1. Real Color 3D Image. 2. 2D + 3D Algorithm. 3. Height Inspection range 0 ~ 450μm. 4. High speed by Linear Motor. 5. Closed Loop Solution

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1 TROI-7700HL Color 2D + 3D SPI

2 Key Features 1. Real Color 3D Image 2. 2D + 3D Algorithm 3. Height Inspection range 0 ~ 450μm 4. High speed by Linear Motor 5. Closed Loop Solution 6. Mounter Bad mark sync 7. 64bit window Operating System 8. User friendly SPC 9. Free software upgrade for lifetime

3 Why SPI? TROI More than 50% of defects are from screen printing process

4 Fast & Accurate TROI systems are equipped with 4MP Black & White camera due to; 1.Faster Inspection Speed 2.Higher Accuracy compare to Color Camera 3.Competitive price for end users In spite of the importance of the color image in the apparatus for measurement of the surface profile, the color camera has defects of being high in price and being low in capture speed rather than the black and white camera.

5 Enhanced Color 3D Display Pemtron Pemtron Competitor Competitor Pemtron Competitor Competitor

6 Simultaneous 2D&3D / Shadow Free 2D Lighting Shadow Free by Dual Projection (Solder) PCB Combination of 2D & 3D inspection eliminates common Shadow problem with SPI systems. Camera grabs shapes of solder from simultaneous 2D and 3D LED light source. Not only Dual Projection, 2D LED approve to be recognized the exact solder field

7 Inspection Logic - 2D & 3D Phase Shifting Technology 2D camera detects Zero reference point and inspects solder shape like sm earing simultaneously. 3D inspection 2D inspection Solder lands are higher or lower than PCB surface. Pemtron Phase Shifting technologies measure the hei ght and volume deposition from the surface of the land s. Also SPI inspects the solder deposition shape.

8 Concept Height difference detected as image shifts. Moire Technology Illuminate full field of view No safety concerns Multiple reflections filtered Laser Source Technology Requires safety precautions Multiple reflections Susceptible to vibration

9 Mechanical Design X & Y Camera Head gantry system provides stable and precise inspection performance. Standard 3 Stage Buffer Conveyor Load / Work / Exit Stage Dual Lane configuration meets with various type of placement system

10 Obtains Bare Board data for accurate inspection TROI SPI automatically recognizes all traces, silk print and land height in order to perform accurate inspection by scanning bare board in about 60 seconds. SPI measures the accurate solder height and volume by compensating traces and silk height, beside most of other systems are using PCB surface as Zero reference point Captured image without bareboard teaching Height Result = 164 um Captured image with bareboard teaching Height Result = 140 um

11 Analysis Editor (Color Mapping) Reference Point Recognition Solder Paste Recognition

12 Reference Range (Warpage) Good Solder Paste Reference PCB Bad Solder Paste Reference PCB Wider range of reference point search area prevents less deviation of recognizing a zero reference point. Accurate height calculation Compare other pads within ROI Better repeatability

13 Accurate Inspection by 2D Color Algorithm Bottom & Substances Color Inspection Substances below 40um Competitor s models used the method which could only recognize solder higher than 40um, making it impossible for measurements below 40um height level. Pemtron has solved this problem by using an Enhanced 3D Color Algorithm that can defines solder printed from a 0 reference point.

14 Advanced Accuracy & Reliability by 3D Algorithm Color 3D Algorithm can inspect from the bottom of PCB,therefore PEMTRON can inspect the accurate PCB bottom, such as Hole, silk. In conclusion, this 3D Algorithm makes it possible to find the exact solder field.

15 Gantry Type Linear motor Maximize Accuracy Minimize Vibration 1. Linear Motor Accurate & Fast Inspection 2. Longer life time than Ball screw Type 3. Less maintenance

16 Easy & Fast Gerber Programming Import Gerber Data Teach Fiducial mark PAD, FOV & Path Information Set Parameters less than 10mins Inspection

17 Real Time Production Status Main View Main GUI PCB Image JOB Data file name Average Result Colored Live Image of FOV PCB position on conveyor Operation menu Result in histogram

18 Ease Control NG View Easy to check the NG Status Real time NG Pads Debugging Rear Color View NG Status

19 Accurate Pad Analysis Tool By selecting the Pad to Analyze, - Check the height by profiling function - Real time Color Display Pad image check including dust on the bottom - Analyzing in rotating by user

20 Color Distribution Height of solder deposition is higher on left side of array User changed pressure on printer to distribute solder evenly Color Map View is capable to show the solder deposition data by Height, Volume & Area. It is easier to see the deposition condition and helps engineers to check screen printing ability.

21 Glue Inspection Combination of various LED makes possible to inspect glue (adhesive) on PCB.

22 Golden Finger Inspection (2D) -Splash Defect Parameter : 50um Result : 426um <OK> <NG> -Contamination Parameter : 50um Result : 465um The system can detect solder splash on the golden finger. The minimum size of splash detection (18um resolution) is 50um in diameter. About 3 particle of solders are about 50um. 12um resolution system can detect as small as 40um of splash size.

23 SPC

24 SPC Introduction SPC Key Feature - Fast & accurate Reliable Database - Server & Client Network connection possible

25 SPC Introduction Diverse Report Export User can select the time to export the real time report for productivity & NG. Available format : PDF, Word, HTML

26 SPI Monitoring System - Production Lines. Monitoring Production(Inspection) Status for entire Lines(SPI) CP/CPK/Histogram/Sigma/Yield/Defect type/report Remote Control system You can monitor multiple lines in from management server (extracted from RMC)

27 SPI Monitoring System - Production Lines. You can monitor production status based on CPK chart Each board information will be saved and can check the board information If some problem happens in out of CPK range, user can leave the comment about the issue by user

28 SPI Monitoring System - Production Lines. From Histogram, operator can easily change which axis is offset From Trend View, operator can decide which part should pressure more visually After NG trends Before Red: NG