MAX9650/MAX9651 High-Current VCOM Drive Op Amps for TFT LCDs

Transcription

1 General Description The MAX965/MAX9651 are single- and dual-channel VCOM amplifiers with rail-to-rail inputs and outputs. The MAX965/MAX9651 can drive up to 13mA of peak current per channel and operate up to V. The MAX965/MAX9651 are designed to source and sink a high current quickly to hold the VCOM voltage stable in large TFT-LCD panels. The MAX965/MAX9651 feature 4V/µs slew rate and 35MHz bandwidth to quickly settle outputs for 1Hz frame rate and full HD television. The MAX965/MAX9651 feature output short-circuit protection and thermal shutdown. These devices are available in exposed pad packages for excellent heat dissipation. TFT-LCD Panels Instrument Control Voltage Sources Applications 13mA Peak Output Current Rail-to-Rail Inputs and Outputs Operates Up to V 4V/µs Slew Rate 35MHz Bandwidth 5mA Quiescent Current per Channel Excellent Heat Dissipation (Exposed Pad) PART Features Ordering Information AMPS PER PACKAGE PIN- PACKAGE TOP MARK MAX965AZK+ 1 5 SOT3 ADSI MAX965AZK/V+ 1 5 SOT3 ADSK MAX965AUA+ 1 8 µmax-ep* AABI MAX965ATA+ 1 8 TDFN-EP* BKX MAX9651AUA+ 8 µmax-ep* AABH MAX9651ATA+ 8 TDFN-EP* BKY Note: All devices are specified over the -4 C to +15 C operating range. +Denotes a lead(pb)-free/rohs-compliant package. /V denotes an automotive qualified part. *EP = Exposed pad. Typical Operating Circuit 16V V DD MAX965 V REF IN_+ OUT_ TFT LCD IN_- GND *R S TFT-LCD CAPACITANCE *R S MAY BE NEEDED FOR SOME APPLICATIONS. For pricing, delivery, and ordering information, please contact Maxim Direct at , or visit Maxim Integrated s website at ; Rev 5; 11/1

2 ABSOLUTE MAXIMUM RATINGS Supply Voltage (V DD to GND)...-.3V to +V Any Other Pin to GND...-.3V to (V DD +.3V) IN_+/IN_- (current)...±ma OUT_ (current)...1.3a Continuous Power Dissipation (T A = +7 C) SOT3 (derate 3.7mW/ C above +7 C) mW µmax-ep (derate 1.9mW/ C above +7 C) mW TDFN-EP (derate 3.8mW/ C above +7 C) mW Operating Temperature Range...-4 C to +15 C Junction Temperature C Storage Temperature Range C to +15 C Lead Temperature (soldering, 1s)...+3 C Soldering Temperature (reflow)...+6 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (V DD = 19V, V GND = V, V CM = = V DD /, T A = T MIN to T MAX, unless otherwise noted. Typical values are at T A = +5 C.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage Range V DD Guaranteed by PSRR 6 V Quiescent Current I DD Per channel ma High Output Voltage V OH I H = +5mA, V IN = V DD V DD -.3 Low Output Voltage V OL I L = -5mA, V IN = V.5.3 V Input Offset Voltage V OS T A = +5 C T A = -4 C to +15 C mv Load Regulation LR I OUT = ma to -8mA +. I OUT = ma to +8mA -. mv/ma Input Bias Current I FB At V IN = 9.5V.1 1 µa Voltage Gain A V R L = 1kΩ, C L = 5pF V/V Power-Supply Rejection Ratio PSRR V DD = 6V to V, V CM = = 3V 7 95 db Common-Mode Input Voltage Range CMVR Inferred from CMRR test.5 Continuous Output Current I O Common-Mode Rejection Ratio CMRR.5V V CM V DD -.5V 6 8 db = 9.5V MAX965AZK+ (Note ) MAX965AUA+ 8 ma V DD = 15V, = 7.5V MAX965ATA+ ±35 V DD -.5 V DD -.5 V V Transient Peak Output Current I PK (Note 3) ±1.3 A Bandwidth BW -3dB 35 MHz Slew Rate SR 4V step, C L = 5pF, R L = 1kΩ, A V = +1V/V 4 V/µs Settling Time t S Settling to.1% of, I L = to 1mA, R S =.Ω, C S =.1µF (Figure 1). µs Maxim Integrated

3 ELECTRICAL CHARACTERISTICS (continued) MAX965/MAX9651 (V DD = 19V, V GND = V, V CM = = V DD /, T A = T MIN to T MAX, unless otherwise noted. Typical values are at T A = +5 C.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Maximum Load Capacitance C LOAD (Note 4) 15 nf Noninverting Input Resistance R IN+ (Note 5) 1 MΩ Inverting Input Resistance R IN- (Note 5) 1 MΩ Input Capacitance C IN 3 pf Thermal Shutdown +17 C Thermal Shutdown Hysteresis 15 C Note 1: All devices are 1% production tested at T A = +5 C. All temperature limits are guaranteed by design. Note : Continuous output current is tested with one output at a time. Note 3: See the Thermal Shutdown with Temperature Hysteresis section. Note 4: A series resistor can extend load capacitance range. The settling time can be optimized by a small series resistance. See the Applications Information section for more information. Note 5: Inputs are protected by back-to-back diodes. Typical Operating Characteristics (V DD = 19V, GND =, V CM = = V DD /, T A = +5 C, unless otherwise specified.) INPUT OFFSET VOLTAGE (mv) INPUT OFFSET VOLTAGE DEVIATION vs. SUPPLY VOLTAGE T A = +15 C T A = +5 C T A = -4 C MAX965 toc1 INPUT OFFSET VOLTAGE (mv) INPUT OFFSET VOLTAGE DEVIATION vs. TEMPERATURE MAX965 toc I OUT (5mA/div) (15mV/div).5A RESPONSE LOAD TRANSIENT SOURCING.1A RESPONSE 1A RESPONSE MAX965 toc SUPPLY VOLTAGE (V) TEMPERATURE ( C) TIME (1μs/div) Maxim Integrated 3

4 Typical Operating Characteristics (continued) (V DD = 19V, GND =, V CM = = V DD /, T A = +5 C, unless otherwise specified.) SUPPLY CURRENT (ma) SUPPLY CURRENT vs. TEMPERATURE TEMPERATURE ( C) MAX965 toc4 I OUT (5mA/div) (15mV/div).5A RESPONSE LOAD TRANSIENT SOURCING TIME (1μs/div).1A RESPONSE 1A RESPONSE MAX965 toc5 I OUT (5mA/div) (15mV/div).5A RESPONSE LOAD TRANSIENT SINKING TIME (1μs/div) 1A RESPONSE.1A RESPONSE MAX965 toc6 STARTUP WAVEFORM 1ms/div MAX965 toc7 I DD 1mA/div V DD 1V/div V IN 5V/div 5V/div MAX965 STEP RESPONSE WITH VARIOUS C L C L = 1pF C L = pf C L =.1μF CL =.μf μs/div MAX965 toc8 5V/div 5V/div 5V/div 5V/div GAIN (db) OPEN-LOOP GAIN AND PHASE vs. FREQUENCY MAX965 toc GAIN C L = 1pF PHASE E+ 1E+3 1E+6 1E+ 1E+3 1E+3 1E+6 1E+6 FREQUENCY (Hz) PHASE (DEG) VOLTAGE GAIN (db) CLOSED-LOOP SMALL-SIGNAL FREQUENCY RESPONSE FOR VARIOUS C L C L =.1μF C L =.1μF C L =.μf C L =.1μF C L = 56pF C L = 1pF -5 C L = 1pF -1 C L = 56pF FREQUENCY (MHz) MAX965 toc1 GAIN (db) SMALL-SIGNAL GAIN vs. FREQUENCY 3 = 1mV P-P R L = 1kΩ TO V DD / E+3 1E+6 1E+6 1E+6 FREQUENCY (Hz) MAX965 toc11 GAIN (db) SMALL-SIGNAL GAIN vs. FREQUENCY WITH VARIOUS C L = 1mV P-P R L = 1kΩ TO V DD / 1pF 1,pF 1pF 1pF -5 1E+3 1E+6 1E+6 1E+6 FREQUENCY (Hz) MAX965 toc1 4 Maxim Integrated

5 SOT3 MAX965 PIN µmax-ep, TDFN-EP MAX9651 (µmax-ep, TDFN-EP) MAX965/MAX9651 NAME OUTA VCOM Output A 4 4 GND Ground INA+ Positive Input A 4 INA- Negative Input A FUNCTION Pin Description Positive-Supply Input. Bypass V V DD to GND with a.1µf capacitor as close as DD possible to the device. 5 INB+ Positive Input B 6 INB- Negative Input B 7 OUTB VCOM Output B 1, 5, 8 N.C. No Connection. Not internally connected. EP Exposed Pad (μmax and TDFN Only). EP is internally connected to GND. Connect EP to GND. Detailed Description The MAX965/MAX9651 operational rail-to-rail input/output amplifiers hold the VCOM voltage stable while providing the ability to source and sink a high current quickly (1.3A) into a capacitive load such as the backplane of a TFT-LCD panel. Thermal Shutdown with Temperature Hysteresis The MAX965/MAX9651 are capable of high output currents and feature thermal-shutdown protection with temperature hysteresis. When the die temperature reaches +17 C, the device shuts down. When the die cools down by 15 C, the device turns on again. In a TFT-LCD application, the duty cycle is very low. Even with high values of voltage and current, the power dissipation is low and the chip does not shut down. 19V SUPPLY *C =.1μF *C1 = 1μF 19V SUPPLY V DD V REF IN_+ IN_- MAX965 GND OUT_ LCD VCOM LOAD R S = C LCD = _.Ω.1μF **V TO.V AT 5kHz *1μF and.1μf CAPACITORS AS CLOSE AS POSSIBLE TO THE PIN. **(R S = R GEN ) x C LCD x 6 < μs, WHERE R GEN = GENERATOR SOURCE IMPEDANCE. Figure 1. Settling Time Test Circuit Maxim Integrated 5

6 Applications Information Output Load The MAX965/MAX9651 are designed to drive capacitive loads. A small value of series resistance improves the performance of the device to ensure stability and fast settling with very large or very small capacitive loads. In many cases, this resistance is already present due to connection resistance in the wiring and no additional physical resistor is necessary. For minimum series resistance required for stability with capacitive loading, see Figure. Power Supplies and Bypass Capacitors The MAX965/MAX9651 operate from a 6V to V single supply or from ±4.5V to ±1V dual supplies. Proper supply bypassing ensures stability while driving high transient loads. The MAX965/MAX9651 require a minimum 1µF (C1) and.1µf (C) power-supply bypass capacitors placed as close as possible to the powersupply pin (V DD ). See Figure 3. For dual-supply operation, use 1µF and.1µf bypass capacitors on both supplies (V DD and GND) with each capacitor placed as close as possible to V DD and GND. Layout and Grounding The exposed pad on the µmax and TDFN packages provide a low thermal resistance for heat dissipation. Solder the exposed pad to a ground plane for best thermal performance. Do not route traces under these packages. For dual-supply operation, the exposed pad (EP) can be electrically connected to the negative supply or it can be left unconnected. RESISTANCE (Ω) STABLE UNSTABLE CAPACITANCE (F) V REF 16V SUPPLY *C =.1μF *C1 = 1μF 19V SUPPLY V DD IN_+ IN_- MAX965 GND OUT_ **R S *1μF and.1μf CAPACITORS AS CLOSE AS POSSIBLE TO THE PIN. **R S MAY BE NEEDED FOR SOME APPLICATIONS. TFT LCD TFT-LCD CAPACITANCE Figure. Minimum Combined ESR/Series/Trace Resistance Required for Stability of the MAX965 in Response to Capacitive Loads Figure 3. Typical TFT-LCD Backplane Drive Circuit PROCESS: BiCMOS Chip Information µmax is a registered trademark of Maxim Integrated Products, Inc. 6 Maxim Integrated

7 Pin Configurations MAX965 N.C. 1 + MAX965 8 N.C. OUTA 1 + MAX V DD OUTA V DD INA- 7 V DD INA- 7 OUTB GND INA+ 3 6 OUTA INA+ 3 6 INB- INA+ 3 4 INA- GND 4 5 N.C. GND 4 5 INB+ THIN SOT3 μmax-ep (TDFN-EP) μmax-ep (TDFN-EP) Maxim Integrated 7

8 Package Information For the latest package outline information and land patterns (footprints), go to Note that a +, #, or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. 5 SOT3 Z µmax U8E TDFN-EP T Maxim Integrated

9 Package Information (continued) For the latest package outline information and land patterns (footprints), go to Note that a +, #, or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Maxim Integrated 9

10 Package Information (continued) For the latest package outline information and land patterns (footprints), go to Note that a +, #, or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. 1 Maxim Integrated

11 Package Information (continued) For the latest package outline information and land patterns (footprints), go to Note that a +, #, or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Maxim Integrated 11

12 Package Information (continued) For the latest package outline information and land patterns (footprints), go to Note that a +, #, or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. COMMON DIMENSIONS SYMBOL MIN. MAX. A.7.8 D E A1..5 L..4 k.5 MIN. A. REF. PACKAGE VARIATIONS PKG. CODE N D E e JEDEC SPEC b [(N/)-1] x e T ±.1.3±.1.95 BSC MO9 / WEEA.4± REF T ±.1.3±.1.65 BSC MO9 / WEEC.3± REF T ±.1.3±.1.65 BSC MO9 / WEEC.3± REF T ±.1.3±.1.5 BSC MO9 / WEED-3.5±.5. REF T133MK-1 T133- T ±.1.3±.1.5 BSC MO9 / WEED ±.1 1.7±.1.3±.1 T ±.1.3±.1 T1433-3F ±.1.3±.1.3±.1.5 BSC MO9 / WEED-3.5±.5. REF.4 BSC ±.5. REF.±.5.4 REF.4 BSC ±.5.4 REF.4 BSC ±.5.4 REF 1 Maxim Integrated

13 Revision History REVISION NUMBER REVISION DATE DESCRIPTION PAGES CHANGED 7/8 Initial release 1 1/8 Updated slew rate and added TDFN-EP package 1,, 6, 1, 11 5/9 Updated continuous output current specification 3 /1 4 7/1 Added automotive part to Ordering Information, corrected units for input offset voltage, and added figure for minimum series resistance Removed extraneous information in the Electrical Characteristics table and corrected typo in TOC /1 Corrected lead pattern number 8 1,, 5, 6, 4 Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated 16 Rio Robles, San Jose, CA USA Maxim Integrated Products, Inc. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.