创新释放高性能计算潜力 林俊 : 华为服务器领域首席架构师

Transcription

1 创新释放高性能计算潜力 林俊 : 华为服务器领域首席架构师

2 Market Trends 2 2

3 Requirement for Compute Security Big Data Cloud Mobility Internet of Things Industry 4.0 Intelligent City 2020 Millions of MIPS Opportunity for Innovation Traditional Architecture MIPS MIPS ,000 MIPS

4 Computing Innovation slows down Past Fast Growth Low Utilization High Power Not Secure The Doubling of Transistors are Slowing Down Single Core Performance Increase is Slowing Down Now Multi Core Performance Limited by mdahl s Law 限制 Uneven Subsystem Development 4 4

5 The End of Moore s Law 10 µm µm µm µm µm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm 2020 Covalent radius of Silicon Atom is 111 pm (0.111 nm) Tick Tock Process Architecture Optimization 5 5

6 Changes to CPU Power Consumption 6 6

7 Increase usage of Accelerators Adoption accelerated since Nvidia still dominates Total performance share plateaued in past year, mainly due to life cycle 7 7 Accelerator-based system projected to dominate for next decade

8 Heterogeneous Architecture Processors are moving toward specialization Performance per Watt is becoming more important Heterogeneous CPUs can be more flexible, higher cost performance, and high power performance First used by storage systems Internet server begin small scale deployment from 2013~2014 Enterprise server application still lag behind 3~5 years 8 8

9 Solution Huawei HPC Technology 9 9

10 World Class HPC Solutions TODAY 170+ Countries Huawei FusionServer $63B 2015 Revenue 14.2% % of Revenue in R&D 79,000 R&D Engineers 16 R&D Centers 36 Joint Innovation Centers Standalone Compute Node 1P-32P Modular HPC Systems OceanStor CloudEngine Petascale System Direct Liquid Cooling Workload Optimization Ecosystem Partnership NVMe SSD HPC storage Big Data storage Network Fabric Modular & Container Data center Reduce Complexity More Performance / $ Design for Growth HPC Private Cloud 10 10

11 Simplify HPC Systems TODAY MAXIMIZE EFFICIENCY ACCELERATE WORKLOAD CONVERGED HPC & BIG DATA SDI SDS Big Data MORE COMPUTE LESS SPACE LOWER POWER CONSUMPTION End-to-end energy efficient design HVDC High Ambient Temperature ~40 o C Direct Liquid Cooling ~ 84% coverage Tight integration with Huawei data center infrastructure MAXIMIZE PERFORMANCE FOR INDIVIDUAL WORKLOAD Flexible, modular architecture Multiple innovative form factors Deep optimization with hardware acceleration Super Fat nodes MAXIMIZE HARDWARE ROI Single HPC cluster and storage system for both traditional HPC MPI workload and Hadoop Innovative big data analytic appliance with deep hardware and software optimization for maximum cost effectiveness 11 11

12 HBM/HMC HPC / IT Solutions for Tomorrow New Technology Enablement Creative Converged Solutions Leverage Cross Disciplinary Assets New Heterogeneous CPU Enabling HPC Cloud DDR4 Next Gen CPU GPU/FPGA Accelerato r FusionInsight Big Data GPU/FPGA Accelerato r HBM/HMC New Memory Hierarchy DDR4-SCM-DIMM DDR4 DRAM as SCM Cache Big Data Acceleration ManageOne Management software FusionSphere Cloud OS SCM-SSD SRAM Cache X86 CPU NVMe- SSD HBA/RAID HDD HB M ME M GPU FPGA Deep Learning FusionStorage Software Defined Storage Pool 12 12

13 HPC Cloud Framework Agile - Open architecture Technical Computing Simulation Graphic Visualization - Rapid deployment - Efficient operation User Login Resource Pool Head Node Job Scheduler DB - Demand based Elastic Graphic Virtualized GPGPU Compute Node CPU Intense Memory Intense - Maximize utilization Distributed File System Object Store Storage Node HPC NAS HPC Block Secure - Multi-tenents VPC isolation HPC Compute HPC Distributed Storage Low Latency Networking Security Isolation - On-premise to cloud end-to-end secured 13 13

14 Converged HPC & Big Data 14 14

15 Builds A Leading Computing Platform With NVIDIA 15 15

16 HPC Solutions THANK YOU Copyright 2016 Huawei Technologies Co., Ltd. All Rights Reserved. The information in this document may contain predictive statements including, without limitation, statements regarding the future financial and operating results, future product portfolio, new technology, etc. There are a number of factors that could cause actual results and developments to differ materially from those expressed or implied in the predictive statements. Therefore, such information is provided for reference purpose only and constitutes neither an offer nor an acceptance. Huawei may change the information at any time without notice.

17 HUAWEI HPC Momentum Manufacturing CAE/CFD Chip Design & Manufacturing Education/Research/Supercomputing Energy Production & Distribution Oil & Gas Exploration Digital Media 17 17

18 Industrial CAE Simulation Crash & safety NVH Indoor acoustics Static strength Vibration and noise Electromagnetics CFD General development process disadvantages Long development period High design cost Weak process control Computational fluid dynamics (CFD) Structural mechanics Electromagnetic simulation System engineering Customers' main requirements Planning Design Sample Verification Design Sample Verification Product Short development cycle Low cost Intuitive analysis and controllable process Industrial HPC cluster highlights Processing before modeling Computing resolution Processing after analysis Application integration and optimization Operation cost reduction Large-scale cluster management Physical component Size model Computing modelcomputing analysis Result obtaining Verification analysis 18 18

19 Huawei CAE Simulation Solution Industrial simulation application scenarios Crash simulation test Fluid mechanics analysis Structure analysis simulation Applications LS-DYNA PAM-CRASH FLUENT STAR-CCM+ ABAQUS NASTRAN Hardware platforms Computing: X6800 & E9000 Network: IB EDR Computing: 8100 V3 & KunLun Storage: OceanStor V3 Application optimization centralized management Bright Computing PARATERA IBM Platform Altair Cluster capabilities High parallelism 100 Gbit/s Fluid mechanics analysis 24TB large memory capacity 400GB/s high storage bandwidth Application optimization Star-CCM+ test, performance up 30% PAM-Crash test, performance up 10% Energy saving Cabinet- and board-level liquid cooling, PUE ºC warm water cooling, lower power consumption for heat exchange Converged management Software license and job scheduling, unified management Hardware platform fault diagnostics, high reliability 19 19

20 Open/Cooperative HPC Ecosystem Hardware Software Application Local partners 20 20

21 CAE Customer Success Stories Daimler Mercedes-Benz Builds Core Vehicle R&D Capabilities with Huawei HPC Improves simulation efficiency by 50% and saves power consumption by 10%. Volkswagen Builds Immersive Car Crash Simulation Test Platform with Huawei HPC Saves 50% design costs and shortens the product development cycle from 3 months to 1 week. Global Foundries Builds Chip Simulation Platform with Huawei HPC Shortens chip design computing simulation time from 1 day to 1 hour. HiSilicon Builds Chip Simulation Cloud Platform with Huawei HPC Increases computing capability from 1 million grids to 10 million grids, improving computing efficiency by 5x

22 HPC Computing Drives R&D Hardware platform Application optimization Benefits X6800 Animation rendering and production 3DMax Maya Softimage 10 TFLOPS-level heterogeneous computing capability 21.1 TFLOPS/chassis, 8 GPUs per chassis 50% density increase, 1U 4-socket ultra-high computing density E9000 Weather forecasting, environment monitoring, aviation simulation WRF MM5 CMAQ CAMs 100 TFLOPS-level CPU computing capability 149 TFLOPS/cabinet, 64 CPUs per cabinet 100G network, proprietary EDR switching technology KunLun Gene sequencing and molecular motion simulation BLAST FASTA Gromacs NAMD Fat node in-memory computing 24 TB in-memory capacity per node 2084 GB/s memory data bandwidth per node 22 22

23 Fast Massive Data Transmission Hardware platform Application optimization Benefits Common solution Compute node cluster OceanStor 9000 Storage node cluster IB/10GE/GE Smart teaching management system Electronic reading library storage system Periodical and paper storage system 200 GB/s bandwidth 50 GB storage capacity per node 144 nodes per cluster Huawei massive data storage solution 400 GB/s massive data bandwidth 100 GB file system, biggest in the industry 3 to 288 nodes linear expansion 23 23

24 University of Toronto Up to 12 TB memory capacity per node, 5x the ecosystem modeling computing requirement, enough for long-term expansion Shortens the 4D simulation computing result time for the integrated watershed-receiving waterbody model from 6 days to 4 hours 24 24

25 Bibliotheca Alexandrina in Egypt Deployment density improved 33%, and overall system energy efficiency improved 10% NAMD application performance delivered in the cluster deployment test is 10% higher than that required by the customer 25 25

26 Huawei Warm Water Cooling Solution Cabinet- and board-level warm water cooling integrated delivery Cooling system (including the primary loop) CDU system and cooling media Secondary loop between the CDU system and cooling cabinets Huawei FusionServer liquid cooling cabinets Air conditioning system 26 26

27 Huawei Warm Water Cooling Solution Air cooling TCO Liquid cooling TCO TCO ratio >>> >>> Integrated cooling loop component, low leakage risk Physical isolation of water flows from circuits, no short-circuit risks 217 system verification test items, high reliability Cooling PUE 1.1 Up to 45ºC inlet water 80% warm water cooling Warm water cooling reduces TCO by 30% compared with air cooling

28 Poland PCSS 1.37 PFLOPS, PUE < 1.2, top 100 supercomputing center worldwide Warm water cooling reduces electricity consumption by 3.26 million kwh per equipment room every year, lowering consumption by 40%+ Huawei s liquid cooling HPC cluster helps PCSS significantly reduce hardware investments and TCO. This year, PCSS and Huawei will further their cooperation by building a joint innovation center to develop solutions covering computing, storage, and cluster architectures. The cooperation with Huawei has enabled PCSS to become one of the most competitive HPC service providers in Europe. Norbert Meyer, Manager of HPC & Data Department, PCSS 28 28

29 THANK YOU Copyright 2016 Huawei Technologies Co., Ltd. All Rights Reserved. The information in this document may contain predictive statements including, without limitation, statements regarding the future financial and operating results, future product portfolio, new technology, etc. There are a number of factors that could cause actual results and developments to differ materially from those expressed or implied in the predictive statements. Therefore, such information is provided for reference purpose only and constitutes neither an offer nor an acceptance. Huawei may change the information at any time without notice.