CHIP BEADS. Power Line Series. Dimensions. Features. Applications. General Code. Temperature Range. Typical Material Characteristics.

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1 CHIP EDS DPS-8114 Power Line Series Features High impedance characteristics Low dc, High Current characteristics Good reliability (Monolithic structure) Dimensions L (unit : mm) T Magnetically shielded Fast mounting speed W ohs compliant pplications Size 15 L 1.±.1 W.5±.1 T.5±.1.25±.1 PDP/LCD Monitor, Digital TV/VC etc ±.15.8±.15.8±.15.3±.2 General Code ±.2 3.2± ±.2 1.6±.2.85±.2 1.1±.2.5±.3.5±.3 C P J 61 T ± ± ±.2 3.2± ±.2 1.5±.25.5±.3.5± Series Code C : Chip Ferrite eads Dimension Code The first two digits : length(mm) The last two digits : width(mm) pplication Code G : Signal Line P : High Current Line U : Ultra High Current Line Material Code : General Frequency K,J: Medium Frequency M: High Frequency V: Very High Frequency Impedance Value Code The first two digits represents significant The last digit is the number of zeros following ex) 61 = 6 (Ω) Packaging Code T : eel paper packaging E : eel embossed tape packaging Temperature ange Operating Temp. -55 ~ +125 Storage Temp. -1 ~ +4 Typical Material Characteristics High μ Low μ (Low CP) (High CP) V M J,K SMWH ELECTONICS CO., LTD

2 DPS-8114 CHIP EDS, For Power Line 168 SIE Samwha P/N Impedance (Ω) ±25% DC esistance (Ω) max. ated Current (m) max. Test Frequency (MHz) C168P C168P C168P C168P C168P C168PK C168PK C168PK6 C168PK121 C168PK181 C168PJ3 C168PJ6 C168PJ121 C168PM3 C168PM6 C168PM121 Measuring Equipment CHIP ED, Power Line Series -. : HP4291 / E dc : HP4338 SMWH ELECTONICS CO., LTD

3 DPS-8114 CHIP EDS, For Power Line 168 SIE C 168 P C 168 P C 168 P C 168 P C 168 PK 6 24 C 168 PK C 168 PJ C 168 PJ C 168 PM 3 CHIP ED, Power Line Series C 168 PM 6 4 C 168 PM SMWH ELECTONICS CO., LTD

4 DPS-8114 CHIP EDS, For Power Line 212 SIE Samwha P/N Impedance (Ω) ±25% DC esistance (Ω) max. ated Current (m) max. Test Frequency (MHz) C212P C212P C212P C212P C212P C212P C212P C212PK15 C212PK3 C212PK6 C212PK121 C212PK181 C212PK221 C212PK31 C212PK61 C212PK12 C212PK22 C212PJ CHIP ED, Power Line Series C212PJ C212PM C212PM C212PM C212PM C212PM Measuring Equipment -. : HP4291 / E dc : HP4338 SMWH ELECTONICS CO., LTD

5 DPS-8114 CHIP EDS, For Power Line 212 SIE 2 C 212 P C 212 P 6 16 C 212 P C 212 P C 212 P C 212 PK C 212 PK C 212 PK C 212 PK 12 CHIP ED, Power Line Series C 212 PK C 212 PJ C 212 PJ SMWH ELECTONICS CO., LTD

6 DPS-8114 CHIP EDS, For Power Line 212 SIE 12 C 212 PM 6 4 C 212 PM C 212 PM CHIP ED, Power Line Series SMWH ELECTONICS CO., LTD

7 DPS-8114 CHIP EDS, For Power Line 3216 SIE Samwha P/N Impedance (Ω) ±25% DC esistance (Ω) max. ated Current (m) max. Test Frequency (MHz) C3216P C3216P C3216P C3216P C3216P C3216P C3216P C3216P121 C3216P151 C3216P31 C3216P51 C3216P61 C3216PK51 C3216PK61 C3216PJ61 C3216PM121 C3216PM CHIP ED, Power Line Series Measuring Equipment -. : HP4291 / E dc : HP4338 SMWH ELECTONICS CO., LTD

8 DPS-8114 CHIP EDS, For Power Line 3216 SIE 8 C 3216 P 31 8 C 3216 P 35 8 C 3216 P C 3216 P 11 C 3216 PK C 3216 P C 3216 PM C 3216 P C 3216 PM 61 CHIP ED, Power Line Series SMWH ELECTONICS CO., LTD

9 CHIP EDS DPS-8114 eliability & Test Condition Item equirements Test Conditions Operating temperature range -55 ~ Storage temperature range 4 max., 7% H max. at packing condition Solderability More than 9% of the terminal electrode shall be covered with new solder Preheat temperature : 1 ~ 15 Preheat time : 6 sec. Solder temperature : 245 ± 5 Soldering time : 1 ± 1 sec. esistance to soldering heat eflow soldering High temperature resistance 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than ±3 % More than 5% of the terminal electrode shall be covered with new solder ST ST 1 2 CT CT Preheat temperature : 1 ~ 15 Preheat time : 6 sec. Solder temperature : 27 ± 1 Soldering time : 1 ±.5 sec. Preheat temperature : 15 Preheat time : 6 sec. Solder temperature : 245 ± 5 Soldering time : 1 sec. max. (eflow soldering profile) Temperature : 125 ± 3 Time : 5 ± 12 hours Measurement at room ambient temperature after placing for 24 hours CHIP ED, eliability & Test Condition High temperature load resistance 1. No mechanical damage 2. Impedance shall not change more than ±3 % Temperature : 125 ± 3 pplied current : rated current Time : 1 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Humidity resistance Temperature : 4 ± 2 Humidity : 9 ± 2 % H Time : 5 ± 12 hours Measurement at room ambient temperature after placing for 24 hours SMWH ELECTONICS CO., LTD

10 CHIP EDS DPS-8114 eliability & Test Condition Item equirements Test Conditions Temperature : 4 ± 2 Humidity : 9 ± 2 % H Humidity load resistance pplied current : rated current Time : 5 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Low temperature resistance Thermal shock Vibration Drop Flexure strength 1. No mechanical damage 2. Impedance shall not change more than ±3 % No mechanical damage ITEM 15 (mm) (mm) Temperature : -55 ± 3 Time : 1 ± 12 hours Measurement at room ambient temperature after placing for 24 hours ± 3 for 3 minutes ± 3 for 3 minutes 3. repeat 1 cycle Frequency : 1 ~ 55 Hz mplitude : 1.5 mm Direction :, Y, Sweep time : 2 hours for each axis Drop 1 times on a concrete floor from a height of 1 cm C W.5 CHIP ED, eliability & Test Condition C (mm) W (kgf) W 5 2 ending strength The terminal electrode shall be neither break off nor the chip damage 34 2 mm esistance meter SMWH ELECTONICS CO., LTD

11 CHIP EDS DPS-8114 Packaging Standard Quantity Size Q TY(PCS) 1, 4, 4, 3, 2, 1, emarks.85 T size eel Dimension Φ178±2 D 4±.8 Φ5 min. E 2±.2 (Unit:mm) C Φ13±.5 W 9±1.5 CHIP ED, Packaging Leader & lank Portion (Unit:mm) lank Chips lank Leader 35±5 mm 35±5 mm 6 Pitch 6 Pitch 15 min SMWH ELECTONICS CO., LTD

12 CHIP EDS DPS-8114 Packaging Taping Dimensions (Paper tape) T S P (Unit:mm) Type ± ± Taping Dimensions (Emboss tape) P ± S ± T (Max.) CHIP ED, Packaging (Unit:mm) Type ±.1 ±.1 C ±.1 D ± SMWH ELECTONICS CO., LTD

13 CHIP EDS DPS-8114 Soldering Profile eflow Soldering Pre - heating Soldering Cooling 245± sec. max. Flow Soldering ~12 sec. Pre - heating 3~6 sec. Soldering 25±5 6 sec. min. Cooling CHIP ED, Soldering Profile 6 sec. min. 1 sec. max. 6 sec. min. Manual Soldering 3 Tc Soldering Iron : 3W max. Diameter of soldering iron : 1.2 mm max. 2 sec. max. SMWH ELECTONICS CO., LTD