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1 C D B B- SPECIFICTION. Product Identification B - CS - N S. Series name.. Dimension.. Inductance N=.nH.. Inductance Tolerance (See Details). S=±.nH, J=±%, K=±%.. Configurations & Dimensions / Recommended PCB Pattern D a b a C c B PCB Pattern Series Name B C D a b c B-CS. ±.. ±.. ±.. ±..~. ref.. ref.. ref. Unit: mm. Electrical Characteristics / B- Part Number Inductance Tolerance ( nh / % ) L, Test Frequency ( MHz / mv ) Value Min SRF ( MHz )Min DC Resistance Max. ( mω ) Rated Current Max. ( m ) B-CS-NS. ±. /, B-CS-NS. ±. /, B-CS-NS. ±. /, B-CS-NS. ±. /, B-CS-NS. ±. /, B-CS-NS. ±. /, B-CS-NS. ±. /, B-CS-NS. ±. /, B-CS-NS. ±. /, tolerance :S=±.nH, J=±%, K=±% ( See Details ). // Copyright -. ll rights reserved.
2 B-. Electrical Characteristics / B- Part Number Inductance Tolerance ( nh / % ) L, Test Frequency ( MHz / mv ) Value Min SRF ( MHz )Min DC Resistance Max. ( mω ) Rated Current Max. ( m ) B-CS-NS. ±. /, B-CS-NS. ±. /, B-CS-NS. ±. /, B-CS-NS. ±. /, B-CS-NS. ±. /, B-CS-NS. ±. /, B-CS-NS. ±. /, B-CS-NS. ±. /, B-CS-NS. ±. /, B-CS-NS. ±. /, B-CS-NS. ±. /, B-CS-NJ. ±% /, B-CS-NJ. ±% /, B-CS-NJ. ±% /, B-CS-NJ. ±% /, B-CS-NJ. ±% /, B-CS-NJ. ±% /, B-CS-NJ ±% /, B-CS-NJ ±% /, B-CS-NJ ±% /, B-CS-NJ ±% /, B-CS-NJ ±% /, // Copyright -. ll rights reserved.
3 B-. Electrical Characteristics / B- Part Number Inductance Tolerance ( nh / % ) L, Test Frequency ( MHz / mv ) Value Min SRF ( MHz )Min DC Resistance Max. ( mω ) Rated Current Max. ( m ) B-CS-NJ ±% /, B-CS-NJ ±% /, B-CS-NJ ±% /, B-CS-NJ ±% /,, B-CS-NJ ±% /,, B-CS-NJ ±% /,, B-CS-NJ ±% /,, B-CS-NJ ±% /,, B-CS-NJ ±% /,, B-CS-RJ ±% /, // Copyright -. ll rights reserved.
4 B-. Electrical Curve/ B-... B-CS-NS FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:... B-CS-NS FREUENCY(MHz) RDC<.Ω SER:MHz IDC:m... B-CS-NS FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:m B-CS-NS FREUENCY(MHz) RDC<. Ω SRF:MHz IDC: m B-CS-NS B-CS-NS FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:m FREUENCY(MHz) RDC<.Ω SRF:MHz IDC: m B-CS-NS FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:m B-CS-NS FREUENCY(MHz) // Copyright -. ll rights reserved.
5 B-. Electrical Curve/ B- B-CS-NS FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:m B-CS-NS FREUENCY(MHz) RDC<.Ω SRF:MHz IDC: B-CS-NS FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:m B-CS-NS FREUENCY(MHz) RDC<. Ω SRF:MHz IDC: m B-CS-NS FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:m B-CS-NS FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:m B-CS-NJ FREUENCY MHz RDC<.Ω SRF:MHz IDC:m B-CS-NJ FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:m // Copyright -. ll rights reserved.
6 B-. Electrical Curve/ B- B-CS-NJ FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:m B-CS-NJ FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:m B-CS-NJ FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:m B-CS-NJ FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:m B-CS-NJ FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:m B-CS-NJ FREUENCY (MHz) RDC<.Ω SRF:MHz IDC:m B-CS-NJ FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:m B-CS-NJ FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:m // Copyright -. ll rights reserved.
7 B-. Electrical Curve/ B- B-CS-NJ FREUENCY(MHz) RDC:.Ω SRF:MHz IDC:m B-CS-NJ FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:m B-CS-NJ FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:m B-CS-NJ FREUENCY(MHz) RDC<.Ω SRF:MHz IDC:m B-CS-RJ - FREUENCY(MHz) RDC<. Ω SRF:MHz IDC: m // Copyright -. ll rights reserved.
8 B-. Reliability Test / Temperature Item Specification Conditions Operating temperature Range Storage temperature and Humidity Range - ~ + - ~ +, % ~ %. Solderability The electrodes shall be at least % covered with new solder coating Pre-heating:, min Solder Composition: Sn/g./Cu.(Pb-Free) Solder Temperature: ± (Pb-Free) Immersion Time: ±sec Resistance to Soldering Heat ppearance: No damage Pre-heating:, min Solder Composition: Sn/g./Cu.(Pb-Free) Solder Temperature: ± Immersion Time: ±sec High Temperature Resistance ppearance: No damage Temperature: ± Inductance:within±% of initial value Relative Humidity: % change:within±% of initial value pplied Current: Rated Current / Time: hrs Measured after exposure in the room condition for hrs Low Temperature Resistance ppearance: No damage Temperature: -± Inductance:within±% of initial value Relative Humidity: % / Time: hrs change:within±% of initial value Measured after exposure in the room condition for hrs Temperature Cycle One cycle: Step Temperature ( ) Times (min.) ppearance: No damage -± Inductance:within±% of initial value ± change:within±% of initial value ± ± Total: cycles Measured after exposure in the room condition for hrs Humidity Resistance ppearance: No damage Temperature: ± Inductance:within±% of initial value Relative Humidity: ~ % change:within±% of initial value Time: hrs Measured after exposure in the room condition for hrs. Reliability Test / Mechanical Flexure Strength The forces applied on the right conditions must not damage the terminal electrode and the ferrite Test device shall be soldered on the substrate Substrate Dimension: xx.mm Deflection:.mm Keeping Time: sec *For, substrate dimension is xx.mm Vibration The forces applied on the right conditions must not damage the terminal electrode and the ferrite Test device shall be soldered on the substrate Oscillation Frequency: to to Hz for min mplitude:.mm Time: hrs for each axis (X, Y & Z), total hrs // Copyright -. ll rights reserved.
9 Temperature ( ) Temperature ( ) B-.Recommended Soldering Conditions / For Lead-Free pplication Figure. Re-flow Soldering PRE-HETING SOLDERING NTURL Preheating Soldering Cooling COOLING Peak : ~ XC or more ~ sec XC or ~ moresec. ~ sec. TEMPERTURE XC to Sec. Figure. Hand Soldering PRE-HETING Time (Sec.) SOLDERING NTURL HETING TIME COOLING PRE-HETING SOLDERING NTURL Preheating Soldering COOLING Cooling TEMPERTURE C C Within sec. ( Ω) # Over min. Over min. Within sec. Sec. Within sec. Gradual Cooling Gradual Cooling // Copyright -. ll rights reserved.
10 B-. Packaging Information. Reel Dimension. Ó. COVER TPE C D C B D B EMBOSSED CRRIER Type (mm) B(mm) C(mm) D(mm) '' x mm ±. ±. ±. ±. Tape Dimension.±..±..±..±. T Ko W.±. Bo.±. P o SECTIONB-B SECTION- P/N o(mm) Bo(mm) Ko(mm) P(mm) T(mm) W(mm) PCS/REEL HLCS.±..±..±..±..±. HLCS.±..±..±..±..±.. Tearing off Force Top cover tape F to Base tape The force tearing off cove tape is to grams in the arrow direction under the following conditions Room Temp Room Humidity Room atrn Teaming Speed ( ) (%) (hpa) (mm/min) ~ ~ ~. Notice Storage Transportation. Temperature and humidity conditions: Less than. Products should be handled with care to avoid damag and % RH. contamination from perspiration and skin oils.. Recommended products should be used within months. The use of tweezers or vacuum pick up is strongly form the time of delivery. recommended for individual components.. The packaging material should be kept where no chlorine. Bulk handling should ensure that abrasion and mecha or sulfur exists in the air. shock are minimized. // Copyright -. ll rights reserved.
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