XDM Version 8.4 System Specifications A03

Transcription

1 XDM Version 8.4 System Specifications A03

2 XDM (ETSI) System Specifications V8.4 Catalog No: X39656 August th Edition Copyright by ECI, All rights reserved worldwide. This is a legal agreement between you, the end user, and ECI Ltd. ( ECI ). BY OPENING THE DOCUMENTATION AND/OR DISK PACKAGE, YOU ARE AGREEING TO BE BOUND BY THE TERMS OF THIS AGREEMENT. IF YOU DO NOT AGREE TO THE TERMS OF THIS AGREEMENT, PROMPTLY RETURN THE UNOPENED DOCUMENTATION AND/OR DISK PACKAGE AND THE ACCOMPANYING ITEMS (INCLUDING WRITTEN MATERIALS AND BINDERS OR OTHER CONTAINERS), TO THE PLACE FROM WHICH YOU OBTAINED THEM. The information contained in the documentation and/or disk is proprietary and is subject to all relevant copyright, patent, and other laws protecting intellectual property, as well as any specific agreement protecting ECI's rights in the aforesaid information. Neither this document nor the information contained in the documentation and/or disk may be published, reproduced, or disclosed to third parties, in whole or in part, without the express prior written permission of ECI. In addition, any use of this document, the documentation and/or the disk, or the information contained therein for any purposes other than those for which it was disclosed, is strictly forbidden. ECI reserves the right, without prior notice or liability, to make changes in equipment design or specifications. Information supplied by ECI is believed to be accurate and reliable. However, no responsibility whatsoever is assumed by ECI for the use thereof, nor for the rights of third parties, which may be affected in any way by the use and/or dissemination thereof. Any representation(s) in the documentation and/or disk concerning performance of ECI product(s) are for informational purposes only and are not warranties of product performance or otherwise, either express or implied. ECI's standard limited warranty, stated in its sales contract or order confirmation form, is the only warranty offered by ECI. The documentation and/or disk is provided AS IS and may contain flaws, omissions, or typesetting errors. No warranty is granted nor liability assumed in relation thereto, unless specifically undertaken in ECI's sales contract or order confirmation. Information contained in the documentation and in the disk is periodically updated, and changes will be incorporated in subsequent editions. If you have encountered an error, please notify ECI. All specifications are subject to change without prior notice. The documentation and/or disk and all information contained therein is owned by ECI and is protected by all relevant copyright, patent, and other applicable laws and international treaty provisions. Therefore, you must treat the information contained in the documentation and disk as any other copyrighted material (for example, a book or musical recording). Other Restrictions. You may not rent, lease, sell, or otherwise dispose of the documentation and disk, as applicable. YOU MAY NOT USE, COPY, MODIFY, OR TRANSFER THE DOCUMENTATION AND/OR DISK OR ANY COPY IN WHOLE OR PART, EXCEPT AS EXPRESSLY PROVIDED IN THIS LICENSE. ALL RIGHTS NOT EXPRESSLY GRANTED ARE RESERVED BY ECI. All trademarks mentioned herein are the property of their respective holders. ECI shall not be liable to you or to any other party for any loss or damage whatsoever or howsoever caused, arising directly or indirectly in connection with this documentation and/or disk, the information contained therein, its use, or otherwise. Notwithstanding the generality of the aforementioned, you expressly waive any claim and/or demand regarding liability for indirect, special, incidental, or consequential loss or damage which may arise in respect of the documentation and/or disk and/or the information contained therein, howsoever caused, even if advised of the possibility of such damages. The end user hereby undertakes and acknowledges that they read the "Before You Start/Safety Guidelines" instructions and that such instructions were understood by them. It is hereby clarified that ECI shall not be liable to you or to any other party for any loss or damage whatsoever or howsoever caused, arising directly or indirectly in connection with you fulfilling and/or failed to fulfill in whole or in part the "Before You Start/Safety Guidelines" instructions.

3 Contents Overview XDM Intelligent and Scalable Optical Networking Platforms Unparalleled Capabilities XDM Platforms Physical Description XDM Shelf Configurations XDM-50 Card and Module Layout MXC50 and ECU50 Cards XDM-100 Card and Module Layout MXC and ECU Cards XDM-300 Card and Module Layout MXC300 and ECU300 Cards XDM-900 Card and Module Layout MXC900 and ECU900 Cards XDM-40 Card Layout XDM-400 Card Layout XDM-450 Card Layout XDM-500 Card Layout XDM-1000 Card Layout XDM-2000 Card Layout XDM-3000 Card Layout Control, Matrix, and I/O Cards for Large XDM Shelves XDM-50 Specifications Cross-Connect Specifications Traffic Protection Redundancy Synchronization Jitter and Wander I/O Interfaces Management SDH Interfaces Data Modules Physical Specifications Environmental Conditions EMC Safety Reliability A03 ECI Telecom Ltd. Proprietary i

4 Contents XDM System Specifications XDM-100 Specifications Cross-Connect Specifications Traffic Protection Redundancy Synchronization Jitter and Wander I/O Interfaces Management SDH/SONET Interfaces Data Modules Optical Amplifier Modules for TPU/OCU GbE/FC/2 Gbps FC/FICON Optical SFP Transceivers for Transponders/Combiners STM-1 SFP Optical supervisory channel transceivers for OSC1_ CWDM Modules Physical Specifications Environmental Conditions EMC Safety Reliability XDM-300/900 Specifications Cross-Connect Specifications Traffic Protection Redundancy Synchronization Jitter and Wander I/O Interfaces Management SDH/SONET Interfaces Data Modules Optical Amplifier Modules for TPU/OCU CWDM Modules Physical Specifications Environmental Conditions EMC Safety Reliability ii ECI Telecom Ltd. Proprietary A03

5 XDM System Specifications Contents XDM-40, 400, 450, 500, 1000, 2000, and 3000 Specifications6-1 Electrical, Optical, and Mixed Basecard Information XDM Shelf Capacities PDH/Async and SDH/SONET Interface Specifications SDH/SONET Interfaces XDM MPLS/Ethernet Card Summary Data Cards Optical Components C Band Channel Frequencies and Wavelengths (ITU-T Rec. G for DWDM) CWDM Frequencies and Wavelengths (ITU-T Rec. G for CWDM) Physical Specifications Environmental Conditions EMC Safety Reliability Management Specifications Other Specifications Standards and References... A-1 Overview... A-1 Broadband Forum... A-1 Environmental Standards... A-2 ETSI: European Telecommunications Standards Institute... A-2 IEC: International Electrotechnical Commission... A-3 IEEE: Institute of Electrical and Electronic Engineers... A-4 IETF: Internet Engineering Task Force... A-5 ISO: International Organization for Standardization... A-7 ITU-T: International Telecommunication Union... A-8 MEF: Metro Ethernet Forum... A-12 NIST: National Institute of Standards and Technology... A-13 North American Standards... A-13 OMG: Object Management Group... A-14 TMF: TeleManagement Forum... A-14 Web Protocol Standards... A-14 Index... I A03 ECI Telecom Ltd. Proprietary iii

6 Contents XDM System Specifications iv ECI Telecom Ltd. Proprietary A03

7 List of Figures Figure 1-1: Multiservice metropolitan optical network Figure 2-1: Basic XDM-50 shelf Figure 2-2: XDM-50 with TPU (I/O protection) Figure 2-3: Basic XDM-100 shelf Figure 2-4: XDM-100 with TPU (I/O protection) Figure 2-5: XDM-100 nonredundant configuration Figure 2-6: XDM-100H with one TPU/OCU shelf Figure 2-7: Basic XDM-300 shelf, horizontal installation Figure 2-8: Basic XDM-300 shelf, vertical Installation Figure 2-9: XDM-300 with TPU on top Figure 2-10: XDM-300 with TPUs on top and at the bottom of the shelf Figure 2-11: XDM-300 with two TPUs and an OCU Figure 2-12: Basic XDM-900 shelf, horizontal installation Figure 2-13: Basic XDM-900 shelf, vertical Installation Figure 2-14: XDM-900 with TPU on top Figure 2-15: XDM-900 with TPUs on top and at the bottom Figure 2-16: XDM-900 with two TPUs and an OCU Figure 2-17: XDM-40 shelf layout Figure 2-18: XDM-400 shelf open view Figure 2-19: XDM-450 platform Figure 2-20: XDM-500 shelf open view Figure 2-21: XDM-1000 standard shelf open view Figure 2-22: XDM-2000 open view Figure 2-23: XDM-3000 front view Figure 2-24: Three XDM-50 shelves in a 2600 mm ECI recommended ETSI rack Figure 2-25: Three XDM-100 or XDM-200 shelves in a 2600 mm ECI recommended ETSI rack Figure 2-26: Two XDM-300 shelves in a 2600 mm ECI recommended ETSI rack Figure 2-27: XDM-1000 and XDM-500 shelves in a 2600 mm ECI recommended ETSI rack Figure 2-28: Two XDM-500 shelves installed in a 2200 mm ETSI rack Figure 2-29: Two XDM-40 shelves installed in a 2200 mm ETSI rack Figure 2-30: Two XDM-2000 shelves installed in a 2200 mm ECI recommended ETSI rack A03 ECI Telecom Ltd. Proprietary v

8 List of Figures XDM System Specifications Figure 2-31: Two XDM-1000 shelves installed in a 2600 mm ECI recommended ETSI rack Figure 2-32: XDM-1000 and XDM-100H shelves installed in a 2200 mm ECI recommended ETSI rack Figure 2-33: XDM-500 and XDM-100H shelves installed in a 2200 mm ECI recommended ETSI rack Figure 2-34: XDM-50 slot allocation Figure 2-35: XDM-100 slot allocation Figure 2-36: XDM-300 slot allocation Figure 2-37: XDM-900 slot allocation Figure 2-38: XDM-40 card layout Figure 2-39: XDM-400 typical card layout Figure 2-40: XDM-450 slot layout Figure 2-41: XDM-500 standard card layout Figure 2-42: XDM-1000 standard card layout Figure 2-43: XDM-2000 standard card layout Figure 2-44: XDM-3000 standard card layout vi ECI Telecom Ltd. Proprietary A03

9 List of Tables Table 3-1: STM-1 bidirectional transceivers Table 3-2: STM-4 bidirectional transceivers Table 4-1: STM-1 bidirectional transceivers Table 4-2: STM-4 bidirectional transceivers Table 4-3: STM-16 bidirectional transceivers Table 4-4: SFP+ client transceivers Table 4-5: SFP+ bidirectional client transceivers Table 4-6: SFP+ C/DWDM transceivers Table 5-1: STM-1 bidirectional transceivers Table 5-2: STM-4 bidirectional transceivers Table 5-3: STM-16 bidirectional transceivers Table 5-4: GbE bidirectional transceivers Table 5-5: SFP+ client transceivers Table 5-6: SFP+ bidirectional client transceivers Table 5-7: SFP+ C/DWDM transceivers Table 6-1: STM-1 transceivers Table 6-2: STM-1 bidirectional transceivers Table 6-3: STM-4 transceivers Table 6-4: STM-4 bidirectional transceivers Table 6-5: STM-16 transceivers Table 6-6: STM-16 bidirectional transceivers A03 ECI Telecom Ltd. Proprietary vii

10 List of Tables XDM System Specifications viii ECI Telecom Ltd. Proprietary A03

11 1 Overview In this chapter: XDM Intelligent and Scalable Optical Networking Platforms Unparalleled Capabilities XDM Platforms XDM Intelligent and Scalable Optical Networking Platforms The telecommunications landscape is becoming more and more competitive. Carriers and operators are demanding networking equipment that can do more for less money. Today's networking equipment must be flexible, upgradeable, and highly intelligent. It must be able to successfully integrate with equipment produced by other manufacturers according to accepted industry standards. Above all, today's networking equipment must be scalable, easy to operate and maintain, and cost effective. At ECI, we specifically addressed these issues when we designed the XDM platforms. The XDM offers carriers unprecedented capacity, cost-savings, and ease of integration, placing it at the forefront of the optical networking revolution A03 ECI Telecom Ltd. Proprietary 1-1

12 Overview XDM System Specifications The XDM offers a series of outstanding advantages, including: Data-services the XDM facilitates migration from voice-oriented to data-oriented networks, combining the cost-effectiveness and universality of Ethernet with the Quality of Service (QoS), scalability, and resilience of SDH/SONET. Optical DWDM capabilities the XDM implements low-cost all-optical networks by offering sublambda grooming of multiple low-rate services (including SDH/SONET, IP, ATM, and GbE) onto a single wavelength. Versatility and interoperability the XDM coexists in perfect harmony with equipment from other vendors by enabling the free flow of management information between network elements. Its management software facilitates smooth integration with other high-level management systems. Readiness for future architectures thanks to its inherently modular build-as-you-grow architecture, the XDM gives carriers the ability to meet all of tomorrow's networking environments, be they ring, star, or mesh. The innovative design of the XDM meets all the requirements of modern transmission networks in a single shelf, consolidating key networking technologies in a modular infrastructure to create the world's most accommodating and scalable single-shelf platform. XDM operators can choose to use only the features required based on current demands, and add functions and services as requirements grow. This results in flexible and scalable platforms that provide dynamic multiservice provisioning while reducing both capital expenditures (CAPEX) and operating expenses (OPEX). 1-2 ECI Telecom Ltd. Proprietary A03

13 XDM System Specifications Overview Unparalleled Capabilities Typical metro networks span distances anywhere from 10 km to 300 km, serving large bandwidth-hungry areas. Equipment serving these networks must therefore be able to interconnect a wide range of protocols, from business customers in the access layer to service providers in the backbone. As a true MultiService Provisioning Platform (MSPP), the XDM seamlessly integrates multiple network types, traffic types and technologies, including: SDH/SONET Bitrates ranging from E1 all the way up to STM-64/OC-192 Large nonblocking matrix for full connectivity Variety of port densities that can fit into any network layer from the network termination unit all the way up to the central office Optical High density of lambdas (40 to 80) in the C band Ability to add/drop any lambda at any site Ability to provide metro solutions without amplification Long-haul solutions up to 1500 km Data Usable bandwidth to customers, including Layer 1 and Layer 2 Ethernet services, from 10BaseT all the way up to 10 GbE Ability to route data over SDH/SONET or DWDM Additional cards can be added as needed, to reduce cost and protect against over-expansion Cellular Aggregates ATM traffic to optimize bandwidth utilization Unifies 2G and 3G networks Several cross connect types are available, including broadband, wideband, and integrated broadband/wideband, all of which comply with applicable standards. The XDM does all of this while maintaining high levels of performance and reliability. Moreover, the inherent DWDM capabilities of the XDM provide operators with an intelligent infrastructure offering virtually unlimited expansion paths A03 ECI Telecom Ltd. Proprietary 1-3

14 Overview XDM System Specifications The multi-layer multiservice functionality of the XDM enables you to: Migrate from today's ring topologies to mesh architectures, segment by segment Add and activate bandwidth as requirements change Provide on-demand services across multiple network layers Figure 1-1: Multiservice metropolitan optical network 1-4 ECI Telecom Ltd. Proprietary A03

15 XDM System Specifications Overview XDM Platforms The XDM family of integrated optical platforms consolidates key networking technologies in a modular infrastructure that integrates all the transport functions of a complete Point of Presence (POP) in a single shelf-sized element. Cards can be interchanged between the various platforms, ensuring a flexible build-as-you-grow architecture for transporting all types of traffic, including voice, ATM, IP, and data. These technical specifications address the following XDM shelf configurations: XDM -50 The Do-It-All MSPP for Up-and-Coming Networks ultra compact platform, designed to provide a swift response to evolving network requirements. It brings greater levels of flexibility to metropolitan and cellular networks, and is emerging as a solid solution for these focused and highly cost-sensitive markets. XDM -100 Miniature MSPP for Metro-Access and Cellular Networks an intelligent integrated system that offers operators a cost-effective flexible approach to maximizing bandwidth utilization, while delivering both enhanced data services and traditional voice services. XDM -300 Flexible MSPP for Metro Aggregation Applications designed for metro aggregation applications and cellular Radio Access Network (RAN) infrastructure. The platform is optimized for cost- and physical size-effective implementation of MADM-64 and MADM-16 network elements. XDM -900 MSPP for High-Capacity Central Exchange Applications designed for high-capacity central exchange applications, the XDM-900 is optimized for the metro-core and features unprecedented port densities. As a digital cross connect, the XDM-900 forms a fully protected mesh core. As a multi-adm, it simultaneously closes STM-64/OC-192 core MS-SPRing/BLSR and multiple edge 1+1/UPSR rings. As a DWDM, it enables migration from SDH/SONET to DWDM networks, providing high capacity and sublambda grooming and reliability. The XDM-900 provides connectivity between central office legacy switches over E1, E3/DS-3, and STM-1/OC-3 trunks, and between POPs over native Fast Ethernet, Gigabit Ethernet, or POS, while efficiently grooming traffic from edge rings. XDM -40 Modular C/DWDM and OTN Platform for Metro-Access and CPE Applications enables service providers to build end-to-end flexible standards-based OTN solutions that address the growing demand for business data transport. It gives service providers the flexibility to take full advantage of their existing networks, while providing a smooth and fully supported migration to IP over optics A03 ECI Telecom Ltd. Proprietary 1-5

16 Overview XDM System Specifications XDM -400 Aggregator for Metro-Edge Networks an innovative product optimized for optical metro-access and cellular applications. When equipped with high-power long-haul optical devices, it provides an excellent solution for regional applications spanning distances of up to 1500 km. XDM -450 Standalone Computer Control Panel (CCP) shelf for optics overlay provides an efficient cost-effective way to add optical capacity to your network configuration and serves as an add-on to host additional OMs such as amplifiers and ROADMs. The XDM-450 is especially valuable for use with the XDM-300, XDM-1000, XDM-2000, XDM-3000, and ECI's CESR 9000 platforms, enabling a smooth DWDM upgrade path and supporting alien lambda extensions. XDM -500 Data-Aware Access Gateway designed for medium interface capacities and street-cabinet installations, the XDM-500 is a compact optical platform optimized for the metro-edge. It provides traditional broadband services and highly advanced data services like adaptive-rate Gigabit Ethernet, sophisticated Layer 2 Ethernet, POS, and lambda. It can be used either as a simple ADM or as an edge multi-adm/tm shared between several rings, providing distributed cross connectivity and concentration of low-rate services. XDM MSPP for High-Capacity Central Exchange Applications designed for high-capacity central exchange applications, the XDM-1000 is optimized for the metro-core and features unprecedented port densities. As a digital cross connect, the XDM-1000 forms a fully protected mesh core. As a multi-adm, it simultaneously closes STM-64/OC-192 core MS-SPRing/BLSR and multiple edge 1+1/UPSR rings. As a DWDM, it enables migration from SDH/SONET to DWDM networks, providing high capacity and sublambda grooming and reliability. The XDM-1000 provides connectivity between central office legacy switches over E1, E3/DS-3, and STM-1/OC-3 trunks, and between POPs over native Fast Ethernet, Gigabit Ethernet, or POS, while efficiently grooming traffic from edge rings. XDM Multifunctional Intelligent Optical Switch designed for the metro and metro-regional core, the XDM-2000 is optimized for pure DWDM and hybrid optical applications. This is a highly dense DWDM platform that provides intelligent sublambda grooming and optimum wavelength utilization. As the most flexible optical switch on the market today, the XDM-2000 transports up to 400 Gbps (upgradeable to 1.6 Tbps and above), and integrates the most advanced optical units with a variety of interfaces and a sophisticated high-capacity matrix in one small low-cost package. 1-6 ECI Telecom Ltd. Proprietary A03

17 XDM System Specifications Overview XDM High Capacity Metro-Core MSPP the 240 Gbps capacity is ideal for regional metro-core networks. The XDM-3000 is designed for ever-expanding optical transport traffic demands, with network migration to n x 10G interfaces increasing the bulk bandwidth requirements for core platforms. The high capacity of the XDM-3000 relieves metro-core network bottlenecks while enabling network expansion and improved BW efficiency through the use of 10 Gbps cards to maximize utilization of available slots. As a multi-adm, the XDM-3000 provides multi-ring closure, simultaneously closing STM-16/STM-64 core MS-SPRing and multiple edge SNCP rings, and providing improved protection and restoration capabilities. The XDM-3000 can also be used as a cost-effective DXC for heavy traffic sites, forming a fully protected mesh core. The large amount of low-order traffic handled by this platform enables full connectivity for TDM networks. Figure 1-2: XDM shelves A03 ECI Telecom Ltd. Proprietary 1-7

18 Overview XDM System Specifications 1-8 ECI Telecom Ltd. Proprietary A03

19 2 Physical Description In this chapter: XDM Shelf Configurations XDM-50 Card and Module Layout MXC50 and ECU50 Cards XDM-100 Card and Module Layout MXC and ECU Cards XDM-300 Card and Module Layout MXC300 and ECU300 Cards XDM-900 Card and Module Layout MXC900 and ECU900 Cards XDM-40 Card Layout XDM-400 Card Layout XDM-450 Card Layout XDM-500 Card Layout XDM-1000 Card Layout XDM-2000 Card Layout XDM-3000 Card Layout Control, Matrix, and I/O Cards for Large XDM Shelves A03 ECI Telecom Ltd. Proprietary 2-1

20 Physical Description XDM System Specifications XDM Shelf Configurations This section describes the XDM shelf configurations and slot assignments. XDM-50 Shelf Layout The XDM-50 is available in two configurations: Basic XDM-50 shelf with 21 protected E1 interfaces XDM-50 with I/O protection Basic XDM-50 shelf The basic XDM-50 shelf is housed in a 231 mm deep, 443 mm wide, and 129 mm high equipment cage. The lower part of the shelf consists of the card cage and accommodates the MXC50 (Main Cross connect and Control) cards (main and protection), the ECU50 (External Connection Unit), the CCP50_2 (Common Connection Panel), and the INF50 (Input Filter) cards. The upper part of the shelf consists of the module cage that houses up to four I/O modules. Various types of interface modules supporting PDH, SDH, and data services are available. The FCU50 fan control unit at the right side of the shelf provides cooling air to the system. Electrical connections are located directly in the tributary modules, except for the CCP50_2, which provides electrical connection to the PDB_21 (PDH Daughter Board) residing in the MXC50. To support system redundancy, the XDM-50 contains two INF50 units with connectors for two input power sources. Figure 2-1: Basic XDM-50 shelf 2-2 ECI Telecom Ltd. Proprietary A03

21 XDM System Specifications Physical Description XDM-50 with I/O protection A Tributary Protection Unit (TPU) is mounted on top of the basic XDM-50 shelf to provide I/O protection to the I/O modules. The TPU adds only 75 mm to the basic shelf height, allowing it to remain ultra compact in size. It has five slots, four allocated for Tributary Protection Modules (TPMs) and one for a Tributary Control (TC) or Tributary Control and Fan (TCF) module. Each TPM is connected to both operating and protection I/O modules in the shelf, in a 1:1 or 1:3 configuration. If a failure is detected in one of the operating I/O modules, the TC (or TCF) switches the traffic from the active to the protection I/O module. Figure 2-2: XDM-50 with TPU (I/O protection) XDM-100 Shelf Layout The XDM-100 is available in four configurations: Basic XDM-100 shelf XDM-100 with I/O protection Nonredundant XDM-100 Hybrid XDM-100H Basic XDM-100 shelf The basic XDM-100 shelf is housed in a 231 mm deep, 443 mm wide, and 200 mm high equipment cage. The lower part of the shelf consists of the card cage and accommodates the MXC-100 cards (main and protection) and the ECU. The upper part of the shelf consists of the module cage that houses up to eight I/O modules. Various types of interface modules supporting PDH, SDH, and data services are available. The FCU fan control unit at the right side of the shelf provides cooling air to the system. All electrical connections are located directly in the tributary modules; therefore, the XDM-100 does not need additional electrical interface connections A03 ECI Telecom Ltd. Proprietary 2-3

22 Physical Description XDM System Specifications To support system redundancy, each MXC card contains an integrated xinf (XDM Input Filter) unit with connectors for two input power sources. Figure 2-3: Basic XDM-100 shelf XDM-100 with I/O protection A TPU is mounted on top of the basic XDM-100 shelf to provide I/O protection to the I/O modules. The TPU adds only 75 mm to the basic shelf height, allowing the XDM-100 to remain compact in size. It has five slots, four allocated for TPMs and one for a TC module. Each TPM is connected to both operating and protection I/O modules in the shelf in a 1:1, 1:2, or 1:3 configuration. If a failure is detected in one of the operating I/O modules, the TC switches the traffic from the active to the protection I/O module. Figure 2-4: XDM-100 with TPU (I/O protection) 2-4 ECI Telecom Ltd. Proprietary A03

23 XDM System Specifications Physical Description Nonredundant XDM-100 NOTE: The nonredundant XDM-100 configuration is not recommended for data applications. The nonredundant XDM-100 has the same physical dimensions as the basic shelf. It differs only by the single MXC-100 card that it has in slot MXC A, compared with two cards in the basic shelf. Slot MXC B of the nonredundant configuration accommodates a bridging unit, MXC-BR. No redundancy is provided for the MXC-100 functions. Figure 2-5: XDM-100 nonredundant configuration A03 ECI Telecom Ltd. Proprietary 2-5

24 Physical Description XDM System Specifications XDM-100H The XDM-100H combines the SDH/SONET and data capabilities of the XDM-100 with the optical CWDM capabilities. This is provided by the software cost option incorporated within the NVM card in each of the MXC-100 cards. The XDM-100H consists of the basic XDM-100 shelf, and if required, one or two TPU/OCU shelves. The I/O module cage can accept any mix of the XDM-100 I/O modules and CWDM I/O modules. The TPU/OCU shelf is identical in its physical dimensions and number of slots (five) to the TPU. Four of the slots can house any mix of TPMs and CWDM optical networking modules (mux/demux, OADM, and splitter/coupler); the fifth slot always accommodates a TC module. Figure 2-6: XDM-100H with one TPU/OCU shelf 2-6 ECI Telecom Ltd. Proprietary A03

25 XDM System Specifications Physical Description XDM-300 Shelf Layout The XDM-300 is available in following configurations: Basic XDM-300 shelf Expanded XDM-300 with I/O protection as follows: A TPU mounted on top of the basic shelf. A TPU mounted at the bottom of the basic shelf. Two TPUs mounted, one on top and one at the bottom of the basic shelf. Expanded XDM-300 with enhanced CWDM networking capabilities. An OCU is mounted on top of the basic shelf, or on the expanded shelf (with a TPU). Basic XDM-300 shelf The basic XDM-300 shelf is housed in a 246 mm deep, 443 mm wide, and 350 mm high equipment cage. The upper part of the shelf consists of a module cage (upper module cage) and houses up to eight I/O modules. In the middle of the shelf is a card cage that accommodate the MXC300 cards (main and protection), the External Connection Unit (ECU300), and up to two I/O cards. The lower part of the shelf consists of an additional module cage (lower module cage) that can be equipped with up to eight I/O modules. I/O protection is not supported in this option. The XDM-300 shelf can be installed in a horizontal or vertical position. Figure 2-7: Basic XDM-300 shelf, horizontal installation A03 ECI Telecom Ltd. Proprietary 2-7

26 Physical Description XDM System Specifications Figure 2-8: Basic XDM-300 shelf, vertical Installation Expanded XDM-300 with I/O Protection TPUs can be attached to the XDM-300 shelf to protect installed I/O modules. Each TPM is connected to both operating and protection I/O modules in the shelf in a 1:1, 1:2, or 1:3 configuration. If a failure is detected in one of the operating I/O modules, the active MXC300 via the TC module in the TPU switches the traffic from the active I/O module to the protection module. Several protection configurations are possible: A TPU mounted on top of the basic shelf, protects I/O modules residing in the upper module cage. A TPU mounted at the bottom of the basic shelf, protects I/O modules installed in the lower module cage. Two TPUs mounted one on top and one at the bottom of the basic shelf; provide protection to I/O modules in both the upper and lower module cages. 2-8 ECI Telecom Ltd. Proprietary A03

27 XDM System Specifications Physical Description Figure 2-9: XDM-300 with TPU on top Figure 2-10: XDM-300 with TPUs on top and at the bottom of the shelf A03 ECI Telecom Ltd. Proprietary 2-9

28 Physical Description XDM System Specifications Expanded XDM-300 with CWDM Networking Capabilities An OCU can be mounted on top of a basic XDM-300 shelf or on top of an expanded shelf to add enhanced CWDM networking capabilities to the platform. NOTE: An OCU is not supported at the bottom of the XDM-300 shelf. Figure 2-11: XDM-300 with two TPUs and an OCU 2-10 ECI Telecom Ltd. Proprietary A03

29 XDM System Specifications Physical Description XDM-900 Shelf Layout The XDM-300 is available in following configurations: Basic XDM-900 shelf Expanded XDM-900 with I/O protection as follows: A TPU mounted on top of the basic shelf. A TPU mounted at the bottom of the basic shelf. Two TPUs mounted, one on top and one at the bottom of the basic shelf. Expanded XDM-900 with enhanced CWDM networking capabilities. An OCU is mounted on top of the basic shelf, or on the expanded shelf (with a TPU). Basic XDM-900 shelf The basic XDM-900 shelf is housed in a 246 mm deep, 443 mm wide, and 350 mm high equipment cage. The upper part of the shelf consists of a module cage (upper module cage) and houses up to eight I/O modules. In the middle of the shelf is a card cage that accommodate the MXC900 cards (main and protection), the External Connection Unit (ECU900), and up to two I/O cards. The lower part of the shelf consists of an additional module cage (lower module cage) that can be equipped with up to eight I/O modules. I/O protection is not supported in this option. The XDM-900 shelf can be installed in a horizontal or vertical position. Figure 2-12: Basic XDM-900 shelf, horizontal installation A03 ECI Telecom Ltd. Proprietary 2-11

30 Physical Description XDM System Specifications Figure 2-13: Basic XDM-900 shelf, vertical Installation 2-12 ECI Telecom Ltd. Proprietary A03

31 XDM System Specifications Physical Description Expanded XDM-900 with I/O Protection TPUs can be attached to the XDM-900 shelf to protect installed I/O modules. Each TPM is connected to both operating and protection I/O modules in the shelf in a 1:1, 1:2, or 1:3 configuration. If a failure is detected in one of the operating I/O modules, the active MXC900 via the TC module in the TPU switches the traffic from the active I/O module to the protection module. Several protection configurations are possible: A TPU mounted on top of the basic shelf, protects I/O modules residing in the upper module cage. A TPU mounted at the bottom of the basic shelf, protects I/O modules installed in the lower module cage. Two TPUs mounted one on top and one at the bottom of the basic shelf; provide protection to I/O modules in both the upper and lower module cages. Figure 2-14: XDM-900 with TPU on top A03 ECI Telecom Ltd. Proprietary 2-13

32 Physical Description XDM System Specifications Figure 2-15: XDM-900 with TPUs on top and at the bottom 2-14 ECI Telecom Ltd. Proprietary A03

33 XDM System Specifications Physical Description Expanded XDM-900 with CWDM Networking Capabilities An OCU can be mounted on top of a basic XDM-900 shelf or on top of an expanded shelf to add enhanced CWDM networking capabilities to the platform. NOTE: An OCU is not supported at the bottom of the XDM-900 shelf. Figure 2-16: XDM-900 with two TPUs and an OCU A03 ECI Telecom Ltd. Proprietary 2-15

34 Physical Description XDM System Specifications XDM-40 Shelf Layout The compact XDM-40 shelf is located in a 285 mm deep, 447 mm wide, and 256 mm high equipment cage. The cards cage houses two I/O slots for optical cards (transponders, combiners, and/or optical amplifiers). The upper cage houses two slots for the DWDM/amplifier modules. The shelf also includes an xmcp_b, MECP, two xinf40s, and an xfcu40 that includes three separate fans to support system redundancy. Figure 2-17: XDM-40 shelf layout XDM-400 Shelf Layout The compact XDM-400 shelf is located in a 285 mm deep, 450 mm wide, and 500 mm high equipment cage. It consists of a single-row cage housing I/O, matrix, processor, and common cards in the middle and right side of the shelf. The electrical interface connection modules are housed in two slots on the left side of the shelf. The shelf also contains two xinf4 (XDM-400 Input Filter) units and an xfcu4 (XDM-400 Fan Control Unit) that consists of five separate fans that provide system redundancy. Figure 2-18: XDM-400 shelf open view 2-16 ECI Telecom Ltd. Proprietary A03

35 XDM System Specifications Physical Description XDM-450 Shelf Layout The standard XDM-450 is located in a 275 mm deep, 492 mm wide, and 374 mm high shelf with a single cards cage section. The shelf consists of a single-row cage housing the DWDM, processor, and common cards. The shelf also has two xinf and an xfcu unit. Figure 2-19: XDM-450 platform A03 ECI Telecom Ltd. Proprietary 2-17

36 Physical Description XDM System Specifications XDM-500 Shelf Layout The XDM-500 compact shelf is located in a 285 mm deep, 450 mm wide, and 725 mm high equipment cage. The shelf consists of a single-row cage housing the I/O, matrix, processor, and common cards in two slot areas on either side of the shelf. The electrical interface connection modules and DWDM/OADM modules are housed in the central slot area. The shelf also has two xinf and three xfcu units. Figure 2-20: XDM-500 shelf open view 2-18 ECI Telecom Ltd. Proprietary A03

37 XDM System Specifications Physical Description XDM-1000 Shelf Layout The standard XDM-1000 is located in a 285 mm deep, 450 mm wide, and 1100 mm high shelf with a modules cage and a cards cage section. The cards cage houses the I/O, matrix, processor, and common cards. The modules cage houses the electrical interface connection modules and DWDM/OADM modules. The shelf also has two xinfs and three xfcus. Figure 2-21: XDM-1000 standard shelf open view A03 ECI Telecom Ltd. Proprietary 2-19

38 Physical Description XDM System Specifications XDM-2000 Shelf Layout The XDM-2000 shelf is located in a 285 mm deep, 450 mm wide, and 775 mm high equipment cage. The shelf consists of a single-row cage that houses optical cards (transponders, mux/demux, optical amplifiers), and xmcp/xmcp_b and MECP cards. XDM-500 and XDM-2000 shelves may be used in conjunction with the regular XDM-1000 shelf in the same rack. Figure 2-22: XDM-2000 open view 2-20 ECI Telecom Ltd. Proprietary A03

39 XDM System Specifications Physical Description XDM-3000 Shelf Layout The XDM-3000 is located in a 350 mm deep, 492 mm wide, and 1550 mm high shelf. The XDM-3000 consists of an I/O card cage arranged in four sections, together with additional power, communication, and control units. Figure 2-23: XDM-3000 front view A03 ECI Telecom Ltd. Proprietary 2-21

40 Physical Description XDM System Specifications Rack Layouts and Expansion Shelves XDM shelves can be installed in both standard and ECI recommended ETSI racks, as well as in 19" and 23" racks. They can also be installed in 19" 7' and 23" 7' bay racks, except for the XDM-50, XDM-100, and XDM-300 that cannot be installed in 19" 7'bay racks. The recommended ETSI rack offered by ECI is specially designed for installation of telecommunication equipment and a wide range of equipment accessories. To facilitate cable routing, the rack has removable rear and side panels which enable tidy leading and efficient maintenance of all rack cables. Two plastic conduits on the rack's front rails support routing of up to 200 optical fibers. It also has open top and bottom frames to facilitate easy routing of cables from suspension floors and/or ceiling ladders. The front door can be mounted for right or left opening. The XDM-50, XDM-100, or XDM-300 can be installed in either 2200 mm or 2600 mm standard or ECI recommended ETSI racks. NOTE: Installations of XDM-50, XDM-100, or XDM-300 in 19" racks must be approved by ECI's Transport Networks Division Mechanical Department ECI Telecom Ltd. Proprietary A03

41 XDM System Specifications Physical Description Figure 2-24: Three XDM-50 shelves in a 2600 mm ECI recommended ETSI rack A03 ECI Telecom Ltd. Proprietary 2-23

42 Physical Description XDM System Specifications Figure 2-25: Three XDM-100 or XDM-200 shelves in a 2600 mm ECI recommended ETSI rack 2-24 ECI Telecom Ltd. Proprietary A03

43 XDM System Specifications Physical Description Figure 2-26: Two XDM-300 shelves in a 2600 mm ECI recommended ETSI rack The XDM-1000 can be installed in either a 2200 mm or 2600 mm ETSI rack. Two XDM-1000 shelves can be installed in a 2600 mm rack, whereas a 2200 mm rack can accommodate only a single XDM-1000 shelf. Alternatively, two XDM-500 and/or XDM-2000 shelves can be installed in a 2200 mm rack. One XDM-1000 shelf and one XDM-500 or XDM-2000 shelf can be installed in a 2600 mm rack. The installation of XDM-500, XDM-1000, and XDM-2000 in 19" or 23" racks is supported as well A03 ECI Telecom Ltd. Proprietary 2-25

44 Physical Description XDM System Specifications In addition, a 600 mm deep rack can house XDM shelves in a back-to-back configuration, thus doubling the capacity of the rack. Figure 2-27: XDM-1000 and XDM-500 shelves in a 2600 mm ECI recommended ETSI rack 2-26 ECI Telecom Ltd. Proprietary A03

45 XDM System Specifications Physical Description Figure 2-28: Two XDM-500 shelves installed in a 2200 mm ETSI rack A03 ECI Telecom Ltd. Proprietary 2-27

46 Physical Description XDM System Specifications Figure 2-29: Two XDM-40 shelves installed in a 2200 mm ETSI rack 2-28 ECI Telecom Ltd. Proprietary A03

47 XDM System Specifications Physical Description Figure 2-30: Two XDM-2000 shelves installed in a 2200 mm ECI recommended ETSI rack A03 ECI Telecom Ltd. Proprietary 2-29

48 Physical Description XDM System Specifications Figure 2-31: Two XDM-1000 shelves installed in a 2600 mm ECI recommended ETSI rack 2-30 ECI Telecom Ltd. Proprietary A03

49 XDM System Specifications Physical Description Figure 2-32: XDM-1000 and XDM-100H shelves installed in a 2200 mm ECI recommended ETSI rack A03 ECI Telecom Ltd. Proprietary 2-31

50 Physical Description XDM System Specifications Figure 2-33: XDM-500 and XDM-100H shelves installed in a 2200 mm ECI recommended ETSI rack 2-32 ECI Telecom Ltd. Proprietary A03

51 XDM System Specifications Physical Description XDM-50 Card and Module Layout Basic XDM-50 Shelf The basic XDM-50 cage contains slots for I/O interface modules and dedicated slots for the MXC50, CCP50, INF50, and ECU50. The cage's design and mechanical practice conform to international mechanical standards and specifications. The modules and cards are distributed as follows: Four (4) slots, I1 to I4, optimally allocated for I/O interface modules. Two (2) slots, A and B respectively, allocated for the MXC50s (main and protection). Each MXC50 has three slots (A1, A2, A3 and B1, B2, B3) to accommodate SDH aggregate SFP transceivers. One (1) slot allocated for the CCP50_2. Two (2) slots allocated for INF50 cards. One (1) slot allocated for the ECU50. The CCP50_2 provides the physical connection to 21 E1 interfaces in the PDB2_21 residing in the MXC50. Two INF50 filter cards, with inputs for two sources, support system DC redundancy. The ECU50 is located beneath the MXC50s. Its front panel features several interface connectors for management, external timing, alarms, orderwire and overhead (future release). It also includes colored alarm severity LED indicators. Figure 2-34: XDM-50 slot allocation A03 ECI Telecom Ltd. Proprietary 2-33

52 Physical Description XDM System Specifications Expanded XDM-50 Shelf with I/O Protection A TPU can be mounted on top of the basic XDM-50 shelf to add protection of electrical I/O modules. The modules are distributed as follows: Four (4) slots flexibly allocated for TPMs (single-slot, double-slot, or triple-slot modules are supported) One (1) slot allocated for the TC or TCF Each TPM is connected to the operating and protection modules of the XDM-50 shelf respectively. If a failure is detected in one of the operating I/O modules, the XDM-50 control system sends control signals to the appropriate TPM relays to switch traffic from the operating I/O module to the protection module. Several types of TPMs for 1:1 or 1:3 protection schemes are supported. The TC or TCF is connected to the DC and control buses of the MXC50 cards via the TPU backplane. It controls the switching of traffic from the main to protection I/O module by relays in the corresponding TPM. In addition, the TCF has three fans that provide cooling air to the modules installed in the TPU (optional). MXC50 and ECU50 Cards The MXC50 and ECU50 were designed to facilitate simple installation and maintenance. They feature: MXC50 Easy routing of external management interfaces Hot insertion of cards and modules to support quick and non-traffic-affecting maintenance and repair The MXC50 performs the shelf's cross-connect, timing, and multiplexing functions, including: Multiplexer control and traffic processing. SDH traffic cross-connect. The switch handles aggregate and tributary interface traffic with a capacity of 128 x STM-1 (64 x STM-1 in use) equivalents. Timing and synchronization. Routing and handling of 16 DCC channels. The XDM-50 supports several types of cross connects in compliance with applicable ITU-T and Telcordia standards. These include broadband, wideband, and integrated broadband/wideband cross connects ECI Telecom Ltd. Proprietary A03

53 XDM System Specifications Physical Description ECU50 and ECU50R The ECU50 is the alarms and maintenance card. It is available in two versions: ECU50 and ECU50R. The functions of both cards are similar; the main difference is that the ECU50R does not support OW. The ECU50 provides a variety of interfaces and indicators, as follows: RS-232 serial interface for a craft terminal Ethernet RJ45 interface for Lightsoft and EMS-XDM Alarm severity outputs (Critical, Major, Minor, Warning) and external alarm outputs and inputs (D-type SCSI connector) External synchronization inputs/outputs (T3/T4) Alarms and status display Analog orderwire (OW) circuit, providing point-to-point or conference engineering orderwire voice connection for technical staff use (future release) Pushbuttons for LED tests, forced laser activation during ALS, alarms cutoff (ACO), and OW circuit (future release) NET SEL switch (A/B) Optional USB interface (future use, for craft terminal) XDM-100 Card and Module Layout Basic XDM-100 Shelf The basic XDM-100 cage contains slots for I/O interface modules, and dedicated slots for the MXC cards and the ECU. The cage's design and mechanical practice conform to international mechanical standards and specifications. The modules and cards are distributed as follows: Eight (8) slots, I1 to I8, optimally allocated for I/O interface modules. Two (2) slots, A and B respectively, allocated for the MXC cards (main and protection). Each MXC has two slots (A1 and A2 and B1 and B2) to accommodate SDH/SONET aggregate modules. One (1) slot allocated for the ECU A03 ECI Telecom Ltd. Proprietary 2-35

54 Physical Description XDM System Specifications The ECU is located beneath the MXC cards. Its front panel features several interface connectors for management, external timing, alarms, orderwire, and overhead (future release). It also includes colored alarm severity LED indicators and selectors, and a display for selecting specific modules and ports for monitoring purposes. Figure 2-35: XDM-100 slot allocation Expanded XDM-100 Shelf with I/O Protection A TPU can be mounted on top of the basic XDM-100 shelf to add protection of electrical I/O modules. The modules are distributed as follows: Four (4) slots flexibly allocated for TPMs (single-slot or double-slot modules are supported) One (1) slot allocated for the TC or TCF module Each TPM is connected to the operating and protection modules of the XDM-100 shelf respectively. If a failure is detected in one of the operating I/O modules, the XDM-100 control system sends control signals to the appropriate TPM relays to switch traffic from the operating I/O module to the protection module. Several types of TPMs for 1:1, 1:2, or 1:3 protection schemes are supported. The TC or TCF is connected to the DC and control buses of the MXC cards via the TPU backplane. It controls the switching of traffic from the main to protection I/O module by relays in the corresponding TPM. In addition, the TCF has four fans that provide cooling air to the modules installed in the TPU (optional). Nonredundant XDM-100 Shelf The XDM-100 is also available in a nonredundant configuration. This shelf is equipped with only one MXC. The second position of the MXC houses an MXC-BG card that bridges the buses of the second slot to the I/O modules. Redundancy for power supply, timing and synchronization, cross-connect, and all other MXC functions is not supported in this configuration. However, since the MXC has two aggregate modules, SNCP, MSP, and MS-SPRing traffic protection mechanisms are supported ECI Telecom Ltd. Proprietary A03

55 XDM System Specifications Physical Description XDM-100H Shelf The XDM-100H platform is based on the basic XDM-100 shelf, with a software cost option that supports installation of any mix of the XDM-100 I/O modules with optical I/O modules in the module cage. In addition, one or two TPU/OCU shelves can be mounted on top of the basic shelf to support any mix of TPM and CWDM optical networking modules. The XDM-100H consists of the following units: Basic XDM-100 shelf that includes the ECU or ECU-F, two MXC-100 cards, the I/O module cage with eight slots, and the FCU. Each MXC-100 card houses an NVM module which contains the licensed option software. The eight slots of the I/O module cage support installation of XDM-100 I/O modules, as well as CWDM I/O modules (transponders and combiners). TPU/OCU shelf (optional), mounted on top of the XDM-100 basic shelf. It contains five (5) slots: four (4) for supporting any mix of mux/demux, OADM, splitter/coupler, and TPM modules, and one (1) for a TC module. One or two TPU/OCUs can be mounted on the basic XDM-100 shelf. MXC and ECU Cards The MXC and ECU were designed to facilitate simple installation and maintenance. They feature: Electrical interface connectors that are integrated into the I/O modules, saving the need for separate electrical interface modules Easy routing of external management interfaces Monitoring system for acceptance test purposes Hot insertion of cards and modules to support quick and non-traffic-affecting maintenance and repair A03 ECI Telecom Ltd. Proprietary 2-37

56 Physical Description XDM System Specifications MXC Two types of MXC cards are available: MXC-100 used in XDM-100. It has two slots for housing aggregate modules in XDM-100. Two MXC-100 cards are usually installed in the XDM-100, providing 1+1 protection. MXC-100B supported only for XDM-100. Features enhanced cross-connect and timing functionality, and also supports OW. The basic and expanded versions of the XDM-100 shelf accommodate two identical MXC cards. By default, the MXC-A is the main card and MXC-B is the protection card. Both cards perform the following functions simultaneously in a 1+1 protection configuration: Communication and control Alarm and maintenance Cross-connect Timing and synchronization Distribution of power supply to all modules Routing and handling of 32 DCC channels Support for OW in conjunction with ECU100B (only MXC-100B) In addition, the MXC accommodates the NVM compact flash memory card and houses SDH/SONET aggregate modules (SAMs). The additional MXC card provides 1+1 protection to the cross-connect matrix and full 1:1 protection to all other functions, since the standby MXC has an identical database to the active MXC. In case of a hardware failure in the active MXC or in its traffic interconnections, the I/O interface modules switch to the protection MXC within 50 ms. Similarly, in case of a hardware failure in the TiMing Unit (TMU) of the operational MXC card, the backup TMU takes over the timing control with no disruption in traffic. The operational MXC card is configured by LightSoft, ECI's Optical Network Division's multidimensional network manager ECI Telecom Ltd. Proprietary A03

57 XDM System Specifications Physical Description ECU The ECU connects management, alarms, overhead access, and orderwire interfaces to the active MXC card. This card also provides the physical connections for these interfaces. Two types of ECU cards are available: ECU-F supports full functionality, is usually used in the XDM-100 ECU supports reduced functionality and can also be used in XDM-100 installations The ECU-F supports the following management and alarm interfaces and functions: Ethernet interface to LightSoft and EMS-XDM Ethernet hub for multiple NE connections Serial RS-232 interface for craft terminal USB interface Synchronization inputs and outputs (T3/T4) Alarm severity outputs (Critical, Major, Minor, Warning) External alarm outputs and inputs Alarm Cut Off (ACO) Operation and alarm LEDs Selection and display of traffic interfaces for monitoring purposes Monitor interface for STM-1/OC-3 ports Laser activation during ALS, for maintenance purposes Multiplexer reset Holdup capacitors Lamp test activation The ECU supports all functions provided by the ECU-F except for Ethernet expansion to hub, monitoring points, holdup capacitors, and alarms in/out A03 ECI Telecom Ltd. Proprietary 2-39

58 Physical Description XDM System Specifications XDM-300 Card and Module Layout Basic XDM-300 Shelf The basic XDM-300 shelf is 443 mm wide, 246 mm deep and 350 mm high. When the optional TPUs or OCU are attached to the shelf, each of these expansion shelves adds 75 mm to the height of the basic shelf. The rightmost slot of the shelf houses the FCU300. The middle part of the shelf consists of the cards cage with five horizontal slots which accommodate: ECU300 or ECU300-F Two MXC300 cards (main and protect) Up to two quad I/O cards NOTE: The slots of the quad I/O cards can be adapted to accommodate one SIM16_1 I/O module each instead of the I/O cards by using a mechanical adapter. The upper and lower parts of the shelf consist of a module cage with eight horizontal slots. Each module cage can house up to eight I/O (PDH, SDH, or data) single slot modules, totaling a maximum of 16 modules. Figure 2-36: XDM-300 slot allocation 2-40 ECI Telecom Ltd. Proprietary A03

59 XDM System Specifications Physical Description Expanded XDM-300 Shelf with I/O Protection In an expanded XDM-300 shelf with I/O protection, one or two TPUs are mounted on the top and/or at the bottom of the basic shelf, including a TC or TCF module and TPMs. An OCU with CWDM networking modules can be mounted on top of a basic or expanded shelf. The TPU modules are distributed as follows: Four (4) slots flexibly allocated for TPMs (single-slot or double-slot modules are supported) One (1) slot allocated for the TC or TCF module Each TPM is connected to the operating and protection modules of the XDM-300 shelf respectively. If a failure is detected in one of the operating I/O modules, the XDM-300 control system sends control signals to the appropriate TPM relays to switch traffic from the operating I/O module to the protection module. Several types of TPMs for 1:1, 1:2, or 1:3 protection schemes are supported. The TC or TCF is connected to the DC and control buses of the MXC300 cards via the TPU backplane. It controls the switching of traffic from the main to protection I/O module by relays in the corresponding TPM. In addition, the TCF has four fans that provide cooling air to the modules installed in the TPU (optional). MXC300 and ECU300 Cards The MXC300 and ECU300 were designed to facilitate simple installation and maintenance. They feature: Electrical interface connectors that are integrated into the I/O modules, saving the need for separate electrical interface modules Easy routing of external management interfaces Monitoring system for acceptance test purposes Hot insertion of cards and modules to support quick and non-traffic-affecting maintenance and repair A03 ECI Telecom Ltd. Proprietary 2-41

60 Physical Description XDM System Specifications MXC300 The XDM-300 is a redundant platform, and two MXC300 cards must always be installed in slots MXC-A and MXC-B of the XDM-300 shelf. The MXC300 performs the following functions: Communications and control (by CPU): Routing and handling of 64 DCC channels Control of all shelf cards and modules Management interface Support of the 256 Mb NonVolatile compact flash Memory (NVM) card Alarms and maintenance Control of TPU/OCU shelves 2.5 Gbps capacity for all I/O module slots, and 10 Gbps for I/O card slots SDH-related functions: SDH timing and synchronization SDH cross connect 4/3/1 60 Gbps HO/LO nonblocking matrix Support for CWDM I/O modules (transponders and combiners) in all I/O module slots DC voltage supply: One 48 V DC power input that supplies voltages for all cards and modules Input Filtering (INF) function for the entire shelf Voltage and control for Fan Control Unit (VFCU) 2-42 ECI Telecom Ltd. Proprietary A03

61 XDM System Specifications Physical Description ECU300 Two types of ECU300 cards are available: ECU300-F supports full functionality ECU300 supports reduced functionality ECU300F The ECU300-F supports: Management interfaces: Management (LightSoft and EMS-XDM) interface (Ethernet) Ethernet hub for the connection of multiple NEs Serial (RS-232) interface for craft terminal Synchronization inputs and outputs (T3/T4) Alarm interfaces and indications, including: Alarm severity outputs (Critical, Major, Minor, Warning) External alarm outputs and inputs to client or xrap-b/xrap-100 ACO LEDs for display of operation and alarms Traffic monitoring, including: Selection and display of the traffic interface channel currently being monitored for all I/O module (I1 to I16) slots, as well as, quad I/O card (I17 and I18) slots Monitor interface for STM-1 ports Activations, including: Laser activation during ALS for maintenance purposes LEDs test for the entire shelf Hold-up capacitors A03 ECI Telecom Ltd. Proprietary 2-43

62 Physical Description XDM System Specifications ECU300 The ECU300 card is suitable for sites that do not require alarms dry-contacts, output system monitoring, and Ethernet hub for management. It supports: Management interfaces, including: Management (LightSoft and EMS-XDM) interface (Ethernet) Ethernet hub for the connection of multiple NEs Serial (RS-232) interface for craft terminal Synchronization inputs and outputs (T3/T4) Alarm interfaces and indications, including: Alarm severity outputs (Critical, Major, Minor, Warning) External alarm outputs and inputs to client or xrap-b/xrap-100 ACO LEDs for the display of operation and alarms Activations, including: Laser activation during ALS for maintenance purposes LEDs test for the entire shelf XDM-900 Card and Module Layout Basic XDM-900 Shelf The basic XDM-900 shelf is 443 mm wide, 246 mm deep and 350 mm high. When the optional TPUs or OCU are attached to the shelf, each of these expansion shelves adds 75 mm to the height of the basic shelf. The rightmost slot of the shelf houses the FCU900. The middle part of the shelf consists of the cards cage with five horizontal slots which accommodate: ECU900 or ECU900-F Two MXC900 cards (main and protect) Two ACP900 modules each in an MXC900 Up to two quad I/O cards NOTE: The slots of the quad I/O cards can be adapted to accommodate one SIM16_1 I/O module each instead of the I/O cards by using a mechanical adapter ECI Telecom Ltd. Proprietary A03

63 XDM System Specifications Physical Description The upper and lower parts of the shelf consist of a module cage with eight horizontal slots. Each module cage can house up to eight I/O (PDH, SDH, or data) single slot modules, totaling a maximum of 16 modules. Figure 2-37: XDM-900 slot allocation Expanded XDM-900 Shelf with I/O Protection In an expanded XDM-900 shelf with I/O protection, one or two TPUs are mounted on the top and/or at the bottom of the basic shelf, including a TC or TCF module and TPMs. An OCU with CWDM networking modules can be mounted on top of a basic or expanded shelf. The TPU modules are distributed as follows: Four (4) slots flexibly allocated for TPMs (single-slot or double-slot modules are supported) One (1) slot allocated for the TC or TCF module Each TPM is connected to the operating and protection modules of the XDM-900 shelf respectively. If a failure is detected in one of the operating I/O modules, the XDM-900 control system sends control signals to the appropriate TPM relays to switch traffic from the operating I/O module to the protection module. Several types of TPMs for 1:1, 1:2, or 1:3 protection schemes are supported. The TC or TCF is connected to the DC and control buses of the MX900 cards via the TPU backplane. It controls the switching of traffic from the main to protection I/O module by relays in the corresponding TPM. In addition, the TCF has four fans that provide cooling air to the modules installed in the TPU (optional) A03 ECI Telecom Ltd. Proprietary 2-45

64 Physical Description XDM System Specifications MXC900 and ECU900 Cards The MXC900 and ECU900 were designed to facilitate simple installation and maintenance. They feature: MXC900 Electrical interface connectors that are integrated into the I/O modules, saving the need for separate electrical interface modules Easy routing of external management interfaces Monitoring system for acceptance test purposes Hot insertion of cards and modules to support quick and non-traffic-affecting maintenance and repair The XDM-900 is a redundant platform, and two MXC900 cards must always be installed in slots MXC-A and MXC-B of the XDM-40 shelf. The MXC900 performs the following functions: Communications and control (by CPU): Routing and handling of 128 DCC channels Control of all shelf cards and modules Management interface Support of the 256 Mb NonVolatile compact flash Memory (NVM) card Alarms and maintenance Control of TPU/OCU shelves 5 Gbps capacity for all I/O module slots, and 20 Gbps for quad I/O card slots SDH/SONET-related functions: SDH/SONET timing and synchronization SDH/SONET cross connect 4/3/1 120 Gbps HO/LO nonblocking matrix Accommodates the ACP-900 module and provides power supply, communication, and control Support for CWDM I/O modules (transponders and combiners) in all I/O module slots DC voltage supply: One 48 VDC power input that supplies voltages for all cards and modules Input Filtering (INF) function for the entire shelf Voltage and control for Fan Control Unit (VFCU) 2-46 ECI Telecom Ltd. Proprietary A03

65 XDM System Specifications Physical Description ECU900 Two types of ECU900 cards are available: ECU900-F supports full functionality ECU900 supports reduced functionality ECU900F The ECU900F supports: Management interfaces: Management (LightSoft and EMS-XDM) interface (Ethernet) Ethernet hub for the connection of multiple NEs Serial (RS-232) interface for craft terminal Synchronization inputs and outputs (T3/T4) Alarm interfaces and indications, including: Alarm severity outputs (Critical, Major, Minor, Warning) External alarm outputs and inputs to client or xrap-100 ACO LEDs for display of operation and alarms Traffic monitoring, including: Selection and display of the traffic interface channel currently being monitored for all I/O module (I1 to I16) slots, as well as, quad I/O card (I17 and I18) slots Monitor interface for STM-1 ports Activations, including: Laser activation during ALS for maintenance purposes LEDs test for the entire shelf Hold-up capacitors A03 ECI Telecom Ltd. Proprietary 2-47

66 Physical Description XDM System Specifications ECU900 The ECU900 card is suitable for sites that do not require alarms dry-contacts, output system monitoring, and Ethernet hub for management. It supports: Management interfaces, including: Management (LightSoft and EMS-XDM) interface (Ethernet) Ethernet hub for the connection of multiple NEs Serial (RS-232) interface for craft terminal Synchronization inputs and outputs (T3/T4) Alarm interfaces and indications, including: Alarm severity outputs (Critical, Major, Minor, Warning) External alarm outputs and inputs to client or xrap-100 ACO LEDs for the display of operation and alarms Activations, including: Laser activation during ALS for maintenance purposes LEDs test for the entire shelf XDM-40 Card Layout The XDM-40 standard shelf consists of a modules cage housing DWDM and amplification modules, a cards cage housing the I/O cards and common cards, the xfcu40, and the power supply for the fan unit (PSFU). Modules cage Two (2) slots (M1 and M2) allocated to DWDM/OADM, optical booster, and accessories modules Two (2) xinf40s designed for power supply redundancy One (1) ECM to facilitate routing of external management interfaces, connecting the management, OHA, and OW interfaces to the active xmcp_b Cards cage Two (2) slots (I1 and I2) flexibly allocated to I/O optical transponders, combiners, and/or amplifiers One (1) slot (C1) allocated to the xmcp_b card One (1) slot (C3) allocated to the MECP card, for user and management interfaces PSFU and xfcu40 that consists of three separate fans to support cooling system redundancy 2-48 ECI Telecom Ltd. Proprietary A03

67 XDM System Specifications Physical Description Hot insertion of cards and modules is allowed to supports quick maintenance and repair activities without affecting traffic. Figure 2-38: XDM-40 card layout XDM-400 Card Layout The XDM-400 shelf consists of a single cage containing slots for five I/O cards, and dedicated slots for the XIO (cross-connect and I/O matrix), processor and common cards in the middle and right side of the shelf. The electrical interface connection modules are housed in two slots on the left side of the shelf. The XDM-400 cage design and mechanical practice conform to international mechanical standards and specifications. The cards are distributed as follows: Five (5) slots, IS1 to IS5, optimally allocated for I/O cards Two (2) slots, MS1 and MS2, allocated for electrical interface connection modules Two (2) slots, X1 and X2, allocated for XIO-192 cards Two (2) slots, C1 and C2, allocated for xmcp cards A03 ECI Telecom Ltd. Proprietary 2-49

68 Physical Description XDM System Specifications An external connection module, the MECP, is located above the xmcp. It connects the management, overhead access (OHA), and orderwire interfaces to the active xmcp. Figure 2-39: XDM-400 typical card layout XDM-450 Card Layout The XDM-450 shelf consists of a single cage containing slots for nine DWDM modules and dedicated slots for the processor, management and other common cards. The XDM-450 standard shelf is arranged as follows. Nine CCP slots (M1 to M9) flexibly allocated to DWDM modules such as ROADMs, Mux/DeMuxes, and amplifiers. One slot (C0) allocated to the xecm-450 card, for user and management interfaces. One slot (C1) allocated to the xmcp-b2g card. One slot for optional OSC Mux/DeMux module with integrated C/T filter (ACC4OSC5). Two xinf-450 modules designed for power supply redundancy. xfcu-450 fan unit to support cooling system redundancy ECI Telecom Ltd. Proprietary A03

69 XDM System Specifications Physical Description The XDM-450 standard card layout is illustrated in the following figure. Figure 2-40: XDM-450 slot layout XDM-500 Card Layout The XDM-500 shelf consists of a single cage containing slots for six I/O cards, four connection modules, and dedicated slots for the matrix, processor, and common cards. The XDM-500 cage design and mechanical practice conform to international mechanical standards and specifications. The cards are distributed as follows: Six (6) slots, IC1 to IC6, flexibly allocated for I/O cards and/or transponders (depending on the configuration) Four (4) slots, MC1 to MC4, allocated for electric interface connection modules or DWDM/OADM modules Two (2) slots, X1 and X2, allocated for the HLXC or XIO matrix cards Two (2) slots, C1 and C2, allocated for the xmcp cards A03 ECI Telecom Ltd. Proprietary 2-51

70 Physical Description XDM System Specifications An external connection module, the MECP, is located above the xmcp/xmcp_b cards for connecting the management, overhead access, and orderwire interfaces to the active xmcp/xmcp_b. Figure 2-41: XDM-500 standard card layout 2-52 ECI Telecom Ltd. Proprietary A03

71 XDM System Specifications Physical Description XDM-1000 Card Layout The standard XDM-1000 consists of a modules cage housing the connection modules, a cards cage housing the I/O and common cards, input filters, and fan control units. The XDM-1000 standard card layout is illustrated in XDM-1000 standard card layout (page 2-54) and is allocated as described in the following paragraphs. Modules Cage Eleven (11) slots, M1 to M11, allocated for electric interface connection modules or DWDM/OADM, optical booster, optical preamp modules Two xinfs Cards Cage Twelve (12) slots, I1 to I12, flexibly allocated for I/O cards and/or transponders (depending on the configuration) Two (2) slots, X1 and X2, allocated for the HLXC or XIO matrix cards Two (2) slots, C1 and C2, allocated for the xmcp/xmcp_b cards An external connection module, the MECP, is located in the cards cage of the XDM-1000 above the xmcp/xmcp_b cards. It is used to connect the management, overhead access, and orderwire interfaces to the active xmcp/xmcp_b card. The modules cage contains 11 double-slot connection modules. Electrical I/O cards installed in the cards cage interface with the XDM-1000 via connection modules installed in the modules cage. The modules are extractable, thus allowing a flexible assignment of physical I/O ports A03 ECI Telecom Ltd. Proprietary 2-53

72 Physical Description XDM System Specifications Optical I/O cards utilize internal slide-in I/O modules for signal interfacing and do not require connection modules in the modules cage. The free modules cage slots in optical systems can therefore be allocated to DWDM or OADM multiplexing and amplification modules. Figure 2-42: XDM-1000 standard card layout 2-54 ECI Telecom Ltd. Proprietary A03

73 XDM System Specifications Physical Description XDM-2000 Card Layout The XDM-2000 consists of a single cage whose slots can be allocated as follows: Twelve (12) slots, I1 to I12, allocated for transponders and other optical modules Two (2) slots, X1 and X2, allocated for mux/demux or matrix cards (depending on the system configuration) Two (2) slots, C1 and C2, allocated for the xmcp/xmcp_b cards The external connection module, the MECP, is located in the upper section of the cage. The cage design and mechanical practice of the XDM-2000 conform to international mechanical standards and specifications. Figure 2-43: XDM-2000 standard card layout A03 ECI Telecom Ltd. Proprietary 2-55

74 Physical Description XDM System Specifications XDM-3000 Card Layout The XDM-3000 consists of an I/O card cage arranged in four sections, together with additional power, communication, and control units, as follows: 24 slots (I1 to I24) flexibly allocated to I/O cards and/or amplifiers, depending on the configuration. I/O card options include combinations of up to 24 SIO1&4B, SIO164, DIOB, and/or MCS5/10 cards. Single channel OFA2 or OFA_M amplifiers can be used for long distance applications. Two slots (X1 and X2) allocated to HLXC1536 matrix cards. Two slots (A1 and A2) allocated to ACP3000 ASON cards. Two slots (C1 and C2) allocated to the xmcp-b2g cards. One slot (C0) allocated to the MECP card, for user and management interfaces. One ECB3000 that provides external connections for the MECP card. Two INF3000s designed for power supply redundancy. Two FCU3000 fan units with ten fans each ECI Telecom Ltd. Proprietary A03

75 XDM System Specifications Physical Description The XDM-3000 card layout is illustrated in the following figure. Figure 2-44: XDM-3000 standard card layout A03 ECI Telecom Ltd. Proprietary 2-57