SurfMate Design Guide. Surface Mount Socketing System for Vicor s Maxi, Mini, Micro Series Modules

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Morgan Elliott
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1 SurfMate Design Guide Surface Mount Socketing System for Vicor s Maxi, Mini, Micro Series Modules

2 Contents Specifications and Materials Printed Circuit Board Design and Soldering Guidelines Layout Drawings Maxi Mini Micro SurfMate Outline Drawings Maxi Mini Micro Part Numbering and Packaging SurfMates, Standoffs & Exchange Tools Introducing the SurfMate, a new surface mount connector system for use with pin-compatible Vicor Maxi, Mini, Micro Series DC-DC converters and accessory modules. For the first time, circuit board designers and assemblers have the ability to surface mount high-density DC-DC converters having current ratings up to 100 Amps. SurfMate first in a family of ModuMate interconnect products utilizes a pair of surface mounted headers which contain sockets to accept the input and output pins of the module. The SurfMate header assembly is compatible with any thickness PC board, does not increase the module mounting height above the board, and is available for all three standard module sizes Maxi, Mini, and Micro (full, half and quarter bricks). SurfMates are available packaged in standard recyclable JEDEC style trays for use with automated pick and place equipment and are compatible with standard reflow solder operations. After reflow, the modules are simply inserted into the SurfMates. Any secondary soldering operation used for thru hole sockets or pins can now be entirely eliminated reducing manufacturing time and eliminating dual processes. This unique interconnect scheme combines the inherent flexibility of component power designs with the manufacturing efficiency of surface mount assembly. Vicor s comprehensive line of power solutions includes modular high density DC-DC converters and accessory components, configurable power supplies, and custom power systems. SurfMates require the use of modules with the ModuMate pin option and are not designed for use with standard tin-lead pins. v i c o r p o w e r. c o m

3 Parameter Specification Value Reference Compatibility Module pin style S Short ModuMate pins Mechanical Contact normal force 100 grams EOL min GR-1217-CORE, R5-23 Number of mating cycles Specifications and Materials 5 min Exception to GR-1217-CORE which specifies 25 mating cycle Module engagement force 32 lbs per connector set max GR-1217-CORE, R5-31,32 Module disengagement force 32 lbs per connector set max GR-1217-CORE, R5-31,32 Electrical Current rating Low level contact resistance 0.080" dia socket (LLCR) Low level contact resistance 0.150" dia socket (LLCR) Low level contact resistance 0.180" dia sockets (LLCR) Thermal Max socket temperature Temperature rise Environmental Shock and vibration 100 Amps - Maxi 50 Amps - Mini Gold plating standards, and 25 Amps - Micro accepted industry standards (Based on 120 C max socket such as IICIT, EIA, Bellcore guidelines temperature & 30 C max temperature rise of contact) 400 µ Ohms max GR-1217-CORE, µ Ohms max GR-1217-CORE, µ Ohms max GR-1217-CORE, C max Max continuous use temperature for gold plating GR-1217-CORE (1) 30 C max EIA A (2) SurfMate products are tested in random vibration environments to best simulate the broad spectrum of frequencies and amplitudes that may be encountered in typical applications. Actual system resonant frequencies will depend on construction and mounting details. For critical, or unusual, shock and vibration environments, the performance of the system should be independently verified. Material Properties of SurfMate Components Materials Ratings Headers Material: Vectra E150i LCP Liquid Crystal Polymer Flammability UL94 V-0/5VA Thermal stability (short term) 260 C (500 F) Thermal stability (long term) 200 C (392 F) Solder Cap 260 cartridge brass Material (70 Cu, 30 Zn) 100 µ in min Cu, followed by 50 to 100 µ in min Plating low stress sulfamate-based electrolytic nickel, followed by 20 µ in min soft gold Sockets Brush Wellman Alloy #25 Material C17200 deep draw quality or equiv thick Woods nickel strike followed by 50 µ in min low stress Plating sulfamate-based electrolytic nickel, followed by 20 µ in min hard gold followed by 10 µ in min soft gold (1) GR-1217-CORE issue 1, November 1995 Generic requirements for separable electrical connectors used in telecommunications hardware. A module of NEBSFR, FR-2063 (2) ANSI/EIA-364 American National Standards Institute/ Electronic Industries Association (Electronic Components, Assemblies & Materials Association) v i c o r p o w e r. c o m 1

4 Printed Circuit Board Design and Solder Guidelines SurfMate Socketing System Recommended layout drawings for SurfMates are provided on the following pages. All unspecified dimensional tolerances comply with ANSI/IPC-D- 300 for Class B boards. Recommended Construction The SurfMate system is capable of very high current carrying capacity. We therefore recommend a multilayer with 3-ounce copper and internal power and ground planes. Consult the drawings for the recommended size and quantity of via holes for carrying current to the internal planes. Solder Mask and Pad Two solder mask keep-out areas are recommended. The larger area encompasses the complete pad area at either end. It ensures the proper height of the 3 ounce solder pads to the surrounding laminate. This provides for the optimum gap between the SurfMate and the (0.0042" ±0.0004"), minimizing the solder paste thickness required for quality solder joints. Without this solder mask keep-out area, the gap may widen, (see flush-mounted pads ), requiring thicker solder paste to fill the larger gap. The smaller solder mask keep-out areas are circular, and are located on each pad, for the solder joint between the and the SurfMate. The remainder of the pad has a covering of solder mask. The solder paste is dispensed in a rectangular area covering the soldering area and part of the solder mask area. During soldering, the paste will migrate away from the solder mask area to the soldering area, providing ample volume for quality solder joints. Each pad features a non-plated thru hole in the center of the pad to provide a venting function. It is normal for the solder joint to have a slight void centered on this thru hole. Solder Paste Solder paste thickness requirements will vary depending on whether the board pads are flush or elevated from the laminate. Elevated Pads (preferred) The ideal height for elevated pads is " ±10%. This can be achieved by using a 3-ounce copper surface layer. With this height, a minimum solder paste thickness of 0.006" should be used. Thicker stencils of between 0.008" and 0.012" are preferred. Flush Mounted Pads For boards with flush mounted pads a minimum of 0.010" solder paste should be used. Preferred thickness is between 0.012" and 0.016". Placement SurfMate locating pins will engage in the corresponding holes with a light push of the SurfMate into the solder paste. The SurfMate should not be taped or adhered in place. The surface tension of the solder during reflow will center the SurfMate parts on the, resulting in accurate positioning. Equipment and Solder Soldering of SurfMates should be done using either an infrared or convection oven reflow process. Solder type Sn63Pb37, or equivalent, with a eutectic temperature of 183 C should be used. Higher temperature solder is NOT recommended. Standoffs Mounting standoffs are required for SurfMate applications. The location for standoff holes is shown on the layout drawing. A selection chart of recommended standoff kits is provided on page 8. Module Pins SurfMates must be used with modules with the S or F pin style. 2 v i c o r p o w e r. c o m

5 X / 2.79 X 45 CHAMFER ± X Ø 52 VIA HOLES SEE NOTE Layout Drawing for Full-brick Module SOLDER MASK KEEP-OUT AREA EXCEPT ON PADS 7X FREE OF SOLDER MASK 9X Ø NONPLATED THRU SEE DETAIL A REF ± X ø 1.63 ±0.08 (#52 DRILL) ± X ø Ø 3.30 ±0.08 Ø 3 VIA HOLES PLATED THRU HOLES 16 VIA HOLES DETAIL A FOR STANDOFF MTG (SEE NOTES 3 & 6) SCALE: 4X (MIRROR IMAGE TO OTHER SIDE) Ø ± VIA HOLES X ± ± SEE DETAIL B SOLDER MASK KEEP-OUT AREA EXCEPT ON PADS ± ± X FREE OF SOLDER MASK MOUNTING SPECIFICATIONS DETAIL B (ALSO SEE NOTE 2 & EXCHANGE TOOL DETAILS IN RIGHT VIEWS) SCALE: 4X (MIRROR IMAGE TO OTHER SIDE) All dimensions are Inch or Inch / Metric ANSI / IPC-D-300 specifications apply for Class B boards. Recommended construction: Multilayer 3 oz Cu with internal power and ground planes. Pad geometry and minimum number of via holes for connection to power and ground planes shown in Details A & B for high current applications. Pads to be covered with solder mask except in circular area shown in Detail A & B. Final pad height above laminate to be 0.004" +/ ". Light gray area denotes stencil aperture (should include circular solder mask keep-out area on each pad) MAX MAXI PIN LEGEND Pin Pin Dia. Number Symbol Function (inches / mm.) 1 + +IN / 2,03 2 PC Prim. Control / 2,03 3 PR Parallel / 2,03 4 IN / 2,03 5 OUT / 4,57 6 S Sense / 2,03 7 SC Sec. Control / 2,03 8 +S +Sense / 2, OUT / 4,57 SurfMate Input Connector EXCHANGE TOOL- BOTH ENDS (PARTIAL) MIN EXCHANGE TOOL HOOK AREA, 4 PLCS (BOTH ENDS-SEE VIEWS) EXCHANGE BASEPLATE TOOL (LESS STANDOFFS) MIN SurfMate Output Connector REF DETAIL C BOTTOM OF SCALE: 8X CAP TO TOP OF PRODUCT APPLICATION SPECIFICATIONS (ALSO SEE NOTE 2) v i c o r p o w e r. c o m 3

6 Layout Drawing for Half-brick Module X.110/2.79 X 45º CHAMFER º SOLDER MASK KEEP-OUT AREA EXCEPT ON PADS 7X ø FREE OF SOLDER MASK 9X ø0.016 NON PLATED THRU VIA HOLES DETAIL A 3 VIA HOLES SEE DETAIL A 1.59 REF SEE NOTE VIA HOLES REF 45º SCALE: 4X (MIRROR IMAGE TO OTHER SIDE) VIA HOLES X.125 ± ± X ø (SEE NOTE 3C) ± ±0.08 (#52 DRILL) 4X ø ± ±0.08 PLATED THRU HOLE FOR STANDOFF MTG (SEE NOTES 3 & 6) SOLDER MASK KEEP-OUT AREA EXCEPT ON PADS Xø 8.03 FREE OF SOLDER MASK ± ±0.05 DETAIL B SCALE: 4X (MIRROR IMAGE TO OTHER SIDE) All dimensions are Inch or Inch / Metric ANSI / IPC-D-300 specifications apply for Class B boards. Recommended construction: Multilayer 3 oz Cu with internal power and ground planes. Pad geometry and minimum number of via holes for connection to power and ground planes shown in Details A & B for high current applications. Pads to be covered with solder mask except in circular area shown in Detail A & B. Final pad height above laminate to be 0.004" +/ ". Light gray area denotes stencil aperture (should include circular solder mask keep-out area on each pad) MAX SurfMate Input Connector EXCHANGE TOOL- BOTH ENDS (PARTIAL) EXCHANGE TOOL 12.5 HOOK AREA, 4 PLCS (BOTH ENDS-SEE VIEWS) EXCHANGE TOOL BASEPLATE 0.15 (LESS STANDOFFS) SurfMate Output Connector REF BOTTOM OF CAP TO TOP OF DETAIL C SCALE: 8X ø ø ø SEE DETAIL B MOUNTING SPECIFICATIONS (ALSO SEE NOTE 2 & EXCHANGE TOOL DETAILS IN RIGHT VIEWS) PIN LEGEND Mini FARM FIAM Pin Pin Dia. Number Symbol Function Symbol Function Symbol Function (Inches / mm) 1 + +IN N Neutral + +IN / 2,03 2 PC Prim. Control EMI GRD EMI N/C No Connection / 2,03 3 PR Parallel NC No Connection EMI/GRD Ground / 2,03 4 IN L Line IN / 2,03 5 OUT Out OUT / 3,81 6 S Sense EN Enable ON/OFF ON/OFF / 2,03 7 SC Sec. Control ST Strap N/C No Connection / 2,03 8 +S +Sense BOK BUS OK N/C No Connection / 2, Out + + OUT + +Out / 3,81 MIN MIN PRODUCT APPLICATION SPECIFICATIONS (ALSO SEE NOTE 2) 4 v i c o r p o w e r. c o m

7 Layout Drawing for Quarter-brick Module X / X 45 CHAMFER SEE NOTE 4 Ø X Ø ± ± ± VIA HOLES 45 DETAIL A SCALE: 4X (MIRROR IMAGE TO OTHER SIDE) VIA HOLES SOLDER MASK KEEP-OUT AREA EXCEPT ON PADS 7X Ø ±0.003 ±0.08 FREE OF SOLDER MASK ± VIA HOLES X SEE DETAIL A ± ± (SEE NOTE 3C) 6X Ø ± ±0.08 (#52 DRILL) ± X Ø 3.30 ±0.08 PLATED THRU HOLE FOR STANDOFF MTG (SEE NOTES 3 & 6) (SEE NOTE 3C) PIN LEGEND Micro VI-ARM FiltMod IAM 48 Pin Pin Dia. Number Symbol Function Symbol Function Symbol Function Symbol Function (Inches / mm) 1 + +IN -Out + +IN -Out / 2,03 2 PC Prim. Control EN Enable N/C No Connection N/C No Connection / 2,03 3 PR Parallel B OK -Bus OK N/C No Connection ON/OFF ON/OFF / 2,03 4 IN + +Out -IN + +OUT / 2,03 5 OUT N Neutral -OUT + +IN / 2,03 6 SC Sec. Control ST Strap GRD Ground N/C No Connection / 2, OUT L Line + +OUT IN / 2, MAX EXCHANGE TOOL- BOTH ENDS (PARTIAL) MIN SOLDER MASK KEEP-OUT AREA EXCEPT ON PADS SEE DETAIL B ± ± MIN EXCHANGE TOOL BASEPLATE (LESS STANDOFFS) SurfMate Output Connector EXCHANGE TOOL HOOK AREA, 4 PLCS (BOTH ENDS-SEE VIEWS) DETAIL B SCALE: 4X (MIRROR IMAGE TO OTHER SIDE) MOUNTING SPECIFICATIONS (ALSO SEE NOTE 2 & EXCHANGE TOOL DETAILS IN RIGHT VIEWS) All dimensions are Inch or Inch / Metric ANSI / IPC-D-300 specifications apply for Class B boards. Recommended construction: Multilayer 3 oz Cu with internal power and ground planes. Pad geometry and minimum number of via holes for connection to power and ground planes shown in Details A & B for high current applications. Pads to be covered with solder mask except in circular area shown in Detail A & B. Final pad height above laminate to be 0.004" +/ ". Light gray area denotes stencil aperture (should include circular solder mask keep-out area on each pad). DETAIL C SCALE: 8X PRODUCT APPLICATION SPECIFICATIONS (ALSO SEE NOTE 2) BOTTOM OF CAP TO TOP OF REF v i c o r p o w e r. c o m 5

8 SurfMate Outline Drawing for Maxi and Mini Size Modules INPUT CONNECTOR ø0.080 PIN SOCKET ø0.064 / ø ID OUTPUT CONNECTOR MINI, ø PIN SOCKET ø / ø ID MAXI, ø PIN SOCKET ø / ø ID ø0.007 M A B C ø0.007 M A B C EXCHANGE TOOL NOTCH ± x Ø x ± CONVEX PROTRUSION SHOWS POSITION OF PINS BELOW 2 x Ø x ± CONVEX PROTRUSION SHOWS POSITION OF PINS BELOW ± EXCHANGE TOOL NOTCH ø PIN SOCKET ø / ø ID ø0.007 M A B C ± ± A- -A- -C x 4 x Ø ø0.010 M A B C (BOTTOM OF SOCKET CAP, SOLDERING TO ) Ø ± ø M A B C -C x 2 x ø0.276 ø0.010 M A B C (BOTTOM OF SOCKET CAP, SOLDERING TO ) Ø ±0.002 ø0.005 M A B C B- -B- Ø0.059 ± Ø0.059 ±0.001 Ø ± DIAMOND PIN SHAPE Ø0.059 ± DIAMOND PIN SHAPE ø0.003 A B C ø0.003 A B C M M MATERIALS: SOCKETS: BE-CU #25, Au PLATED. CAPS: 260 BRASS, Au PLATED. HOUSINGS: VECTRA E150i LCP, 50% GLASS FILLED, BLACK COLOR. 3 x ø0.193 ø0.010 M A B C (BOTTOM OF SOCKET CAP, SOLDERING TO ) 6 v i c o r p o w e r. c o m

9 SurfMate Outline Drawing for Micro Size Modules INPUT CONNECTOR OUTPUT CONNECTOR ø0.080 PIN SOCKET ø0.064 / ø ID ø0.007 M A B C EXCHANGE TOOL NOTCH 2 x Ø0.055 x ± CONVEX PROTRUSION SHOWS POSITION OF PINS BELOW EXCHANGE TOOL NOTCH ± ± ± ± A x -C- -C- 4 x Ø0.193 ø0.010 M A B C (BOTTOM OF SOCKET CAP; SOLDERING TO ) Ø ± ø0.005 M A B C B- Ø ± Ø0.059 DIAMOND PIN SHAPE ø0.003 M A B C -B- Ø ± MATERIALS: SOCKETS: BE-CU #25, Au PLATED. CAPS: 260 BRASS, Au PLATED. HOUSINGS: VECTRA E150i LCP, 50% GLASS FILLED, BLACK COLOR x ø0.080 PIN SOCKET ø0.064 / ø ID ø0.007 M A B C 2 x ø0.055 x ± CONVEX PROTRUSION SHOWS POSITION OF PINS BELOW -A- 3 x Ø0.193 ø0.010 M A B C (BOTTOM OF SOCKET CAP; SOLDERING TO ) Ø ±0.002 ø0.005 M A B C Ø0.059 ±0.001 DIAMOND PIN SHAPE ø0.003 M A B C v i c o r p o w e r. c o m 7

Part Numbering and Packaging SurfMates Maxi Mini Micro Five pair sets 16017 16021 16025 Inputs and

22102 Input 22103 Output 22104 Sold only in multiples of 35 Maxi, Mini, or 40 Micro.

Standoff Kits for SurfMate Mounted Modules Heat Sinks Slotted Baseplate Thru-hole Baseplate Threaded

20178 20188 20176 20186 20176 20186 Threaded heat sink 20179 20189 20177 20187 N/A N/A No heat sink

standoffs and screws for one module. 100 piece kits contain standoffs only.

10 Part Numbering and Packaging SurfMates Maxi Mini Micro Five pair sets Inputs and outputs for five modules Individual Part Numbers Maxi Mini Micro Input Output Input Output Sold only in multiples of 35 Maxi, Mini, or 40 Micro. Shipped in JEDEC trays. Standoff Kits for SurfMate Mounted Modules Heat Sinks Slotted Baseplate Thru-hole Baseplate Threaded Baseplate Module Kit # 100 pc Kit # Module Kit # 100 pc Kit # Module Kit # 100 pc Kit # Thru hole Threaded heat sink N/A N/A No heat sink Height above board with standoff Module kits contain enough standoffs and screws for one module. 100 piece kits contain standoffs only. Module Exchange Tools Part Number Maxi Mini Micro NOTE: These tools properly extract modules from the SurfMate sockets. Removal of a module without using the tool may damage the sockets. 8 v i c o r p o w e r. c o m

11 NOTES v i c o r p o w e r. c o m 9

12 Vicor Corporation 25 Frontage Road Andover, MA Tel: Fax: Lombard, IL Tel: Fax: Sunnyvale, CA Tel: Fax: Austin, TX Tel: Fax: Vicor France Tel: Fax: Vicor Germany Tel: Fax: Vicor Italy Tel: Fax: Vicor U.K. Tel: Fax: Vicor Japan Co., Ltd. Tel: Fax: Vicor Hong Kong Tel: Fax: vicorpower.com Rev /06

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