2008 Printed Circuits, Inc.

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Marsha Cole
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2 Why Flex? Innovation Flexible circuits give you a unique tool to bring your innovative packaging ideas to market, and to separate your products from the crowd. Flex gives you the ability to create circuitry that fits your device and its application. Circuit density The dielectrics in flexible circuits are.001 making it a natural for ultra thin, ultra light, packaging. Adhesiveless laminates, HDI and thin copper layers make it ideal for fine line technology, giving you the smallest thinnest lightest solution for your circuit designs. Reliability Flexible circuits are designed for the rigors of aerospace, medical and military applications, for the ultimate reliability. Flex assemblies also eliminate connectors, and the labor, yield, and reliability issues that are inherent in their application. Why PCi? Focused Everything we produce at PCi is a flex or rigid flex construction. We ve been at it for thirty years, so we have the focus and experience to engineer your product for success. Certified PCi boards are used in military, aerospace, and medical applications, where there is no option for failure. We are military qualified to Mil-PRF , Mil-P-50884, and ISO The reliability of our technology is built right into your product. Friendly At PCi we love a challenge, and would love to work with you to produce your next design. Ask to see some examples of our work, and how we ve given package designers the innovation, circuit density, reliability, focus, certification, and friendly service they needed to compete in today s electronics marketplace. Capabilities Each day new board designs push one or more areas of our technology curve and help us produce tighter tolerances and denser boards. The capabilities that we have listed below are given in general terms because they are interdependent and it is possible that your requirements extend beyond the ranges given below. If your project is outside of those ranges, give us a call. We may have already produced it, and if not we d like to work with you to expand our capabilities. B OARD A TTRIBUTE S TANDARD T ECHNOLOGY A DVANCED T ECHNOLOGY Layer Count Multilayer Board Thickness Internal Imaging.004 / /.0025 External Imaging.004 / /.0025 Minimum Dielectric Minimum Copper 12µ 5µ Minimum Drilled Hole.006 <.006 Minimum Laser Via Aspect Ratio 10:1 > 10:1 Impedance Tolerance + 10% + 5%

3 Enabling Technologies LDI Imaged antenna.004/.004 with perfect front to back registration Below are a few of the technologies that we use to bring your concepts to reality: Laser Direct Imaging LDI offers the ability to image below.003/.003 with excellent repeatability and registration, but where it excels is providing dimensional scaling holding annular ring tolerances on outerlayers and soldermask registration within ±.001 Laser Drilling and Routing Laser gives you improved capabilities for very tight tolerance work with reasonable cost, and provides greater density with laser vias. Delphi Bump Plating Delphi bump technology provides longer pad life and greater reliability in repeated force applications particularly for military electronics. Laser routed flex ±.001 Delphi bump plating within traces.004/.004 pads with Laser Direct Imaged photoimagable coverlayer

4 This is our very first rigid flex, built in 1981! The board was for a laser bore site for the Apache Helicopter. It is a two layer rigid flex, with sections of flex with stiffeners, with a difficult butterfly spread on the two round rigid sections that mated to a military connector. Application: Military laser bore site Size: 4 by Adhesive flex Bondply FR4 core.010/.020 Minimum hole:.031 Minimum pad:.062 Thickness:.035 Certification: N/A Layers 1 and 2 are split to mate to a round military connector

Aircraft manufacturers use rigid flex boards for

rigid flex, with 8 layers of un-bonded flex cables,

7/9 outerlayers Minimum hole:.010 Minimum pad:.

5 Aircraft manufacturers use rigid flex boards for high reliability, compact packaging of their electronic flight controls. The board below is a large format fourteen layer rigid flex, with 8 layers of un-bonded flex cables, and anodized aluminum heat sinks. Application: Avionics Size: 20.5 by overall, 8 flex Polyimide core 7/9 innerlayers 7/9 outerlayers Minimum hole:.010 Minimum pad: Thickness: board only Certification: IPC 6013 Class T6 anodized aluminum heat sink.004 minimum annular ring

6 Electronics manufacturers for fighter aircraft use rigid flex for its ability to withstand extreme temperature cycling with life critical, interconnect reliability. This board is a 9 layer motherboard. It is a multilayer flex with stiffener as well as rigid flex. Application: Military electronics Size: by 9.75 Minimum hole:.042 Minimum pad: overall, all flex Polyimide no flow prepreg Polyimide id stiffener 14/10 innerlayers Pads only outerlayers Thickness: Certification: Mil-P Polyimide id stiffeners Laser profile rout

035 Polyimide core 10/7 innerlayers 10/7

7 Designers of military electronics appreciate rigid flex for its light weight and high reliability. This is a family of flexible boards for a smart bullet grenade launcher. It includes a double sided flex, a flex with stiffener for the shell, and a multilayer rigid flex with pedestal raised section within the rigid area. Application: Infantry smart weapon Size: Various average 4 by 1 1 to 6 Minimum hole:.0225 Minimum i pad:.035 Polyimide core 10/7 innerlayers 10/7 outerlayers Thickness: Various pedestal Certification: IPC 6013 Class 3 Pedestal.099 raised rigid area Delphi plated bump technology minimum annular ring Plated Bumps

8 Application: Designers of military electronics appreciate the mission survivability of rigid flex. Unlike conventional flex cables and connectors, rigid flex layers are integral to the board. This board is an 8 layer rigid flex with demanding registration requirements, and is designed to withstand negative 14,000 G s. Missile guidance Size: 13.6 by 1.2 Minimum hole:.011 Minimum pad:.022 8overall overall, 2flex Polyimide core 4/4 innerlayers 5/4 outerlayers Thickness: Certification: IPC 6013 Class 3 Sequential lamination with less than registration tolerance between sub-lams.002 minimum annular ring

Application: Rigid flex is also ideal for

flex board, to improve mission endurance.

It is mounted on an external pod on the aircraft

thermal excursions. Weapon system Size: 16.5 by 5.

042 16 to start - 10 finished, all flex p 8/8

9 Application: Rigid flex is also ideal for environments with high vibration and temperature requirements. This 10 layer rigid flex was designed to replace a flex board, to improve mission endurance. The board is 5 boards laminated together. It is mounted on an external pod on the aircraft and is subject to stress from vibration and rapid thermal excursions. Weapon system Size: 16.5 by 5.5 Minimum hole:.026 Minimum pad: to start - 10 finished, all flex p 8/8 innerlayers 9/8 outerlayers Thickness: Certification: Mil-PRF lamination drill/plate/image cycles.002 minimum annular ring

Designers often use rigid flex to provide mechanical as well as electronic

This board is a 10 layer rigid flex that is used to connect and house an infrared

It folds into a box like shape providing structural as well as electronic

10 Designers often use rigid flex to provide mechanical as well as electronic capabilities. This board is a 10 layer rigid flex that is used to connect and house an infrared camera. It folds into a box like shape providing structural as well as electronic functionality. Application: Infrared Camera Size: 9.75 by 5 8 overall, 4 flex bonded Polyimide core 4/4 innerlayers 4/5 outerlayers Minimum hole:.021 Minimum pad:.030 Thickness: Certification: IPC 6013 Class 3 Cut back coverlayer.002 minimum annular ring

11 This is a pure flex board, also used for an infrared camera. It is 14 layers,.060 thick, laminated with bondply only no glass. It has five lamination cycles with laser vias from layers 1-2, 1-3, 1-4; 14-13, and Application: Infrared Camera Size: 7 by 2.5 Minimum hole:.006 Minimum pad: overall, all flex Adhesive bondplies and coverlayer 5/4.5 innerlayers 5/5 outerlayers Thickness: Certification: IPC 6013 Class 2 Laser vias Sequential lamination/drill/image/plate Controlled impedance four layers

12 Application: This board shows one of the options for designers of rigid flex trying to package electronics in small spaces. It is a seven layer rigid flex with controlled impedance on three layers. The lower flex arm peels away from inside the hardboard, providing a larger bend radius within a confined space. Size: 7 by 2.25 Minimum hole:.0145 Minimum i pad:.022 Military communications 8 overall, 5 flex Polyimide core 2.75/4 innerlayers 4/4 outerlayers Thickness: Certification: IPC 6013 Class 3 Controlled impedance Flex/rigid transition area is within hardboard

It folds into a box, proving electronic as well as mechanical packaging capability. Application: Missile guidance Size: 11.

13 Rigid flex designers use the technology to provide light weight, high reliability electronic packaging. This board is an 11 layer rigid flex for a missile guidance system. It folds into a box, proving electronic as well as mechanical packaging capability. Application: Missile guidance Size: 11.6 by 11.6 Minimum hole:.025 Minimum pad: overall, 4 flex Adhesive flex Polyimide core 4/4 innerlayers 5/4 outerlayers Thickness: Certification: Mil-P Electroplated nickel gold

Unlike flex and multilayer flex, rigid flex designs can incorporate high density

without sacrificing reliability or weight.

Application: Size: 12 by 6.5 Minimum hole: Minimum pad:.

14 Unlike flex and multilayer flex, rigid flex designs can incorporate high density electronic component packaging as well as form fitting capability in their design, without sacrificing reliability or weight. This board has high I/O BGA s with via in pad, which are filled and cap plated. Application: Size: 12 by 6.5 Minimum hole: Minimum pad:.020 Electronic surveillance 8 overall, 2 flex Polyimide core 4/5 innerlayers 4.5/4 outerlayers.010 filled Thickness: Certification: IPC 6013 Class 2 Filled and cap plated via in pads

Application: Size: 12 by 6.5 Minimum hole:.

045 High layer count boards, with multiple

increased stress on the internal flex layers.

to get a lot of connectivity in a very small

This is a 24 layer bookbinder flex; each flex

15 Application: Size: 12 by 6.5 Minimum hole:.028 Minimum pad:.045 High layer count boards, with multiple flex arms, can be difficult to bend, and put increased stress on the internal flex layers. In those cases the rigid flex designer might consider a bookbinder flex. Although expensive, bookbinders provide a way to get a lot of connectivity in a very small space. This is a 24 layer bookbinder flex; each flex arm is made sequentially longer to improve reliability and bend radius. Rigid flex motherboard 24 overall, 16 flex Polyimide core 9/4 innerlayers 5/10 outerlayers Thickness: Certification: IPC 6013 Class 3 Bookbinder flex

16 PCi Certifications MIL-PRF Mil-P ITAR Registration #M13523 ISO from DSCC ISO from DNV PCI UL Approval File #E67398 Copies are available at

17 1200 West 96 th Street Minneapolis, MN Phone: Fax:

MOLEX COPPER FLEXIBLE CIRCUIT SOLUTIONS

MOLEX COPPER FLEXIBLE CIRCUIT SOLUTIONS CIRCUITS DESIGNED WITH A RANGE OF CAPABILITIES Maximum Performance for Demanding Applications Flex and Rigid Flex (Typical) Layer Count 1 to 8 Layers Standard Panel