UMD0514M UNITED MICRO DEVICE INC. Low Capacitance Series TVS. Description. MSOP-10 Pin Configuration. Features. Mechanical Characteristics

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1 UMD0M Channel Ultra Low Capacitance Dual-Rail Clamp Array for ESD Protection Description Dual-rail clamp diodes are designed to provide ESD protection for high speed data interfaces. They are ideal for protecting systems with high data and clock rates or for circuits requiring low capacitive loading. The UMD0M consists of four pairs of diodes in series which steer the positive or negative ESD current pulse to either the positive (Vp) or negative (Vn) supply rail, and a diode which is embedded between Vp and Vn. The low capacitance array configuration allows the user to protect four high-speed data or transmission lines. The diode prevents over-voltage on the power line, protecting any down stream components. Low Capacitance Series MSOP-0 Configuration 0 Description,, and I/O Vn Vp Features * Dual-Rail Clamp technology * MSOP-0 package * Bi-Directional protection * Protects four data lines and one power line * Low channel input capacitance of 0.pF typical * Working voltage: V * Low clamping factor Vcl/Vbr * Low leakage current * Full RoHS compliance * Complies with the following standards: - IEC (ESD) Air-kv, Contact-kv - IEC (EFT) (/0ns) - IEC (Surge) (/0µs) Mechanical Characteristics * Molded JEDEC MSOP-0 package * Weight 0 milligrams (Approximate) * Available in Lead-Free Pure-Tin Plating * Solder Reflow Temp: Pure-Tin (Sn), 0-0ºC * Consult Factory for Leaded Device Availability * Flammability Rating UL V-0 * mm Tape and Reel per EIA Standard * Device Marking: Marking Code, one defined by DOT Applications * HDMI and DVI Port Protection * VGA and SCART Port Protection * 0/00/000 Ethernet Port Protection * USB.0 Power and Data Line Protection * Notebook Computers * Set Top Boxes and Digital TV Rev 0/0/0

2 UMD0M Channel Ultra Low Capacitance Dual-Rail Clamp Array for ESD Protection Absolute Maximum ºC unless otherwise specified Parameter Symbol Value Units Peak Pulse Power; pulse waveform = /0µs Ppp W Peak Pulse Current; pulse waveform = /0µs Ipp A ESD per IEC (Air) ± Vpp ESD per IEC (Contact) ± kv Operating Temperature Tj - to ºC Storage Temperature Tstg - to 0 ºC Dual-Rail Clamp Diode Protection + ve ESD transient current causes upper diode to forward bias and conduct the current into VCC VCC VCC Upper Steering Diode Upper Steering Diode +ve ESD Strike Device to be Protected -ve ESD Strike Device to be Protected Lower Steering Diode Avalanche Breakdown Diode Lower Steering Diode Avalanche Breakdown Diode Ground -ve ESD transient current causes lower diode to forward bias and conduct the current away from the protected load Electrical ºC unless otherwise specified Ground Parameter Symbol Conditions Minimum Typical Maximum Units Stand-off Voltage Vwm to.0 V Breakdown Voltage Vbr It=mA to.0 V Leakage Current Ir Vwm=V, to µa Forward Voltage Vf It=mA. V Clamping Voltage Vc Ipp=A, Tp=/0µs.0 V Clamping Voltage Vc Ipp=A, Tp=/0µs 0.0 V Junction Capacitance Cj Vr=0V, f=mhz I/O to I/O Vr=0V, f=mhz I/O to Gnd. pf Rev 0/0/0

3 UMD0M Channel Ultra Low Capacitance Dual-Rail Clamp Array for ESD Protection Electrical Characteristics Graphs Peak Pulse Power Ppp (w) Percentage of Peak Pulse Current PEAK PULSE POWER vs. PULSE TIME Pulse Duration tp (µs) PULSE WAVEFORM (/0µs) Time (µs) Capacitance C (pf) Percentage of Rated Power POWER DERATING CURVE CAPACITANCE FOR UMD0M Ambient Temperature TA ( C) vs. REVERSE VOLTAGE 0 0 Reverse Voltage VR (V) CLAMPING VOLTAGE vs. PEAK PULSE CURRENT FOR UMD0M Clamping Voltage Vc (V) Peak Pulse Current Ipp (A) Rev 0/0/0

4 UMD0M Channel Ultra Low Capacitance Dual-Rail Clamp Array for ESD Protection Applications Information The UMD0M is designed for have ease of layout by allowing the traces to run straight through the device. The traces can be used to connect the pin pairs for each line. Flow through layout protection Circuit connectivity is as follows: Line is connected to and 0 Line is connected to and is connected to Vcc Line is connected to and Line is connected to and is connected to Ground Line Line Vcc Line Line 0 Line Line Line Line Isolation from the power supply. Circuit connectivity is as follows: Line is connected to and 0 Line is connected to and is connected to series resistor Line is connected to and Line is connected to and is connected to Ground Line Line Line Line Vcc Line Line 0 Line Line No positive supply reference is available. Circuit connectivity is as follows: Line is connected to and 0 Line is connected to and is not connected Line is connected to and Line is connected to and is connected to Ground Line Line Line Line NC 0 Line Line Line Line Rev 0/0/0

5 UMD0M Channel Ultra Low Capacitance Dual-Rail Clamp Array for ESD Protection UMD0M on VGA Port Application R G VGA Gra phic Video Controller B VGA Port SCL VSync HSync SDA VGA Assignment Red Video NC Green Video 0 Sync Ground Blue Video Ground Ground SDA (Serial Data) DDC (Display Data Channel) Ground Horizontal Sync Red Ground Vertical Sync Green Ground SCL (Serial Clock) Blue Ground UMD0M on DVI Port Application DATA- DATA+ DATA- DATA+ DDCCLOCK DDCDATA DVI Port DATA- DATA+ DATA- DATA+ +V POWER DVI Graphic Video Controller DATA0- DATA0+ DATA- DATA+ CLOCK+ CLOCK- RED GREEN BLUE HSync DVI Assignment TMDS Data - Hot Plug Detect TMDS Data + TMDS Data 0- TMDS Data 0+ TMDS Data - TMDS Data + 0 TMDS Data - DDC Clock TMDS Data + DDC Data Analog VSync TMDS Clock+ TMDS Data - TMDS Clock- 0 TMDS Data + C Analog Red C Analog Green TMDS Data - C Analog Blue TMDS Data + C Analog HSync +V Power C Analog Ground Ground Rev /0/0 - - United Micro Device Inc Rev 0/0/0

6 UMD0M Channel Ultra Low Capacitance Dual-Rail Clamp Array for ESD Protection UMD0M on HDMI Port Application HDMI Graphic Video Controller TMDS D+ TMDS D- TMDS D+ TMDS D- TMDS D0+ TMDS D0- TMDS CK+ TMDS CK- CEC SCL SDA Power Hot Plug NC HDMI Port HDMI Assignment TMDS Data + TMDS Clock- TMDS Data - CEC TMDS Data + NC SCL TMDS Data - SDA TMDS Data 0+ +V Power TMDS Data 0- Hot Plug Detect 0 TMDS Clock+ UMD0M on Scart Port Application Audio Out R Audio In R Audio Out L SCART Port Audio In L RGB Blue A matte tin finish Switch is composed of 00% tin solder with large grains. Since the solder volume on the leads is RGB Green small compared to the solder paste volume that is pla ced on the land pattern of the, the reflow profile will be determined by the requirements of the solder paste. Therefore, these Scart Assignment SCART Port Controller Audio Out R RGB Red RGB Status CVBS Out CVBS In 0 0 Audio In R Audio Out L Audio Gnd Blue Gnd Audio in L RGB Blue Switch Green Gnd RGB Green 0 Red Gnd RGB Status Gnd RGB Red RGB Status CVBS Out Gnd CVBS In Gnd CVBS Out CVBS In Gnd Rev 0/0/0

7 UMD0M Channel Ultra Low Capacitance Dual-Rail Clamp Array for ESD Protection UMD0M on 0/00 Base Ethernet Port Application 0/00 Ethernet PHY RX - RX + TX - TX + Transformer Ethernet Port Ethernet Assignment TX + TX - RX - RX + UMD0M on Gigabit Ethernet Port Application Gigabit Ethernet Transceiver BI_DD- BI_DD+ BI_DB- BI_DC- BI_DC+ BI_DB+ Transformer Gigabit Ethernet Port BI_DA- BI_DA+ Gigabit Ethernet Assignment Bi-directional Pair A+ Bi-directional Pair A- Bi-directional Pair B+ Bi-directional Pair C+ Bi-directional Pair C- Bi-directional Pair B- Bi-directional Pair D+ Bi-directional Pair D- Rev 0/0/0

8 UMD0M Channel Ultra Low Capacitance Dual-Rail Clamp Array for ESD Protection Circuit Board Layout Recommendations Good circuit board layout is critical for creating an effective surge suppression circuit. The following guidelines are recommended to enhance the performance of a device: Place the near the input terminals or connectors to restrict transient coupling. Minimize the path length between the and the protected line. The ESD transient return path to ground should be kept as short as possible. Place a and decoupling capacitor between power and ground of components that may be vulnerable to electrostatic discharges to the ground plane. Minimize all conductive loops including power and ground loops. Use multilayer boards when possible. Minimize interconnecting line lengths. Never run critical signals near board edges. Fill unused portions of the with ground plane. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 00% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. Unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation to solder joint. Poor Layout Poor Layout Poor Layout Oscillator Clock Reset Good Layout Good Layout Good Layout Oscillator Clock Reset Rev 0/0/0

9 UMD0M Channel Ultra Low Capacitance Dual-Rail Clamp Array for ESD Protection Soldering Method for UMD s Products. Storage environment: Temperature = 0ºC~ºC Humidity = %±%. Reflow soldering of surface-mount devices tp Tp Critical Zone Ramp-up TL to Tp TL TSmax tl Temperature TSmin ts Preheat Ramp-down t C to Peak Time Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (TSmin) - Temperature Max (TSmax) - Time (min to max) (ts) Pb-Free Assembly <ºC/sec 0ºC 00ºC 0~0sec TSmax to TL - Ramp-up Rate <ºC/sec Time maintained above: - Temperature (TL) 0ºC - Time (tl) 0~sec Peak Temperature (Tp) 0ºC +0/-ºC Time within ºC of actual Peak Temperature (tp) 0~0sec Ramp-down Rate <ºC/sec Time ºC to peak Temperature < minutes Flow (wave) soldering (solder dipping) Products Pb devices Pb-Free devices Dipping time sec±sec sec±sec Rev 0/0/0

10 UMD0M Channel Ultra Low Capacitance Dual-Rail Clamp Array for ESD Protection MSOP-0 Dimension Drawing D 0 Dim Dimensions Inches mm Min Max Min Max A H 0M E A B C D C E e 0.0 BSC 0. 0 BSC L H 0. BSC. 0 BSC SEATING PLANE A B e A L MSOP-0 Carrier Dimension ΦD0 P P0 P A X Mounting Pattern E B0 0M 0M 0M F W C + G Z Y P K0 A0 A Typical SECTION A-A B B Dim MM Inches T C G P SECTION B-B X Y Z Dimensions in mm. Reel Dia. Tape Width A0 B0 K0 T D0 0mm ( ) mm.0±0.0.0±0.0.0± ±0.0.0±0.0 P0 P P E F W.00±0.0.00±0.0.00±0.0.±0.0.0±0.0.0±0.0 Rev 0/0/0 0

11 UMD0M Channel Ultra Low Capacitance Dual-Rail Clamp Array for ESD Protection Marking Code Part Number UMD0M Device Marking 0M Ordering Information Part Number Lead Finish Qty Per Reel Reel Size UMD0M Pb-Free,000 inch Please Read Carefully Information in this document is provided solely in connection with UMD products. UMD reserves the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All UMD products are sold pursuant to UMD s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the UMD products and services described herein, and UMD assumes no liability whatsoever relating to the choice, selection or use of the UMD products and services described herein. No license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by UMD for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. Unless otherwise set forth in UMD s Terms and Conditions of sale UMD disclaims any express or implied warranty with respect to the use and/or sale of UMD products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. Unless expressly approved in writing by an authorized UMD representative, UMD products are not recommended, authorized or warranted for use in military, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. Resale of UMD products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by UMD for the UMD product or service described herein and shall not create or extend in any manner whatsoever, any liability of UMD. 00 United Micro Device Inc All rights reserved Rev 0/0/0