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2 FEATURES AND SPEIFIATIONS Features and Benefits Accepts JEDE MO-161 modules for 100% industry compatibility Dual ejector latches for easy module removal Latches include feature to minimize micro motion Palladium Nickel with Gold flash plating for improved reliability Added contact wipe for improved reliability Optional voltage and function keying Reference Information Product Specification: Packaging: Tray UL File No.: E29179 SA File No.: LR19980A-366 Mates With: JEDE MO-161 modules Designed In: Inches Electrical Voltage: 100V urrent: 1.0A ontact Resistance: 30mΩ max. Dielectric Withstanding Voltage: 500V A Insulation Resistance: 1000 MΩ min. Mechanical Mating Force: 1.6N per pair Durability: 25 cycles min. Physical Housing and Latch: High-temperature resistant thermoplastic, UL 94V-0 ontact: Phosphor Bronze Plating: Selective Palladium Nickel with Gold flash with Tin/Lead on solder tails Operating Temperature: -40 to mm (.050") Pitch DIMM 4-Byte Socket Vertical, Multi-Key Plastic Peg Version Sockets and Edge onnectors ATALOG DRAWING (FOR REFERENE ONLY) L FUNTION KEY VOLTAGE KEY ORDERING INFORMATION ircuits Order No. Description Function Key Voltage Key Unbuffered 3.3V Detail X Detail Y L-16 MX01

3 PRODUT SPEIFIATION TABLE OF ONTENTS 1.0 SOPE 2.0 PRODUT DESRIPTION 3.0 APPLIABLE DOUMENTS AND SPEIFIATIONS 4.0 RATINGS 5.0 PERFORMANE 5.1 ELETRIAL PERFORMANE 5.2 MEHANIAL PERFORMANE 5.3 ENVIRONMENTAL PERFORMANE 6.0 TEST SEQUENES AND QUALIFIATION REQUIREMENTS 7.0 PAKAGING 8.0 GAGES, FIXTURES AND SHEMATIS REV SHT REVISE ON P ONLY Add series & mod. module ripout. EN UDT , dmorgan 01/10/ mm (.050 IN.) PITH DUAL IN-LINE MEMORY MODULE ONNETOR THIS DOUMENT ONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX IN. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REV DESRIPTION DESIGN ONTROL STATUS WRITTEN BY: HEKED BY: APPROVED BY: DATE: YR / MO / DAY LISLE M DB 95 / 08 / 08 DOUMENT NO. DIMENSION LASS: SHT NO. RITIAL = 0 MAJOR = 0 PS71243.SAM 1 OF 17 ES REV. A 3 95/MAR/10 E U DBRD03.SAM

4 PRODUT SPEIFIATION 1.0 SOPE This specification covers the 1.27mm (.050 inch) centerline DIMM socket board to board interconnect for 1.27+/-0.10 (.050+/-.004 in.) thick memory modules. 2.0 PRODUT DESRIPTION 2.1 PRODUT NAME AND PART NUMBER Product Name Dual In-Line Memory Module (DIMM) Series Numbers 71243, 71251, 71481, 71729, 71736, 73705, 73817, 73818, 73822, 74080, 74081, Series. 2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS See the appropriate Sales Drawings for information on dimensions, materials, platings and markings, recommended module outlines and footprint patterns. 2.3 UL/SA ERTIFIATION UL file: E29179 SA file: LR-19980A APPLIABLE DOUMENTS AND SPEIFIATIONS See the Sales Drawings and the other sections of this Specification for the necessary referenced Documents and Specifications. 4.0 RATINGS 4.1 VOLTAGE 100 Volts A (RMS)/D 4.2 URRENT 1.0 Amps 4.3 TEMPERATURE Operating: - 40 to + 85 Nonoperating: - 55 to + 85 REVISE ON P ONLY SEE mm (.050 IN.) PITH DUAL IN-LINE MEMORY MODULE ONNETOR THIS DOUMENT ONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX IN. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REV DESRIPTION DOUMENT NO. DIMENSION LASS: RITIAL = 0 MAJOR = 0 PS71243.SAM ES REV. A 4 95/MAR/10 E U DBRD03.SAM 2

5 PRODUT SPEIFIATION 5.0 PERFORMANE 5.1 ELETRIAL PERFORMANE Item ontact Resistance (Low Level) Insulation Resistance Dielectric Withstanding Voltage apacitance Test ondition Mate onnectors with a maximum voltage of 20mV and a current of 100 ma. (Measurement Locations in Section 8.3) Mate onnectors with a voltage of 500 VD between adjacent terminals and between terminals and ground. Mate onnectors with a voltage of 500 VA for 1 minimum between adjacent terminals and between terminals and ground. Measure between adjacent terminals at 1 MHz. (Loaded: 50 ohms impedence) No breakdown Requirement 30 milliohm Maximum Initial 1000 Megohms Minimum Loaded: 2 picofarad maximum. Unloaded: 0.5 picofarad maximum. REVISE ON P ONLY SEE mm (.050 IN.) PITH DUAL IN-LINE MEMORY MODULE ONNETOR THIS DOUMENT ONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX IN. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REV DESRIPTION DOUMENT NO. DIMENSION LASS: RITIAL = 0 MAJOR = 0 PS71243.SAM ES REV. A 4 95/MAR/10 E U DBRD03.SAM 3

6 PRODUT SPEIFIATION 5.1 ELETRIAL PERFORMANE ONTINUED haracteristics: Loaded condition (Module inserted) PARAMETER apacitance(pf) Inductance(nH) Propagation Delay (psec) Risetime Degradation (psec) Bandwidth (GHz) Impedance 45 psec % rosstalk (1v/1ns) 1 Drive 4 Drives 7 Drives 1:1 S:G Average N.E. 0.33% 0.90% 1.10% onfiguration Range nominal nominal nominal NA NA nominal F.E % -0.82% -0.92% 3:1 S:G Average N.E. 1.26% 3.33% 4.57% onfiguration Range NA NA nominal F.E % -2.35% -3.50% haracteristics: Unloaded condition. 1:1 S:G onfiguration 3:1 S:G onfiguration PARAMETER apacitance (pf) Average 0.36 Range nominal Average 0.34 Range Note: All data is based on analytical analysis. ontact Molex Inc. orporate Headquarters for Spice model and additional information.. REVISE ON P ONLY SEE mm (.050 IN.) PITH DUAL IN-LINE MEMORY MODULE ONNETOR THIS DOUMENT ONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX IN. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REV DESRIPTION DOUMENT NO. DIMENSION LASS: RITIAL = 0 MAJOR = 0 PS71243.SAM ES REV. A 4 95/MAR/10 E U DBRD03.SAM 4

7 PRODUT SPEIFIATION 5.2 MEHANIAL PERFORMANE Item Test ondition Total Insert and withdraw a steel blade at a rate of Insertion and Withdrawal 25 +/- 6mm (1+/- 1/4 inch) per minute. Force (excl. latches) Latches shall be excluded in the test. (Gage dimensions in Section 8.1) Total Insertion Force ( w/ latches) Terminal Retention Force in Housing Durability Vibration Mil-Std-1344 Method ondition I Mechanical Shock Mil-Std-1344 Method ondition A Latch Overstress Force Latch Actuation Force Normal Force Insert a nominal thick PB w/o chamfer at a rate of 25 +/- 6mm (1+/- 1/4 inch) per minute. Latches shall be included in the test. Axial pullout force on the terminal in the housing at a rate of 25 +/- 6mm (1 +/- 1/4 inch) per minute. Mate connectors up to 25 cycles at a maxiumum rate of 10 cycles per minute prior to defined Environmental Tests. Amplitude: 1.50mm (.060 inch) peak to peak Sweep: Hz in one minute Duration: 2 hours in each X-Y-Z axis. (Test module shall be per Section 8.2) 50 g s with three 1/2 sine waveform shocks in each X-Y-Z axis. (Test module shall be per Section 8.2) Apply an actuation force on the latch at a rate of 25 +/- 6mm (1 +/- 1/4 inch) per minute in the fully open position and hold for 10 sec. Apply an actuation force on the latch at a rate of 25 +/- 6mm (1 +/- 1/4 inch) per minute with recommended test module inserted into connector. Apply a perpendicular force at a rate of 25+/- 6mm (1 +/- 1/4 inch) per minute on the contacts in a manner simulating actual use. Requirement Insertion force shall be 0.78 N (2.8 oz) maximum with maximum blade, and withdrawal 0.07 N (0.25 oz) min imum. with minimum. blade per contact respectively x the total contact population Maximum Insertion force shall be 0.83 N (3.3 oz) max. per contact respectively x the total contact population ontact : 4.45 N (1.0 lbs.) minimum Forklock : N. (5.0 lbs) minimum. ontact Resistance : 10 milliohms Maximum hange from Initial ontact Resistance: 10 milliohms Maximum hange from Initial Discontinuity: not greater than one microsecond ontact Resistance: 10 milliohms Maximum hange from Initial Discontinuity: not greater than one microsecond N (15 lbs) minimum. force held for 10 sec., no damage. The force to fully actuate the latch open shall be N (10 lbs) maximum per latch N (50 grams) minimum end of life. REVISE ON P ONLY SEE mm (.050 IN.) PITH DUAL IN-LINE MEMORY MODULE ONNETOR THIS DOUMENT ONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX IN. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REV DESRIPTION DOUMENT NO. DIMENSION LASS: RITIAL = 0 MAJOR = 0 PS71243.SAM ES REV. A 4 95/MAR/10 E U DBRD03.SAM 5

8 PRODUT SPEIFIATION 5.2 MEHANIAL PERFORMANE ONTINUED Item Module Ripout Force Test ondition Pull up from the center of the module with the latches closed at a rate of 25 +/- 6mm (1 +/- ¼ inch) per minute. Requirement The module ripout forces is N (20 lbs) minimum for a DIMM connector that has a tall or short latch at both ends. See figures above. The module ripout forces is N (8 lbs) minimum for a DIMM connector that has a DRO latch at both ends, and the tower options that have only one tall or short latch and a tower at the other end. See REVISE ON P ONLY SEE mm (.050 IN.) PITH DUAL IN-LINE MEMORY MODULE ONNETOR THIS DOUMENT ONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX IN. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REV DESRIPTION DOUMENT NO. DIMENSION LASS: RITIAL = 0 MAJOR = 0 PS71243.SAM ES REV. A 4 95/MAR/10 E U DBRD03.SAM 6

9 PRODUT SPEIFIATION 5.2 MEHANIAL PERFORMANE ONTINUED Item Normal Force Retention of connector to PB Insertion force of connector into PB Durability of marking Test ondition Apply a perpendicular force at a rate of 25+/- 6mm (1+/- ¼ inch per minute on the contacts in a manner simulating actual use. Pull connector out of max. recommended diameter holes. PB: 1.57+/-0.18 mm (.062+/-.007 inch) thick. Rate: 25.4+/-6 mm (1.0+/-1/4 inch) per minute. Push connector into min. recommended diameter holes. PB: 1.57+/-0.18 mm (.062+/-.007 inch) thick. Rate: 25.4+/-6mm (1.0+/-1/4inch) per minute. Brush connector per Mil-Std-202, Method 215 with isopropyl alchohol solution. Requirement 0.49 N (50 grams) minimum end of life. The connector shall not lift off the PB when pulling up either end with a force of 4.45 N (1.0 lbs) minimum N (5 lbs) max. Plastic peg: N (10.0 lbs.) per peg maximum. Metal forklock: N (6.0 lbs) per peg maximum. No degradation of the marking 5.3 ENVIROMENTAL PERFORMANE Item Thermal Shock Mil-Std-202F Method 107 E Thermal Aging Mil-Std-202F Method 108 Humidity (Steady State) Mil-Std-202F Method 103 Test ondition Mate connectors exposed to 5 cycles of: Temperature Duration (Min) / /-10 5 Max / /-10 5 Max Mated connector exposed to 240+/-10 hrs. at 85+/- 3 o Mated connectors exposed to a temperature of : 50 +/- 2 with a Relative of 80+/-3% for 300 hours. Remove surface moisture and air dry for 24 hours prior to measurements. Requirement Appearance: No Damage ontact Resistance: 10 milliohms maximum change from initial Appearance: No Damage ontact Resistance: 10 milliohms maximum change from initial Appearance: No Damage ontact Resistance: 10 milliohms maximum change from initial. Dielectric Withstanding Voltage: No Breakdown Insulation Resistance: 1000 Megohms Minimum REVISE ON P ONLY SEE mm (.050 IN.) PITH DUAL IN-LINE MEMORY MODULE ONNETOR THIS DOUMENT ONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX IN. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REV DESRIPTION DOUMENT NO. DIMENSION LASS: RITIAL = 0 MAJOR = 0 PS71243.SAM ES REV. A 4 95/MAR/10 E U DBRD03.SAM 7

10 PRODUT SPEIFIATION 5.3 ENVIROMENTAL PERFORMANE ONTINUED Item Temperature ycling Temperature Rise Solderability Molex SMES-152 IR Process Flowing Mixed Gas (FMG) Resistance to Solder Heats Test ondition Mated connectors exposed for 335 cycles Relative Humidity uncontrolled with a temperature transition of 10 per minute. Temperature Duration (Min) +0 +/ /-3 15 Allow to air dry for 24 hours prior to measurements. Mate the connectors, series 4 contacts and measure the temperature rise at the rated current after 4 hours. (Schematic per Section 8.3) Steam age 1 hr. Solder time 5 +/- 0.5 seconds. Solder temperature: 245 +/- 5 Nonactivated flux. Exposure: Molex IR Profile per Section 8.4 Battelle lass II, 10 ppm l 2, 10 ppm H2S, 100 ppm NO2, 70+/-1% R.H., 25 deg FM. 10 days mated and 7 days unmated exposure. Solder Time 3 +/- 0.5 seconds Solder Temperature: 260 +/- 5 Immerse leads to a depth of 1.57mm (.062 in.) from connector body. Requirement Appearance: No Damage ontact Resistance: 10 milliohms maximum change from initial. Dielectric Withstanding Voltage: No Breakdown Insulation Resistance: 1000 Megohms Minimum Maximum Temperature Rise: 30 above ambient 95% of the immersed area must show no voids, pin holes Appearance: No damage, blistering or solder bridging. Dimensional: onformance to Sales Drawing requirements ontact Resistance: 10 milliohms Maximum change from Initial Appearance: No damage or discoloration of connector materials. REVISE ON P ONLY SEE mm (.050 IN.) PITH DUAL IN-LINE MEMORY MODULE ONNETOR THIS DOUMENT ONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX IN. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REV DESRIPTION DOUMENT NO. DIMENSION LASS: RITIAL = 0 MAJOR = 0 PS71243.SAM ES REV. A 4 95/MAR/10 E U DBRD03.SAM 8

11 PRODUT SPEIFIATION Group I Mated Enviromental 1/2 samples Initial ontact Resistance Ia - 1/2 samples 2 mate/unmates 2 mate/unmates ontact Resistance ontact Resistance Thermal Age Mil-Std-202F, Method 108 Thermal Shock Mil-Std-202F, Method 107E ontact Resistance ontact Resistance Disturbance Thermal ycling 335 cycles 0-75 ontact Resistance ontact Resistance 2 mate/ unmate Disturbance ontact Resistance ontact Resistance 2 mate/ unmate ontact Resistance 6.0 TEST SEQUENE AND QUALIFIATION Note: Disturbance consists of a 10 degree rotation of the module in the connector. REVISE ON P ONLY SEE mm (.050 IN.) PITH DUAL IN-LINE MEMORY MODULE ONNETOR THIS DOUMENT ONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX IN. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REV DESRIPTION DOUMENT NO. DIMENSION LASS: RITIAL = 0 MAJOR = 0 PS71243.SAM ES REV. A 4 95/MAR/10 E U DBRD03.SAM 9

12 PRODUT SPEIFIATION Group II Enviromental IIa 1/2 Unmated onnectors (Do not expose modules) 1/2 Mated Initial ontact Resistance 7 days FMG lass II unmated Initial ontact Resistance 25 mate/unmate cycles 1 mate ontact Resistance 3 mate/unmates ontact Resistance ontact Resistance 10 days FMG lass II mated ontact Resistance 1 mate / unmate cycle ontact Resistance REVISE ON P ONLY SEE mm (.050 IN.) PITH DUAL IN-LINE MEMORY MODULE ONNETOR THIS DOUMENT ONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX IN. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REV DESRIPTION DOUMENT NO. DIMENSION LASS: RITIAL = 0 MAJOR = 0 PS71243.SAM ES REV. A 4 95/MAR/10 E U DBRD03.SAM 10

13 PRODUT SPEIFIATION Group III Mated Mechanical 1/2 samples Initial ontact Resistance IIIa - 1/2 samples 24 Mate/Unmate cycles 4 Mate/Unmate ycles ontact Resistance ontact Resistance Mechanical Shock Mil-Std-1344, Method , ondition A Vibration Mil-Std-1344 Method ondition I ontact Resistance ontact Resistance REVISE ON P ONLY SEE mm (.050 IN.) PITH DUAL IN-LINE MEMORY MODULE ONNETOR THIS DOUMENT ONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX IN. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REV DESRIPTION DOUMENT NO. DIMENSION LASS: RITIAL = 0 MAJOR = 0 PS71243.SAM ES REV. A 4 95/MAR/10 E U DBRD03.SAM 11

14 PRODUT SPEIFIATION Group IV mated Enviromental Initial ontact Resistance 2 Mate/Unmate ycles ontact Resistance Steady State Humidity Mil-Std-202F, Method 103 ontact Resistance Disturbance ontact Resistance 2 Mate/Unmate ycle ontact Resistance Group V Other Enviromental Temp Rise Solderability Solder Resistance IR compatability Note: Disturbance consists of a 10 degree rotation of the module in the connector. REVISE ON P ONLY SEE mm (.050 IN.) PITH DUAL IN-LINE MEMORY MODULE ONNETOR THIS DOUMENT ONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX IN. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REV DESRIPTION DOUMENT NO. DIMENSION LASS: RITIAL = 0 MAJOR = 0 PS71243.SAM ES REV. A 4 95/MAR/10 E U DBRD03.SAM 12

15 PRODUT SPEIFIATION Group VI - Mechanical V1a onnector Mate/Unmate Forces (1,2,5,25 cycles) VIc Latch Actuation Force VId onnector Insertion and Retention to PB VIb Normal Forces Module Ripout Force ontact Retention Durability of Marking Measure Initial Gaps Latch Overstress Force 5 Mate/Unmates Measure Gaps 85 / 240hrs Thermal Aging Measure Gaps Derive Normal Forces use spring rate and gap REVISE ON P ONLY SEE mm (.050 IN.) PITH DUAL IN-LINE MEMORY MODULE ONNETOR THIS DOUMENT ONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX IN. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REV DESRIPTION DOUMENT NO. DIMENSION LASS: RITIAL = 0 MAJOR = 0 PS71243.SAM ES REV. A 4 95/MAR/10 E U DBRD03.SAM 13

16 PRODUT SPEIFIATION 6.1 QUALIFIATION REQUIREMENTS Samples shall be taken from approved production processes A minimum of 1000 contact points and 5 connectors per group shall be tested typically from the smallest and largest circuit size Acceptance criteria shall be as defined in the applicable test requirement in sections PAKAGING 7.1 METHOD Product shall be packaged in trays per the packaging specification as called out on the applicable assembly print. 7.2 REQUIREMENTS Packaging shall meet the requirements and be tested per Molex specification PK GAGES, FIXTURES AND SHEMATIS 8.1 ontact Insertion and Withdrawal Blades REVISE ON P ONLY SEE mm (.050 IN.) PITH DUAL IN-LINE MEMORY MODULE ONNETOR THIS DOUMENT ONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX IN. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REV DESRIPTION DOUMENT NO. DIMENSION LASS: RITIAL = 0 MAJOR = 0 PS71243.SAM ES REV. A 4 95/MAR/10 E U DBRD03.SAM 14

17 PRODUT SPEIFIATION IRUIT SIZE JEDE MODULE OUTLINE MO-172 MO-167 NA NA NA MO-161 MO-172 "A" mm(in.) 21.91(.863) 24.45(.963) 25.72(1.013) 26.99(1.063) 29.53(2.325) 30.80(1.213) 35.88(1.413) "B" mm(in.) 48.89(1.925) 48.90(1.925) 51.44(2.025) 53.98(2.125) 59.06(2.325) 61.60(2.425) 76.83(3.025) "" mm(in.) 21.97(.865) 21.97(.865) 21.97(.865) 21.97(.865) 21.97(.865) 21.97(.865) 21.97(.865) "D" mm(in.) 38.10(1.5) 25.40(1.0) 25.40(1.0) 25.40(1.0) 25.40(1.0) 38.10(1.5) 38.10(1.5) SOJ WEIGHT (gm+/-10%) SHOK VIBRATION TEST (weighted) TEST (unweighted) Shock and Vibration Test Modules Notes 1. Item 1 (weights) shall be epoxied to recommended module test board. Material shall be aluminum. 2. Total weight of finished test module shall be per the table. REVISE ON P ONLY SEE mm (.050 IN.) PITH DUAL IN-LINE MEMORY MODULE ONNETOR THIS DOUMENT ONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX IN. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REV DESRIPTION DOUMENT NO. DIMENSION LASS: RITIAL = 0 MAJOR = 0 PS71243.SAM ES REV. A 4 95/MAR/10 E U DBRD03.SAM 15

18 PRODUT SPEIFIATION 8.3 ontact Reistance and Temperature Rise Set-up. REVISE ON P ONLY SEE mm (.050 IN.) PITH DUAL IN-LINE MEMORY MODULE ONNETOR THIS DOUMENT ONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX IN. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REV DESRIPTION DOUMENT NO. DIMENSION LASS: RITIAL = 0 MAJOR = 0 PS71243.SAM ES REV. A 4 95/MAR/10 E U DBRD03.SAM 16

19 PRODUT SPEIFIATION 8.4 Reflow Solder Profile /s ool in Still Air 45 s Max. 90 s Max. 30 s Preheating Soldering ooling NOTES: 1. Reflow solder Preheat at 3 /s to Reflow at 240 using 60/40 solder for 30 s per figure. 3. omponent must withstand (2) reflow solder cycles with a cool down between. REVISE ON P ONLY SEE mm (.050 IN.) PITH DUAL IN-LINE MEMORY MODULE ONNETOR THIS DOUMENT ONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX IN. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REV DESRIPTION DOUMENT NO. DIMENSION LASS: RITIAL = 0 MAJOR = 0 PS71243.SAM ES REV. A 4 95/MAR/10 E U DBRD03.SAM 17

PRODUCT SPECIFICATION

1.0 SCOPE DDR4 DIMM SOCKET This Product Specification covers the 0.85mm centerline gold plated DDR4 DIMM edge card connector for 1.40 ± 0.10 thick memory modules..0 PRODUCT DESCRIPTION.1 PRODUCT NAME AND