R1511x Series. 300mA 36V Input Regulator OUTLINE FEATURES APPLICATIONS NO.EA

Transcription

1 Rx ma V Input Regulator NO.EA-- OUTLINE The Rx are CMOS-based high-voltage resistant and fast response voltage regulators that provide the minimum ma of output current. Internally, Rx consists of an Output Short-circuit Protection Circuit, an Over-current Protection Circuit, and a Thermal Shutdown Circuit in addition to the basic regulator circuits. The operating temperature range is between ºC to +ºC, and the maximum input voltage is V. All these features allow the Rx to become an ideal power source of electric home appliances. Rx is available in B version (RxxxxB) with the fixed output voltage type, and C version (RxC) with adjustable output voltage type with external resistors. The output voltage accuracy is ±.%. Rx is available in two types of packages: HSOP-J for high-density mounting and TO---P for high wattage. FEATURES Input Voltage Range.V to V Supply Current Typ. µa Supply Current (Standby Mode) Typ..µA (RxxxxB) Range RxxxxB:.V to 9.V (.V step) (For other voltages, please refer to MARK INFORMATIONS.) RxxxxC:.V to.v Accuracy RxxxxB: ±.% (Ta= C) Feed Back Voltage RxxxxC:.V ±.% (Ta= C) Temperature-Drift Coefficient Typ. ±ppm/ C Line Regulation Typ..%/V (=+.V to V) Dropout Voltage Typ..V (IOUT=mA, =.V) Package Option HSOP-J, TO---P Built-in Output Short-circuit Protection Circuit Typ. ma Built-in Over-current Protection Circuit Typ. ma Built-in Thermal Shutdown Circuit Thermal Shutdown Temperature: Typ. C Operating Temperature Range - to + C Ripple Rejection Typ. db (khz) Ceramic capacitors are recommended to be used with this IC CIN=.μF or more, =.μf or more APPLICATIONS For home electrical appliances: refrigerators, rice cookers, electrical pots, etc. For digital equipments: laptop PCs, digital TVs, telephone equipments, home LAN systems, etc. For OA equipments: copy machines, printers, fax machines, scanners, projectors, etc.

2 Rx BLOCK DIAGRAMS RxxxxB RxC Thermal Shutdown Current Limit Thermal Shutdown Current Limit VFB ON/OFF Circuit Vref Vref CE SELECTION GUIDE The output voltage, version and the package type for the ICs can be selected at the user s request. Product Name Package Quantity per Reel Pb Free Halogen Free RSxxx -E-FE HSOP-J,pcs Yes Yes RJxxx -T-FE TO---P,pcs Yes Yes xxx : Specify the output setting voltage (V SET ) RxxxxB: Specify the output voltage within the range of.v () to 9.V (9) in.v steps. (For other voltages, please refer to MARK INFORMATIONS.) RxC: only () : Specify the version (B) Fixed output and Built-in Chip Enable ( H active) (C) Adjustable output

3 Rx PIN CONFIGHURATIONS HSOP-J TO---P PIN DESCRIPTIONS RS:HSOP-J Pin No. Symbol Description Input Pin * Ground Pin * Ground Pin CE RSxxxB Chip Enable Pin ( H Active) VFB RSC Feed Back Pin * Ground Pin Output Pin *) No., No. and No. pins must be wired to the plane when they are mounted on board. RJ:TO---P Pin No. Symbol Description Input Pin * Ground Pin * Ground Pin CE RJxxxB Chip Enable Pin ( H Active) VFB RJC Feed Back Pin Output Pin *) No. and No. pins must be wired to the plane when they are mounted on board.

4 PIN EQIVALENT CIRCUIT DIAGRAMS < Pin> <CE Pin (RxxxxB)> <VFB Pin (RxC)> Rx Driver CE VFB ABSOLUTE MAXIMUM RATINGS Symbol Item Rating Unit VIN Input Voltage -. to V VIN Peak Input Voltage V VCE Input Voltage (CE Pin) -. to V VFB Input Voltage (VFB Pin) -. to V -. to V IN +. V PD Power Dissipation HSOP-J 7 (Standard Test Land Pattern) TO---P 9 mw Tj Operating Junction Temperature Range - to + C Tstg Storage Temperature Range - to + C ) Duration time: ms ) For Power Dissipation, please refer to next page to be described. ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages and may degrade the lifetime and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings are not assured. RECOMMENDED OPERATING CONDITIONS Symbol Item Rating Unit Ta Operating Temperature Range - to + C RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS) All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions.

5 Rx Power Dissipation (HSOP-J) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions High Wattage Land Pattern Standard Land Pattern Environment Mounting on Board (Wind velocity=m/s) Mounting on Board (Wind velocity=m/s) Board Material Glass cloth epoxy plastic (Double-sided) Glass cloth epoxy plastic (Double-sided) Board Dimensions mm * mm *.mm mm * mm *.mm Copper Ratio 9% % Through-hole φ.mm * pcs φ.mm * pcs Measurement Result High Wattage Land Pattern Standard Land Pattern Free Air Power Dissipation mw 7mW mw Thermal Resistance C/W 9 C/W C/W (Ta= C) Power Dissipation PD (mw) 7 On Board (High Wattage Land Pattern) On Board (Standard Land Pattern) 7 Ta ( C) Power Dissipation 単体宙吊り Free Air 9 High Wattage Measurement Board Pattern Standard IC Mount Area Unit: mm

6 Rx Power Dissipation (TO---P) This specification is at mounted on board. Power Dissipation (P D ) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement conditions Standard Land Pattern High Wattage Land Pattern Environment Mounting on board (Wind velocity m/s) Mounting on board (Wind velocity m/s) Board Material Glass cloth epoxy plastic Glass cloth epoxy plastic (Double-layers) (Four-layers) Board Dimensions mm * mm *.mm 7.mm *.mm *.mm Copper Ratio Top side: Approx. %, Top, Back side: Approx. 9%, Back side: Approx. % nd, rd: % Through - hole φ.mm * pcs φ.mm * pcs Measurement Results Standard Land Pattern High Wattage Land Pattern Power Dissipation 9mW mw Thermal Resistance θja=(- C)/.9W= C/W θja= (- C)/.W = C/W θjc= 7 C/W θjc= 7 C/W (Ta= C) 7. On Board (High W attage Land Pattern) Power Dissipation PD (mw) 9 On Board (Standard Land Pattern). Standard 7 Ta ( C) Power Dissipation IC Mount Area Unit: mm High Wattage IC Mount Area Unit: mm

7 ELECTRICAL CHARACTERISTICS CIN=.μF, =.μf, unless otherwise noted. The specification surrounded by are guaranteed by design engeneering at - C Ta + C. RxxxxB Rx (Ta= C) Symbol Item Conditions Min. Typ. Max. Unit VIN Input Voltage. V ISS Supply Current VIN=VSET+.V, IOUT=mA μa Istandby Standby Current VIN=V, VCE=V.. μa Δ /ΔIOUT Δ /ΔVIN Load Regulation VIN=VSET+.V Ta= C.99. IOUT=mA C Ta + C.9. VIN=VSET+.V VSET.V - ma IOUT ma.v<vset - Line Regulation VSET+.V VIN V, IOUT=mA.. %/V VDIF Dropout Voltage IOUT=mA Δ /ΔTa Temperature Coefficient VIN=VSET+.V, IOUT=mA C Ta + C.V VSET.V.9..V<VSET.V.9..V<VSET.V...V<VSET.V.79..V<VSET.9V.7..9V<VSET.7V...7V<VSET.V.9.9.V<VSET.V...V<VSET 9.V.7.7 ILIM Output Current Limit VIN=VSET+.V ma ISC Short Current Limit =V ma RR Ripple Rejection f=khz, Ripple=.Vpp IOUT=mA, VIN=VSET+.V db VCEH CE Input Voltage H. V VCEL CE Input Voltage L. V IPD TTSD TTSR CE Pull-down Current Thermal Shutdown Temparature Thermal Shutdown Released Temperature ± VCE=.V.. VCE=V.. Junction Temperature C Junction Temperature C V mv V ppm / C μa All test items listed under Electrical Characteristics are done under the pulse load condition (Tj Ta=ºC) except for Ripple Rejection and Temperature Coefficient. 7

8 Rx CIN=.μF, =.μf, =VFB, unless otherwise noted. The specification surrounded by are guaranteed by design engeneering at - C Ta + C. RxC (Ta= C) Symbol Item Conditions Min. Typ. Max. Unit VIN Input Voltage. V ISS Supply Current VIN=.V, IOUT=mA μa VIN=.V Ta= C.97. IOUT=mA C Ta + C.9. V Δ /ΔIOUT Δ /ΔVIN Load Regulation Line Regulation VIN=.V ma IOUT ma VSET+.V VIN V IOUT=mA - mv.. %/V VDIF Dropout Voltage IOUT=mA.9. V Δ /ΔTa Temperature Coefficient VIN=VSET+.V, IOUT=mA C Ta + C ILIM Output Current Limit VIN= VSET+.V ma ISC Short Current Limit =V ma RR Ripple Rejection f=khz, Ripple=.Vpp IOUT=mA, VIN=VSET+.V db RFB VFB Pin Resistanse.. MΩ TTSD TTSR Thermal Shutdown Temparature Thermal Shutdown Released Temperature ± Junction Temperature C Junction Temperature C All test items listed under Electrical Characteristics are done under the pulse load condition (Tj Ta=ºC) except for Ripple Rejection and Temperature Coefficient. ppm / C

9 Rx TYPICAL APPLICATIONS CIN RxxxxB CIN RxC R CE RFB VFB R CIN=Ceramic.μF =Ceramic.μF CIN=Ceramic.μF =Ceramic.μF NOTES CONCERNING EXTERNAL PARTS Phase Compensation In the Rx, phase compensation is provided to secure stable operation even when the load current is varied. For this purpose, please make sure to use a capacitor. In case of using a tantalum type capacitor and the ESR (Equivalent Resistance) value of the capacitor is large, the output might be unstable. Evaluate the circuit including consideration of frequency characteristics. Depending on the capacitor size, manufacturer, and part number, the bias characteristics and temperature characteristics are different. Evaluate the circuit taking actual characteristics into account. PCB Layout and Wiring Ensure the and lines are sufficiently robust. If their impedance is too high, noise pickup or unstable operation may result. Connect a CIN capacitor with.µf or more value between the and pins, and as close as possible to the pins. Likewise, connect a capacitor with suitable values between the and pins, and as close as possible to the pins (Please refer to the Typical Application above). In the case of using HSOP-J package, please make sure to wire No., No., and No. pins to the plane. Also, in the case of using TO---P package, please make sure to wire No. and No. pins to the plane. Thermal Shutdown Rx contains a thermal shutdown circuit, which stops regulator operation if the junction temperature of Rx becomes higher than ºC (Typ.). Additionally, if the junction temperature after the regulator being stopped decreases to a level below ºC (Typ.), it restarts regulator operation. As a result the operation of the thermal shutdown circuit causes the regulator repeatedly to turn off and on until the causes of overheating are removed. As a consequence a pulse shaped output voltage occurs. Setting Method (RxC) RxC can be adjusted the output voltage up to.v by using the external divider resistors. The output voltage can be calculated by the following equation. =VFB (R+R)/R However, output voltage will be as large as R IFB by the current flowing through the resistor in the IC. Because IFB = VFB/RFB, R IFB cause of error is as follows. R IFB=R VFB/RFB=VFB R/RFB For better accuracy, choosing R<<RFB reduces this error. RFB of Rx is approximately min.mω (guaranteed by design). 9

10 Rx TEST CIRCUITS. CIN RxxxxB A CIN RxxxxB CE IOUT CE CIN=Ceramic.μF, =Ceramic.μF RxxxxB Basic Test Circuit CIN=Ceramic.μF, =Ceramic.μF RxxxxB Test Circuit for Supply Current P.G. RxxxxB CIN RxxxxB CE IOUT CE P.G. IOUT =Ceramic.μF RxxxxB Test Circuit for Ripple Rejection and Regulator Input Transient Response CIN=Ceramic.μF, =Ceramic.μF RxxxxB Test Circuit for CE Start-up CIN RxxxxB CIN RxC CE I I VFB IOUT CIN=Ceramic.μF, =Ceramic.μF RxxxxB Test Circuit for Load Transient Response CIN=Ceramic.μF, =Ceramic.μF RxC Basic Test Circuit A CIN RxC RxC R=kΩ VFB VFB R=kΩ CIN=Ceramic.μF, =Ceramic.μF RxC Test Circuit for Supply Current RxC Case of output voltage adjustment by external resistors

11 Rx TYPICAL CHARACTERISTICS () Vs. Output Current (Ta=ºC) RxB RxB VIN=.V.V.V VIN=.V.V.V.. Rx9B RxC 9 7 VIN=9.V.V.V VIN=.V.V.V R=kΩ R=kΩ (=V) ) Vs. Input Voltage (Ta=ºC) RxB RxB IOUT=mA ma ma ma IOUT=mA ma ma ma

12 Rx 9 7 Rx9B IOUT=mA ma ma ma 7 9 RxC..... IOUT=mA. ma ma. ma ) Supply Current Vs. Input Voltage RxB RxB Supply Current Iss (μa) Ta=- C C C Supply Current Iss (μa) Ta=- C C C Rx9B RxC Supply Current Iss (μa) Ta=- C C C Supply Current Iss (μa) Ta=- C C C

13 Rx ) Vs. Ambient Temperature RxB RxB VIN =.V IOUT =ma VIN = 7.V IOUT =ma Ta ( C) Ta ( C) Rx9B RxC VIN =.V IOUT =ma R=kΩ R=kΩ (=V) VIN =.V IOUT =ma Ta ( C) Ta ( C) ) Dropout Voltage Vs. Output Current RxB/RxC RxB Dropout Voltage VDIF (V) Ta=- C C C Dropout Voltage VDIF (V) Ta=- C C C..

14 Rx Rx9B ) Dropout Voltage Vs. Setting Voltage (Ta=ºC) Dropout Voltage VDIF (V) Ta=- C C C Dropout Voltage VDIF (V) IOUT=mA ma ma ma 7 9 Output Setting Voltage VSET (V) 7) Ripple Rejection Vs. Input Bias Voltage (Ta= C, Ripple=.Vpp) RxB/RxC (IOUT=mA) RxB/RxC (IOUT=mA) Ripple Rejection Ratio RR (db) 7 f=hz khz khz khz 7 Ripple Rejection Ratio RR (db) 7 f=hz khz khz khz 7 RxB (IOUT=mA) RxB (IOUT=mA) Ripple Rejection Ratio RR (db) 7 f=hz khz khz khz 7 9 Ripple Rejection Ratio RR (db) 7 f=hz khz khz khz 7 9

15 Rx Rx9B (IOUT=mA) Rx9B (IOUT=mA) Ripple Rejection Ratio RR (db) 7 f=hz khz khz khz Ripple Rejection Ratio RR (db) 7 f=hz khz khz khz 9 9 ) Ripple Rejection Vs. Frequency (Ta= C, Ripple=.Vpp) RxB/RxC RxB Ripple Rejection Ratio RR (db) 7 IOUT=mA ma ma VIN = V Ripple Rejection Ratio RR (db) 7 IOUT=mA ma ma VIN = 7V Frequency (khz) Frequency (khz) Rx9B Ripple Rejection Ratio RR (db) 7 IOUT=mA ma ma VIN = V Frequency (khz)

16 Rx ) Input Transient Response (Ta= C) RxB RxB Input Voltage tr=tf=μs IOUT=mA ma Input Voltage tr=tf=μs ma IOUT=mA Rx9B Input Voltage tr=tf=μs IOUT=mA ma ) Load Transient Response (Ta= C) RxB RxB.. ma Vin=V.. ma Vin=7V Vout (V) Output Current tr=tf=.μs ma Output Current Iout (ma) Vout (V) Output Current tr=tf=.μs ma Output Current Iout (ma). -. -

17 Rx Rx9B ma Vin=V Vout (V) Output Current tr=tf=.μs ma Output Current Iout (ma).9. - ) CE Response (Ta= C) RxB (Turn On) RxB (Turn Off) CE Input Voltage =.μf μf Inrush Current VIN = V 9 7 Inrush Current Irush (ma) 9 7 ma CE Input Voltage ma ma IOUT=mA VIN = V CE Input Voltage Vce (V) time (ms) RxB (Turn On) RxB (Turn Off) CE Input Voltage =.μf μf Inrush Current VIN = 7V 9 7 Inrush Current Irush (ma) 9 7 CE Input Voltage ma ma ma VIN = 7V IOUT=mA CE Input Voltage Vce (V) time (ms) 7

18 Rx Rx9B (Turn On) Rx9B (Turn Off) CE Input Voltage =.μf μf Inrush Current VIN = V 9 7 Inrush Current Irush (ma) CE Input Voltage ma ma ma VIN = V IOUT=mA CE Input Voltage Vce (V) time (ms) ) Start Up Waveform (Ta= C) RxB RxC Input Voltage =.μf μf Inrush Current VCE = V 9 7 Inrush Current Irush (ma) Input Voltage =.μf μf Inrush Current 9 7 Inrush Current Irush (ma) - - ) CE Pin Current Vs. CE Input Voltage. RxxxxB. CE Current ICE (μa)..... CE Input Voltage VCE (V)

19 Rx EFFECTIVE SERIES RESISTANCE (ESR) VS. OUTPUT CURRENT Ceramic type output capacitor is recommended for this series; however, the other output capacitors with low ESR also can be used. As for reference, the below graphs show the relationship between output current (I OUT ) and effective series resistance (ESR). The noise level of the output current (I OUT ) was measured by the test circuit and is lower than the specified value. CIN RxxxxB IOUT CIN RxC IOUT CE VFB ESR ESR CIN=Ceramic.μF, =Ceramic.μF CIN=Ceramic.μF, =Ceramic.μF Measurement Conditions Noise Frequency Range: Hz to MHz Ambient Temperature: -ºC to ºC Shaded Area: Noise level is lower than the specified value (μv) Capacitor: CIN=Ceramic.µF, =Ceramic.µF (CX7SHK) RxB RxB Equivalent Resistance ESR (Ω) VIN=.V to V C C Ta=- C.. Equivalent Resistance ESR (Ω). Ta=- C C C VI N=V to V. Rx9B RxC (=V) Equivalent Resistance ESR (Ω) VIN=9V to V C Ta=- C C.. Equivalent Resistance ESR (Ω).. VIN=V to V C C Ta=- C 9

20 Halogen Free Ricoh is committed to reducing the environmental loading materials in electrical devices with a view to contributing to the protection of human health and the environment. Ricoh has been providing RoHS compliant products since April, and Halogen-free products since April,.

21 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Ricoh Electronics: RSC-E-FE RJC-T-FE RSB-E-FE RSB-E-FE RJB-T-FE RJB-T-FE