Multi-Layer Ferrite Chip Beads

Transcription

1 Multi-Layer Ferrite Chip Beads ORDERING CODE... 1 External Dimensions... 2 Beads For Signal Lines(BF series)... 3 Beads For Power Lines (BP series)... 8 Beads For High Speed Signal Lines (BH series) Testing Condition & Requirements Packaging Specification ORDERING CODE BF T T S 5 PRODUCT CODE BF : For General Signal Lines BP : For Power Lines BH : For High Speed Signal Lines DIMENSION (L X W) Code Dimension EIA X 0.3 mm X 0.5 mm X 0.8 mm X 1.2 mm X 1.6 mm 1206 IMPEDANCE CODE Code (Ω) TOLERANCE CODE T= ± 25% PACKAGING CODE T = Paper Tape P = Embossed Tape TYPE CODE S= R=Low DCR B=GHz Band THICKNESS CODE 3=0.3 5=0.5 8=0.8 9=0.9 B=1.1 1 Rev

2 External Dimensions Unit: mm/(inch) Series L W 0603 (0201) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206) 0.60±0.03 (0.024 ± 0.001) 1.00 ± 0.10 (0.040 ± 0.004) 1.60 ± 0.20 (0.063 ± 0.008) / ( / ) / ( / ) 0.30 ± 0.03 (0.012 ± 0.001) 0.50 ± 0.10 (0.020 ± 0.004) 0.80 ± 0.20 (0.031 ± 0.008) / ( / ) / ( / ) A (Min/Max) 0.15 ± 0.05 (0.006 ± 0.002) 0.25 ± 0.15 (0.010 ± 0.006) 0.30 ± 0.20 (0.012 ± 0.008) / ( / ) / ( / ) Recommended pad dimensions Land Pattern SMD Soldering resist c b a Size mm (EIA) L x W a b c 0603(0201) 0.6* to to to (0402) 1.0* to to to (0603) 1.6* to to to (0805) 2.0* to to to (1206) 3.2* to to to 1.6 EMI Suppression 2

3 Beads For Signal Lines(BF series) Feature 1. High density packaging is possible. This series requires less space and has greater EMI suppression effects. 2. Different types with the same shape are available. 3. Excellent in physical properties, such as terminal strength, flexure strength, soldering resistance and solderability. 4. Applicable to both flow and reflow soldering. Application 1. Computers and peripheral devices, personal computers, VCR and cameras. 2. Noise suppression in digital equipments, car stereo, car engines controllers and OA electronic instruments. 3. Communication equipment. Part Numbers & Characteristic BF0603 series (EIA 0201 Size) BF TTS ± 0.03 BF TTS ± 0.03 BF TTS ± 0.03 BF TTS ± 0.03 BF TTS ± 0.03 BF TTS ± 0.03 OPERATING TEMPERATURE RANGE: -55 TO BF1005 series (EIA 0402 Size) BF TTS ± 0.10 BF TTS ± 0.10 BF TTS ± 0.10 BF TTS ± 0.10 BF TTS ± 0.10 BF TTS ± 0.10 BF TTS ± 0.10 BF TTS ± 0.10 BF TTS ± 0.10 BF TTS ± 0.10 BF TTS ± 0.10 BF TTS5 1, ± GHz Band at 100MHZ at 1GHZ (Ω)±40% BF TTB ± 0.10 BF TTB , ± 0.10 OPERATING TEMPERATURE RANGE: -55 TO Rev

4 BF1608 series (EIA 0603 Size) BF TTS ± 0.20 BF TTS ± 0.20 BF TTS ± 0.20 BF TTS ± 0.20 BF TTS ± 0.20 BF TTS ± 0.20 BF TTS ± 0.20 BF TTS ± 0.20 BF TTS ± 0.20 BF TTS ± 0.20 BF TTS ± 0.20 BF TTS8 1, ± 0.20 BF TTS8 2, ± 0.20 OPERATING TEMPERATURE RANGE: -55 TO BF2012 series (EIA 0805 Size) (Ω) ±25% BF TTS ± 0.20 BF TTS ± 0.20 BF TTS ± 0.20 BF TTS ± 0.20 BF TTS ± 0.20 BF TTS ± 0.20 BF TTS ± 0.20 BF TTS ± 0.20 BF TTS ± 0.20 BF TTS ± 0.20 BF TTS ± 0.20 BF TTS9 1, ± 0.20 OPERATING TEMPERATURE RANGE: -55 TO +125 BF3216 series (EIA 1206 Size) BF TPSB ± 0.03 BF TPSB ± 0.03 OPERATING TEMPERATURE RANGE: -55 TO EMI Suppression Multi-Layer Ferrite Bead for General Signal Lines 4

5 TYPICAL ELECTRICAL CHARACTERISTICS (IMPEDANCE VS FREQUENCY) BF0603 series (EIA 0201 Size) BF1005 series (EIA 0402 Size) 5 Rev

6 BF1608 series (EIA 0603 Size) EMI Suppression Multi-Layer Ferrite Bead for General Signal Lines 6

7 BF2012 series (EIA 0805 Size) BF3216 series (EIA 1206 Size) 7 Rev

8 Beads For Power Lines (BP series) Feature The BP series can be used on high current circuits due to its low DC resistance. It can meet power lines to the maximum at DC. Application 1. This series is suitable for EMI suppression of the high DC current power line. 2. Various power lines of electronic equipment. 3. Mother board, tablet PC, notebook, desktop omputers and peripheral equipment. 4. DSC, DVC, LCD Television, Set Top Box. 5. Digital communication equipment. Part Numbers & Characteristic BP0603 series (EIA 0201 Size) BP TTS , ± 0.03 BP TTS , ± 0.03 BP TTS , ± 0.03 BP TTS , ± 0.03 BP TTS ± 0.03 BP TTS ± 0.03 BP TTS ± 0.03 OPERATING TEMPERATURE RANGE: -55 TO BP1005 series (EIA 0402 Size) BP TTS , ± 0.10 BP TTS , ± 0.10 BP TTS , ± 0.10 BP TTS , ± 0.10 OPERATING TEMPERATURE RANGE: -55 TO +125 BP1608 series (EIA 0603 Size) BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 OPERATING TEMPERATURE RANGE: -55 TO EMI Suppression Multi-Layer Ferrite Bead for Power Lines 8 Rev

9 BP2012 series (EIA 0805 Size) (Ω) ±25% BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS , ± 0.20 BP TTS9 1, , ± 0.20 OPERATING TEMPERATURE RANGE: -55 TO Rev

10 TYPICAL ELECTRICAL CHARACTERISTICS (IMPEDANCE VS FREQUENCY) BP0603 series (EIA 0201 Size) BP1005 series (EIA 0402 Size) BP1608 series (EIA 0603 Size) EMI Suppression Multi-Layer Ferrite Bead for Power Lines 10

11 BP2012 series (EIA 0805 Size) 11 Rev

12 12 EMI Suppression Multi-Layer Ferrite Bead for Power Lines

13 Feature Beads For High Speed Signal Lines (BH series) 1. Internal silver printed layer creates a closed circuit which acts as a magnetic shield minimizing heat generation and crosstalk. 2. No need for grounding provides greater circuit design flexibility. Part Numbers & Characteristic BH0603 series (EIA 0201 Size) Low DCR Application 1. High frequency noise countermeasure in personal computers, digital cameras and other information system products. For use on digital product clock lines and general signal lines. 2. Radiated noise suppression in computer or printer interfaces and harness connectors. 3. Noise suppression in video and other AV products. 4. Prevents interference between circuits in cellularphones (PHS, PDC, etc.) BH TTS ± 0.03 BH TTS ± 0.03 BH TTS ± 0.03 BH TTS ± 0.03 BH TTS ± 0.03 BH TTR ± 0.03 BH TTR ± 0.03 BH TTR ± 0.03 BH TTR ± GHz Band at 100MHZ at 1GHZ BH TTB3 600 typ 1, ± 0.03 BH TTB3 1,000 typ 2, ± 0.03 BH TTB3 1,500 typ 2, ± 0.03 OPERATING TEMPERATURE RANGE: -55 TO +125 BH1005 series (EIA 0402 Size) BH TTS ± 0.10 BH TTS ± 0.10 BH TTS ± 0.10 BH TTS ± 0.10 BH TTS ± 0.10 BH TTS5 1, ± GHz Band at 100MHZ at 1GHZ BH TTB5 600 typ 1, ± 0.10 BH TTB5 1,000 typ 1, ± 0.10 BH TTB5 1,500 typ 2, ± 0.10 BH TTB5 1,800 typ 2, ± 0.10 OPERATING TEMPERATURE RANGE: -55 TO +125 BH1608 series (EIA 0603 Size) GHz Band at 100MHZ at 1GHZ BH TTB8 470 typ 1, ± 0.15 BH TTB8 600 typ 1, ± 0.15 BH TTB8 1,000 typ 1, ± 0.15 OPERATING TEMPERATURE RANGE: -55 TO Rev

14 TYPICAL ELECTRICAL CHARACTERISTICS (IMPEDANCE VS FREQUENCY) BH0603 series (EIA 0201 Size) BH1005 series (EIA 0402 Size) EMI Suppression Multi-Layer Ferrite Bead for High Speed Signal Lines 14

15 BH1608 series (EIA 0603 Size) 15 Rev

16 Testing Condition & Requirements No. Item Test Condition 1 Appearance Ferrite Beads shall be visually inspected for visible evidence of defect. 2 Measuring frequency:100±1mhz Measuring equipment and fixture: 0603: HP4291A A 1005: HP4291B A 1608: HP4291B A 2012: HP4291A A 3216: HP4291A A a. Temperatur re: 25±3 3 b. Relative Humidity: 45~75%RH c. Measuring equipment: HP Dimension Dimension shall be measured with caliper or micrometer Requirements In accordance with specification. Within specified tolerance. In accordance with electrical specification. In accordance with dimension specification. 5 Solder-ability Preheat: 150,60 seconds Solder temperature: 245±5 Flux: Rosin Dip time: 4±1 seconds More than 75% of the terminal electrode part shall be covered with new solder. Solder the chip to test jig then apply a force in the direction shown in below. The soldering shall be done with the reflow method and shall be conducted with care so thatt the soldering is uniform and free of defects such as heat shock. 6 Bending Strength No mechanical damage shall be observed. BF BP_Series 7 Resistance to Soldering Heat Preheat: 150,60 seconds Solder temperature: 270±5 Flux: Rosin Dip time: 10±1 seconds BH_Series Preheating temperature : 150 to 180 Preheating time :3 min. Preheat: 150,60 seconds Solder temperature: 260±5 Flux: Rosin Dip time: 10±0.5 seconds The chip shall not be cracks.more than 75% of terminal electrode shall be covered with solder. EMI Suppression Multi-Layer Ferrite Bead 16

17 Humidity: 90 to 95% RH. Temperature: 40±2 BF BP_Series Testing time: 500±12 hours 8 High Humidity Load Life Test Humidity: 90 to 95% RH. Temperature: 40±2 BH_Series Testing time: /-0 hours No visible damage. : Within±30% of the initial value. Recovery:2 to 3 hrs of recovery under the standard condition after the removal from test chamber. BF BP_Series Measurement: After placing for 24±2 hours min. BH_Series Measurement: After placing for 48±2 hours min. Temperature:Maximum and Minimum,kept stabilized for 30±3 minutes each 9 Thermal Shock Cycle:5 cycles BF BP_Series Measurement: After placing for 24±2 hours min. BH_Series Measurement: After placing for 48±2 hours min. No visible damage : Within±30% of the initial value. BF BP_Series Temperature: 85±3 (BP_0603 Series) 125±3 Testing time: 500±12 hours 10 High Temperature Load BH_Series Temperature: 125±3 Testing time: /-0 hours No visible damage. : Within±30% of the initial value. Recovery:2 to 3 hrs of recovery under the standard condition after the removal from test chamber. BF BP_Series Measurement: After placing for 24±2 hours min. BH_Series Measurement: After placing for 48±2 hours min. 17 Rev

18 Soldering Profile for SMT Process with SnPb Solder Paste. The rate of preheat should not exceed 4 /sec and a target of 2 /sec is preferred. Ceramic chip components should be preheated to within 100 to 130 of the soldering Soldering 220 to ~ 10 sec. Temperature ( ) 200 Gradual Natural Cooling Preheating 0 over 1 min over 1 min Over 200,within 40sec Time (sec.) Soldering Profile for SMT Process with Lead Free Solder Paste. The rate of preheat should not exceed 4 /sec and a target of 2 /sec is preferred. Ceramic chip components should be preheated to within 100 to 130 of the soldering. Temperature ( ) Preheating 0 over 1 min over 1 min Soldering 240 to ~ 10 sec. Over 200,within 90sec Gradual Natural Cooling Time (sec.) EMI Suppression Multi-Layer Ferrite Bead 18

19 Packaging Specification Paper Tape Material Paper ( Dimensions in mm) TYPE A B W P T CHIPS / REEL , , , ,000 Embossed Tape Material Embossed ( Dimensions in mm) TYPE A B W P T CHIPS / REEL ,000 Reel dimensions Dimensions in mm TYPE 4mm 8mm A 178±2 178±2 B 21.0± ±0.8 C 13.0± ±0.8 G N T Rev