21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) website :

Size: px
Start display at page:

Download "21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) website :"

Transcription

1 21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) info@systemplus.fr - website : November Version 1 Written by: Romain FRAUX DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 1

2 Glossary Table of Contents 1. Overview / Introduction Executive Summary Reverse Costing Methodology 2. Company Profile Analog Devices Profile MEMS Accelerometer Portfolio ADXL362 Characteristics 3. ADXL362 Physical Analysis Physical Analysis Methodology Package Package Characteristics & Markings Package Pin-Out Package X-Ray Package Opening Main Parts Package Opening Dies Bonding Process Package Cross-Section ASIC ASIC Dimensions ASIC Markings ASIC Delayering ASIC Cross-Section MEMS Accelerometer MEMS Accelerometer Dimensions MEMS Accelerometer Markings MEMS Accelerometer Bond Pads MEMS Accelerometer Cap Opening MEMS Accelerometer Cap Overview MEMS Accelerometer Sensing Area MEMS Accelerometer Sensor Details MEMS Accelerometer Cross-section 4. Manufacturing Process Flow Global Overview ASIC Process Flow Description of the ASIC Wafer Fabrication Unit MEMS Accelerometer Process Overview MEMS Accelerometer - Sensor Process Flow MEMS Accelerometer - Cap Process Flow MEMS Accelerometer - Wafer Bonding Process Flow Description of the MEMS Accelerometer Wafer Fabrication Unit Component Packaging Process Flow Description of the Assembly Unit 5. Cost Analysis Synthesis of the Cost Analysis Main Steps of Economic Analysis Yields Explanation Yields Hypotheses Die per wafer & Probe Test ASIC Wafer Cost ASIC Back-End 0 : Probe Test, Backgrinding & Dicing ASIC Die Cost MEMS Accelerometer Wafer Cost MEMS Accelerometer cost per Steps MEMS Accelerometer Die Cost Back-End: Packaging Cost Back-End: Packaging Cost per steps Back-End: Final test & Calibration Cost ADXL362 Component Cost (FE + BE 0 + BE 1) 6. Estimated Price Analysis Definition of Prices Manufacturer Financial Ratios ADXL362 Estimated Manufacturer Price ADXL362 Estimated Selling Price Contact by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 2

3 Executive Summary This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Analog Devices ADXL362 component. The ADXL362 is a 3-axis MEMS Accelerometer. It is suitable for applications that require long battery life expectancy, and where battery replacement can be impractical or dangerous (Hearing aids, Home healthcare devices, Motion enabled power save switches, Wireless sensors, Motion enabled metering devices). The ADXL362 provides measurement ranges of ±2g, ±4g, and ±8g. It consume only 1.8µA at a 100Hz output data rate and 270nA in motion sensing wake-up mode. Compatible with SMD process, the ADXL362 is provided in a 3x3.25x1.05mm LGA 16-pin package by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 3

4 2012 by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 4

5 Package Characteristics & Markings Package type: 16-pin LGA Dimensions: 3mm x 3.25mm x 1.05mm Pin pitch: 0.5mm Marking: 362X LH 5171 Package Top view Package side view Package back view (without solder mask) Package back view 2012 by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 5

6 Package Cross-Section PCB + ASIC 2012 by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 6

7 2012 by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 7

8 ASIC Dimensions 2012 by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 8

9 2012 by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 9

10 MEMS Accelerometer Cap Overview 2012 by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 10

11 MEMS Cross-Section - Sensor 2012 by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 11

12 2012 by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 12

13 MEMS Sensor : Process Flow 3/ by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 13

14 2012 by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 14

15 Main steps of economic analysis Front-End ASIC Front-End Cost MEMS Front-End Cost Back-End 0 Probe Test Cost Backgrinding & Dicing Cost Probe Test Cost Dicing Cost Back-End 1 Packaging Cost Final Test & Calibration Cost Component Cost ADXL362 We perform the economic analysis of the ASIC with the IC Price+ software. We perform the economic analysis of the MEMS and the packaging with the MEMS CoSim+ software by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 15

16 MEMS Accelerometer Front-End Cost 2012 by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 16

17 MEMS Accelero Front-End : Equipment Cost per Family 2012 by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 17

18 ADXL362 Component Cost (FE+BE 0+BE 1) 2012 by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 18

19 Contact Reverse costing analysis represents the best cost/price evaluation given the publically available data, completed with industry expert estimates. Given the hypothesis presented in this analysis the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated) IC +/- 8% MEMS +/- 5% Packaging +/- 10% Test +/- 20% These results are open for discussion. We can re-evaluate this circuit with your information. Please contact us: 2012 by SYSTEM PLUS CONSULTING, all rights reserved. ADI ADXL362 3-Axis Accelerometer 19

21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) website :

21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) website : 21 rue La Nouë Bras de Fer - 44200 Nantes - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr August 2012- Version 1 Written by: Maher SAHMIMI DISCLAIMER : System

More information

IMU for OIS. InvenSense 6-Axis OIS IMU & STMicroelectronics LSM6DSM. MEMS report by Stéphane ELISABETH November 2016

IMU for OIS. InvenSense 6-Axis OIS IMU & STMicroelectronics LSM6DSM. MEMS report by Stéphane ELISABETH November 2016 InvenSense 6-Axis OIS IMU & STMicroelectronics LSM6DSM IMU for OIS MEMS report by Stéphane ELISABETH November 2016 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr

More information

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website : 9 rue Alfred Kastler - BP 10748-44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr August 2011 - Version 1 Written by: Sylvain HALLEREAU

More information

Electronic Costing & Technology Experts

Electronic Costing & Technology Experts Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes France Phone : +33 (0) 240 180 916 email : info@systemplus.fr www.systemplus.fr March 2016 Version 1 Written by Stéphane

More information

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website : 9 rue Alfred Kastler - BP 10748-44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr October 2011 - Version 1 Written by: Romain FRAUX DISCLAIMER

More information

Electronic Costing & Technology Experts

Electronic Costing & Technology Experts Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes France Phone : +33 (0) 240 180 916 email : info@systemplus.fr www.systemplus.fr June 2016 Version 1 Written by Audrey Lahrach

More information

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website : 9 rue Alfred Kastler - BP 10748-44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr May 2011 - Version 2 Written by: Sylvain HALLEREAU DISCLAIMER

More information

WLCSP Accelerometer. MEMS report by Audrey LAHRACH March rue la Noue Bras de Fer NANTES - FRANCE

WLCSP Accelerometer. MEMS report by Audrey LAHRACH March rue la Noue Bras de Fer NANTES - FRANCE mcube MC3672 WLCSP Accelerometer MEMS report by Audrey LAHRACH March 2017 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr 2017 by System Plus Consulting

More information

Electronic Costing & Technology Experts

Electronic Costing & Technology Experts Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes France Phone : +33 (0) 240 180 916 email : info@systemplus.fr www.systemplus.fr DISCLAIMER : System Plus Consulting provides

More information

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website : 9 rue Alfred Kastler - BP 10748-44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr June 2012 - Version 1 written by : Maher SAHMIMI DISCLAIMER

More information

Bosch LRR4 Long and Short Range 77GHz Radar

Bosch LRR4 Long and Short Range 77GHz Radar Bosch LRR4 Long and Short Range 77GHz Radar System report by David Le Gac April 2017 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr 2017 by System

More information

Camera Module 2017 Physical Analyses Overview

Camera Module 2017 Physical Analyses Overview Camera Module 2017 Physical Analyses Overview Imaging report by Audrey LAHRACH November 2017 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr 2017

More information

AMD Radeon Vega Frontier Edition

AMD Radeon Vega Frontier Edition AMD Radeon Vega Frontier Edition 2.5D & 3D Packaging SPIL CoW last Samsung HBM2 Adv. Packaging report by Romain FRAUX November 2017 Version 1 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18

More information

Samsung s Galaxy S7 Processor Packages: Qualcomm/Shinko s MCeP vs. Samsung s PoP

Samsung s Galaxy S7 Processor Packages: Qualcomm/Shinko s MCeP vs. Samsung s PoP Samsung s Galaxy S7 Processor Packages: Qualcomm/Shinko s MCeP vs. Samsung s PoP Comparison of both Samsung Galaxy S7 processor packages: Qualcomm Snapdragon 820 MSM8996 with MCeP packaging technology

More information

LG LA080WVA-SD01 8 Inch Automotive Display with Touchscreen

LG LA080WVA-SD01 8 Inch Automotive Display with Touchscreen LG LA080WVA-SD01 8 Inch Automotive Display with Touchscreen Display Report by Audrey Lahrach & Farid Hamrani June 2017 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr

More information

Comparison & highlight on the last 3D TSV technologies trends Romain Fraux

Comparison & highlight on the last 3D TSV technologies trends Romain Fraux Comparison & highlight on the last 3D TSV technologies trends Romain Fraux Advanced Packaging & MEMS Project Manager European 3D Summit 18 20 January, 2016 Outline About System Plus Consulting 2015 3D

More information

THERMAL IMAGER WITH MICROBOLOMETER FOR SMARTPHONE: EVOLUTION & COMPARISON ON THE. Cliquez pour modifier le style du. titre LAST TECHNOLOGIES TRENDS

THERMAL IMAGER WITH MICROBOLOMETER FOR SMARTPHONE: EVOLUTION & COMPARISON ON THE. Cliquez pour modifier le style du. titre LAST TECHNOLOGIES TRENDS Electronic Costing & Technology Experts Power electronics MEMS & Sensors LED & Optoelectronics Advanced Packaging System THERMAL IMAGER WITH MICROBOLOMETER FOR Cliquez pour modifier le style du SMARTPHONE:

More information

NVIDIA Tesla P100 GPU with HBM2

NVIDIA Tesla P100 GPU with HBM2 NVIDIA Tesla P100 GPU with HBM2 2.5D & 3D Packaging TSMC CWS Samsung HBM2 Adv. Packaging reprt by Rmain FRAUX August 2017 Versin 1 21 rue la Nue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 inf@systemplus.fr

More information

Vertical Circuits. Small Footprint Stacked Die Package and HVM Supply Chain Readiness. November 10, Marc Robinson Vertical Circuits, Inc

Vertical Circuits. Small Footprint Stacked Die Package and HVM Supply Chain Readiness. November 10, Marc Robinson Vertical Circuits, Inc Small Footprint Stacked Die Package and HVM Supply Chain Readiness Marc Robinson Vertical Circuits, Inc November 10, 2011 Vertical Circuits Building Blocks for 3D Interconnects Infrastructure Readiness

More information

Adafruit Analog Accelerometer Breakouts

Adafruit Analog Accelerometer Breakouts Adafruit Analog Accelerometer Breakouts Created by Bill Earl Last updated on 2016-0-0 07:03:24 AM EDT Guide Contents Guide Contents Overview How it Works: MEMS - Micro Electro-Mechanical Systems Ratiometric

More information

± 2g Tri-Axis Accelerometer Specifications

± 2g Tri-Axis Accelerometer Specifications Product Description The is a tri-axis, silicon micromachined accelerometer with a full-scale output range of ±g (19.6m/s ). The sense element is fabricated using Kionix s proprietary plasma micromachining

More information

PNP 500 ma, 50 V resistor-equipped transistor; R1 = 2.2 kω, R2 = open

PNP 500 ma, 50 V resistor-equipped transistor; R1 = 2.2 kω, R2 = open PNP 500 ma, 50 V resistor-equipped transistor; R1 = 2.2 kω, R2 = open Rev. 4 8 November 2010 Product data sheet 1. Product profile 1.1 General description 500 ma PNP Resistor-Equipped Transistor (RET)

More information

MEMS functional sensor: smart 3D orientation and click detection standalone device. FC30-40 to +85 LGA-14 Tray FC30TR -40 to +85 LGA-14 Tape and reel

MEMS functional sensor: smart 3D orientation and click detection standalone device. FC30-40 to +85 LGA-14 Tray FC30TR -40 to +85 LGA-14 Tape and reel MEMS functional sensor: smart 3D orientation and click detection standalone device Features 3D orientation sensor: 3 orthogonal directions (6 positions) Embedded click/double-click functionality Low power

More information

Quick Start Guide for FRDM-FXS-MULTI-B

Quick Start Guide for FRDM-FXS-MULTI-B Quick Start Guide for FRDM-FXS-MULTI-B Contents: Quick Start Package Overview Get to Know the FRDM-FXS-MULTI-B Getting Started Out of the Box Explore Further freescale.com/frdm-multi-b External Use FRDMFXSMULTIBQSG

More information

Low DropOut Linear Voltage regulators (LDOs)

Low DropOut Linear Voltage regulators (LDOs) START Low DropOut Linear Voltage regulators (LDOs) July 2013 ST Low DropOut Linear voltage regulators Portfolio Key features drivers Complete range of low power and high performances LDOs Enlarging portfolio

More information

ORDERING INFORMATION # of Ports Pressure Type Device Name

ORDERING INFORMATION # of Ports Pressure Type Device Name Freescale Semiconductor Data Sheet: Technical Data High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and

More information

Packaging of Selected Advanced Logic in 2x and 1x nodes. 1 I TechInsights

Packaging of Selected Advanced Logic in 2x and 1x nodes. 1 I TechInsights Packaging of Selected Advanced Logic in 2x and 1x nodes 1 I TechInsights Logic: LOGIC: Packaging of Selected Advanced Devices in 2x and 1x nodes Xilinx-Kintex 7XC 7 XC7K325T TSMC 28 nm HPL HKMG planar

More information

MPS4101-6LP Datasheet 50 MHz 25 GHz RoHS-Compliant Control Device QFN SPST PIN

MPS4101-6LP Datasheet 50 MHz 25 GHz RoHS-Compliant Control Device QFN SPST PIN MPS4101-6LP Datasheet 50 MHz 25 GHz RoHS-Compliant Control Device QFN SPST PIN Microsemi Corporate Headquarters One Enterprise, Aliso Viejo, CA 92656 USA Within the USA: +1 (800) 713-4113 Outside the USA:

More information

Freescale Semiconductor Data Sheet: Technical Data

Freescale Semiconductor Data Sheet: Technical Data Freescale Semiconductor Data Sheet: Technical Data High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and

More information

Solidus Technologies, Inc. STI White Paper: AN092309R1

Solidus Technologies, Inc. STI White Paper: AN092309R1 STI White Paper: AN092309R1 Reduce your MEMS Package Level Final Test Times and Save MEMS Manufacturing Costs using STI3000 Wafer Level Test Technology Introduction A survey of MEMS manufacturing literature

More information

3D technology for Advanced Medical Devices Applications

3D technology for Advanced Medical Devices Applications 3D technology for Advanced Medical Devices Applications By, Dr Pascal Couderc,Jerome Noiray, Dr Christian Val, Dr Nadia Boulay IMAPS MEDICAL WORKSHOP DECEMBER 4 & 5,2012 P.COUDERC 3D technology for Advanced

More information

Power Matters. TM. Why Embedded Die? Piers Tremlett Microsemi 22/9/ Microsemi Corporation. Company Proprietary 1

Power Matters. TM. Why Embedded Die? Piers Tremlett Microsemi 22/9/ Microsemi Corporation. Company Proprietary 1 Power Matters. TM Why Embedded Die? Piers Tremlett Microsemi 22/9/16 1 Introduction This presentation: Outlines our journey to make miniaturised SiP modules Compares : Embedded Die Technology (EDT) With

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

MPXH6300A, 20 to 300 kpa, Absolute, Integrated, Pressure Sensor

MPXH6300A, 20 to 300 kpa, Absolute, Integrated, Pressure Sensor Freescale Semiconductor Document Number: Data Sheet: Technical Data Rev. 6.0, 09/2015, 20 to 300 kpa, Absolute, Integrated, Pressure Sensor Freescale's series sensor integrates on-chip, bipolar op amp

More information

Chapter 5: ASICs Vs. PLDs

Chapter 5: ASICs Vs. PLDs Chapter 5: ASICs Vs. PLDs 5.1 Introduction A general definition of the term Application Specific Integrated Circuit (ASIC) is virtually every type of chip that is designed to perform a dedicated task.

More information

GENERAL DESCRIPTION MC3635 FEATURES

GENERAL DESCRIPTION MC3635 FEATURES Quick Start Guide and Demo GENERAL DESCRIPTION The MC3635 is an ultra-low power, lownoise, integrated digital output 3-axis accelerometer with a feature set optimized for wearables and consumer product

More information

MPXHZ6130A, 15 to 130 kpa, Absolute, Integrated Pressure Sensor

MPXHZ6130A, 15 to 130 kpa, Absolute, Integrated Pressure Sensor Freescale Semiconductor Document Number: Data Sheet: Technical Data Rev. 1.2, 06/2015, 15 to 130 kpa, Absolute, Integrated Pressure Sensor The series sensor integrates on-chip, bipolar op amp circuitry

More information

Multi-Die Packaging How Ready Are We?

Multi-Die Packaging How Ready Are We? Multi-Die Packaging How Ready Are We? Rich Rice ASE Group April 23 rd, 2015 Agenda ASE Brief Integration Drivers Multi-Chip Packaging 2.5D / 3D / SiP / SiM Design / Co-Design Challenges: an OSAT Perspective

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

mcube Proprietary APS v1.0 1 / mcube Inc. All rights reserved.

mcube Proprietary APS v1.0 1 / mcube Inc. All rights reserved. GENERAL DESCRIPTION The MC3672 is an ultra-low power, low noise, integrated digital output 3-axis accelerometer with a feature set optimized for wearables and consumer product motion sensing. Applications

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

ENG04057 Teste de Sistema Integrados. Prof. Eric Ericson Fabris (Marcelo Lubaszewski)

ENG04057 Teste de Sistema Integrados. Prof. Eric Ericson Fabris (Marcelo Lubaszewski) ENG04057 Teste de Sistema Integrados Prof. Eric Ericson Fabris (Marcelo Lubaszewski) Março 2011 Slides adapted from ABRAMOVICI, M.; BREUER, M.; FRIEDMAN, A. Digital Systems Testing and Testable Design.

More information

Flexible Hybrid Electronics Solutions for Wearable Sensor Systems. Richard Chaney American Semiconductor, Inc.

Flexible Hybrid Electronics Solutions for Wearable Sensor Systems. Richard Chaney American Semiconductor, Inc. Flexible Hybrid Electronics Solutions for Wearable Sensor Systems Richard Chaney American Semiconductor, Inc. What is a Flexible Hybrid System (FHS)? Printed Electronics Low Cost, R2R, Large Format Flexible

More information

MP3V5050V, -50 to 0 kpa, Gauge Pressure Sensor

MP3V5050V, -50 to 0 kpa, Gauge Pressure Sensor Freescale Semiconductor Document Number: Data Sheet: Technical Data Rev. 3.0, 09/2015, -50 to 0 kpa, Gauge Pressure Sensor The piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned,

More information

2PB709ARL; 2PB709ASL

2PB709ARL; 2PB709ASL Rev. 01 12 November 2008 Product data sheet 1. Product profile 1.1 General description PNP general-purpose transistors in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. Table 1.

More information

300 V, 100 ma PNP high-voltage transistor

300 V, 100 ma PNP high-voltage transistor SOT89 Rev. 6 27 September 2011 Product data sheet 1. Product profile 1.1 General description PNP high-voltage transistor in a medium power and flat lead SOT89 (SC-62) Surface-Mounted Device (SMD) plastic

More information

Dual back-to-back Zener diode

Dual back-to-back Zener diode Rev. 01 28 January 2008 Product data sheet 1. Product profile 1.1 General description in a SOD323 (SC-76) very small Surface-Mounted Device (SMD) plastic package. 1.2 Features Non-repetitive peak reverse

More information

Total power dissipation: 500 mw Small plastic package suitable for surface-mounted design Wide working voltage range Low differential resistance

Total power dissipation: 500 mw Small plastic package suitable for surface-mounted design Wide working voltage range Low differential resistance Rev. 01 27 January 2010 Product data sheet 1. Product profile 1.1 General description General-purpose Zener diodes in a SOD123F small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features

More information

Application Report. 1 Hardware Description. John Fahrenbruch... MSP430 Applications

Application Report. 1 Hardware Description. John Fahrenbruch... MSP430 Applications Application Report SLAA309 June 2006 Low-Power Tilt Sensor Using the MSP430F2012 John Fahrenbruch... MSP430 Applications ABSTRACT The MSP430 family of low-power microcontrollers are ideal for low-power

More information

Burn-in & Test Socket Workshop

Burn-in & Test Socket Workshop Burn-in & Test Socket Workshop IEEE March 4-7, 2001 Hilton Mesa Pavilion Hotel Mesa, Arizona IEEE COMPUTER SOCIETY Sponsored By The IEEE Computer Society Test Technology Technical Council COPYRIGHT NOTICE

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

PMEG3015EH; PMEG3015EJ

PMEG3015EH; PMEG3015EJ Rev. 03 13 January 2010 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for

More information

Packaging Challenges for High Performance Mixed Signal Products. Caroline Beelen-Hendrikx, Eef Bagerman Semi Networking Day Porto, June 27, 2013

Packaging Challenges for High Performance Mixed Signal Products. Caroline Beelen-Hendrikx, Eef Bagerman Semi Networking Day Porto, June 27, 2013 Packaging Challenges for High Performance Mixed Signal Products Caroline Beelen-Hendrikx, Eef Bagerman Semi Networking Day Porto, June 27, 2013 Content HPMS introduction Assembly technology drivers for

More information

± 2g Tri-axis Accelerometer Specifications

± 2g Tri-axis Accelerometer Specifications Product Description The is a Tri-axis, silicon micromachined accelerometer with a full-scale output range of +/-2g (19.6 m/s/s). The sense element is fabricated using Kionix s proprietary plasma micromachining

More information

TABLE OF CONTENTS III. Section 1. Executive Summary

TABLE OF CONTENTS III. Section 1. Executive Summary Section 1. Executive Summary... 1-1 Section 2. Global IC Industry Outlook and Cycles... 2-1 IC Insights' Forecast Methodology... 2-1 Overview... 2-1 Worldwide GDP... 2-1 Electronic System Sales... 2-2

More information

Surface Mount Micromachined Accelerometer

Surface Mount Micromachined Accelerometer Freescale Semiconductor Data Sheet: Technical Data Surface Mount Micromachined Accelerometer The MMA3204 series of dual axis (X and Y) silicon capacitive, micromachined accelerometers features signal conditioning,

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

Reverse Engineering: Printed Circuit Boards Rev II

Reverse Engineering: Printed Circuit Boards Rev II Reverse Engineering: Printed Circuit Boards Rev II DR. T A R E K A. T U T U N J I R E V E R S E E N G I N E E R I N G P H I L A D E L P H I A U N I V E R S I T Y, J O R D A N 2 0 1 5 References PCB Reverse

More information

NXP s innovative GX packages: Saving space, reducing cost

NXP s innovative GX packages: Saving space, reducing cost NXP s innovative GX packages: Saving space, reducing cost Discrete logic is certainly not new, and NXP recognizes its enduring importance for today s applications. That s why we continue to innovate. With

More information

MAG3110 Frequently Asked Questions

MAG3110 Frequently Asked Questions Freescale Semiconductor Frequently Asked Questions Document Number: Rev 1, 05/2012 MAG3110 Frequently Asked Questions Applications Collateral for the MAG3110 to Aid Customer Questions Data Sheet, Fact

More information

PMEG1030EH; PMEG1030EJ

PMEG1030EH; PMEG1030EJ Rev. 04 15 January 2010 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for

More information

Surface Mount Micromachined Accelerometer

Surface Mount Micromachined Accelerometer Freescale Semiconductor Data Sheet: Technical Data Surface Mount Micromachined Accelerometer The MMA3202 series of dual axis (X and Y) silicon capacitive, micromachined accelerometers features signal conditioning,

More information

SCA620-EF1V1B SINGLE AXIS ACCELEROMETER WITH ANALOG INTERFACE

SCA620-EF1V1B SINGLE AXIS ACCELEROMETER WITH ANALOG INTERFACE Datasheet SCA620-EF1V1B SINGLE AXIS ACCELEROMETER WITH ANALOG INTERFACE The SCA620 accelerometer consists of a silicon bulk micro machined sensing element chip and a signal conditioning ASIC. The chips

More information

LQFP. Thermal Resistance. Body Size (mm) Pkg. 32 ld 7 x 7 5 x ld 7 x 7 5 x ld 14 x 14 8 x ld 20 x x 8.5

LQFP. Thermal Resistance. Body Size (mm) Pkg. 32 ld 7 x 7 5 x ld 7 x 7 5 x ld 14 x 14 8 x ld 20 x x 8.5 LQFP Low Profile Quad Flat Pack Packages (LQFP) Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. These packages

More information

NPA 201. Amphenol Advanced Sensors. Digital Output Absolute Pressure Sensor. 11:15 17 Jan,15. Applications. Features

NPA 201. Amphenol Advanced Sensors. Digital Output Absolute Pressure Sensor. 11:15 17 Jan,15. Applications. Features NPA 201 Digital Output Absolute Pressure Sensor Applications Pressure sensor for mobile devices (smart phones, smart watches, tablets) Indoor and outdoor navigation Enhancement of GPS navigation Altimeter

More information

Obsolete Product(s) - Obsolete Product(s)

Obsolete Product(s) - Obsolete Product(s) MEMS motion sensor: 3 axis analog output gyroscope Preliminary data Features Analog supply voltage 2.7 V to 3.6 V Wide extended operating temperature range (-40 C to 85 C) 3 indipendent angular rate channels

More information

FXPQ3115BV. 1 General description. 2 Features and benefits. I 2 C precision pressure sensor with altimetry

FXPQ3115BV. 1 General description. 2 Features and benefits. I 2 C precision pressure sensor with altimetry Rev. 1 9 October 2017 Short data sheet: technical data 1 General description 2 Features and benefits The is a compact, piezoresistive, absolute pressure sensor with an I 2 C digital interface. has a wide

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

TSYS01-FAMILY Digital Temperature Sensors

TSYS01-FAMILY Digital Temperature Sensors ADC 1 S 2 PI 3 I 2 C Q 4 FN TSYS01-FAMILY s SPECIFICATIONS High Accuracy Temperature Sensor TSYS01: ±0.1 C @ Temp.: -5 C +50 C TSYS01-1: ±0.1 C @ Temp.: -20 C +70 C 16/24 bit ADC 1 Resolution Low Power

More information

Package (1C) Young Won Lim 3/20/13

Package (1C) Young Won Lim 3/20/13 Copyright (c) 2011-2013 Young W. Lim. Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published

More information

MP3V5050, 0 to 50 kpa, Differential, and Gauge Pressure Sensor

MP3V5050, 0 to 50 kpa, Differential, and Gauge Pressure Sensor NXP Semiconductors Document Number: Data Sheet: Technical Data Rev. 1.3, 11/2017, 0 to 50 kpa, Differential, and Gauge Pressure Sensor The series piezoresistive transducer is a state-of-the-art, monolithic

More information

± 2g Tri-axis Accelerometer Specifications

± 2g Tri-axis Accelerometer Specifications Product Description The is a Tri-axis, silicon micromachined accelerometer with a full-scale output range of +/-2g (19.6 m/s/s). The sense element is fabricated using Kionix s proprietary plasma micromachining

More information

Update: Lambda project

Update: Lambda project Update: Lambda project Sabine Lange Detector Group DESY meeting, May 29-31, 2012 s1 Lambda project About Lambda: 2 x 6 3 chips (~28 x 85mm) high frame rate (8 read out lines, 2kHz readout) 10 gigabit Ethernet

More information

Lab 9 PCB Design & Layout

Lab 9 PCB Design & Layout Lab 9 PCB Design & Layout ECT 224L Department of Engineering Technology Lab 9 PCB Traces Size dependent upon electrical requirements, design constraints (routing space and clearance), and trace/space resolution

More information

4-Line BUS-Port ESD Protection Array - Flow Through Design

4-Line BUS-Port ESD Protection Array - Flow Through Design -Line BUS-Port ESD Protection Array - Flow Through Design 22736 5 MARKING Pin 1 5F = type code = date code month YY = date code year DESIGN SUPPORT TOOLS click logo to get started Models Available 1 YY

More information

Package (1C) Young Won Lim 3/13/13

Package (1C) Young Won Lim 3/13/13 Copyright (c) 2011-2013 Young W. Lim. Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published

More information

AC342 Application Note CQFP to CLGA Adapter Socket

AC342 Application Note CQFP to CLGA Adapter Socket AC342 Application Note CQFP to CLGA Adapter Socket Microsemi Corporate Headquarters One Enterprise, Aliso Viejo, CA 92656 USA Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Sales:

More information

EV-VND7040AJ. VND7040AJ evaluation board. Features. Applications

EV-VND7040AJ. VND7040AJ evaluation board. Features. Applications VND7040AJ evaluation board Data brief Features Max transient supply voltage V CC 40 V Operating voltage range V CC 4 to 28 V Typ. on-state resistance (per Ch) R ON 40 mω Current limitation (typ) I LIMH

More information

Circuit Board Guidelines for aqfn Package nan-40

Circuit Board Guidelines for aqfn Package nan-40 Circuit Board Guidelines for aqfn Package nan-40 Application Note v1.1 4413_398 v1.1 / 2018-04-23 Contents Revision history.................................. iii 1 Introduction...................................

More information

RoBoard Module RM-G144 Manual V1.01 The Heart of Robotics. Jun 2010 DMP Electronics Inc

RoBoard Module RM-G144 Manual V1.01 The Heart of Robotics. Jun 2010 DMP Electronics Inc Manual V1.01 Jun 2010 DMP Electronics Inc Copyright The information in this manual is subject to change without notice for continuous improvement in the product. All rights are reserved. The manufacturer

More information

GLAST Silicon Microstrip Tracker Status

GLAST Silicon Microstrip Tracker Status R.P. Johnson Santa Cruz Institute for Particle Physics University of California at Santa Cruz Mechanical Design Detector Procurement Work list for the Prototype Tracker Construction. ASIC Development Hybrids

More information

BD020 Nanopower Medical Magnetic Sensor

BD020 Nanopower Medical Magnetic Sensor Datasheet BD020 Nanopower Medical Magnetic Sensor Key Features Ultraminiature 1.1 mm x 1.1 mm x 0.45 mm ULLGA package Solid-State Reliability Precise Detection of Low Magnetic Fields Low Voltage Operation

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

±4g, ±9g Two Axis Low-g Micromachined Accelerometer

±4g, ±9g Two Axis Low-g Micromachined Accelerometer Freescale Semiconductor Data Sheet: Technical Data ±4g, ±9g Two Axis Low-g Micromachined Accelerometer The is a low power, low profile capacitive micromachined accelerometer featuring signal conditioning,

More information

TSV Test. Marc Loranger Director of Test Technologies Nov 11 th 2009, Seoul Korea

TSV Test. Marc Loranger Director of Test Technologies Nov 11 th 2009, Seoul Korea TSV Test Marc Loranger Director of Test Technologies Nov 11 th 2009, Seoul Korea # Agenda TSV Test Issues Reliability and Burn-in High Frequency Test at Probe (HFTAP) TSV Probing Issues DFT Opportunities

More information

There is a paradigm shift in semiconductor industry towards 2.5D and 3D integration of heterogeneous parts to build complex systems.

There is a paradigm shift in semiconductor industry towards 2.5D and 3D integration of heterogeneous parts to build complex systems. Direct Connection and Testing of TSV and Microbump Devices using NanoPierce Contactor for 3D-IC Integration There is a paradigm shift in semiconductor industry towards 2.5D and 3D integration of heterogeneous

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

Additional Slides for Lecture 17. EE 271 Lecture 17

Additional Slides for Lecture 17. EE 271 Lecture 17 Additional Slides for Lecture 17 Advantages/Disadvantages of Wire Bonding Pros Cost: cheapest packages use wire bonding Allows ready access to front side of die for probing Cons Relatively high inductance

More information

Multi Level Stacked Socket Challenges & Solutions

Multi Level Stacked Socket Challenges & Solutions Multi Level Stacked Socket Challenges & Solutions Mike Fedde, Ranjit Patil, Ila Pal & Vinayak Panavala Ironwood Electronics 2010 BiTS Workshop March 7-10, 2010 Content Introduction Multi Level IC Configuration

More information

Solving Integration Challenges for Flexible Hybrid Electronics. High performance flexible electronics

Solving Integration Challenges for Flexible Hybrid Electronics. High performance flexible electronics Solving Integration Challenges for Flexible Hybrid Electronics High performance flexible electronics Wearable Sensor System Configurations 2 Wearable Hybrid System Sensor Signal Processing Data Processing

More information

1 INTRODUCTION. Solder paste deposits on grid array of soldering pads. SPI system integration in a PCB assembly production line

1 INTRODUCTION. Solder paste deposits on grid array of soldering pads. SPI system integration in a PCB assembly production line 1 INTRODUCTION Test Research Inc. (TRI) designs, manufactures and markets precision test equipment for the world s leading electronics manufacturing service (EMS) companies. Product lines include Automated

More information

Comparative Report Silicon Capacitors

Comparative Report Silicon Capacitors Cmparative Reprt Silicn Capacitrs Passive Cmpnent reprt by Elena Barbarini & Pierre-Vincent Dugue September 2017 versin 1 21 rue la Nue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 inf@systemplus.fr

More information

Low forward voltage Ultra small SMD plastic package Low capacitance Flat leads: excellent coplanarity and improved thermal behavior

Low forward voltage Ultra small SMD plastic package Low capacitance Flat leads: excellent coplanarity and improved thermal behavior Rev. 02 15 January 2010 Product data sheet 1. Product profile 1.1 General description Planar Schottky barrier triple diode with an integrated guard ring for stress protection. Three electrically isolated

More information

MC3635 FEATURES GENERAL DESCRIPTION

MC3635 FEATURES GENERAL DESCRIPTION GENERAL DESCRIPTION MC3635 FEATURES The MC3635 is an ultra-low power, low noise, integrated digital output 3-axis accelerometer with a feature set optimized for wearables and the Internet of Moving Things

More information

General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device (SMD) plastic package.

General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device (SMD) plastic package. Rev. 2 29 July 2011 Product data sheet 1. Product profile 1.1 General description General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device (SMD) plastic package.

More information

Order code Temperature range ( C) Package Packing

Order code Temperature range ( C) Package Packing MEMS motion sensor: three-axis analog gyroscope Preliminary data Features Two selectable full scales (625/2500 dps) Embedded self-test Wide supply voltage range: 2.4 V to 3.6 V Embedded power-down and

More information

PLR0521E ULTRA LOW CAPACITANCE TVS ARRAY DESCRIPTION DFN-2 PACKAGE APPLICATIONS FEATURES MECHANICAL CHARACTERISTICS PIN CONFIGURATION

PLR0521E ULTRA LOW CAPACITANCE TVS ARRAY DESCRIPTION DFN-2 PACKAGE APPLICATIONS FEATURES MECHANICAL CHARACTERISTICS PIN CONFIGURATION ULTRA LOW CAPACITANCE TVS ARRAY DESCRIPTION The is an ultra low capacitance transient voltage suppressor array, designed to protect computing applications from the damaging effects of Electrostatic Discharge

More information

P0603V24 ULTRA LOW CAPACITANCE ESD PROTECTION COMPONENT DESCRIPTION FEATURES APPLICATIONS MECHANICAL CHARACTERISTICS PIN CONFIGURATION

P0603V24 ULTRA LOW CAPACITANCE ESD PROTECTION COMPONENT DESCRIPTION FEATURES APPLICATIONS MECHANICAL CHARACTERISTICS PIN CONFIGURATION ULTRA LOW CAPACITANCE ESD PROTECTION COMPONENT DESCRIPTION The is an ultra low capacitance ESD component designed to protect very high-speed data interfaces. The device has a typical capactiance of only

More information

PCB Layout Guidelines for the MC1321x

PCB Layout Guidelines for the MC1321x Freescale Semiconductor Application Note Document Number: AN3149 Rev. 0.0, 03/2006 PCB Layout Guidelines for the MC1321x 1 Introduction This application note describes Printed Circuit Board (PCB) footprint

More information

Bidirectional ESD protection diode

Bidirectional ESD protection diode 11 December 2018 Preliminary data sheet 1. General description 2. Features and benefits 3. Applications 4. Quick reference data Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection

More information