Investor Relations 2018 Leader of Single Wafer Deposition

Transcription

1 EUGENE TECHNOLOGY Investor Relations 2018 Leader of Single Wafer Deposition

2 1. Overview 1 Highlight CONTENTS 2 3 Company Overview History 4 Market / Dividend 2. Business 5 6 Business Area Core Competence 3. Finance 7 8 Revenue / Profit (Yearly) Financial Structure

3 Highlight Acquisition of CVD, ALD Record High Sales (E) LP CVD M/S & Batch ALD Tool Approaching (billion won) Qualified Process of LP CVD MINI BATCH ALD LARGE BATCH ALD BEP Wafer

4 Company Overview Specialized in semiconductor process equipments, particularly deposition Overview Location CEO Established Published Um, Pyung Yong Jan / Jan HQ, R&D Yongin Icheon Manufacturing Business Area Semiconductor Process Equipments Key Customers Samsung, SK Hynix, Winbond, Macronix Samsung Sales & CRE 22 21Hwasung Chungju 17 SK Hynix CRE Pain-in Capital $11.5mn China Korea USA Employee 174 (End of 2017) / R&D 133 Taiwan Location Yongin(HQ, R&D), Icheon(Manufacture) 4

5 History Global company with a customer-oriented engineering development Pioneering Stage Growth 도약을위한 and Development 내실성장 Rapid 가속성장과 growth and 글로벌화 Globalization 2000 / Foundation and Technology Development Established company & R&D center JDA on 200mm LP CVD with SK Hynix 2006 / Listed on KOSDAQ Approved for trading on KOSDAQ ( ) 2011 / Overseas business & Tool development Success in penetration to Taiwan (Macronix, Winbond) Supplied PE ALD to Samsung Developed next generation tool 450mm LP CVD 2001 / 200mm Equipment Sales JDA success led to equipment sales to SK Hynix 2007 / Secure New Customers Supplied 300mm LP CVD to Samsung 2014 / Expand Production Facilities Completed construction of new Icheon manufacturing center Expanded production capability (84 94 systems/year) 2003 / 300mm Equipment Sales JDA on 300mm CVD with SK Hynix and exported to Hynix America, Taiwan 2008 / Release a New Equipment Supplied plasma System to SK Hynix 2017 년 / Acquisition of New Business Aquired Aixtron US CVD, ALD Tool by EUGENUS (USA Subsidiary) 5

6 Market Volume / Dividend On - Going Growth on FEOL Shareholders-friendly Policy Shareholders (as of 2017) (US$ Billion) Foreigners 27% Others 16% CEO 38% Treasury 3% Domestic Institutions 16% 40 Cash Dividend per Share (won) (E) 2019(E) (Source : World Fab Forecast by SEMI)

7 Business Area Big growth through developing the next generation equipment EUGENETECH EUGENUS BlueJay Single Thermal LPCVD As a single-type LP CVD, the BlueJay provides better quality of thin films, compare to conventional batch-type LPCVD for technology migrations IXP IXP CVD With higher throughput and lower CoO, IXP CVD WSi process is running in High Volume Manufacturing (HVM) with >90% availability in semiconductor fabs. Albatross Plasma Treatment Equipment The Albatross provides high density and low temperature plasmas for the application of plasma surface treatment processes, such as plasma oxidation and nitridation QXP QXP ALD Multi-component metal (doped TiN) and high k (doped HfO2 and ZrO2) films are running in High Volume Manufacturing (HVM) in semiconductor fabs. Dry Cleaning System The Hawk is a dry cleaning system for memory and logic device which provides a perfectly clean Si surface for deep contact plug integration and all of the Epi processes Hawk 7

8 Core Competence Single type thermal control technology leads to excellent film thickness (Patents 157) Strong Point Strong Point BATCH (Furnace) SINGLE (Chamber) 100~125 wafers at once 4~5 hours per process Gas 1~2 wafers at once 2~5 minutes per wafer Wafer Gas Good productivity Re-diffusion of the impurity Wafer Heater Heat Control Technology Better quality (Thickness uniformity) Better process window (Lower Temperature than Batch) High uniformity control through Specialized thermal control technology Consistent & Uniformed Heat Distribution Uniformity 3~5% Uniformity 1.6% 8

9 Revenue/Profit(Yearly) 2 nd Heyday with new process and customer Sales (billion won) Customer Mix in 2017 Samsung (38%) LP CVD (50%) SK Plasma Hynix Treatment (62%) (50%) Operating Profit (billion won) % % % % 31% 29% % % % 25.7 Product Mix in 2017 LP CVD (85%) Plasma Treatment (15%)

10 Finance Stable financial structure (Debt to equity 15%, Current ratio 510%) Asset 266 CASH 81 Liability 35 Asset $266mn Cash W81bn (Time Deposit, Certificate of Deposit etc.) Excellent A/R (Samsung, SK Hynix) Inventory based on orders Equity 231 Liability $35mn Loan & Debt Free Equity $231mn Paid-in Capital $11.5mn Cumulative Retained Earnings $227mn 2017 년말 10