Qualcomm Toq Smartwatch ToqSW1

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1 Qualcomm Toq Smartwatch ToqSW1 Bluetooth Sample Report Product Description The Qualcomm Toq Smartwatch, model ToqSW1, not only functions as a normal watch but can receive notifications and applet content with limited replays when paired to a smartphone via a Bluetooth connection. Time/date and all notifications are displayed on a 1.55-in. Qualcomm Mirasol IMOD (interferometric modulation) display with frontlight illumination for extra readability in darker environments. A Qualcomm touchscreen, driven by a Cypress Technologies controller, allows you to navigate easily through various screens, while Semtech s Tap/Touch sensor controller activates the frontlight as well as the home page and lock functions. Other features include vibrational alerts, airplane mode, and future stereo Bluetooth audio. The Toq Smartwatch is powered by a 3.7 V, 240 mah Li-ion that supplies up to 72 hours of use time. It s recharged via Qualcomm s WiPower LE wireless inductive charger, which can also be used for charging wireless headsets. DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information. Copyright 2014, TechIngsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights. 2014, TechInsights Survey Teardown

2 Product Type Smartwatch Brand Qualcomm Product Name & Model # Toq Smartwatch ToqSW1 Official Release Date 12/02/2013 Retail Price $ Weight (grams) 72.3 Product Dimensions (mm) 81.6 x 74.1 x 47.3 Operating System ThreadX (Software compatibility requires minimum Android "Ice Cream Sandwich"; Android "Jelly Bean" and above preferred.) Microcontroller STMicroelectronics STM32F207IGH6 ARM Cortex-M3 32-Bit MCU Interfaces Touchscreen, (2) Tap Pads Sensor 3-Axis Digital Accelerometer Connectivity Bluetooth 4.0 Storage Internal: 2 GB; External: N/A Battery Life Use Time: ~72 hrs. Battery Display Product Description Product Features Key Subsystems 3.7 V, 240 mah, Li-Polymer 1.55" IMOD (Interferometric Modulation); 288 x 192 Pixels; 262,144 Colors Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

3 Package Info Die Info Estimated Costs Pkg Ref. # Pkg Qty Brand Name Part Number Pkg Description Form Pin Count Length (mm) Width (mm) Height (mm) Die Ref # Die Qty Brand Name Part Number Description 1 1 STMicroelectronics STM32F207IGH6 ARM Cortex-M3 32-Bit Microcontroller BGA STMicroelectronics R411B ARM Cortex-M3 32-Bit Microcontroller $2.100 $ Micron MT45W8MW16BGX-701 IT p-sram Memory - 16 MB BGA Micron P26Z p-sram Memory - 16 MB $1.350 $ Semtech SX8648Q Capacitive Button / Slider Touch Controller w/ LED Drivers QFN Semtech UD332 Capacitive Button / Slider Touch Controller $0.420 $ Freescale MMA8451Q 3-Axis Digital MEMS Accelerometer QFN Stacked Freescale 5662 MEMS Sensor $0.700 $ Freescale N16D Accelerometer Processor $0.240 $ Maxim MAX9867 Stereo Audio CODEC Flip Chip, Solder Maxim AU97Y Stereo Audio CODEC $0.700 $ Toshiba T3GE9WBG? Dual-Supply Bus Transceiver? Flip Chip, Solder Toshiba CGH9C Dual-Supply Bus Transceiver? $0.290 $ Intersil ISL97634 White LED Driver w/ PWM Dimming DFN Intersil 53515A02 White LED Driver w/ PWM Dimming $0.100 $ Micron MTFC2GMXEA-WT Multichip Memory - 2 GB MLC NAND Flash, Memory Controller (emmc) MCP - 2 Chips Micron L72A MLC NAND Flash Memory - 2 GB $2.100 $ Micron PS8200 Memory Controller $0.820 $ Qualcomm Atheros WCN2243 Single-Chip Bluetooth 4.0 / FM Rx/Tx + RDS/RBDS Flip Chip, Solder Qualcomm Atheros HG11-VK Single-Chip Bluetooth 4.0 / FM Rx/Tx + RDS/RBDS $1.150 $ Texas Instruments BQ24232 Battery Charger w/ Power Management QFN Texas Instruments BQ24072 Battery Charger w/ Power Management $0.240 $ Atmel ATmega168PA-MMH 8-Bit Microcontroller w/ Flash - 16 KB QFN Atmel?66 8-Bit Microcontroller w/ Flash - 16 KB $0.520 $ Cypress Semiconductor CY8CTMA140-LQI Capacitive Touchscreen Controller QFN Cypress Semiconductor C20300A Capacitive Touchscreen Controller $0.820 $ STMicroelectronics M95512-D EEPROM Memory - 64 KB DFN STMicroelectronics M95512KA EEPROM Memory - 64 KB $0.190 $ Himax PA6561A2 IMOD Display Driver Flip Chip, Adhesive Himax PA6561A2 IMOD Display Driver $1.890 $1.890 Totals $13.63 Length (mm) Width (mm) Each Total Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet. Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

4 View 1 Watch View 2 Charger Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

5 View 1 Watch View 2 Charger Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

6 View 1 Watch View 2 Charger Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

7 View 1 Watch View 2 Charger Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

8 Watch Markings Charger Markings Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

9 View 1 Watch View 2 Charger Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

10 View 1 Watch View 2 Charger Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

11 View 1 View 2 Watch Charger Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

12 View 1 View 2 Watch Charger Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

13 Bluetooth Antenna Bluetooth Antenna Touch Sensor Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

14 Tap Sensor Pad Front Light Tap Sensor Bluetooth Antenna Home / Lock Touch Sensor Touch Sensor Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

15 Battery/Tap Sensor Connector Battery Tap Sensor Pad Front Light Tap Sensor Bluetooth Antenna Home / Lock Touch Sensor Touch Sensor Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

16 Battery Subsystem Brand UER Technologies Part Number INO Type Li-Polymer Voltage 3.70 Rating (mah) 240 Size (mm) 30.7 x 20.7 x 5 Vol. Energy Density (mwh/cc) Weight (grams) 5.7 Wt. Energy Density (mwh/g) 156 Battery Display Touchscreen Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

17 Display Subsystem 14 - Himax #PA6561A2 IMOD Display Driver Brand Qualcomm Part Number M4789? Type IMOD View Diagonal (inches) 1.55 Colors Rows x Columns (pixels) 192 x 288 Frontlight Frontlight Illumination, 3 White LEDs Display Size (mm) 39.8 x 32 x 1.21 Weight (grams) STMicroelectronics #M95512-D EEPROM Memory - 64 KB Qualcomm Mirasol IMOD Matrix Battery Display Touchscreen Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

18 Touchscreen Subsystem Brand Qualcomm Part Number M5148? Type Capacitive Size (mm) 40.7 x 33.0 x 0.5 Weight (grams) Cypress Semiconductor #CY8CTMA140-LQI Capacitive Touchscreen Controller Qualcomm Touchscreen Matrix Battery Display Touchscreen Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

19 Grid = 1 cm Side 1 Side 1 IC Identification Side 2 Side 2 IC Identification Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

20 1 - STMicroelectronics #STM32F207IGH6 ARM Cortex-M3 32-Bit Microcontroller 5 - Maxim #MAX9867 Stereo Audio CODEC 2 - Micron #MT45W8MW16BGX-701 IT p-sram Memory - 16 MB 6 - Toshiba #T3GE9WBG? Dual-Supply Bus Transceiver? 4 - Freescale #MMA8451Q 3-Axis Digital MEMS Accelerometer (2-Die Pkg.) 3 - Semtech #SX8648Q Capacitive Button / Slider Touch Controller w/ LED Drivers 7 - Intersil #ISL97634 White LED Driver w/ PWM Dimming Grid = 1 cm Side 1 Side 1 IC Identification Side 2 Side 2 IC Identification Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

21 Grid = 1 cm Side 1 Side 1 IC Identification Side 2 Side 2 IC Identification Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

22 8 - Micron #MTFC2GMXEA-WT Multichip Memory - 2 GB MLC NAND Flash, Memory Controller (emmc) (2-Die Pkg.) 9 - Qualcomm Atheros #WCN2243 Single-Chip Bluetooth 4.0 / FM Rx/Tx + RDS/RBDS 10 - Texas Instruments #BQ24232 Battery Charger w/ Power Management Grid = 1 cm Side 1 Side 1 IC Identification Side 2 Side 2 IC Identification Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

23 11 - Atmel #ATmega168PA-MMH 8-Bit Microcontroller w/ Flash - 16 KB Grid = 1 cm Side 1 Side 2 Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

24 Grid = 1 cm Side 1 Side 2 Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion

25 COST ESTIMATION PROCESS Overview and Discussion Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time. TechInsights' philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider's knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the "right" answer for your firm's environment. However, TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge. Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-ofmaterials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources. Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennas, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost. The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate. We believe our cost estimates generally fall within 15 percent of the "right answer", which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce. Please feel free to contact us at support@techinsights.com with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input. Product Details Major IC Bill of Materials Exterior Features Product Label Major Components Antenna / Touch Sensor Subsystems Main Board Charger Board Cost Estimation Discussion