TROI SPI Series. Key Features Overview

Transcription

1 TROI SPI Series Key Features Overview

2 Key Features Enhanced Color 3D Display Reliable Simultaneous 2D & 3D for Shadow Free Golden Finger Ease of Use Fast & Accurate Strong Sales & Support Network Advanced Features

3 Fast & Accurate TROI systems are equipped with 4MP Black & White camera due to; 1.Faster Inspection Speed 2.Higher Accuracy compare to Color Camera 3.Competitive price for end users In spite of the importance of the color image in the apparatus for measurement of the surface profile, the color camera has defects of being high in price and being low in capture speed rather than the black and white camera. Inspection Speed Comparison Pemtron Company C Company C Company K 12 μm : 19.5 cm2 /sec 18 μm : 43.9 cm2 /sec 20 μm : 67.3 cm2 /sec 20 μm : 16 cm2 /sec 40 μm : 29 cm2 /sec 12 μm : cm2 /sec 20 μm : 19.7 cm2 /sec (High Speed Mode) 15.7 cm2 /sec (GR&R Mode)

4 Enhanced Color 3D Display Pemtron Pemtron Pemtron Pemtron & Others Others Others Pads adjacent to holes Others Previous 3D systems displayed height by a RGB color map. Combination of ordinary a RGB Color Map and state of the art Color Image Processing generates Enhanced Color 3D Display. Past models used methods which could only recognize solder higher than silk print, making it impossible for measurements below silk print height level. Pemtron has solved this problem by using an Enhanced 3D Color Algorithm that can defines solder printed from a 0 reference point. Pemtron

5 Simultaneous 2D&3D / Shadow Free 2D Lighting PCB (Solder) Combination of 2D & 3D inspection eliminates common Shadow problem with SPI systems. Camera grabs shapes of solder from simultaneous 2D and 3D LED light source.

6 Moire Technology SPI system is able to find out X- Value which is for solder height calculation.

7 Inspection Logic - 2D & 3D Phase Shifting Technology 2D camera detects Zero reference point and inspects solder shape like smearing simultaneously. 3D inspection 2D inspection Solder lands are higher or lower than PCB surface. Pemtron Phase Shifting technologies measure the height and volume deposition from the surface of the lands. Also SPI inspects the solder deposition shape.

8 Golden Finger Inspection (2D) -Splash Defect Parameter : 50um Result : 426um <OK> <NG> -Contamination Parameter : 50um Result : 465um The system can detect solder splash on the golden finger. The minimum size of splash detection (18um resolution) is 50um in diameter. About 3 particle of solders are about 50um. 12um resolution system can detect as small as 40um of splash size.

9 Reliable 1/3 Purpose of this test is to show accuracy of our TROI system by checking height of 3D Jig which certified from KTL. We programmed to check heights from 4 corners of FOV 50 times with loading and unloading option. There are total of 2 blocks on 3D Jig and each certified heights are 148.5um and 300.5um. TROI s height accuracy is +/- 2um. Result 1 st Block Height 148.5um a. Average um b. Min um c. Max um 2 nd Block Height 300.5um a. Average um b. Min um c. Max um 3 4 Camera Field of View 2 1

10 Reliable 2/3 Target Height 148.5um a. Average um b. Min um c. Max um

11 Reliable 3/3 Target Height 300.5um a. Average um b. Min um c. Max um

12 Ease of Use Main GUI Operator s NG Viewer TROI Software runs based on Embeded Windows XP operating system. User Friendly GUI allows to take only 30 minutes of training to begin operation. Easy recognition of production status. Our powerful SPC module enables each user to keep track of result record with user friendly GUI. PAD Control View module imports Gerber data and or CAD data to complete program in 5 to 15 minutes. SPC Module Pad Control View

13 Explanation of Main GUI Main GUI PCB Image JOB Data file name Average Result Colored Live Image of FOV PCB position on conveyor Operation menu Current partner with Aegis in the programming of a Pemtron Module. Result in histogram

14 ROI Analysis View

15 Color Distribution Height of solder deposition is higher on left side of array User changed pressure on printer to distribute solder evenly Color Map View is capable to show the solder deposition data by Height, Volume & Area. It is easier to see the deposition condition and helps engineers to check screen printing ability.

16 Sample Rotation Test Item Data Image QFP BGA Array- Chip 0.5 Pitch 0.5 Pitch 1608(mm) 1005(inch) Average Rotation Board id BGA QFP Chip 0' 90' 180' 270' Total Pad

17 Glue Inspection Combination of various LED enables to inspect glue (adhesive) on PCB.

18 Barcode Reading (Top Side) Data Matrix 1.9 x 1.9mm 1. Single Single snap shot mode 2. Dual Dual snap shot mode

19 Manual Add or Edit Pad Info. Drag outline of PAD and press right click to open menu for create a new pad. ROI Analysis view after add a new pad manually. TROI Series is capable to add or remove pad information manually. When there is a minor changes on each revision, user may edit any shape of pad information.