D Pass Control Halogen Pass (no added halogen) GC 3W Surface Insulation Resistance IPC TM & IPC TM Electromigration IPC TM Pass (cleaned) Pass (cleaned) 3.2 x10 8 Ohms ( , after 168 hrs.) 1.1x10 11 Ohms after 21days HF 2W flux has been classified as ORM0 according to reliability test methods defined in the J-STD004b specification OR designates an organic flux- the largest part of the non-volatile portion of GC 3W flux is best described as organic M designates moderate flux activity, GC 3W flux must be cleaned in order to meet the IPC Surface Insulation Resistance requirement 0 designates a material that is halogen-free GC 3W has been assigned the flux classification ORM0 according to ANSI/ J-STD004B 34

3 (85 o C/ 85% RH) SIR / Ohms 24 hours 96 hours 168 hours Loctite GC 3W Cleaned after reflow (deionized water) Loctite GC 3W Cleaned

35 5. GC 3W Reliability Surface Insulation Resistance (SIR) to IPC TM (85 o C/ 85% RH) SIR / Ohms 24 hours 96 hours 168 hours Loctite GC 3W Cleaned after reflow (deionized water) Loctite GC 3W Cleaned seven days after reflow (deionized water) 1.8 x x x x x x10 8 Passmark 1.0 x x x µm track gap, 85 o C/85% RH, 5V bias, measured after cleaning (deionized water, 50 o C) GC 3W passes surface insulation resistance test to method IPC TM after cleaning 35

5. GC 3W Reliability Electrochemical Migration Resistance (electromigration) To IPC TM-650 2.6.14.

36 5. GC 3W Reliability Electrochemical Migration Resistance (electromigration) To IPC TM o C/85% RH, 5V bias, tested after cleaning (deionized water, 50 o C) GC 3W passes electromigration to method IPC TM after cleaning 36

37 5. GC 3W Reliability Surface Insulation Resistance (SIR) to IPC TM µm track gap, 40 o C/93% RH, 5V bias, measured after cleaning (deionized water, 50 o C) GC 3W passes surface insulation resistance test to method IPC TM after cleaning 37

38 5. GC 3W Specification Testing SGS report for GC 3W. Sample reflowed flux residue. Reference EN14582/IC Analysis. To meet halogen free requirements. Br<900ppm, Cl <900ppm, and combined <1500ppm Halogen Fluorine - ND Halogen Chorine - ND Halogen Bromine ND Halogen Iodine ND GC 3W contains no detectable halogen and is designated as halogen free 38

39 5. GC 3W Reliability Summary Copper Mirror (IPC TM D) Corrosion (IPC TM C) Pass Pass Halogen content (EN 14582, O 2 bomb) SIR (IPC TM ) Cleaned same day as reflow SIR (IPC TM ) Cleaned after delay of 1 week SIR (IPC TM V/200 m spacing Electromigration (IPC TM ) Pass Pass (when cleaned) Pass (when cleaned) Pass (when cleaned) Pass (when cleaned) IPC Flux classification, J-STD004B, Dec 2008 ORM0 39

40 6. Performance Summary Flux Halogen-free flux: passes IC with pretreatment IPC-TM /EN14582 Halogen-free flux classification: ANSI/J-STD-004 Rev. B, ORM0 classification Paste Lead-free, water-washable solder paste Storage stability: 5-25 o C for six months Suitable for fine pitch, high speed printing up to 150 mm/s (6 /s) Excellent resistance to humidity Long printer abandon time and open time Designed to be cleanable in deionized water Residues cleanable after two reflow cycles Low corrosivity of flux residues: boards can be cleaned up to seven days after soldering 40

41 Thank you!

ALPHA OM-350 Lead-Free Solder Paste

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