Trends in High Density Optical Interconnects for HPC Applications. US Conec Ltd.

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Blanche Charlotte Horton
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1 Trends in High Density Optical Interconnects for HPC Applications US Conec Ltd. April 20, 2010 MIT CTR April, 2010.

2 Company Overview US Conec develops, manufactures, and markets high density multi-fiber optical interconnect components using high precision molding technology Support standard optical interfaces IEC, TIA, IEEE Offer formal training and equipment to terminate connectors Founded in 1992 as joint venture - Corning Cable Systems - Fujikura Ltd. - NTT-AT HQ in Hickory, NC with CMs in Texas and Asia Over 300 customers worldwide MIT CTR April,

3 Product Lines Multi-Fiber Ferrules MT style 2-72 Fibers Contract Ferrules MTP Connector ( MPO Style) Housing Kits Adapters Fiber Cleaning Products Optical Package Components Prizm LightTurn SNAP 12, QSFP, CXP Active optical cable MIT CTR April,

4 MT Ferrule Based Connectors MTP Brand Connector (MPO style) MT Ferrule HBMT backplane Connector MPX Connector MTP US Conec HBMT Molex Fiber Optics MPX Tyco Electronics MIT CTR April,

5 Applications for MT Connectors More than 35 million MT installed to date Link Length (m) 1000 LAN Backbone U.S. FTTx NTT OSP Cable splice 100 Data Center Cabling SM 10 HPC CO Eqmt MM 1 Aerospace 1 10 MT connectors installed base (million) MIT CTR April,

6 1995 Data Center Structured Cabling use: Space and Time Savings Simplex cable installation Multi-fiber cable installation 200 simplex jumpers replaced by three 72 fiber cables MIT CTR April,

7 HPC uses 12X Inifiniband SNAP 12 T/R Line rates double every few years 2.5 Gb SDR 5 Gb DDR 10 Gb QDR Core routers also use SNAP 12 T/R for rack-torack MIT CTR April,

Cost Requirement for Interconnects 1-3 m 100G link is next target Products to replace electrical interconnect at 10Gb and higher rates 3-15 m: Active optical cables for 10G Ethernet and 4x,12x

8 Cost Requirement for Interconnects 1-3 m 100G link is next target Products to replace electrical interconnect at 10Gb and higher rates 3-15 m: Active optical cables for 10G Ethernet and 4x,12x Infiniband, and PCI Express are rapidly replacing electrical cables 1-3 m: On-card low cost 10Gb x12f array T/R for Infiniband, 100G Ethernet, PSI to replace electrical backplanes at < $2 / Gb/s MIT CTR April,

9 Next step is on the card Interconnects Faster networks drive HPC performance not processor speed Optics is faster Optics is greener Optics is much smaller MIT CTR April,

structured cabling IBM Supercomputer card-to-card 7-100m Links 10 3

10 At OFC 2010: IBM new P7 HPC drawer On-Card links replace copper for lower power, 100Gs speed Data Center rack-to-rack and (Edge ) structured cabling IBM Supercomputer card-to-card 7-100m Links 10 3 cables Density=1 1-7m Links 10 5 cables Density=8 Avago MicroPOD MIT CTR April,

11 Array Tx/Rx Package w/ photonic turn connector Module Packaging Components Substrate Photonic turn connector Interface with pins, lens or window VCSEL array MIT CTR April,

PRIZM TM LightTurn TM Connector 12 fiber, 90

12 PRIZM TM LightTurn TM Connector 12 fiber, 90 photonic turn Low-cost termination with no polishing Perpendicular mating and passive alignment features Detachable connector for automated placement/test Multiple mates/de-mates Two components 6 x 7 mm! MIT CTR April,

13 MT connector card edge density scales with on-card The image cannot be displayed. Your computer may not have enough memory to open the image, or the image may have been corrupted. Restart your computer, and then open the file again. If the red x still appears, you may have to delete the image and then insert it again. Multi-port adapter QSFP AOC CXP AOC MIT CTR April,

14 MTP Connector Density MT Ferrule + MTP Connector Body 12f Card Edge Adapter 24f & 72f IEC ; TIA Backend size dependant on cable design MIT CTR April,

15 MTP Connector Density Extract and insert MTP connector with Push/Pull tab. Standard round jacketed 3.0 or 3.6mm OD Can be installed in field or factory MIT CTR April,

16 MTP Connector Density 12f 24f 48f 72f 3.0mm 3.6mm 5.7mm 7.5mm MIT CTR April,

17 Card Edge Connection Cost per Fiber HPC volumes will reduce cost per fiber MIT CTR April,

18 New on-card components are emerging Modules: Tx/ Rx, switches, WDM, etc. Blind Mate Backplane Bulkhead Couplers, Adapters To other Rack, Cabled To other Rack, Cabled Module Connectors MTP Connector PRIZM LightTurn Connector On Card Bulkhead Connectors Typically MTP for current applications Off Card Bulkhead Connectors, Cabled, Patch panels Typically MTP for current applications Card Edge Tx/Rx Off Card Bulkhead Connectors, not necessarily cabled Typically MTP for current applications MIT CTR April,

State-of-the-Art and direction for high density optical fiber interconnects

State-of-the-Art and direction for high density optical fiber interconnects Bill Blubaugh, Toshiaki Satake US Conec Ltd. April 18, 2007 We develop, manufacture and market high density optical interconnect