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1 ITEM : EMI_ESD FILTER ESTABLISHMENT APPROVED REVISION Series NO:FLE67191 APPROVAL SHEET ARRAY TYPE EMI_ESD FILTER CUSTOMER : DATE : You can reapprove only the changed quality request recorded in spec sheet. And, We can decide other changed parts

2 Features ITEM : CHIP LC+ESD FILTER Features 1.4 elements in one chip. 2.Multilayer chip EMI suppression + ESD Protection Filter. 3.High transient current capability. 4.Good Solderability. (Ni, Sn plating) 5.Lead Free. (RoHS Compliant) 6.No Polarity. 7.Assurance IEC Level 4(8kV, contact discharge)_esd(1/3ns) protection. Applications 1.LCD module, Mobile Phone, Digital Camera. 2.Transient Voltage Protection for IC and Transistor. 3.ESD and I/O Protection. 4.Telecommunication Transient Protection. 5.EFT / Burst protection. Ordering Information FLE 4E J T (1) (2) (3) (4) (5) (6) (7) (1) Series FLE : LC+ESD Filter (2) Element 4E : 4 Elements (3) Dimension 2 : 212mm size (4) Working Voltage(V) Code Working Voltage(V) (5) Typical Capacitance(@1MHz) Code Capacitance(pF) (6) Termination J : Nickel barrier (7) Packing B : Bulk Pack T : Tape & Reel (Φ178mm [ 7 inches ]) L : Tape & Reel (Φ254mm [ 1 inches ]) Shape and Dimensions C2_1 C2 C1_1 D C1 M Unit : mm Type L W T C1 C2 D M C1_1 C2_1 FLE4E 2. ± ± ± ±.15.3 max.5 ±.1.2 max.4 ±.1.3 max

3 Specifications FLE4E Series Part No. Working voltage Varistor Typical Capacitance Inductance Cut off Freq -2dB Attenuation Frequency range Min Max Tolerance Typical -3dB Typical Typical Rdc VWDC (V) VV (V) C (pf) % nh MHz MHz Ω FLE4E253JT ~25 4 FLE4E21825JT ~25 5 1) VWDC... Leakage Current at 25 is under 5 μa at VWDC 2) IEC Level 4 (8kV, contact) Parts with other electrical characteristics available upon request. Equivalent Circuit In-1 In-2 In-3 In-4 GN GN Out-1 Out-2 Out-3 Out-4 Terms and Descriptions Working DC Voltage (VW(DC)) Maximum continuous DC voltage that can be applied at maximum operating temperature of the device. The rated DC operating voltage (working voltage) is also used as the reference point for leakage current. This voltage is always less than the breakdown voltage of the device. Leakage Current (IL) at Rated DC Voltage In non-conducting mode, with device at very high impedance value (approaching 1 9 Ω), it will appears as an open circuit in the system. The current drawn at this level is the leakage current and it is very low (<5μA at ambient temperature). Varistor Voltage (VV(DC)) Voltage at which the device changes from off-state to on-state and enter its conductive mode of operation. The voltage is usually characterized at 1mA point and has a specified minimum and maximum voltage listed. Capacitance (Cp) Capacitance of device at a specified frequency (1MHz) and bias (1VP.P.).

4 Electrical Characteristics FLE4E253JT S21 Crosstalk M 1M 1M 1G 1M 1M 1M 1G FLE4E21825JT S21 Crosstalk M 1M 1M 1G 1M 1M 1M 1G

5 Packaging 1. Label 1) Part name. 2) Lot No. 3) Quantity. 2. Standard quantity for packaging Pcs Packaging Tape & reel Bulk Type(EIA) Reel Inner box Carton box Vinyl or Cassette 212 4, 4, 16, As wanted * Packaging method can be changed upon request. TAPE DIMENSION/ Paper unit : mm SPROCKET HOLE Φ , - CHIP CAVITY 1.75±.1 3.5±.5 (Unit : mm) Type A B P T A 8.± ±.5 2.3±.5 4.±.1.75±.5 B P 4.±.1 2.±.5 T LEADER AND BLANK PORTION Blank Chips Blank Leader 1 to 2 pitches 2 to 4 pitches 21mm to 25 mm Drawing direction The pitch holes shift within ±.3mm for cumulative 1 pitches

6 REEL DIMENSION 2.±.8 Φ13.±.5 unit : mm Type W ( mm ) more th an ±.3 R1. Φ21.±.8 Φ178±2. Φ254±2. less than 1.5 TOP COVER TAPE STRENGTH 165 to 18 Top cover tape Embossing tape The force for tearing off top cover tape is 2 to 7 grams in the arrow direction Recommended PCB Pattern G F C D E (Unit : mm) A B C D E F G B A

7 Soldering Profile REFLOW SOLDERING PROFILE(Peak 25 ) Soldering 1 sec. max. 6 sec. max sec. min FLOW SOLDERING MANUAL SOLDERING 25 Preheating 1 sec. max. Dipping 1 sec. max. Cooling 6 sec. min. 3 Solder iron 3W Max sec. min. Tc Δ soldering 2 sec Diameter of Solder iron 1.2mm Max PRECAUTION FOR PRODUCT STORAGE The electrical characteristics of products will not change when stored under typical environmental conditions. However, it is possible that the solderability of the terminal electrodes and the characteristics of the tape packaging can be changed during storage. For this reasons, the following storage guidelines should be followed. 1. STORAGE ENVIRONMENT The tape packaging material is designed to withstand long-term storage, but they will degrade more rapidly in the presence of high temperature or high humidity. Therefore, the products shall be stored in an ambient temperature of less than 4 with a relative humidity of less than 7%. The products should be used within 6 months of receipt. To achieve best solderability, the products should be used as soon as possible after unpacking. Leftover products must be Stored in dry conditions with desiccant. 2. CORROSIVE GASES Since sulfur and chlorine may degrade the solderability of the terminal electrodes, it is important to store the product in an environment free of these gases. 3. TEMPERATURE FLUCTUATIONS Dew condensation may occur when the products are taken out of storage, due to variation of temperature. it is important to maintain a temperature-controlled environment.

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