Improvement of placement effi ciency Placement effi ciency of Chip Resistor Array is two, four or eight times of the fl at type chip resistor

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1 Chip Resistor Array ype: EX1 : 001 Array EX : 00 Array EX3 : 0603 Array EXN: 00 Array EX : 0603 Array EXS : 005 Array Features High density resistors in 0. mm 0.6 mm size (EX1) resistors in 1. mm 0.6 mm size (EX1) resistors in 1.0 mm 1.0 mm size (EX) resistors in.0 mm 1.0 mm size (EX, N) resistors in 3. mm 1.6 mm size (EX) resistors in 1.6 mm 1.6 mm size (EX3, ) resistors in 3. mm 1.6 mm size (EX3, ) resistors in 5.1 mm. mm size (EX) Improvement of placement effi ciency lacement effi ciency of Chip Resistor Array is two, four or eight times of the fl at type chip resistor Explanation of art Numbers E X J roduct Code hick Film Chip Resistor Networks 1 3 N S Chip Resistor Array ype: inches 001 Array 00 Array 0603 Array 00 Array 0603 Array 005 Array Convex erminal Concave erminal No. of erminal erminal erminal H 16 erminal Construction (Example : Concave erminal) Schematics Isolated type Resistance alue he first two digits are significant figures of resistance value and the third one denotes the number of zeros following. Jumper is expressed by R00 Example: :. k Schematics Isolated type 3 Resistance olerance J 0 ±5 % Jumper ackaging Methods Code ackaging Embossed Nil Carrier aping () unched Carrier aping X mmpitch (1, 1,,, N) unched Carrier aping mmpitch (, 3, 3,, ) 1,, 3, 1,, N, 3,, resistors resistors 6 5 rotective coating Alumina substrate Electrode (Outer) hick film resistive element Electrode (etween) Electrode (Inner) resistors

2 Dimensions in mm (not to scale) (1) Convex erminal type A1 EX1,, 3 A1 A EX, 3 A1 EX A1 A EXN,, A1 A EX1 A1 A EX ype (inches) Dimensions (mm) Mass (eight) [g/1000 pcs.] A1 A EX1 (001 ) 0.0 ± ± ± ± ±0.10 (0.50) 0.15 ± EX (00 ) 1.00 ± ± ± ± ±0.10 (0.65) 0.5 ± EX (00 ).00 ± ± ± ± ± ±0.10 (0.50) 0.5 ± EX (00 ) 3.0 ± ± ± ± ± ±0.10 (0.50) 0.30 ± EX3 (0603 ) 1.60 ± ± ± ± ±0.0 (0.0) 0.30 ± EX3 (0603 ) 3.0 ± ± ± ± ± ±0.0 (0.0) 0.35 ±0.0.0 () Concave erminal type ( ) Reference ype (inches) Dimensions (mm) Mass (eight) [g/1000 pcs.] A1 A EXN (00 ).00 ± ± ± ± ± ±0.15 (0.50) 0.30 ± EX (0603 ) ± ± ±0.15 (0.0) 0.5 ± EX (0603 ) ± ± ± ±0.15 (0.0) 0.5 ± EX (005 ) ± ± ± ±0.15 (1.) 0.55 ± (3) Flat erminal type ( ) Reference ype (inches) Dimensions (mm) Mass (eight) [g/1000 pcs.] A1 A EX1 (001 ) 1.0 ± ± ± ± ± ±0.10 (0.0) 0.0 ± ( ) Reference

3 Ratings Item Specifi cations Resistance Range 10 to 1 M :E series Resistance olerance J: ±5 % 1,,,3 terminal Number of erminals 1,,N,3,, terminal 16 terminal 1,,,3 terminal Item Specifi cations 1,1 1.5 imiting Element oltage (1) 5 Max. Rated Continuous (,,N,3,3,, 50 orking oltage ) 100 1, Max. Over-load oltage (),,N,3,3,, Number of Resistors 1,,N,3,, terminal.c.r. ± / C(ppm/ C) 1,,N terminal /element Category emperature Range (Operating emperature Range) 55 C to 15 C 1 ower Rating at 0 C,,3,, /element (0.1 /package) /element 0.1 /element /element (0.5 /package) Jumper Array Rated Current Max, Overload Current 1,1,,,N,3,3,, 1,1,,,N,3,3,, 0.5 A 1 A A 1 A A A (1) Rated Continuous orking oltage (RC) shall be de ter mined from RC= ower Rating Resistance alue, or imiting Element oltage (max. RC) listed above, whichever less. () Overload (Short-time Overload) est oltage (SO) shall be determined from SO=.5 ower Rating or max. Overload (oltage) list ed above whichever less. ower Derating Curve For resistors operated in ambient temperature above 0 C, power rating shall be derated in accordance with the fi gure on the right. Rated oad (%) 55 C 0 C C Ambient emperature ( C) ackaging Methods (aping) Standard Quantity ype Kind of aping itch (1) Quantity EX1, 1 EX, EXN EX unched Carrier aping mm pcs./reel EX3, pcs./reel mm EX, EX Embossed Carrier aping 500 pcs./reel

4 Carrier ape Unit (mm) unched Carrier Embossed Carrier fd F E A 1 ( mm pitch) fd 1 (Only Emboss) ype A F E 1 0 fd 0 fd 1 EX EX ±0.10 EX EX EXN EX 1.0 ± ± ± ± ±0.15 EX ±0.0 EX ± ± ± ± ± ± ± ± ± ±0.05 EX 1.95 ± ±0.05 EX 3.60 ±0.0 EX.0 ± ± ± ± max _ 0 aping Reel fc f Unit (mm) ype fa f fc EX1,1 EX, EXN EX EX3,3 EX, EX min ± ± ± ± ±.0 fa and pattern design Recommended land pattern design for Network chip is shown below. (Not to scale) Dimensions Unit (mm) ype a b c p f to to to to 0.90 f a to to to to to to to 1.5 b p c, 0. to to to to. 3,3 0. to to to to.6 1 to to to to 3.

5 f a f a b d c d c d b (Not to scale) Dimensions Unit (mm) ype a b c d f N 0.5 to to to.00 b d c d c d c d c d c d c d (Not to scale) Dimensions Unit (mm) ype a b c d f b Recommended Soldering Conditions Recommendations and precautions are described below. Recommended soldering conditions for refl ow Refl ow soldering shall be performed a maximum of two times. lease contact us for additional information when used in conditions other than those specifi ed. lease measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. eak For soldering (Example : Sn/b) emperature ime reheating 10 C to 160 C 60 s to 10 s Main heating Above 00 C 30 s to 0 s eak 35 ± 5 C max. 10 s emperature reheating ime Heating Flow soldering e do not recommend fl ow soldering, because a solder bridge may form. For lead-free soldering (Example : Sn/Ag/Cu) emperature ime reheating 150 C to 10 C 60 s to 10 s Main heating Above 30 C 30 s to 0 s eak max. 60 C max. 10 s Safety recautions he following are precautions for individual products. lease also refer to the precautions common to Fixed Resistors shown on page ER3 of this catalog. 1. ake measures against mechanical stress during and after mounting of Chip Resistor Array (hereafter called the resistors) so as not to damage their electrodes and protective coatings. e careful not to misplace the resistors on the land patterns. Otherwise, solder bridging may occur.. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and eval u ate the op er a tions of the resistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired. 3. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance and/or reliability.. hen soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. hen using a soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at 350 C max.). 5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder. 6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Oth er wise, the re sis tors' protective coatings and bodies may be chipped, affecting their performance.. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.

6 Safety recautions (Common precautions for Fixed Resistors) hen using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifi cations with us in advance. he design and specifi cations in this catalog are subject to change without prior notice. Do not use the products beyond the specifi cations described in this catalog. his catalog explains the quality and performance of the products as individual components. e fore use, check and evaluate their operations when installed in your products. Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of human life or other signifi cant damage, such as damage to vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating ap pli anc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equip ment. Systems equipped with a protection circuit and a protection device Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) recautions for use hese products are designed and manufactured for general and stan dard use in general elec tron ic equipment (e.g. A equipment, home electric ap pli anc es, offi ce equipment, information and com mu ni ca tion equipment) hese products are not intended for use in the following special conditions. e fore using the products, care ful ly check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl, HS, NH3, SO, or NO. Electric Static Discharge (ESD) Environment hese components are sensitive to static electricity and can be damaged under static shock (ESD). lease take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials hese products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating com po nents. Do not mount or place heat-generating com po nents or infl ammables, such as vinyl-coated wires, near these products. Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the performance or reliability of the products. Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water res i dues. Otherwise, the insulation performance may be deteriorated. () recautions for storage he performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 C to 35 C and a relative humidity of 5 % to 5 %. Even within the above guarantee periods, do not store these products in the fol low ing conditions. Otherwise, their elec tri cal performance and/or solderability may be deteriorated, and the packaging materials (e.g. tap ing ma te ri als) may be de formed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl, HS, NH3, SO, or NO. In direct sunlight <ackage markings> ackage markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. ER3