ADSP-2106x SHARC DSP Microcomputer Family ADSP-21061/ADSP-21061L

Transcription

1 a SUMMARY High Performance Signal Computer for Speech, Sound, Graphics and Imaging Applications Super Harvard Architecture Computer (SHARC) Four Independent Buses for Dual Data, Instructions, and I/O 32-Bit IEEE Floating-Point Computation Units Multiplier, ALU and Shifter 1 Megabit On-Chip SRAM Memory and Integrated I/O Peripherals A Complete System-On-A-Chip Integrated Multiprocessing Features KEY FEATURES 50 MIPS, 20 ns Instruction Rate, Single-Cycle Instruction Execution 120 MFLOPS Peak, 80 MFLOPS Sustained Performance Dual Data Address Generators with Modulo and Bit- Reverse Addressing Efficient Program Sequencing with Zero-Overhead Looping: Single-Cycle Loop Setup IEEE JTAG Standard Test Access Port and On-Chip Emulation 240-Lead MQFP Package 225-Ball Plastic Ball Grid Array (PBGA) CORE PROCESSOR ADSP-2106x SHARC DSP Microcomputer Family ADSP-21061/ADSP-21061L Pin-Compatible with ADSP (4 Mbit) and ADSP (2 Mbit) Flexible Data Formats and 40-Bit Extended Precision 32-Bit Single-Precision and 40-Bit Extended-Precision IEEE Floating-Point Data Formats 32-Bit Fixed-Point Data Format, Integer and Fractional, with 80-Bit Accumulators Parallel Computations Single-Cycle Multiply and ALU Operations in Parallel with Dual Memory Read/Writes and Instruction Fetch Multiply with Add and Subtract for Accelerated FFT Butterfly Computation 1024-Point Complex FFT Benchmark: 0.37 ms (18,221 Cycles) 1 Megabit Configurable On-Chip SRAM Dual-Ported for Independent Access by Core Processor and DMA Configurable as 32K Words Data Memory (32-Bit), 16K Words Program Memory (48-Bit) or Combinations of Both Up to 1 Mbit Off-Chip Memory Interfacing 4-Gigawords Addressable (32-Bit Address) Programmable Wait State Generation, Page-Mode DRAM Support DUAL-PORTED SRAM DAG1 8 x 4 x 32 DAG2 8 x 4 x 24 TIMER PM ADDRESS BUS DM ADDRESS BUS INSTRUCTION CACHE 32 x 48-BIT PROGRAM SEQUEER TWO INDEPENDENT DUAL-PORTED BLOCKS PROCESSOR PORT I/O PORT ADDR DATA DATA ADDR ADDR DATA DATA ADDR IOD 48 BLOCK 0 IOA 17 BLOCK 1 JTAG TEST & EMULATION EXTERNAL PORT ADDR BUS MUX 7 32 BUS CONNECT (PX) PM DATA BUS DM DATA BUS 48 40/32 MULTIPROCESSOR INTERFACE DATA BUS MUX 48 HOST PORT MULTIPLIER DATA REGISTER FILE 16 x 40-BIT BARREL SHIFTER ALU IOP REGISTERS (MEMORY MAPPED) CONTROL, STATUS & DATA BUFFERS I/O PROCESSOR Figure 1. ADSP-21061/ADSP-21061L Block Diagram DMA CONTROLLER SERIAL PORTS (2) SHARC is a registered trademark of Analog Devices, Inc. Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA , U.S.A. Tel: 781/ World Wide Web Site: Fax: 781/ Analog Devices, Inc., 2000

2 DMA Controller 6 DMA Channels Background DMA Transfers at 50 MHz, in Parallel with Full-Speed Processor Execution Performs Transfers Between ADSP Internal Memory and External Memory, External Peripherals, Host Processor, or Serial Ports Host Processor Interface Efficient Interface to 16- and 32-Bit Microprocessors Host can Directly Read/Write ADSP Internal Memory Multiprocessing Glueless Connection for Scalable DSP Multiprocessing Architecture Distributed On-Chip Bus Arbitration for Parallel Bus Connect of Up To Six ADSP-21061s Plus Host 300 Mbytes/s Transfer Rate Over Parallel Bus Serial Ports Two 40 Mbit/s Synchronous Serial Ports Independent Transmit and Receive Functions 3- to 32-Bit Data Word Width -Law/A-Law Hardware Companding TDM Multichannel Mode Multichannel Signaling Protocol TABLE OF CONTENTS GENERAL DESCRIPTION ADSP FAMILY CORE ARCHITECTURE ADSP FEATURES DEVELOPMENT TOOLS ADDITIONAL INFORMATION PIN DESCRIPTIONS TARGET BOARD CONNECTOR FOR EZ-ICE PROBE RECOMMENDED OPERATING CONDITIONS (5 V). 14 ELECTRICAL CHARACTERISTICS (5 V) POWER DISSIPATION ADSP (5 V) RECOMMENDED OPERATING CONDITIONS (3.3 V) 16 ELECTRICAL CHARACTERISTICS (3.3 V) POWER DISSIPATION ADSP-21061L (3.3 V) ABSOLUTE MAXIMUM RATINGS TIMING SPECIFICATIONS Memory Read Bus Master Memory Write Bus Master Synchronous Read/Write Bus Master Synchronous Read/Write Bus Slave Multiprocessor Bus Request and Host Bus Request Asynchronous Read/Write Host to ADSP Three-State Timing Bus Master, Bus Slave, HBR, SBTS DMA Handshake Serial Ports JTAG Test Access Port and Emulation OUTPUT DRIVE CURRENTS POWER DISSIPATION TEST CONDITIONS ENVIRONMENTAL CONDITIONS LEAD METRIC MQFP PIN CONFIGURATIONS.. 42 OUTLINE DIMENSIONS , 44 ADSP-21061L 225-Ball Plastic Ball Grid Array (PBGA) Package Pinout Ball Plastic Ball Grid Array (PBGA) Package Pinout OUTLINE DIMENSIONS ORDERING GUIDE FIGURES Figure 1. ADSP-21061/ADSP-21061L Block Diagram Figure 2. ADSP-21061/ADSP-21061L System Figure 3. Multiprocessing System Figure 4. ADSP-21061/ADSP-21061L Memory Map Figure 5. Target Board Connector For ADSP-21061/ EZ-ICE is a registered trademark of Analog Devices, Inc. 2 ADSP-21061L EZ-ICE Emulator (Jumpers in Place) Figure 6. JTAG Scan Path Connections for Multiple ADSP-21061/ADSP-21061L Systems Figure 7. JTAG Clocktree for Multiple ADSP-21061/ ADSP-21061L Systems Figure 8. Clock Input Figure 9. Reset Figure 10. Interrupts Figure 11. Timer Figure 12. Flags Figure 13. Memory Read Bus Master Figure 14. Memory Write Bus Master Figure 15. Synchronous Read/Write Bus Master Figure 16. Synchronous Read/Write Bus Slave Figure 17. Multiprocessor Bus Request and Host Bus Request Figure 18a. Synchronous REDY Timing Figure 18b. Asynchronous Read/Write Host to ADSP-21061/ADSP-21061L Figure 19a. Three-State Timing (Bus Transition Cycle, SBTS Assertion) Figure 19b. Three-State Timing (Host Transition Cycle).. 31 Figure 20. DMA Handshake Timing Figure 21. Serial Ports Figure 22. External Late Frame Sync Figure 23. JTAG Test Access Port and Emulation Figure 24. Output Enable/Disable Figure 25. Equivalent Device Loading for AC Measurements (Includes All Fixtures) Figure 26. Voltage Reference Levels for AC Measurements (Except Output Enable/Disable) Figure 27. ADSP-2106x Typical Drive Currents (V DD = 5 V) Figure 28. Typical Output Rise Time (10% 90% V DD ) vs. Load Capacitance (V DD = 5 V) Figure 29. Typical Output Rise Time (0.8 V 2.0 V) vs. Load Capacitance (V DD = 5 V) Figure 30. Typical Output Delay or Hold vs. Load Capacitance (at Maximum Case Temperature) (V DD = 5 V) Figure 31. ADSP-2106x Typical Drive Currents (V DD = 3.3 V) Figure 32. Typical Output Rise Time (10% 90% V DD ) vs. Load Capacitance (V DD = 3.3 V) Figure 33. Typical Output Rise Time (0.8 V 2.0 V) vs. Load Capacitance (V DD = 3.3 V) Figure 34. Typical Output Delay or Hold vs. Load Capacitance (at Maximum Case Temperature) (V DD = 3.3 V)

3 S ADSP-21061/ADSP-21061L GENERAL NOTE This data sheet represents production released specifications for the ADSP V and ADSP-21061L 3.3 V processors. ADSP is used throughout this data sheet to refer to both devices unless expressly noted. GENERAL DESCRIPTION The ADSP is a member of the powerful SHARC family of floating point processors. The SHARC Super Harvard Architecture Computer are signal processing microcomputers that offer new capabilities and levels of integration and performance. The ADSP is a 32-bit processor optimized for high performance DSP applications. The ADSP combines the ADSP DSP core with a dual-ported on-chip SRAM and an I/O processor with a dedicated I/O bus to form a complete system-in-a-chip. Fabricated in a high-speed, low-power CMOS process, the ADSP has a 20 ns instruction cycle time operating at up to 50 MIPS. With its on-chip instruction cache, the processor can execute every instruction in a single cycle. Table I shows performance benchmarks for the ADSP-21061/ADSP-21061L. The ADSP SHARC combines a high-performance floating-point DSP core with integrated, on-chip system features, including a 1 Mbit SRAM memory, host processor interface, DMA controller, serial ports and parallel bus connectivity for glueless DSP multiprocessing. Figure 1 shows a block diagram of the ADSP-21061/ADSP L, illustrating the following architectural features: Computation Units (ALU, Multiplier and Shifter) with a Shared Data Register File Data Address Generators (DAG1, DAG2) Program Sequencer with Instruction Cache Interval Timer 1 Mbit On-Chip SRAM External Port for Interfacing to Off-Chip Memory and Peripherals Host Port & Multiprocessor Interface DMA Controller Serial Ports JTAG Test Access Port Figure 2 shows a typical single-processor system. A multiprocessing system is shown in Figure 3. Table I. ADSP-21061/ADSP-21061L Benchmarks (@ 50 MHz) 1024-Pt. Complex FFT 0.37 ms 18,221 Cycles (Radix 4, with Digit Reverse) FIR Filter (per Tap) 20 ns 1 Cycle IIR Filter (per Biquad) 80 ns 4 Cycles Divide (y/x) 120 ns 6 Cycles Inverse Square Root (1/ x) 180 ns 9 Cycles DMA Transfer Rate 300 Mbytes/s 3

4 ADSP FAMILY CORE ARCHITECTURE The ADSP includes the following architectural features of the ADSP family core. The ADSP is code and function compatible with the ADSP-21060/ADSP and the ADSP Independent, Parallel Computation Units The arithmetic/logic unit (ALU), multiplier and shifter all perform single-cycle instructions. The three units are arranged in parallel, maximizing computational throughput. Single multifunction instructions execute parallel ALU and multiplier operations. These computation units support IEEE 32-bit singleprecision floating-point, extended precision 40-bit floatingpoint and 32-bit fixed-point data formats. 1x CLOCK TO 3 4 SERIAL DEVICE (OPTIONAL) SERIAL DEVICE (OPTIONAL) ADSP-21061/ ADSP-21061L CLKIN EBOOT LBOOT IRQ 2-0 FLAG 3-0 TIMEXP TCLK0 RCLK0 TFS0 RSF0 DT0 DR0 TCLK1 RCLK1 TFS1 RSF1 DT1 DR1 RPBA ID 2-0 RESET JTAG BMS ADDR 31-0 DATA 47-0 RD WR ACK MS 3-0 PAGE SBTS SW ADRCLK DMAR 1-2 DMAG 1-2 CS HBR HBG REDY BR 1-6 CPA 7 CONTROL ADDRESS DATA CS BOOT ADDR EPROM DATA (OPTIONAL) ADDR DATA MEMORY AND OE PERIPHERALS WE (OPTIONAL) ACK CS DMA DEVICE (OPTIONAL) DATA HOST PROCESSOR INTERFACE (OPTIONAL) ADDR DATA Figure 2. ADSP-21061/ADSP-21061L System Data Register File A general purpose data register file is used for transferring data between the computation units and the data buses, and for storing intermediate results. This 10-port, 32-register (16 primary, 16 secondary) register file, combined with the ADSP Harvard architecture, allows unconstrained data flow between computation units and internal memory. Single-Cycle Fetch of Instruction and Two Operands The ADSP features an enhanced Harvard architecture in which the data memory (DM) bus transfers data and the program memory (PM) bus transfers both instructions and data (see Figure 1). With its separate program and data memory buses and on-chip instruction cache, the processor can simultaneously fetch two operands and an instruction (from the cache), all in a single cycle. Instruction Cache The ADSP includes an on-chip instruction cache that enables three-bus operation for fetching an instruction and two data values. The cache is selective only the instructions whose fetches conflict with PM bus data accesses are cached. This allows full-speed execution of core, looped operations such as digital filter multiply-accumulates and FFT butterfly processing. Data Address Generators with Hardware Circular Buffers The ADSP s two data address generators (DAGs) implement circular data buffers in hardware. Circular buffers allow efficient programming of delay lines and other data structures required in digital signal processing, and are commonly used in digital filters and Fourier transforms. The ADSP two DAGs contain sufficient registers to allow the creation of up to 32 circular buffers (16 primary register sets, 16 secondary). The DAGs automatically handle address pointer wraparound, reducing overhead, increasing performance and simplifying implementation. Circular buffers can start and end at any memory location. Flexible Instruction Set The 48-bit instruction word accommodates a variety of parallel operations, for concise programming. For example, the ADSP can conditionally execute a multiply, an add, a subtract and a branch, all in a single instruction. ADSP FEATURES Augmenting the ADSP family core, the ADSP adds the following architectural features: Dual-Ported On-Chip Memory The ADSP contains 1 megabit of on-chip SRAM, organized as two banks of 0.5 Mbits each. Each bank has eight 16- bit columns with 4K 16-bit words per column. Each memory block is dual-ported for single-cycle, independent accesses by the core processor and I/O processor or DMA controller. The dual-ported memory and separate on-chip buses allow two data transfers from the core and one from I/O, all in a single cycle (see Figure 4 for the ADSP Memory Map). On the ADSP-21061, the memory can be configured as a maximum of 32K words of 32-bit data, 64K words for 16-bit data, 16K words of 48-bit instructions (and 40-bit data) or combinations of different word sizes up to 1 megabit. All the memory can be accessed as 16-bit, 32-bit or 48-bit. A 16-bit floating-point storage format is supported that effectively doubles the amount of data that may be stored on chip. Conversion between the 32-bit floating-point and 16-bit floatingpoint formats is done in a single instruction. While each memory block can store combinations of code and data, accesses are most efficient when one block stores data, using the DM bus for transfers, and the other block stores instructions and data, using the PM bus for transfers. Using the DM and PM buses in this way, with one dedicated to each memory block, assures single-cycle execution with two data transfers. In this case, the instruction must be available in the cache. Single-cycle execution is also maintained when one of the data operands is transferred to or from off-chip, via the ADSP s external port. 4

5 Off-Chip Memory and Peripherals Interface The ADSP s external port provides the processor s interface to off-chip memory and peripherals. The 4-gigaword offchip address space is included in the ADSP s unified address space. The separate on-chip buses for program memory, data memory and I/O are multiplexed at the external port to create an external system bus with a single 32-bit address bus and a single 48-bit (or 32-bit) data bus. The on-chip Super Harvard Architecture provides three-bus performance, while the off-chip unified address space gives flexibility to the designer. Addressing of external memory devices is facilitated by on-chip decoding of high order address lines to generate memory bank select signals. Separate control lines are also generated for simplified addressing of page-mode DRAM. The ADSP provides programmable memory wait states and external memory acknowledge controls to allow interfacing to DRAM and peripherals with variable access, hold and disable time requirements. Host Processor Interface The ADSP s host interface allows easy connection to standard microprocessor buses, both 16-bit and 32-bit, with little additional hardware required. Asynchronous transfers at speeds up to the full clock rate of the processor are supported. The host interface is accessed through the ADSP s external port and is memory-mapped into the unified address space. Two channels of DMA are available for the host interface; code and data transfers are accomplished with low software overhead. The host processor requests the ADSP s external bus with the host bus request (HBR), host bus grant (HBG) and ready (REDY) signals. The host can directly read and write the internal memory of the ADSP-21061, and can access the DMA channel setup and mailbox registers. Vector interrupt support is provided for efficient execution of host commands. DMA Controller The ADSP s on-chip DMA controller allows zerooverhead, nonintrusive data transfers without processor intervention. The DMA controller operates independently and invisibly to the processor core, allowing DMA operations to occur while the core is simultaneously executing its program instructions. DMA transfers can occur between the ADSP s internal memory and either external memory, external peripherals, or a host processor. DMA transfers can also occur between the ADSP s internal memory and its serial ports. DMA transfers between external memory and external peripheral devices are another option. External bus packing to 16-, 32- or 48-bit words is performed during DMA transfers. Six channels of DMA are available on the ADSP four via the serial ports, and two via the processor s external port (for either host processor, other ADSP-21061s, memory or I/O transfers). Programs can be downloaded to the ADSP using DMA transfers. Asynchronous off-chip peripherals can control two DMA channels using DMA Request/Grant lines (DMAR 1-2, DMAG 1-2 ). Other DMA features include interrupt generation upon completion of DMA transfers and DMA chaining for automatic linked DMA transfers. Serial Ports The ADSP features two synchronous serial ports that provide an inexpensive interface to a wide variety of digital and mixed-signal peripheral devices. The serial ports can operate at the full clock rate of the processor, providing each with a maximum data rate of 40 Mbit/s. Independent transmit and receive functions provide greater flexibility for serial communications. Serial port data can be automatically transferred to and from on-chip memory via DMA. Each of the serial ports offers TDM multichannel mode. The serial ports can operate with little-endian or big-endian transmission formats, with word lengths selectable from three bits to 32 bits. They offer selectable synchronization and transmit modes as well as optional µ-law or A-law companding. Serial port clocks and frame syncs can be internally or externally generated. The serial ports also include keyword and keymask features to enhance interprocessor communication. Multiprocessing The ADSP offers powerful features tailored to multiprocessing DSP systems. The unified address space allows direct interprocessor accesses of each ADSP s internal memory. Distributed bus arbitration logic is included on-chip for simple, glueless connection of systems containing up to six ADSP-21061s and a host processor. Master processor changeover incurs only one cycle of overhead. Bus arbitration is selectable as either fixed or rotating priority. Bus lock allows indivisible read-modifywrite sequences for semaphores. A vector interrupt is provided for interprocessor commands. Maximum throughput for interprocessor data transfer is 500 Mbytes/sec over the external port. Broadcast writes allow simultaneous transmission of data to all ADSP-21061s and can be used to implement reflective semaphores. Program Booting The internal memory of the ADSP can be booted at system power-up from either an 8-bit EPROM or a host processor. Selection of the boot source is controlled by the BMS (Boot Memory Select), EBOOT (EPROM Boot), and LBOOT (Host Boot) pins. 32-bit and 16-bit host processors can be used for booting. See the BMS pin in the Pin Function Descriptions section of this data sheet. 5

6 ADSP-2106x #6 ADSP-2106x #5 ADSP-2106x #4 ADSP-2106x #3 CONTROL ADDRESS DATA CLKIN ADDR 31-0 RESET DATA 47-0 RPBA ID 2-0 CONTROL CPA BR 1-2, BR 4-6 BR 3 5 ADSP-2106x #2 CLKIN ADDR 31-0 RESET DATA 47-0 RPBA ID 2-0 CONTROL CPA BR 1, BR 3-6 BR 2 5 1x CLOCK RESET ADSP-2106x #1 CLKIN RESET RPBA ID 2-0 ADDR 31-0 DATA 47-0 RD WR ACK MS 3-0 CONTROL ADDRESS DATA ADDR DATA OE WE ACK CS GLOBAL MEMORY AND PERIPHERALS (OPTIONAL) CONTROL BMS PAGE SBTS SW ADRCLK CS HBR HBG REDY CPA BR 2-6 BR 1 5 CS ADDR DATA BOOT EPROM (OPTIONAL) HOST PROCESSOR INTERFACE (OPTIONAL) ADDR DATA Figure 3. Multiprocessing System 6

7 INTERNAL MEMORY SPACE MULTIPROCESSOR MEMORY SPACE IOP REGISTERS NORMAL WORD ADDRESSING SHORT WORD ADDRESSING INTERNAL MEMORY SPACE OF ADSP-2106x WITH ID=001 INTERNAL MEMORY SPACE OF ADSP-2106x WITH ID=010 INTERNAL MEMORY SPACE OF ADSP-2106x WITH ID=011 INTERNAL MEMORY SPACE OF ADSP-2106x WITH ID=100 INTERNAL MEMORY SPACE OF ADSP-2106x WITH ID=101 INTERNAL MEMORY SPACE OF ADSP-2106x WITH ID=110 BROADCAST WRITE TO ALL ADSP-2106xs 0x x x x x x x x x x x003F FFFF EXTERNAL MEMORY SPACE BANK 0 DRAM (OPTIONAL) BANK 1 BANK 2 BANK 3 NONBANKED 0x MS 0 MS 1 MS 2 MS 3 BANK SIZE IS SELECTED BY MSIZE BIT FIELD OF SYSCON REGISTER. NORMAL WORD ADDRESSING: 32-BIT DATA WORDS 48-BIT INSTRUCTION WORDS SHORT WORD ADDRESSING: 16-BIT DATA WORDS 0xFFFF FFFF Figure 4. ADSP-21061/ADSP-21061L Memory Map 7

8 Porting Code from ADSP or ADSP to the ADSP The ADSP is pin compatible with the ADSP-21060/ ADSP-21061/ADSP processors. The ADSP pins that correspond to the Link Port pins of the ADSP-21060/ ADSP are no-connects. The ADSP is object code compatible with the ADSP /ADSP except for the following functional changes: The ADSP memory is organized into two blocks with eight columns that are 4K deep per block. The ADSP-21060/ADSP memory has 16 columns per block. Link port functions are not available. Handshake external port DMA pins DMAR2 and DMAG2 are assigned to external port DMA Channel 6 instead of Channel 8. 2-D DMA capability of the SPORT is not available. The modify registers in SPORT DMA are not programmable. On the ADSP-21061, Block 0 starts at the beginning of internal memory, normal word address 0x Block 1 starts at the end of Block 0, with contiguous addresses. The remaining addresses in internal memory are divided into blocks that alias into Block 1. This allows any code or data stored in Block 1 on the ADSP to retain the same addresses on the ADSP these addresses will alias into the actual Block 1 of each processor. If you develop your application using the ADSP-21062, but will migrate to the ADSP-21061, use only the first eight columns of each memory bank. Limit your application to 8K of instructions or up to 16K of data in each bank of the ADSP-21062, or any combinations of instructions or data that does not exceed the memory bank. DEVELOPMENT TOOLS The ADSP is supported with a complete set of software and hardware development tools, including an EZ-ICE In- Circuit Emulator, EZ-Kit Lite, and development software. The SHARC EZ-Kit Lite (ADDS-2106x-EZ-Lite) is a complete low cost package for DSP evaluation and prototyping. The EZ-Kit Lite contains an evaluation board with an ADSP (5 V) processor and provides a serial connection to your PC. The EZ- Kit Lite also includes an optimizing compiler, assembler, instruction level simulator, run-time libraries, diagnostic utilities and a complete set of example programs. The same EZ-ICE hardware can be used for the ADSP-21060/ ADSP-21062, to fully emulate the ADSP-21061, with the exception of displaying and modifying the two new SPORTS registers. The emulator will not display these two registers, but your code can use them. Analog Devices ADSP Family Development Software includes an easy to use Assembler based on an algebraic syntax, Assembly Library/Librarian, Linker, instruction-level Simulator, an ANSI C optimizing Compiler, the CBUG C Source Level Debugger and a C Runtime Library including DSP and mathematical functions. The Optimizing Compiler includes Numerical C extensions based on the work of the ANSI Numerical C Extensions Group. Numerical C provides extensions to the C language for array selections, vector math operations, complex data types, circular pointers and variably dimensioned arrays. The ADSP Family Development Software is available for both the PC and Sun platforms. The EZ-ICE Emulator uses the IEEE JTAG test access port of the ADSP processor to monitor and control the target board processor during emulation. The EZ-ICE provides full-speed emulation, allowing inspection and modification of memory, registers, and processor stacks. Nonintrusive in-circuit emulation is assured by the use of the processor s JTAG interface the emulator does not affect target system loading or timing. Further details and ordering information are available in the ADSP Family Hardware and Software Development Tools data sheet (ADDS-210xx-TOOLS). This data sheet can be requested from any Analog Devices sales office or distributor. In addition to the software and hardware development tools available from Analog Devices, third parties provide a wide range of tools supporting the SHARC processor family. Hardware tools include SHARC PC plug-in cards multiprocessor SHARC VME boards, and daughter and modules with multiple SHARCs and additional memory. These modules are based on the SHARCPAC module specification. Third Party software tools include an Ada compiler, DSP libraries, operating systems and block diagram design tools. ADDITIONAL INFORMATION This data sheet provides a general overview of the ADSP architecture and functionality. For detailed information on the ADSP Family core architecture and instruction set, refer to the ADSP-2106x SHARC User s Manual, Second Edition. CBUG and SHARCPAC are trademarks of Analog Devices, Inc. 8

9 PIN DESCRIPTIONS ADSP pin definitions are listed below. Inputs identified as synchronous (S) must meet timing requirements with respect to CLKIN (or with respect to TCK for TMS, TDI). Inputs identified as asynchronous (A) can be asserted asynchronously to CLKIN (or to TCK for TRST). Unused inputs should be tied or pulled to IVDD or I, except for ADDR 31-0, DATA 47-0, FLAG 3-0, SW and inputs that have internal pull-up or pull-down resistors (CPA, ACK, DTx, DRx, TCLKx, RCLKx, TMS and TDI) these pins can be left floating. These pins have a logic-level hold circuit that prevents the input from floating internally. I = Input S = Synchronous P = Power Supply (O/D) = Open Drain O = Output A = Asynchronous G = Ground (A/D) = Active Drive T = Three-State (when SBTS is asserted, or when the ADSP-2106x is a bus slave) Pin Type Function PIN FUTION DESCRIPTIONS ADDR 31-0 I/O/T External Bus Address. The ADSP outputs addresses for external memory and peripherals on these pins. In a multiprocessor system the bus master outputs addresses for read/writes of the internal memory or IOP registers of other ADSP-2106xs. The ADSP inputs addresses when a host processor or multiprocessing bus master is reading or writing its internal memory or IOP registers. DATA 47-0 I/O/T External Bus Data. The ADSP inputs and outputs data and instructions on these pins. The external data bus transfers 32-bit single-precision floating-point data and 32-bit fixed-point data over Bits bit extended-precision floating-point data is transferred over Bits 47-8 of the bus. 16-bit short word data is transferred over Bits of the bus. Pull-up resistors on unused DATA pins are not necessary. MS 3-0 O/T Memory Select Lines. These lines are asserted (low) as chip selects for the corresponding banks of external memory. Memory bank size must be defined in the ADSP s system control register (SYSCON). The MS 3-0 lines are decoded memory address lines that change at the same time as the other address lines. When no external memory access is occurring the MS 3-0 lines are inactive; they are active, however, when a conditional memory access instruction is executed, whether or not the condition is true. MS 0 can be used with the PAGE signal to implement a bank of DRAM memory (Bank 0). In a multiprocessor system the MS 3-0 lines are output by the bus master. RD I/O/T Memory Read Strobe. This pin is asserted (low) when the ADSP reads from external memory devices or from the internal memory of other ADSP-21061s. External devices (including other ADSP-21061s) must assert RD to read from the ADSP s internal memory. In a multiprocessor system RD is output by the bus master and is input by all other ADSP-21061s. WR I/O/T Memory Write Strobe. This pin is asserted (low) when the ADSP writes to external memory devices or to the internal memory of other ADSP-21061s. External devices must assert WR to write to the ADSP s internal memory. In a multiprocessor system WR is output by the bus master and is input by all other ADSP-21061s. PAGE O/T DRAM Page Boundary. The ADSP asserts this pin to signal that an external DRAM page boundary has been crossed. DRAM page size must be defined in the ADSP s memory control register (WAIT). DRAM can only be implemented in external memory Bank 0; the PAGE signal can only be activated for Bank 0 accesses. In a multiprocessor system PAGE is output by the bus master. ADRCLK O/T Address Clock for synchronous external memories. Addresses on ADDR 31-0 are valid before the rising edge of ADRCLK. In a multiprocessing system ADRCLK is output by the bus master. SW I/O/T Synchronous Write Select. This signal is used to interface the ADSP-2106x to synchronous memory devices (including other ADSP-21061s). The ADSP asserts SW (low) to provide an early indication of an impending write cycle, which can be aborted if WR is not later asserted (e.g. in a conditional write instruction). In a multiprocessor system, SW is output by the bus master and is input by all other ADSP-21061s to determine if the multiprocessor memory access is a read or write. SW is asserted at the same time as the address output. A host processor using synchronous writes must assert this pin when writing to the ADSP-21061(s). ACK I/O/S Memory Acknowledge. External devices can deassert ACK (low) to add wait states to an external memory access. ACK is used by I/O devices, memory controllers or other peripherals to hold off completion of an external memory access. The ADSP deasserts ACK as an output to add wait states to a synchronous access of its internal memory. In a multiprocessor system, a slave ADSP deasserts the bus master s ACK input to add wait state(s) to an access of its internal memory. The bus master has a keeper latch on its ACK pin that maintains the input at the level it was last driven to. 9

10 Pin Type Function SBTS I/S Suspend Bus Three-State. External devices can assert SBTS (low) to place the external bus address, data, selects, and strobes in a high impedance state for the following cycle. If the ADSP attempts to access external memory while SBTS is asserted, the processor will halt and the memory access will not be completed until SBTS is deasserted. SBTS should only be used to recover from PAGE faults or host processor/adsp deadlock. IRQ 2-0 I/A Interrupt Request Lines. May be either edge-triggered or level-sensitive. FLAG 3-0 I/O/A Flag Pins. Each is configured via control bits as either an input or an output. As an input, it can be tested as a condition. As an output, it can be used to signal external peripherals. TIMEXP O Timer Expired. Asserted for four cycles when the timer is enabled and TCOUNT decrements to zero. HBR I/A Host Bus Request. Must be asserted by a host processor to request control of the ADSP s external bus. When HBR is asserted in a multiprocessing system, the ADSP that is bus master will relinquish the bus and assert HBG. To relinquish the bus, the ADSP places the address, data, select, and strobe lines in a high impedance state. HBR has priority over all ADSP bus requests (BR 6-1 ) in a multiprocessing system. HBG I/O Host Bus Grant. Acknowledges an HBR bus request, indicating that the host processor may take control of the external bus. HBG is asserted (held low) by the ADSP until HBR is released. In a multiprocessing system, HBG is output by the ADSP bus master and is monitored by all others. CS I/A Chip Select. Asserted by host processor to select the ADSP REDY (O/D) O Host Bus Acknowledge. The ADSP-2106x deasserts REDY (low) to add wait states to an asynchronous access of its internal memory or IOP registers by a host. Open drain output (O/D) by default; can be programmed in ADREDY bit of SYSCON register to be active drive (A/D). REDY will only be output if the CS and HBR inputs are asserted. DMAR1 I/A DMA Request 1 (DMA Channel 7). DMAR2 I/A DMA Request 2 (DMA Channel 6). DMAG1 O/T DMA Grant 1 (DMA Channel 7). DMAG2 O/T DMA Grant 2 (DMA Channel 6). BR 6-1 I/O/S Multiprocessing Bus Requests. Used by multiprocessing ADSP-21061s to arbitrate for bus mastership. An ADSP only drives its own BRx line (corresponding to the value of its ID 2-0 inputs) and monitors all others. In a multiprocessor system with less than six ADSP-21061s, the unused BRx pins should be tied high; the processor s own BRx line must not be tied high or low because it is an output. ID 2-0 I Multiprocessing ID. Determines which multiprocessing bus request (BR1 BR6) is used by ADSP ID = 001 corresponds to BR1, ID = 010 corresponds to BR2, etc. ID = 000 in single-processor systems. These lines are a system configuration selection which should be hardwired or only changed at reset. RPBA I/S Rotating Priority Bus Arbitration Select. When RPBA is high, rotating priority for multiprocessor bus arbitration is selected. When RPBA is low, fixed priority is selected. This signal is a system configuration selection which must be set to the same value on every ADSP If the value of RPBA is changed during system operation, it must be changed in the same CLKIN cycle on every ADSP CPA (O/D) I/O Core Priority Access. Asserting its CPA pin allows the core processor of an ADSP bus slave to interrupt background DMA transfers and gain access to the external bus. CPA is an open drain output that is connected to all ADSP-2106Ls in the system. The CPA pin has an internal 5 kω pull-up resistor. If core access priority is not required in a system, the CPA pin should be left unconnected. DTx O Data Transmit (Serial Ports 0, 1). Each DT pin has a 50 kω internal pull-up resistor. DRx I Data Receive (Serial Ports 0, 1). Each DR pin has a 50 kω internal pull-up resistor. TCLKx I/O Transmit Clock (Serial Ports 0, 1). Each TCLK pin has a 50 kω internal pull-up resistor. RCLKx I/O Receive Clock (Serial Ports 0, 1). Each RCLK pin has a 50 kω internal pull-up resistor. 10

11 Pin Type Function TFSx I/O Transmit Frame Sync (Serial Ports 0, 1). RFSx I/O Receive Frame Sync (Serial Ports 0, 1). EBOOT I EPROM Boot Select. When EBOOT is high, the ADSP is configured for booting from an 8- bit EPROM. When EBOOT is low, the LBOOT and BMS inputs determine booting mode. See table below. This signal is a system configuration selection which should be hardwired. LBOOT I Link Boot Must be tied to. BMS I/O/T* Boot Memory Select. Output: Used as chip select for boot EPROM devices (when EBOOT = 1, LBOOT = 0). In a multiprocessor system, BMS is output by the bus master. Input: When low, indicates that no booting will occur and that ADSP will begin executing instructions from external memory. See table below. This input is a system configuration selection which should be hardwired. *Three-statable only in EPROM boot mode (when BMS is an output). EBOOT LBOOT BMS Booting Mode 1 0 Output EPROM (Connect BMS to EPROM chip select.) (Input) Host Processor (Input) No Booting. Processor executes from external memory. CLKIN I Clock In. External clock input to the ADSP The instruction cycle rate is equal to CLKIN. CLKIN may not be halted, changed, or operated below the specified frequency. RESET I/A Processor Reset. Resets the ADSP to a known state and begins execution at the program memory location specified by the hardware reset vector address. This input must be asserted (low) at power-up. TCK I Test Clock (JTAG). Provides an asynchronous clock for JTAG boundary scan. TMS I/S Test Mode Select (JTAG). Used to control the test state machine. TMS has a 20 kω internal pull-up resistor. TDI I/S Test Data Input (JTAG). Provides serial data for the boundary scan logic. TDI has a 20 kω internal pull-up resistor. TDO O Test Data Output (JTAG). Serial scan output of the boundary scan path. TRST I/A Test Reset (JTAG). Resets the test state machine. TRST must be asserted (pulsed low) after powerup or held low for proper operation of the ADSP TRST has a 20 kω internal pull-up resistor. EMU O Emulation Status. Must be connected to the ADSP EZ-ICE target board connector only. ICSA O Reserved, leave unconnected. VDD P Power Supply; nominally +3.3 V dc for ADSP-21061L, +5.0 V dc for ADSP G Power Supply Return. Do Not Connect. Reserved pins which must be left open and unconnected. 11

12 TARGET BOARD CONNECTOR FOR EZ-ICE PROBE The ADSP-2106x EZ-ICE Emulator uses the IEEE JTAG test access port of the ADSP-2106x to monitor and control the target board processor during emulation. The EZ-ICE probe requires the ADSP-2106x s CLKIN, TMS, TCK, TRST, TDI, TDO, EMU, and signals be made accessible on the target system via a 14-pin connector (a 2 row 7 pin strip header) such as that shown in Figure 5. The EZ-ICE probe plugs directly onto this connector for chip-on-board emulation. You must add this connector to your target board design if you intend to use the ADSP-2106x EZ-ICE. The total trace length between the EZ-ICE connector and the furthest device sharing the EZ-ICE JTAG pins should be limited to 15 inches maximum for guaranteed operation. This length restriction must include EZ-ICE JTAG signals that are routed to one or more ADSP-2106x devices, or a combination of ADSP- 2106x devices and other JTAG devices on the chain. KEY (NO PIN) BTMS BTCK BTRST BTDI TOP VIEW EMU CLKIN (OPTIONAL) TMS TCK TRST TDI TDO Figure 5. Target Board Connector For ADSP-21061/ADSP L EZ-ICE Emulator (Jumpers in Place) The 14-pin, 2-row pin strip header is keyed at the Pin 3 location Pin 3 must be removed from the header. The pins must be inch square and at least 0.20 inch in length. Pin spacing should be inches. Pin strip headers are available from vendors such as 3M, McKenzie and Samtec. The BTMS, BTCK, BTRST and BTDI signals are provided so the test access port can also be used for board-level testing. When the connector is not being used for emulation, place jumpers between the Bxxx pins and the xxx pins. If the test access port will not be used for board testing, tie BTRST to and tie or pull BTCK up to VDD. The TRST pin must be asserted after power-up (through BTRST on the connector) or held low for proper operation of the ADSP-2106x. None of the Bxxx pins (Pins 5, 7, 9, 11) are connected on the EZ-ICE probe. The JTAG signals are terminated on the EZ-ICE probe as follows: Signal Termination TMS Driven through 22 Ω Resistor (16 ma Driver) TCK Driven at 10 MHz through 22 Ω Resistor (16 ma Driver) TRST* Active Low Driven through 22 Ω Resistor (16 ma Driver) (Pulled Up by On-Chip 20 kω Resistor) TDI Driven by 22 Ω Resistor (16 ma Driver) TDO One TTL Load, Split Termination (160/220) CLKIN One TTL Load, Split Termination (160/220) EMU Active Low 4.7 kω Pull-Up Resistor, One TTL Load (Open-Drain Output from the DSP) *TRST is driven low until the EZ-ICE probe is turned on by the emulator at software start-up. After software start-up, TRST is driven high. Figure 6 shows JTAG scan path connections for systems that contain multiple ADSP-2106x processors. ADSP-2106x #1 JTAG DEVICE (OPTIONAL) ADSP-2106x #n TDI TDI TDO TDI TDO TDI TDO EZ-ICE JTAG CONNECTOR TCK TMS EMU TRST TCK TMS TRST TCK TMS EMU TRST OTHER JTAG CONTROLLER TCK TMS EMU TRST TDO CLKIN OPTIONAL Figure 6. JTAG Scan Path Connections for Multiple ADSP-21061/ADSP-21061L Systems 12

13 Connecting CLKIN to Pin 4 of the EZ-ICE header is optional. The emulator only uses CLKIN when directed to perform operations such as starting, stopping and single-stepping multiple ADSP-2106x in a synchronous manner. If you do not need these operations to occur synchronously on the multiple processors, simply tie Pin 4 of the EZ-ICE header to ground. If synchronous multiprocessor operations are needed and CLKIN is connected, clock skew between the multiple ADSP x processors and the CLKIN pin on the EZ-ICE header must be minimal. If the skew is too large, synchronous operations may be off by one or more cycles between processors. For synchronous multiprocessor operation TCK, TMS, CLKIN and EMU should be treated as critical signals in terms of skew, and should be laid out as short as possible on your board. If TCK, TMS and CLKIN are driving a large number of ADSP-2106x (more than eight) in your system, then treat them as a clock tree using multiple drivers to minimize skew. (See Figure 7, JTAG Clock Tree, and Clock Distribution in the High Frequency Design Considerations section of the ADSP-2106x User s Manual, Second Edition.) If synchronous multiprocessor operations are not needed (i.e., CLKIN is not connected), just use appropriate parallel termination on TCK and TMS. TDI, TDO, EMU and TRST are not critical signals in terms of skew. For complete information on the SHARC EZ-ICE, see the ADSP Family JTAG EZ-ICE User s Guide and Reference. TDI TDO TDI TDO TDI TDO * 5k TDI TDO TDI TDO TDI TDO TDI EMU TCK TMS * 5k TRST TDO CLKIN *OPEN DRAIN DRIVER OR EQUIVALENT, i.e., EMU SYSTEM CLKIN Figure 7. JTAG Clocktree for Multiple ADSP-21061/ADSP-21061L Systems 13

14 ADSP SPECIFICATIONS RECOMMENDED OPERATING CONDITIONS (5 V) K Grade Parameter Test Conditions Min Max Unit V DD Supply Voltage V T CASE Case Operating Temperature C V IH1 High Level Input Voltage V DD = max 2.0 V DD V V IH2 High Level Input Voltage V DD = max 2.2 V DD V V IL Low Level Input Voltage 1, V DD = min V NOTES 1 Applies to input and bidirectional pins: DATA 47-0, ADDR 31-0, RD, WR, SW, ACK, SBTS, IRQ 2-0, FLAG 3-0, HBG, CS, DMAR1, DMAR2, BR 6-1, ID 2-0, RPBA, CPA, TFS0, TFS1, RFS0, RFS1, LxDAT 3-0, LxCLK, LxACK, EBOOT, LBOOT, BMS, TMS, TDI, TCK, HBR, DR0, DR1, TCLK0, TCLK1, RCLK0, RCLK1. 2 Applies to input pins: CLKIN, RESET, TRST. ELECTRICAL CHARACTERISTICS (5 V) Parameter Test Conditions Min Max Unit V OH High Level Output Voltage V DD = min, I OH = 2.0 ma V V OL Low Level Output Voltage V DD = min, I OL = 4.0 ma V I IH High Level Input Current 3, V DD = max, V IN = V DD max 10 µa I IL Low Level Input Current V DD = max, V IN = 0 V 10 µa I ILP Low Level Input Current V DD = max, V IN = 0 V 150 µa I OZH Three-State Leakage Current 5, 6, 7, V DD = max, V IN = V DD max 10 µa I OZL Three-State Leakage Current 5, V DD = max, V IN = 0 V 10 µa I OZHP Three-State Leakage Current V DD = max, V IN = V DD max 350 µa I OZLC Three-State Leakage Current V DD = max, V IN = 0 V 1.5 ma I OZLA Three-State Leakage Current V DD = max, V IN = 1.5 V 350 µa I OZLAR Three-State Leakage Current V DD = max, V IN = 0 V 4.2 ma I OZLS Three-State Leakage Current V DD = max, V IN = 0 V 150 µa C IN Input Capacitance 11, 12 f IN = 1 MHz, T CASE = 25 C, V IN = 2.5 V 4.7 pf NOTES 11 Applies to output and bidirectional pins: DATA 47-0, ADDR 31-0, MS 3-0, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG 3-0, TIMEXP, HBG, REDY, DMAG1, DMAG2, BR 6-1, CPA, DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT 3-0, LxCLK, LxACK, BMS, TDO, EMU, ICSA. 12 See Output Drive Currents section for typical drive current capabilities. 13 Applies to input pins: ACK SBTS, IRQ 2-0, HBR, CS, DMAR1, DMAR2, ID 2-0, RPBA, EBOOT, LBOOT, CLKIN, RESET, TCK. Note that ACK is pulled up internally with 2 kω during reset in a multiprocessor system, when ID2 0 = 001 and another ADSP-2106x is not requesting bus mastership.) 14 Applies to input pins with internal pull-ups: DR0, DR1, TRST, TMS, TDI. 15 Applies to three-statable pins: DATA 47-0, ADDR 31-0, MS 3-0, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG 3-0, REDY, HBG, DMAG1, DMAG2, BMS, BR 6 1, TFS X, RFS X, TDO, EMU. (Note that ACK is pulled up internally with 2 kω during reset in a multiprocessor system, when ID 2-0 = 001 and another ADSP-2106x is not requesting bus mastership.) 16 Applies to three-statable pins with internal pull-ups: DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1. 17 Applies to CPA pin. 18 Applies to ACK pin when pulled up. (Note that ACK is pulled up internally with 2 kω during reset in a multiprocessor system, when ID 2-0 = 001 and another ADSP-21061x is not requesting bus mastership). 19 Applies to three-statable pins with internal pull-downs: LxDAT 3-0, LxCLK, LxACK. 10 Applies to ACK pin when keeper latch enabled. 11 Applies to all signal pins. 12 Guaranteed but not tested. Specifications subject to change without notice. 14

15 POWER DISSIPATION ADSP (5 V) These specifications apply to the internal power portion of V DD only. See the Power Dissipation section of this data sheet for calculation of external supply current and total supply current. For a complete discussion of the code used to measure power dissipation, see the technical note SHARC Power Dissipation Measurements. Specifications are based on the following operating scenarios: Operation Peak Activity (I DDINPEAK ) High Activity (I DDINHIGH ) Low Activity (I DDINLOW ) Instruction Type Multifunction Multifunction Single Function Instruction Fetch Cache Internal Memory Internal Memory Core Memory Access 2 per Cycle (DM and PM) 1 per Cycle (DM) None Internal Memory DMA 1 per Cycle 1 per 2 Cycles 1 per 2 Cycles To estimate power consumption for a specific application, use the following equation where % is the amount of time your program spends in that state: %PEAK I DDINPEAK + %HIGH I DDINHIGH + %LOW I DDINLOW + %IDLE I DDIDLE + %IDLE16 I DDIDLE16 = power consumption Parameter Test Conditions Max Unit I DDINPEAK Supply Current (Internal) 1 t CK = 30 ns, V DD = max 595 ma t CK = 25 ns, V DD = max 680 ma t CK = 20 ns, V DD = max 850 ma I DDINHIGH Supply Current (Internal) 2 t CK = 30 ns, V DD = max 460 ma t CK = 25 ns, V DD = max 540 ma t CK = 20 ns, V DD = max 670 ma I DDINLOW Supply Current (Internal) 3 t CK = 30 ns, V DD = max 270 ma t CK = 25 ns, V DD = max 320 ma t CK = 20 ns, V DD = max 390 ma I DDIDLE Supply Current (Idle) 4 V DD = max 200 ma I DDIDLE16 Supply Current (Idle16) 5 V DD = max 55 ma NOTES 1 The test program used to measure I DDINPEAK represents worst case processor operation and is not sustainable under normal application conditions. Actual internal power measurements made using typical applications are less than specified. 2 I DDINHIGH is a composite average based on a range of high activity code. 3 I DDINLOW is a composite average based on a range of low activity code. 4 Idle denotes ADSP state during execution of IDLE instruction. 5 Idle16 denotes ADSP state during execution of IDLE16 instruction. 15

16 ADSP-21061L SPECIFICATIONS RECOMMENDED OPERATING CONDITIONS (3.3 V) A Grade K Grade Parameter Test Conditions Min Max Min Max Unit V DD Supply Voltage V T CASE Case Operating Temperature C V IH1 High Level Input Voltage V DD = max 2.0 V DD V DD V V IH2 High Level Input Voltage V DD = max 2.2 V DD V DD V V IL Low Level Input Voltage 1, V DD = min V NOTES 1 Applies to input and bidirectional pins: DATA 47-0, ADDR 31-0, RD, WR, SW, ACK, SBTS, IRQ 2-0, FLAG 3-0, HBG, CS, DMAR1, DMAR2, BR 6-1, ID 2-0, RPBA, CPA, TFS0, TFS1, RFS0, RFS1, LxDAT 3-0, LxCLK, LxACK, EBOOT, LBOOT, BMS, TMS, TDI, TCK, HBR, DR0, DR1, TCLK0, TCLK1, RCLK0, RCLK1. 2 Applies to input pins: CLKIN, RESET, TRST. ELECTRICAL CHARACTERISTICS (3.3 V) Parameter Test Conditions Min Max Unit V OH High Level Output Voltage V DD = min, I OH = 2.0 ma V V OL Low Level Output Voltage V DD = min, I OL = 4.0 ma V I IH High Level Input Current 3, V DD = max, V IN = V DD max 10 µa I IL Low Level Input Current V DD = max, V IN = 0 V 10 µa I ILP Low Level Input Current V DD = max, V IN = 0 V 150 µa I OZH Three-State Leakage Current 5, 6, 7, V DD = max, V IN = V DD max 10 µa I OZL Three-State Leakage Current 5, V DD = max, V IN = 0 V 10 µa I OZHP Three-State Leakage Current V DD = max, V IN = V DD max 350 µa I OZLC Three-State Leakage Current V DD = max, V IN = 0 V 1.5 ma I OZLA Three-State Leakage Current V DD = max, V IN = 1.5 V 350 µa I OZLAR Three-State Leakage Current V DD = max, V IN = 0 V 4.2 ma I OZLS Three-State Leakage Current V DD = max, V IN = 0 V 150 µa C IN Input Capacitance 11, 12 f IN = 1 MHz, T CASE = 25 C, V IN = 2.5 V 4.7 pf NOTES 11 Applies to output and bidirectional pins: DATA 47-0, ADDR 31-0, MS 3-0, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG 3-0, TIMEXP, HBG, REDY, DMAG1, DMAG2, BR 6-1, CPA, DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT 3-0, LxCLK, LxACK, BMS, TDO, EMU, ICSA. 12 See Output Drive Currents for typical drive current capabilities. 13 Applies to input pins: ACK SBTS, IRQ 2-0, HBR, CS, DMAR1, DMAR2, ID 2-0, RPBA, EBOOT, LBOOT, CLKIN, RESET, TCK. Note that ACK is pulled up internally with 2 kω during reset in a multiprocessor system, when ID2 0 = 001 and another ADSP-2106x is not requesting bus mastership.) 14 Applies to input pins with internal pull-ups: DR0, DR1, TRST, TMS, TDI. 15 Applies to three-statable pins: DATA 47-0, ADDR 31-0, MS 3-0, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG 3-0, REDY, HBG, DMAG1, DMAG2, BMS, BR 6 1, TFS X, RFS X, TDO, EMU. (Note that ACK is pulled up internally with 2 kω during reset in a multiprocessor system, when ID 2-0 = 001 and another ADSP-2106x is not requesting bus mastership.) 16 Applies to three-statable pins with internal pull-ups: DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1. 17 Applies to CPA pin. 18 Applies to ACK pin when pulled up. (Note that ACK is pulled up internally with 2 kω during reset in a multiprocessor system, when ID 2-0 = 001 and another ADSP-21061L is not requesting bus mastership). 19 Applies to three-statable pins with internal pull-downs: LxDAT 3-0, LxCLK, LxACK. 10 Applies to ACK pin when keeper latch enabled. 11 Applies to all signal pins. 12 Guaranteed but not tested. Specifications subject to change without notice. 16