State-of-the-Art and direction for high density optical fiber interconnects

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Frederick Small
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1 State-of-the-Art and direction for high density optical fiber interconnects Bill Blubaugh, Toshiaki Satake US Conec Ltd. April 18, 2007

We develop, manufacture and market high density optical interconnect components using high precision molding technology and metal parts main products are for MT style multi-fiber connectors including

2 We develop, manufacture and market high density optical interconnect components using high precision molding technology and metal parts main products are for MT style multi-fiber connectors including installation and cleaning equipment Currently 48 staff Based in Hickory, NC with contract manufacturing in Texas and Japan Over 250 customers worldwide Founded 1992 as joint venture - Corning Cable Systems (customer) - Fujikura (production technology) - NTTAT ( MT/MPO patent licenses, products) Visit to learn about products and careers 2

Markets using our technology Private Network - Data center clustered computing, servers, SAN, LAN backbone Public Network - IP routers, DWDM, ROADM, switches, FTTx cable plant Aerospace Emerging

3 Markets using our technology Private Network - Data center clustered computing, servers, SAN, LAN backbone Public Network - IP routers, DWDM, ROADM, switches, FTTx cable plant Aerospace Emerging medical, video, industrial, military Card-to-card connectors Rack-to-rack connectors Backplane connectors Fiber management circuits Array Tx/Rx package: POP4, SNAP12, QSFP Data Center / CO Quick Install cabling High density under floor Structured solutions 3

4 MT Style connectors installed base More Than 25 million MT installed Link Length (m) 1000 U.S. FTTx LAN Backbone NTT OSP Cable splice Aerospace Router Switch OADM Data Center 1 10 MT connectors installed base (million) 4

5 MTP Connector TIA FOCIS 5 and IEC 1754 compliant MPO style connector Most popular multi-fiber connector RoHS Compliant Several boot styles Color coded and keyed 5

6 Cabling with MTP connectors saves space and time Simplex cable installation Multi-fiber cable installation 200 simplex jumpers replaced by three 72 fiber cables 6

tolerance < 0.5 micron SM IL <0.35 db; <0.

7 MT Ferrule Technology >80% glass filled polymer - Thermoset initially - Thermoplastic (PPS) 2001 * Less moisture absorption * Lower cost potential Hole position tolerance < 1 micron (SM) Guide pin tolerance < 0.5 micron SM IL <0.35 db; <0.2 db demonstrated Guide Pin Alignment Glass filled PPS Optical fiber Hole Position Tolerance Fibers in one ferrule Used in many styles of connector bodies 7

8 Multifiber ferrule materials CTE (x10^-6) 0 Silica Fiber PLC on Si Wafer Si V-groove array Pyrex Glass V-groove a... MT Guide Pin ZrO2 Ceramic Ferrule Al2O3 Ceramic Ferrule Thermoplastic MT Thermoset MT Note 1: CTE of MT Ferrule material and Guide pin material are matched for alignment stability Note 2: CTE of PLC and Pyrex V-groove array are matched for stable adhesion Note 3: PLC to MT ferrule butt joint is possible with a small cross section 8

9 Required end face for consistent insertion loss Simplex ferrule Polished with radius MT ferrule Array must be flat Consistent protrusion is essential 9

10 Insertion Loss Experience curve Loss (db) Data Center Switch Router OADM U.S. FTTx SM MM 0.50 NTT OSP Cable

11 Card Edge Connector Density MPO 4-72 Fibers MT-RJ MU Duplex LC Duplex SC Duplex 2 Fibers 2 Fibers 2 Fibers 2 Fibers 11

12 Fiber Density Vs. Connector Type Fibers per sqcm Fibers/sqcm SC Duplex LC Duplex MT-RJ MU MPO 8 MPO 12 MPO 24 MPO 72 What density and connector body style is required in future? 12

13 MT ferrule configurations IEC ; TIA TIA F 72F 8F IEC ; TIA/EIA F 2F Mini MT 24F Custom Small Profile Ferrule 36F 13

14 Blind Mate Card Edge Density* HBMT 48 Fibers/6.7 sqcm HD Optyx 96 Fibers/10.5 sqcm MPX 48 Fibers/8.8 sqcm * Based on 12Fibers/MT 14

15 MPO style Termination Prices Terminated end ASP $160 $140 $120 $100 $80 $60 $40 $20 $ SM low-loss 12SM 12 MM Will new applications result if ASP drops another 50%? 15

16 Array Tx/Rx Devices with MPO connector interface POP 4 SNAP 12 QSFP 4 Channel Tx/Rx 2.8 F/sqcm 12 Channel Tx 4.3 F/sqcm 4 Channel Tx/Rx 3.2 F/sqcm 16

17 Module Packaging Components Array Tx/Rx Package Example Substrate Active Array MTP Receptacle MTP Card Edge Connector Alignment part examples Light pipes Active receptacle with pins, lens or window MTP Receptacle 17

18 Packaging Questions 1. What applications/architectures favor parallel mutifiber vs serial transmission? 2. What is density and cost requirement for fiber/waveguide technology from on-card to the card edge connector? e.g. flex circuit 3. What is the foot print and fiber density for next generation card edge connectors? 4. What is cost / fiber to win 1-10 m card-card 10Gb and higher link rates? 18

Trends in High Density Optical Interconnects for HPC Applications. US Conec Ltd.

Trends in High Density Optical Interconnects for HPC Applications US Conec Ltd. April 20, 2010 MIT CTR April, 2010. Company Overview US Conec develops, manufactures, and markets high density multi-fiber