Automotive MCU Body Electronics Product and Solution Update

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1 Automotive MCU Body Electronics Product and Solution Update APF-AUT-T0445 Kent Lin A P R TM External Use

2 Body Electronics Trends and Challenges External Use 1

3 Integrated BCM Gateways What s Behind Body Electronics? Door SLP AFS ripple cnt Front Light / Light / Light LED ctrl LED ctrl MCU Input CAN Gateway 32bit 176 pin Monitor LIN SBC (208/256) BCM Output Driver W/D & Front Light / RF Light / Safety Light LED ctrl Rx LED ctrl MCU AFS Door SLP ripple cnt Rear Light Input Switches etc. Output Interior lighting etc. Rear Light Comfort Features Vehicle Networking Safety Related Security Door Module Window Lift Seat Module/position HVAC Electric sunroof/shade Interior lighting Central Body Control Module Central Gateways: CAN, LIN, Flexray, Ethernet, MOST Steering column lock Steering column adjustment AFS Anti-pitch power windows Wipers and rain sensors Immobilizer Keyless Entry Preventing hacking and counterfeit modules Body systems embrace a broad variety of applications inside the cabin Body systems cover the widest range of performance requirements Small 8-bit controllers and watchdogs General purpose 16-bit controllers High performance 32-bit compute engines External Use 2

4 Body Market Trends and Challenges Connected More complex Gateways with higher performance and multicore usage (Expanding memory ) Ethernet and wireless communication Personalization options driving LIN nodes Software Integration: Safe and Secure Green Cost Efficient Functional Safety - ISO26262 Several body-apps need ASIL A/B (some C/D) Reduced ASIL-assessment effort Security/Cryptography for Gateway and BCM modules Power management in stop and run modes Autosar SW management of partial/pretended networking EC-motors, LED-lighting Cost reduction via ECU integration Electrification of the car replacing mech. components Scalability of hardware and software Auto generated code to decrease dev costs Autosar: Multicore-support OS MCAL Safety: SW-routines supporting self-test (Core/Memory) Security: Cryptography algorithmic support Application-support Motor Control-library Reference designs External Use 3

5 Overview of Freescale Body MCU Solutions External Use 4

6 Body MCU Application Mapping Sub-Segment MCU Requirements Central BCM / Gateways 16-/32-bit Functional integration Higher performance for lower cost Increased data traffic & Security Low Power Functional Safety AUTOSAR Actuators/Sensors (window lift, wipers, HVAC blower, rain and light sensors ) 8-/16-bit ASSP Board space and package size LIN growth via option management Low power External Use 5

7 Freescale MCU for Body Applications Family Concept Scalable HW and SW approach Enabling wide range of BCM/Gateway applications from basic Non-CAN nodes to complex, multi networked Gateways Performance - From single core to multicore MCUs From single core 20MHz 8-bit to dual core 120MHz 32-bit Power Consumption - Aggressive run, stop, standby values Flexible power modes dedicated for body applications Advanced Peripherals CAN, LIN, Flexray, Ethernet, MLB Security modules Healthy Ecosystem S08D/SG/RN 8-bit Single Core, 20MHz 2 ~128kB Flash Up to 2k EEPROM 1 CAN/16 ch TSI 8 TSSOP~100 LQFP S12XE/S12G 16-bit Single Core, 25/50MHz Optional 100MHz RISC XGate 16k~1MB Flash Up to 32k DFlash, 2k EEPROM Up to 5 CAN, 8LIN,FlexRay 20 TSSOP~208 BGA MagniV ASSP 16-bit MCU with analog & power Target for window lifter, Varies pmups, LIN nodes, CAN nodes and etc MPC56xxB/C 32-bit Single /Dual Core 48/60/64/120MHz 128k-3MB Flash 1-6 CANs Flexray,Ethernet Security module 64 LQFP~256 BGA Qorivva Next-Gen 55nm Ecosys Partners External Use 6

8 Qorivva for Body Electronics External Use 7

9 e200z - 32bit Core Scalability Up to 16k cache Up to 32k cache Up to 32k cache 8-entries MMU 16-entries MMU 32-entries MMU 64-entries MMU 4-stage pipeline VLE Only e200z0 80MHz 4-stage pipeline VLE e200z2 80MHz FPU(optional) 4-stage pipeline FPU VLE e200z3 80MHz SIMD 5-stage pipeline FPU2 VLE e200z4 180MHz SIMD 7-stage pipeline FPU VLE e200z6 144MHz SIMD 10-stage pipeline Dual Issue / VLE FPU2 e200z7 300MHz SIMD Same instruction set / memory map / interrupt map / software External Use 8

10 Target Applications : BCM and Gateways Body Control Gateways External Use 9

11 Existing FSL MCUs for 32-bit Automotive Networking Family Concept Completely scalable family of Qorivva gateway solutions ranging from CAN/LIN only Gateways to advanced Gateway solutions integrating LIN, CAN, Ethernet, MLB, FlexRay on a single chip From 128k to 3M Flash options Performance High-performance cores with optimized system architecture From single-core to multi-core MCUs 48MHz to 120MHz with Crossbar architecture Advanced Peripherals Ethernet, FlexRay, MOST, Security Modules, CAN, LIN, etc Power Consumption Aggressive run, stop, standby values Acceptance Widely utilized by major Tier 1s/OEMs Availability Qualed today, in mass production now MPC560xD Single Core kB Flash 1 CAN MPC560xB/C Single Core 256k-1.5MB Flash 2-6 CANs MPC564xB/C, MPC5668G Dual Core Options 1.5-3MB Flash kB RAM Flexray, Ethernet, MLB Security External Use 10

12 Key Feature of MPC564xB/C - The CSE (Crypto Service Engine) Target Applications Immobilizers Component protection Prevent counterfeit modules Protecting data sets mileage / Prevent Chip tuning Secure communication Secure Boot Secure Hardware Extension Standard compliant Crypto Service Engine (CSE) RNG AES 128 Key storage Unique ID AES Random Key Device encryption Number storage ID Generation Product Modes: Up to ECB, 10 CBC Latency PRNG 128bit, identifiction 2μs TRNG keys for (@ SEED 100 in secure generation MBit/sec) NVM External Use 11

13 MPC5602D Optimal Low End BCM Solution High Performance Industry standard PowerArch Core e200z0 up to 48 MHz Over 60 DMIPs Low-power LIN transmissions in STOP Internal oscillators to support low power modes and fast wake-up 256kB Code Flash 64kB Data Flash Includes small sectors and capability to read/write to both Flash blocks at same time emios Timer Input capture, output compare and PWM capabilities in one very flexible timer module Small Packaging 64 LQFP 10x10mm.5 pitch 100 LQFP 14x14mm.5 pitch System Integration VReg FMPLL Osc & RTC SIU CROSSBAR SWITCH 28 Ch. emios PIT INTC BAM Timed I/O Watchdog I/O Bridge 256kB Code Flash FlexCAN Crossbar Masters edma (16xCh.) 3 x LinFlex 64kB Data Flash Communications e200z0 Core 16kB SRAM Crossbar Slaves 2 x DSPIs CTU Debug JTAG Nexus Class 1 Analogue 12-bit ADC DMA Helps offload CPU with data/message handling Crossbar Allows parallel accesses to on-chip resources for maximum system performance Communications Wide range of peripheral options for BCM applications CAN, LIN, SPI interfaces Cross Triggering Unit (CTU) Synchronizes PWM output signals with ADC conversions for very accurate diagnostic and control capabilities. Simplifies HW and SW development for lighting and motor control applications. External Use 13

14 MPC560xB/C Mid End BCM High Performance Industry standard PowerPC Core e200z0 up to 64 MHz Over 80 DMIPs 256kB-1.5MB Flash 64kB Data Flash Includes small sectors and capability to read/write to both Flash blocks at same time System Integration VReg MCM PIT 4ch 32b Power Mgt Oscillator FMPLL Interrupt Controller Crossbar Masters e200z0 Core DMA (5/6/7B) Debug JTAG Nexus 2+ Nexus2+ and JTAG Eliminate need for cumbersome emulators. Real time instruction trace DMA Helps offload CPU with data/message handling emios Timer Input capture, output compare and PWM capabilities in one very flexible timer module Cross Triggering Unit (CTU) Synchronizes PWM output signals with ADC conversions for very accurate diagnostic and control capabilities. Simplifies HW and SW development for lighting and motor control applications. CTU I/O Bridge Up to emios 64ch, 16bit CROSSBAR SWITCH Memory Protection Unit (MPU) 256k-1.5M Flash 64K Data Flash 24-96K SRAM Crossbar Slaves Communications I/O System Up to 52 ch ADC 16x12bit, 36x10bit Up to 6 FlexCAN Up to 10 LINFlex Up to 6 DSPI 1 I2C Crossbar Allows parallel accesses to on-chip resources for maximum system performance Communications Wide range of peripheral options for BCM applications CAN, LIN, SPI interfaces Small Packaging 64 LQFP 10x10mm.5 pitch 100 LQFP 14x14mm.5 pitch 144 LQFP 20x20mm.5 pitch External Use 14

15 MPC564xB/C High End BCM/Gateway High Performance Dual Core CPU Industry standard PowerArch e200z4 up to 120 MHz e200z0 up to 80 MHz Over 300 DMIPs Performance Low-power Internal oscillators to support low power modes and fast wake-up Large Flash and RAM Memory Offering Optimized memory offering in support of BCM/GTY message handling/ Autocoding requirements emios Timer / Cross Triggering Unit Flexible timer module Accurate diagnostic and control capabilities GPIO Intensive Packaging 176 LQFP 24x24mm.5 pitch 208 LQFP 28x28mm.5 pitch 256 BGA 17x17mm 1 pitch CTU System VReg 4-40MHzOsc FMPLL 32KHz Osc 16MHz IRC 128KHz IRC RTC/API Interrupt Controller 8xPIT 1x SWT 4xSTM (BAM) SSCM emios 32ch Debug JTAG Nexus Class 3+ AIPS_L Bridge PPC TM e200z0 Core CROSSBAR SWITCH 128k SRAM (with ECC) Crossbar Slaves Crossbar Masters PPC TM e200z4d Core (4k I-cache) MMU Memory Protection Unit (MPU) Communications I/O System emios 32ch Nexus Class 3 128k SRAM (with ECC) 32 ch(min) ATD 10bit 16 ch ATD 12bit 8 DSPI 32ch edma 1 I2C Ethernet (FEC) 3M CFlash (ECC) 6 FlexCAN Security CSE FlexRay 96K DFlash (ECC) 10 LINFlex Cryptographic Services Engine Encodes and decodes data in support of component protection, immobilizers, etc Ethernet/Flexray Ideal for Flash programming/ diagnostics and interfacing with safety/chassis networks Crossbar Allows parallel accesses to on-chip resources for maximum system performance Communications Wide range of peripheral options for BCM/GTY applications CAN, LIN, SPI, I2C interfaces External Use 15

16 Debug HW Tool Support Modular EVB Kits Common motherboard, mini-module for each device The evaluation system (Motherboard & Mini- Module) allows full access to the CPU, all of the CPU s I/O signals, and the motherboard peripherals (such as CAN, SCI, LIN). Standard communication transceivers and connectors User s buttons, jumpers and LED s Mini Modules Can be used as a stand-alone board by providing external 5V power supply input Socket for MCU Starter Trak Board Low cost ($99) start up board Soldered Bolero 512k in a 144 LQFP package On board JTAG connection, CAN transceiver, CAN/LIN interface, etc External Use 16

17 Enablement - RAppID Init and Pin Wizard RAppID is a family of graphical development tools that enables the user to quickly and easily configure the controller PLUS generate complete documentation. It can also be used as a learning tool to gain an understanding of the controller and its peripherals. GUI-based tool for rapidly, intuitively developing Initialization code Configure startup code from reset to main() Automatic report generation of peripheral and register settings On-line documentation and built-in tool tips for ease of use Built-in tutorials with sample projects External Use 17

18 New Integration, Low Power, Security and Safety Unprecedented Integration Single-chip solution offering multicore architecture and advanced networking protocols for next generation communication requirements while reducing the quantity of body control/gateway ECUs Low Power Management New low power modes, analog comparators and pretended networking support help meet stringent next-generation power budgets and ensure more efficient vehicles External Use 18 Functional Safety and Security Security modules help protect ECUs against various attack scenarios and Safety modules help ensure robust operation per ISO 26262

19 Highly Integrated Body Control/Gateway MCU Performance through Multicore Up to three e200 cores built on Power Architecture technology, with up to 160 MHz performance allows for easy division of tasks in an integrated BCM/gateway system Most Diverse Set of Networking Communication Ethernet with AVB support, FlexRay, MLB, USB, up to eight CAN with CAN Flexible Data Rate (FD) up to 18 LIN, SDIO interface, I 2 S all supported on a single-chip solution Flexible Memory Options Up to 6 MB Flash and 768 KB of embedded SRAM provide suitable storage to maintain the local BCM/gateway application functionality, handle message buffering, and also store additional Flash images for other nodes in the vehicle External Use 19

20 Driving Low Power Consumption New Low-Power Unit Allows for increased functionality in a lower power state, reducing current consumption by over 30% for a typical cyclic wake-up application over previous generation devices Provides a mechanism to bypass entire platform while supporting a smaller set of peripherals (1x CAN, LIN, SPI, ADC, timer, etc.) thereby providing very low power execution modes Analog Comparator Typical periodic monitoring routines can be fully handled in Standby mode offering a significant improvement in power consumption Pretended Networking Support Enabled through advanced filtering, wakeup capabilities and CAN availability in low power modes External Use 20

21 MPC5748G Key Features and Block Diagram Multicore architecture: 2x e200z4 + 1x z2 Power Architecture cores Floating Point Unit (FPU) on z4 cores for additional computational algorithm support High performance: 160 MHz max for z4s and 80 MHz on z2 Triple ported flash and multiple RAM minimize access time to memory Part of SafeAssure functional safety program: Designed for ISO ASIL B systems Broad Communications: Multiple CAN, LIN, I²C, I²S for integrated BCM/gateway applications Media Local Bus supports MOST for infotainment domain networking Robust security: Hardware security module (HSM) option supports both SHE and EVITA low/medium security specs USB 2.0 (OTG and host module) support interfacing to both wireless modems and infotainment domain Ethernet 10/100 Mb/s for diagnostics, backbone and audio video bridging (AVB) applications Innovative Low-Power Unit (LPU) provides CAN, LIN, SPI, ADC functionality in a new low power state External Use 21

22 S12 MagniV simplifies system design with the integration of High-Voltage (40V) analog IP onto mixed-signal MCUs for automotive applications Building upon proven high-volume LL18 technology Ideal for space constraint applications like sensor and actuators Reduces the Total Cost of Ownership (TCO) through Bill Of Material (BOM) and manufacturing cost reductions (PCB assembly). External Use 22

23 What s S12 MagniV? SiP = System in Package Semi-Discrete Solution (Multi-Chip) Standard MCU Multi-die SiP Single package Die-to-die bonding Monolithic SiP MCU and Analog on the same die Application Specific Analog IC (ASIC) External Use 23

24 15 Years of System in Package (SiP) Experience 908E622/1 8-bit HC08 + SMOS5 Mirror Driver 1997 Troll - MUX3 8-bit HC05 Hyper-integrated Climate Stepper Driver 908E626 HC08 + SMOS5 AFS Stepper Driver 908E630 8-bit HC08 (SOG) + SMOS8 Relay Driver Start of SiP R&D HC05PV8 8-bit HC05 Hyper-integrated Relay Driver Monolithic Architecture HC05 Microcontroller with EEPROM (IDR60% -1.2um) Mechatronics Package 908E624 8-bit HC08 + SMOS5 Relay Driver SiP Architecture HC08 Microcontroller with flash (0.5um) SMOS5 (0.8um) 54ld SOIC Package SMOS8 (0.25um) QFN Package 912F bit S12I32 + SMOS8 Relay & Switch Driver S12 Core (0.25um) Architecture Repartitioning S12VR64 (first part of MagniV family S12ZVM S12ZVH S12ZVL S12ZVC LL18UHV technology Monolithic SiP S12Z Core Products Technologies st Gen 2nd Gen 3rd Gen 4th Gen External Use 24

25 Reduce Footprint by up to 30 Percent Traditional MCU with Discrete Analog and Power S12 MagniV Mixed-Signal MCUs Target Applications Many external components Additional assembly & testing needs Higher total system cost System-in-package: 12 V direct supply regulator LIN or CAN physical interface High-voltage inputs LED driver S12Z-based MCU Simple, low-cost package Pretested subsystem Switch panels Userinterfaces Actuators/sensors Lighting control HVAC Seat positioning External Use 25

26 Ultimate Flexibility and Scalability CAN PWM Connectivity CAN or LIN support with on-chip physical interface On-chip 12 V voltage regulator for flexible on- and off-chip supply 8 KB 64 KB 192 KB Range of memory options address multiple applications and allow for platform design External Use 26

27 S12 MagniV: Integration Beyond the MCU Our S12 MagniV portfolio simplifies system design with the integration on High- Voltage (HV) analog features onto MCUs for automotive applications MM912/S12VR Window Lift S12ZVM BLDC Motor Control S12ZVH Instrument Cluster S12ZVL LIN Slave Nodes S12ZVH MM912_S812 S12ZVL S12VR Reduced BOM Reduced PCB Size Improved Manufacturing and Quality Efficient motor control External Use 27

28 S12 CPU with an integrated Voltage regulator, LIN physical layer and HS/LS-drivers for Relay-driven Windowlift-motor External Use 28

29 S12VR - family Relay driven Windowlift Summary Digital MCU Core and Memories 5V Analogue High-Voltage Key Features: S12 CPU (up to 25 MHz) 16-bit compatible with the S12G family and existing SiP solutions. Voltage Regulatror operating directly from car battery (No Ext regulator reqd.) capable to drive 20mA to drive offchip components (E-Vdd) LIN Physical Layer: LIN 2.x / J2602 compliant ; +/- 8kV ESD capability True 512B EEPROM with ECC, 4 byte eraseable 2 Low-Side Drivers: Protected LS Drivers to drive brushed DC Motor Relays Up to 2 HS drivers: For indicator LED and Switch supply 4 High Voltage Inputs: 12V Inputs for Switch Monitoring (ESDprotected, optional use as 12V-ADC) On chip RC Oscillator; trimmed to +/- 1,3% tolerance over full temperature range Target Applications Automotive electric windowlift / sunroof with antipinch generic LIN-controlled Reais-driver Lin nodes G P I O LIN -PHY SCI 1 SCI 0 SPI BDM KWU Win Wdog TIM 16b 4ch PWM 8ch 8b or 4ch 16b 1# E-Vdd Family options: RCosc. +/-1.3% 48-64kB Flash (ECC) 512B EEPROM (ECC) 4 HV Inputs Pierce Osc. PLL S12 25MHz Bus 2 kb RAM Vbat sense Temp Sense Vreg 70mA 10-Bit ADC 2 HS Drivers 2 Low Side Drivers Vsup sense Flexible Flash Options: 64/48kB down to 32/16kB Flash 32-LQFP or 48-LQFP Packaging C / V / M Temperature options (up to 125 C Ta) External Use 29

30 S12VR Details Digital MCU Core and Memories 5V Analogue High-Voltage 2 UARTs One linked to LIN Phy, 2 nd as reardoor communication or independ. Test Intf. SPI As alternative test Interf. Up to 16 Wakeup pins Combined with Analog Input pins and HV pins 4ch 16bit Timer Hall inputs, SW timing 8ch PWM Routable to HS and LS outputs, for LED lighting External Supply 5V / 20mA switchable for local (same PCB), over current protected. Eg. supplying Hallsensors LIN Physical Layer LIN2.2 and SAE J2602 compliant +/- 8kV ESD capability G P I O LIN -PHY SCI 1 SCI 0 SPI BDM KWU Win Wdog TIM 16b 4ch PWM 8ch 8b or 4ch 16b 1# E-Vdd 4 High Voltage Inputs 12V Inputs for Switch Monitoring Routable to ADC S12 CPU 16-bit, compatible with S12G Family and existing SiP Solutions. RCosc. +/-1.3% 48-64kB Flash (ECC) 512B EEPROM (ECC) 4 HV Inputs Pierce Osc. PLL S12 25MHz Bus 2 kb RAM Vbat sense EEPROM 512B EEPROM, 4 byte eraseable On chip RC OSC factorytrimmed to +/- 1.3%, meets LIN -needs Temp Sense Vreg 70mA 10-Bit ADC 2 HS Drivers 2 Low Side Drivers Vsup sense Flexible Flash Options 48kB or 64kB Flash version ADC - up to 6 ext. Ch. +4 int. channels for temp sense, supply monitors, HV inputs, internal ref Voltages Up to 2 HS drivers For LED and Switch supply 2 Low-Side Drivers Protected LS Drivers to drive relays directly Voltage Regulator 5V/70mA for the whole system Vbat and Vsup sense Supply sense before and after protection diode Packaging Options 32LQFP and 48LQFP External Use 30

31 VDDA VDDX LIN LGND VSUP VSENSE Window Lift with S12VR LIN Digital MCU Core and Memories Vbat 5V Analogue High-Voltage Switches Indicator LED HVI0 HVI1 HVI2 HVI3 HS1 HS0 HVI High Side KWU LIN PHY SCI0 S12 RAM IRC Vreg Temp Sense Flash EEPROM PLL KWU Low Side Relay Driver EVDD TIM LS1 LSGND LS0 EVDD IOC IOC Hallout Hall Sensor M Debug & Programming Connector Altern. SPI&UART based Test Connector BDM SCI1 SPI Ext. Osc RTI COP ADC 10bit PWM 8ch Pinout representing functionality, Physical pins location is not correct External Use 31

32 16-bit MCU with 12/5V voltage regulator, LIN physical layer, and MOSFET pre-drivers for DC and BLDC motors External Use 32

33 Full Discrete Semi Integrated TM S12ZVM Concept VREG (8pin) CAN or LIN phy (8pin) MCU or DSC (48pin) Op-amps 20+ Gate Driver (48pin) 4cm ~1 ½ in. ~50 pins less at assembly 4 to 6 cm2 PCB space savings MCU or DSC (48pin) 24+ ASIC (GDU+ VREG+ LIN+ Op-amps) (48pin) ~30 pins less at assembly 2 to 3 cm2 PCB space savings External Use 33

34 S12ZVM Family (Carcassonne/Obidos) BLDC/PMSM motor control Digital MCU Core and Memories 5V Analogue High-Voltage Key Features: S12Z 50MHz bus speed VREG + 5V/20mA sensor supply LIN PHY, LIN2.1 / 2.2 / J2602 compliant 6ch Gate Pre-Driver (GDU) with nom. 100nC total Gate Charge Dual 12bit ADC, synch with PWM Programmable Triggering unit with fault protection G P I O LIN -PHY SCI 1 SPI BDM BDC TIM 16b 4ch 6ch PMF (PWM) 1# E-Vdd SCI 0 MSCAN KWU Win Wdog 2ch PTU RCosc. +/-1.3% S12Z 50MHz Bus KB Flash (ECC) 512B EEPROM (ECC) Pierce Osc. PLL 2-8kB RAM (ECC) Temp Sense Vreg 12-Bit ADC 12-Bit ADC Current Sense (2 x Op-Amp) GDU 6ch MOS-FET-Predriver Charge Pump Vsup sense 2x Op-amp for current Target applications: - Sensorless BLDC or PMSM motorcontrol - Bidirectional DC motors (H-Bridge) - Various pumps (oil / fuel / water / compressor) - Cooling fans and HVAC blower Options: Package: 64-LQFP-EP Memory: 32kB / 64kB / 128kB Flash Option -L with LIN phy pinout. Option -C with 2nd Vreg for external CAN phy Temperature: V / M / W (up to 150 C Ta) External Use 34

35 S12ZVML (LIN Version) Details Digital MCU Core and Memories 5V Analogue High-Voltage 2 UARTs One linked to LIN Phy, 2 nd as independant Test Intf. SPI - As alternative test Interf - Or for peripherals (sensors, ) MSCAN 2.0A/B Up to 18 Wakeup pins Combined with Analog Input pins Timer module - 4ch / 16Bit 6-ch PMF 15bit PWM for motor control with dead time, fault mgmt, etc External Supply 5V / 20mA switchable for local (same PCB), over current protected. Eg. supplying Hallsensors LIN Physical Layer LIN2.2 and SAE J2602 compliant +/- 8kV ESD capability G P I O LIN -PHY SCI 1 SPI BDM BDC TIM 16b 4ch 6ch PMF (PWM) 1# E-Vdd SCI 0 MSCAN KWU Win Wdog PTU Programmable triggering unit. Triggering ADC/PWM 2ch PTU S12Z CPU 16-bit, 32-bit MAC, linear addressing Harvard architech compatible within S12 MagniV RCosc. +/-1.3% S12Z 50MHz Bus KB Flash (ECC) 512B EEPROM (ECC) Pierce Osc. EEPROM 512 Byte EEPROM, 4 byte eraseable PLL 2-8kB RAM (ECC) On chip RC OSC factorytrimmed to +/- 1.3%, meets LIN -needs Temp Sense Vreg 12-Bit ADC 12-Bit ADC Current Sense (2 x Op-Amp) GDU 6ch MOS-FET-Predriver Charge Pump Vsup sense Flexible Flash Options 32/64/128kB Flash versions 2 x 12-bit ADC modules Simultaneous measurement 5+4ch external. Plus 8ch internally with DMA 2x Op-Amp for current measurement / sensing 6-ch GDU nC total Gate charge 3-phase bridge predriver Charge Pump To support reverse battery protection and boostrap assist for 100% duty-cycle Vsup sense Monitoring supply voltage Voltage Regulator Operating on car-battery 70mA total supply Packaging Options 64-LQFP-EP AEC-Q100 Grade 0 Qual ed up to 150 C Ta External Use 35

36 S12ZVM Hardware Tools Overview Type Evaluation Board BLDC Motor Control Devt Kit Purpose Evaluation and software development for either CAN or LIN target device Spin a BLDC motors within minutes HW Features - LIN and CAN interfaces - Onboard BDM-to-USB - SCI-to-USB interface for Freemaster - Hall sensor interface - Resolver interface - 6 N-channel FET with 10-15A drive capability - S12ZVML12EVBLIN with pre-programmed S12ZVML128 part - BLDC motor with Hall-effect sensors mounted on plexiglas Software Package MTRCKTSBNZVM128_SW MTRCKTSBNZVM128_SW Availability Partnumbers Prototypes now (XS12ZVMx12EVB) S12ZVML12EVBLIN S12ZVML12EVBCAN Price $349 $789 Now evkits MTRCKTSBNZVM128 External Use 36

37 Reset VSS1 VSS2 VSSX1 VSSA TM BKGD VDDF VDD VDDA VDDX2 VDDX1 BCTL LIN LINGND VSUP VSSB AMP0 BST AMPM0 AMPP0 VLS2 AMP1 VLS1 VLS0 AMPM1 VLSOUT AMPP1 S12ZVML Application Schematic VBAT +11V S D EVDD XTAL EXTAL IO/ MISO IO/ MOSI IO/ SCLK IO/ SS IO/ RXD0 IO/ TXD0 IO/ KWP0 IO/ KWP1 IO/IOC0 IO/IOC1 Hallout IO/IOC2 IO/IOC3 AN0_3 AN0_4 AN1_3 Ext Osc G P I O IRC BDM Wdog SPI SCI SCI PLL KWU RTI TIM 4ch/16b MSCAN Dual 12bit ADC 5+4ch. Ext. (Mux d with Op-Amps) + 8ch. Int. S12Z core 128 kb Flash 8 kb RAM 512Bytes EEPROM PTU PMF 6-ch PWM Vregs (5V VDD, VLS, VDD sensor) Temp Sense LIN Physical Interface Charge Pump GDU 3 phase H-Bridge Predriver Current Sense (2 x Op-Amp) VCP CP VBS0 VBS1 VBS2 HD HG0 HG1 HG2 HS0 HS1 HS2 LG0 LG1 LG2 LS0 LS1 LS2 +11V 0V VHD AMRsin AMRcos Hallout AMR/ GMR/ Hall Sensor M AMRcos AMRsin Shunt1 optional Shunt0 External Use 37

38 S12ZVM for BLDC/PMSM Fuel Pumps CAN/LIN/PWM S12ZVM Key Features for Fuel Pumps Smallest form factor with MCU + analog integration Full operation through cranking pulse down to Vsup=3.5V including gate driver. 4cm ~1 ½ in. CAN, LIN or PWM communication to main ECU. Scalability from 32K to 128K depending on pump functionality (including or not tank level sensors or other functions). External Use 38

39 General Purpose S12 MagniV 16-bit MCU with 12/5V voltage regulator, LIN-physical layer External Use 39

40 S12ZVL - family Integrated General Purpose LIN Node - Summary Key Features: S12Z-core (up to 32MHz bus frequency) compatible within MagniV On chip 12V Vreg with Supply-capability: 70mA total (170mA with ext. Ballast) LIN-PHY, LIN2.x / J2602 compliant On chip RC Oscillator; trimmed to +/- 1,3% tolerance over full temperature range Robust 12V inputs Vsup-sense & HVI (with ADC) 1x E-Vdd (20mA source capability) 1-3x N-GPIO (25 ma sink capability) 5x5mm footprint 32QFN-package optional ASIL-A compliancy Target Applications: Any kind of automotive LIN-node LIN-sensors / actuators LIN switchpanel / userinterface LIN RGB LED lighting Ultrasonic sensors G P I O LIN-PHY SCI 1 SCI 0 SPI BDM BDC TIM 16b 6+2ch 1# E-Vdd IIC KWU Win Wdog PWM 8ch 8b or 4ch 16b Family options: 1-3# NGPIO RCosc. +/-1.3% S12Z 32MHz Bus 8-32KB Flash (ECC) 128B EEPROM (ECC) Pierce Osc. HV Input Digital MCU Core and Memories PLL 1kB RAM (ECC) KNOX Temp Sense 5V Analogue High-Voltage 10-Bit ADC Vreg Vsup sense 70, or up to 170mA with ext. Ballast Flexible Memory Options: 8kB to 32kB Flash version 32-LQFP, 48-LQFP or 32QFN-Packaging C / V / M Temperature options (up to 125 C Ta) S12ZVL S12ZVLS Application orientation generic small sensors Package 48LQFP 32LQFP 32QFN Flash Memory (ECC) 32/16/8 kb 32/16/8 kb 32/16 kb NGPIO (GPIO with 25mA NMOS) Bit ADC 10ch 6ch 6ch External Use 40

41 S12ZVL Details Digital MCU Core and Memories 5V Analogue High-Voltage 2 UARTs One linked to LIN Phy, 2 nd as independant Test Intf. SPI, IIC Serial link to other Ics, e.g sensors, LIN Physical Layer LIN2.2 and SAE J2602 compliant +/- 8kV ESD capability S12Z CPU 16-bit, 32b MAC, linear addressing Harvard architec. compatible within MagniV On chip RC OSC factorytrimmed to +/- 1.3%, meets LIN -needs ADC - up to 10 ext. Ch. +7 int. channels for temp sense, supply monitors, HV inputs, internal ref Voltages ADC can directly write to RAM (DMA) Up to 23 Wakeup pins Combined with Analog Input pins and HV pins 2 Timer modules - 6ch / 16Bit - 2ch / 16 Bit 8ch PWM Configurable to 8ch / 8Bit or 4ch / 16Bit NGPIO 1-3# 5V / 25mA sink Eg. for RGB-LED External Supply 5V / 20mA switchable for local (same PCB), over current protected G P I O LIN-PHY SCI 1 SCI 0 SPI BDM BDC TIM 16b 6+2ch 1# E-Vdd IIC KWU Win Wdog PWM 8ch 8b or 4ch 16b 1-3# NGPIO High Voltage Input 12V Input for Switch Monitoring Routable to ADC RCosc. +/-1.3% S12Z 32MHz Bus 8-32KB Flash (ECC) 128B EEPROM (ECC) Pierce Osc. HV Input EEPROM 128B EEPROM, 4 byte eraseable PLL 1kB RAM (ECC) Temp Sense 10-Bit ADC Vreg Vsup sense 70, or up to 170mA with ext. Ballast Flexible Flash Options 8/16/32kB Flash version Voltage Regulator 5V/70mA total supply or 170mA with external ballast for more current and lower power dissipation Vsup sense Monitoring supply voltage (sense after protection diode) Packaging Options 32-LQFP and 48-LQFP 32-QFN 5x5mm External Use 41

42 Target Applications LIN-Sensors LIN-switchpanels LIN-Actuator Product Function Hooking up sensors into automotive LIN-Network (with signal preconditioning Market Requirements LIN-PHY, 12V-Vreg, MCU Small formfactor (QFN) ADC, SPI Product Function Reading multiple switchpositions and feeding into LIN-network Market Requirements LIN-PHY, 12V-Vreg, MCU Multiple GPIOs ADC Product Function Converting LINcommand into an activity (eg driving LEDs) Market Requirements LIN-PHY, 12V-Vreg, MCU Drivers (3x25mA drive strength in case of RGB- LED) ADC External Use 42

43 Switch Panel with S12ZVL Digital MCU Core and Memories 5V Analogue High-Voltage LIN Bus LIN-PHY SCI 1 SCI 0 RCosc. +/-1.3% Pierce Osc. PLL Temp Sense 10-Bit ADC Dials SPI IIC S12Z 32MHz Bus G P I O BDM BDC TIM 16b 6+2ch 1# E-Vdd KWU Win Wdog PWM 8ch 8b or 4ch 16b 1-3# NGPIO 8-32KB Flash (ECC) 128B EEPROM (ECC) HV Input 1kB RAM (ECC) Vreg Vsup sense 70, or up to 170mA with ext. Ballast On-board Switches Off-board Switches LED Backlight Battery Voltage Wakeup External Use 43

44 Intelligent Sensor Application Digital MCU Core and Memories 5V Analogue High-Voltage LIN Bus G P I O LIN-PHY SCI 1 SCI 0 SPI BDM BDC TIM 16b 6+2ch 1# E-Vdd IIC KWU Win Wdog PWM 8ch 8b or 4ch 16b 1-3# NGPIO RCosc. +/-1.3% S12Z 32MHz Bus 8-32KB Flash (ECC) 128B EEPROM (ECC) Pierce Osc. HV Input PLL 1kB RAM (ECC) Temp Sense 10-Bit ADC Vreg Vsup sense 70, or up to 170mA with ext. Ballast Rain / Light Sensor ASIC Automotive Voltage 5V Supply /technology_guide/articles/rain_sensor.html External Use 44

45 General Purpose S12 MagniV 16-bit MCU with 12/5V voltage regulator, CAN-physical layer External Use 45

46 S12ZVC - family integrated CAN node - Summary Key Features: S12Z-core (up to 32MHz bus frequency) compatible within MagniV On chip CAN PHY: CAN-supply requires ext. Ballast Transistor dominant Txd timeout On-chip-voltage-regulator - Supply-cpability: 70mA total with no ext components 170mA total with ext. Ballast transistor 12V Input-pins with ADC-capability (HVI) Sensor-support: 12Bit resolution ADC 16ns resolution Timer / PWM 2x Analog Comparator with DAC SENT ASIL-A compliancy Target Applications: Any kind of automotive CAN-node (non-autosar) Powertrain sensors & actuators CAN-based user-interfaces G P I O CAN-PHY Family options: 2 x SCI MSCAN 2x SPI BDM BDC HR-PWM 4ch16b HR-Tim 4ch16b 1# E-Vdd IIC Sent tx KWU Win Wdog PWM 4ch16b Tim 8ch16b 4 Open Drain RCosc. +/-1.3% S12Z 32MHz Bus kB Flash (ECC) 1-2kB EEPROM (ECC) Pierce Osc. 2 HV Input Flexible Memory Options: 64kB to 128kB Flash version 48-LQFP-EP or 64-LQFP-EP Packaging Digital MCU Core and Memories PLL 4-12kB RAM (ECC) V / M / W Temperature options (up to 150 C Ta) Temp Sense 2ch ACMP 6-bit DAC + OpAmp 5V Analogue High-Voltage 12-Bit ADC Vreg for CAN PHY with ext. ballast Vreg Vsup sense 70, or up to 170mA with ext. Ballast Fully featured (S12ZVCAx) or reduced featureset S12ZVCx) External Use 46

47 S12ZVCA (fully featured) Details Digital MCU Core and Memories 5V Analogue High-Voltage MS-CAN 2.0A/B linked to CAN Phy SENT (tx) Sent Transmitter Module 2SCI, 2SPI, IIC - Several serial comms - for peripherals, debugging, programming Up to 34 Wakeup pins Combined with Analog Input pins and HV pins 2 PWM modules 4ch/16bit 16ns resolution 4ch/16bit 32ns resolution 2 Timer modules 4ch/16bit 16ns resolution 8ch/16bit 32ns resolution External Supply 5V / 20mA source; Over current control CAN Physical Layer (HighSpeed) Supporting dominant Txd timeout G P I O CAN-PHY 2 x SCI MSCAN 2x SPI BDM BDC HR-PWM 4ch16b HR-Tim 4ch16b 1# E-Vdd IIC Sent tx KWU Win Wdog PWM 4ch16b Tim 8ch16b 4 Open Drain 2 High Voltage Inputs 12V Inputs for Switch Monitoring Routable to ADC S12Z CPU 16-bit, 32b MAC, linear addressing Harvard architec. compatible within MagniV RCosc. +/-1.3% S12Z 32MHz Bus kB Flash (ECC) 1-2kB EEPROM (ECC) Pierce Osc. 2 HV Input EEPROM 1-2kB EEPROM, 4 byte eraseable PLL 4-8kB RAM (ECC) On chip RC OSC factorytrimmed to +/- 1.3% Temp Sense 12-Bit ADC 2ch ACMP With 1x6-Bit-DAC Vreg for CAN PHY with ext. ballast Vreg Vsup sense 70, or up to 170mA with ext. Ballast Flexible Flash Options 64/128/192kB Flash version 12Bit ADC up to 16 ext. Ch. +8ch int. for temp sense, HV inputs, monitoring. ADC can directly write to RAM (DMA) 2 Analog Comparators With DAC 2nd Voltage Regulator For CAN-Phy-supply Voltage Regulator Operating on car-battery 70mA total supply or 170mA with external ballast Vsup sense Monitoring supply voltage (sense after protection diode) Packaging Options 48-LQFP-EP 64-LQFP-EP AEC-Q100 Grade 0 Qual ed up to 150 C Ta External Use 47

48 S12ZVC Usecase CAN-sensors in Powertrain Automotive Voltage Digital MCU Core and Memories 5V Analogue High-Voltage 5V Supply VREG for tot. supply: 70mA w/o ext comp. or 170mA with ext. ballast 12-Bit ADC NOX- Sensor S12Z 32MHz HVIs Particle Sensor CAN- PHY Memory MS-CAN SPI GPIO PWM Timer Humidity/Air Mass Hydrocarbo n-sensor CAN BUS Urea-Sensor Hi-temp Sensor External Use 48

49 S12 MagniV portfolio simplifies system design with easy-to-use, expertly integrated mixed-signal MCUs for automotive applications Improved Reliability Reducing the number of components in a system greatly improves reliability, requires less power which provides a greener footprint Core Efficiency S12Z core performance improves code density which reduces system flash requirements Ease of Use In addition to excellent support, availability of a full featured reference design and enablement facilitates ease of use and faster time to market External Use 49

50 S12ZVH - family entry level cluster solutions - Summary Key Features: - S12Z 32MHz bus speed - 128kB Flash / 4kB true EEPROM with ECC - VREG + 5V/20mA sensor supply - CAN with Physical Layer - Stepper Motor Controller with Stall Detect (SSD) for gauges - LCD-drive for up to 160 segments - Monotonic Sound Generator Module - Real Time Clock (with option to operate on 32kHz osc. Target applications: - entry level automotive instrument clusters G P I O CANPHY 2 x SCI MSCAN SPI BDM BDC RTC Timer 8ch16b IIC KWP 10 Open Drain Options: Win Wdog PWM 4ch16b Timer 8ch16b Pierce Osc. IRC +/-1.3% 4kB EEPROM (ECC) Digital MCU Core and Memories Package: 144-LQFP; 100-LQFP Memory: 64kB / 128kB Flash Temperature: C / V / M 32kHz Osc PLL S12Z 32MHz Bus kB Flash (ECC) 4-8kB RAM (ECC) Vbat sense Temp Sense 5V Analogue High-Voltage 10-Bit ADC 2-4 Stepper Motors with SSD Segment LCD (Up to 4x40) Soundgenerator Vreg for CAN PHY with ext. ballast Vreg Vsup sense 70, or up to 170mA with ext. Ballast External Use 50

51 S12ZVHL / S12ZVHY / S12ZVFP family basic cluster solutions - Summary Key Features: - S12Z 32MHz bus speed - 64kB Flash / 2kB true EEPROM with ECC - VREG + 5V/20mA sensor supply - LIN with Physical Layer - Stepper Motor Controller with Stall Detect (SSD) for gauges - 8 High Current pins 20mA (S12ZVFP only) - LCD-drive for up to 160 segments - Monotonic Sound Generator Module - Real Time Clock (with option to operate on 32kHz osc.) G P I O LIN-PHY 2 x SCI MSCAN SPI BDM BDC RTC Timer 8ch16b IIC KWP 10 Open Drain Win Wdog PWM 4ch16b Timer 8ch16b Pierce Osc. IRC +/-1.3% S12Z 32MHz Bus 32-64kB Flash (ECC) 2kB EEPROM (ECC) Digital MCU Core and Memories 32kHz Osc PLL 2-4kB RAM (ECC) Vbat sense Temp Sense 5V Analogue High-Voltage 10-Bit ADC 2 Stepper Motors with SSD Segment LCD (Up to 4x40) Soundgenerator Vreg Vsup sense 70, or up to 170mA with ext. Ballast Target applications: - entry level automotive/motorcycle instrument clusters - Frontpanels / Userinterfaces Options: Package: 144-LQFP; 100-LQFP Memory: 64kB / 32kB Flash Temperature: C / V / M 2 Stepper drive or 8x high current pins LIN-PHY External Use 51

52 S12ZVH Use Case Speed RPM Vbat Ignition 12V switches (e.g.- L/R/Cancel) Ballast Transistors Vsup Vddc Signal Conditioning Vreg RTC 5V OSC 32 khz Timer (Input Capture) 16bit x 8ch GPIO XOSCLCP 4-16 MHz IRC Timer 16bit x 8ch S12ZVH 128k Flash (ECC) 4k EEPROM (ECC) 8k RAM LCD drive 4x40 4 x Stepper Motor Drivers (w/ SSD) SPI 2xSCI IIC SSGM Digital MCU Core and Memories 4x40 Segment LCD 5V Speedometer Tachometer Fuel Level Coolant Temp Amp 5V Analogue High-Voltage Vsup Temperature Sensor Fuel Level Input ADC 10-bit, 8-ch on pins S12Z CPU CAN PWM 8b,6ch / 16b, 3ch Typical MCU CAN PHY S12ZVH Integration External Use 52 CAN Bus

53 Freescale S12ZVH Enablement Development Boards TRK-S12ZVH128 TRK-S12ZVHY64 TRK-S12ZVFP64 S12ZVH Reference Designs (Available on request, FSL Contact: Arturo Inzunza Leon) S12ZVH-REF-V1 S12ZVHY-REF-V1 External Use 53

54 S12ZVFP (HVAC) Use Case Ballast Transistor 5V 32 khz 4-16 MHz 4x40 Segment LCD Vbat Vsup Encoder Knob Vreg OSC XOSCLCP IRC Timer 16bit x 8ch LCD drive Up to 4x40 8 High Current GPIOs Function ON Indicator Function Buttons 5V Timer (Input Capture) 16bit x 8ch S12ZVFP SPI SCI1 IIC GPIO 64KB Flash (ECC) 2KB EEPROM (ECC) 4KB RAM (ECC) PWM_1 8b,4ch / 16b, 2ch Dimmable Backlight Vsup ADC 10-bit, 4-ch on pins S12Z CPU PWM_2 8b,6ch / 16b, 3ch Temperature Battery CAN SCI0 Typical MCU LINPHY S12ZVFP Integration LIN Bus External Use 54

55 S12G Family Expanding External Use 55 55

56 S12G Key Messages The MC9S12G-Family offers wide scalability in memory and pin-count with the performance and superior code-efficiency of Freescale's 16-Bit-S12-MCUs. The MC9S12G-Family is targeted at generic automotive applications requiring CAN or LIN/SAE J2602 communication. Functionality Performance & Reliability Time to market Reducing system-cost due to right peripheral mix Market proven Automotive 16-bit platform Broad development support. Analog integration: - 10/12Bit ADC with 2,5us conversion time - DAC & Comparator Connectivity: - CAN, SPI - LIN-UART (SCI) Memory: kB Flash with ECC - 1k-11kB RAM - 0,5-4kB EEPROM with ECC Packaging: - 20-pin 100-pin options - QFN option for space-constraint External Use 56 25MHz S12-core with superior codeefficiency Best-in-class 0.18um automotive qualified embedded flash Using best practices such as DFT, DFM and zero defect processes AEC Grade 0 from 16K to 64KB options. Tower development system boards for each product family. Expands ColdFire MCU memory size to 512KB embedded flash while also offering a versatile external interface to deliver higher processing power and Single-wire debug-interface increased flexibility. Codewarrior, 3rd parties tools, Application notes, Reference designs.... online-training

57 S12G-Family 1-3 LIN/SCI 0-1 MSCAN 1-11KB RAM KB Flash ATD 8-16ch 10 Bit (12Bit on S12GA) DAC on S12GA One scalable family for all low-end body applications 16-bit performance and convenience True EEPROM onboard Multiple SCI and SPI modules Wide operating range Vdd = 3,13.. 5,5V 25MHz Bus speed Family Member Differences 1-3 SPI 0-1 ACMP GPIO 0,5-4 KB EEPROM DBG INT S12CPU 25MHz Timer 16b 6-8ch PWM 6-8ch 8Bit (or 3-4ch 16-Bit) LQFP 20TSSOP, 48QFN Device Flash RAM EEPROM Freq MSCAN SCI SPI ATD PWM Tim DAC ACMP Packages S12GA K 11K 4K 25MHz c12b 8c8b 8c16b 2c8b 0 48/64/100 LQFP S12G K 11K 4K 25MHz c10b 8c8b 8c16b /64/100 LQFP S12GA K 11K 4K 25MHz c12b 8c8b 8c16b 2c8b 0 48/64/100 LQFP S12G K 11K 4K 25MHz c10b 8c8b 8c16b /64/100 LQFP S12G K 8K 4K 25MHz c10b 8c8b 8c16b /64/100 LQFP S12GA K 8K 4K 25MHz c12b 8c8b 8c16b /64/100 LQFP S12G96 96K 8K 3K 25MHz c10b 8c8b 8c16b /64/100 LQFP S12GA96 96K 8K 3K 25MHz c12b 8c8b 8c16b /64/100 LQFP S12G64 64K 4K 2K 25MHz c10b 6c8b 6c16b /48/64 LQFP S12GA64 64K 4K 2K 25MHz c12b 6c8b 6c16b /48/64 LQFP S12G48 48K 4K 1.5K 25MHz c10b 6c8b 6c16b /48/64 LQFP S12GA48 48K 4K 1.5K 25MHz c12b 6c8b 6c16b /48/64 LQFP S12GN48 48K 4K 1.5K 25MHz c10b 6c8b 6c16b /48/64 LQFP S12GN32 32K 2K 1K 25MHz c12b 6c8b 6c16b TSSOP 32/48LQFP/48QFN S12GNA32 32K 2K 1K 25MHz c10b 6c8b 6c16b LQFP S12GN16 16K 1K 512B 25MHz c12b 6c8b 6c16b TSSOP 32/48LQFP/48QFN S12GNA16 16K 1K 512B External Use 25MHz c10b 6c8b 6c16b LQFP Note: Not all peripherals are available in all package types.

58 Freescale Tower System e.g. TWR-S12G128-KIT ($99) Product Specific Module Board (TWR-S12G128) Elevator Boards (TWR- ELEV): Common serial and expansion bus signals Two 2x80 connectors on backside for easy signal access and sidemounting board (e.g. LCD module) Power regulation circuitry Standardized signal assignments Serial Modules Board (TWR-SER) External Use 58

59 New Fully AEC-Q100 qualified suitable for any automotive application with ambient temperatures up to 125 C The new scalable and pin-compatible S08RN families reuses existing core, IP and tools for easy migration from existing 8-bit S08 products. S08RN Family of MCUs integrates key features like EEPROM, TSI (touch sensing interface) and motor control FlexTimer to further reduce system costs. Suitable for any kind of Sensor-, Actuator- or User interface-module in an automotive LIN- Network External Use 59

60 S08RN Family LIN/SCI Up to 3 GPIO Up to 55 12Bit ADC Up to 16ch Key Features & Benefits: Optional operation on low-power 32kHz Oscillator reduces power consumption Typ. Ridd [20MHz] / Stop idd: 5mA / 1uA 6x16-bit FlexTimer PWM and analog comparator for power-conversion (DC/DC-converter, lighting, motor control, ) 16 channel Touch-Sense Interface (TSI) for implementing buttons, sliders rotary (Centerstack / Domelight / RKE...) LIN-UART & 12-bit ADC for Lin-based sensor- or I/O nodes 20mA sink on up to 8 pin reduces cost for external components Low-cost non intrusive singlewire debugging via BDM Low current Startup (500uA) on RN16/8 and RNA4/2 60kB 48kB 32kB 16kB 8kB 4kB 2kB SPI Up to 2 IIC Up to 1 6-Bit DAC (internal) Flash S08 CPU 20MHz Bus CRC DBG WD+RTC Interrupt EEPROM 4 byte Block (ECC) 256B 128B FlexTimer Up to 6+2+2ch 16b 2ch 8b Mod.-timer Analog Comparator 12-16ch TSI (not on RNA) RAM 4kB 2kB 512B Features S08RN60/48/32 S08RN16/8 S08RNA16/8 S08RNA4/2 Flash (KB) 60/48/32 16/8 16/8 4/2 RAM (KB) EEPROM (Byte) LIN/UART SPI IIC TSI (cap. Touchsensing) 16ch 12ch - - ADC channel (12-Bit) 16ch 12ch 12ch 8ch Comparator Flex-Timer (16-Bit) 6ch + 2ch + 2ch 6ch + 2ch 6ch + 2ch 2ch + 2ch Mod. Timer (8-Bit) 2ch 1ch 1ch - Pincount 64, 48, 32 48, 32, 20, 16 48, 32, 20, 16 20, 16, 8 External Use 60

61 Features & Performance TM S08RN Target Applications RN60/48/32 automotive (AEC-Q100) qualified Up to 16-ch TSI for touch-sensing Full-featured class Up to 16ch TSI pin RN16/8 Up to 12ch TSI pin 20Mhz Up to 4KB RAM; 256B EEPROM Up to 3 x LIN-UART; 2 x SPI; IIC Up to 6ch + 2ch + 2ch Flextimer (configurable for IC/OC or PWM); 2 x MTIM RTC; CRC Automotive lighting 3-Phase BLDC Automotive LIN-nodes RNA16/8 Up to 16ch 12bit ADC with 4 entry buffer registers Automotive Sensor-nodes Automotive Actuators Capacitive Touch Button-replacement no TSI pin Up to 1 ACMP Up to 8pins with 20mA Sink RNA4/2 2 pins with true open drain 2.7V~5.5V Entry-level class no TSI 8-20-pin -40 C 125 C / AEC-Q100 RKE/ Immobilizer HVAC Control Unit External Use 61

62 Freescale Touch Sense Solution Touch Sense Interface + Runs with minimal CPU intervention: interrupt in the case of a capacitance variation Low Power Operation (~1-3uA) allows wakeup capability from stop-modes No need for external components Detect electrode fault (too small or too big capacitance) Compensate temperature and Supply voltage variations Touch Sense Software Library Full API Configurable Rotary, Slider, Keypad decoders Flexible combination of any electrode array on the same application Configurable smart auto-calibration mechanisms for environment hassles Auto repeat, stuck-up key, gorilla hand and other typical HMI functions Noise rejection algorithms Application System Configuration and Management System Setup Decoders Keypad Rotary Slider Key Detector TSS Library Touch Sensing Module (TSI) TSI Module External Use 62

63 Easy-to-Use Development Tools and Training TWR-S08RN60-KIT Elevators, supporting peripheral module, MC9S08RN60 MCU card TWR-S08RN60 MCU card only Includes Quick Start Guide and labs Integrated USB-to-BDM interface (OSBDM): No USBMULTILINKBDME required - $99 savings! In-circuit debugging & Flash programming Without emulation requirements of serial monitors or other debugging techniques in the industry Demo board can be powered by the USB circuit No need for external power supply CodeWarrior Development Studio for Microcontrollers v10.x Complimentary Special Edition with compiler sizes up to 60K Single compiler/debugger tool suite including rapid application development tool, Processor Expert Partners: IAR Embedded Workbench support for S08 Cosmic Online training, webcast, technical documentation and application notes available at External Use 63

64 Body Solutions Freescale Portfolio Overview BCM and Gateway Door, Window, Seat, HVAC, Other Body Motor Control, Lighting, etc. S08 8-bit Microcontroller Families S12 16-bit Microcontroller Families S12 MagniV 16-bit with Analog ASSP/MCUs Qorivva 32-bit Single-Core Microcontr. Families Qorivva 32-bit Dual-Core Microcontr. Families System Basis Chip (SBC), Network Interconnect High Side Switches (extreme Switch), H-Bridges, Switch Monitoring External Use 64

65 Kinetis for Automotive: 32-Bit ARM MCU External Use 65

66 The SafeAssure Support General Support: SafeAssure products are conceived to simplify system-level functional safety design and cut down time to compliance Key functional safety activities addressed Safety analysis (FMEA, FTA, FMEDA) Hardware integration (Safety Manual) Software integration (Safety Manual) Support interface (DIA for ISO 26262) Body application specific: Since 2012 most body MCUs will be designed in compliance with ISO26262, for example MPC5748G, S12ZVL, S12ZVC and etc. We re stepping further in China market Co-development on prototype of modules ready for certification. A global virtual team is formed up to support functional safety opportunities in China, have already engaged with several Tier1s and car OEMs. External Use 66

67 1-CY MUL NVIC Kinetis EA Series MCUs for Automotive: Block Diagram System PMC V Ext Osc (1-20M, 32K) Int R/C OSC (~32KHz) Int LP Osc (1KHz) FLL Clk Mult LVD POR 1xWDT 1-Cycle GPIO BME (1) Debug SWD Debugger RAM Up to 16KB ARM Cortex M0+ 48MHz Core Freq Peripheral Bus Flash UP To 128KB Peripheral Bridge Communications I/O System Applications: Automotive general purpose Operating Characteristics Voltage range: 2.7 to 5.5 V Temperature range (ambient): -40 to 125 C Key Features: ARM Cortex M0+ core Up to 128K embedded flash Up to 16K RAM External OSC and internal ICS for clock System functions: LVD, WDG, CRC, SWD, BITBAND, BME, LP modes Communication interfaces: SPI, SCI, IIC, CAN Multiple timers: FTM, PWM, PIT, PWT, RTC 12-bit ADC and ACMP Open- Drain IO, KBI, GPIO 1 PWT 1 PIT 6+2+2ch 16bit Flex Timer (2) RTC (1) Support bit operation in RAM (2) Faster timer running 2 x core clock 1 MSCAN 12ch, 12bit ADC w/8 FIFO 2 Analog Comparators 2 SPI 2 I2C 3 SCI (LIN) 2 KBI Packages: 16TSSOP, 24QFN, 32LQFP, 64LQFP, 80LQFP Pin compatible within KEA family and other Kinetis Auto family External Use 67

68 DMA NVIC 1-CY MUL KFA Block Diagram KFA512 Preliminary Schedule: Sample in Q System PMC V Ext Osc (1-20M, 32K) Open- Drain IO, KBI, GPIO Int OSC (48Mhz) Int Osc (128KHz) PLL LVD POR 1xWDT MCG 1 PWT 2 KBI Debug SWD JTAG Debugger Data flash up to 64KB RAM Up to 32KB Motor Control Timer ARM Cortex M4 80 MHz FPU, DSP enabled Peripheral Bus 3 FlexCAN Flash UP To 512KB Communications I/O System 24ch, 12bit ADC w/8 FIFO 2 Analog Comparators Peripheral Bridge 3 SPI 2 I2C 4 SCI (LIN) Flex IO peripheral emulation system 1 PIT Applications: Automotive general purpose Operating Characteristics Voltage range: 3.1 to 5.5 V Temperature range (ambient): -40 to 125 C Key Features: ARM Cortex M4 core 512K embedded flash 32K SRAM 64K Data flash/eerpom(emulated) External OSC and internal ICS for clock System functions: LVD, WDG, CRC, SWD, BITBAND, BME, LP modes Communication interfaces: SPI, SCI, IIC, crystal-less CAN Multiple timers: FTM/PWM, PIT, PWT, RTC 12-bit ADC, ACMP, API Flex IO Packages: 64LQFP, 100LQFP Pin compatible within Kinetis Auto family External Use 68

69 Kinetis KEA Key differentiators KEA MCU is cost-effective auto-grade scalable 32bit product family with complete ARM ecosystem for a wide range of automotive applications -- Customers can start design easily today for fast prototyping! Complete enablement to save development cost & time Massive options of development tools, SW and HW references Complete ARM ecosystem Super scalable product family 8K to 2M embedded flash, pin to pin compatible Automotive grade Quality AEC Q100 certificated, Proven automotive IP on board, Enhanced EMC/ESD performance high performance 32-bit ARM M0+ core Low power consumption M0+ core optimized for low power Chip level low power design Advanced automotive connectivity Plenty of automotive peripherals including CAN, LIN(SCI), SPI, IIC etc Wide operating range Vdd = V, 3.3V or 5V convenience Ta = -40C to 125C Ideal for automotive applications External Use 69

70 Kinetis Auto Family- Super Scalability Migrate from KEA to KFA family: Higher performance : core and peripherals Improved security & safety Save development cost with pin compatibility, SW and tool re-use Flash Pin Count M KFA2M KFA2M KFA2M 1.5M KFA1.5M KFA1.5M KFA1.5M 1M KFA1M KFA1M KFA1M 512K KFA512 KFA512 KFA K KFA256 KFA K KEAZ128 KEA128 64K KEAZN64 KEAZ(N)64 KEAZ64 32K KEAZN32 KEAZN32 16K KEAZN16 KEAZN16 8K KEAZN8 KEAZN8 External Use 70

71 24 Hours to Prototype: Typical Development Flow Choose Your Hardware Install Development Suite Prototype with Demo Code Demo boards Reference solutions USB Starter Kits StarterTRAK $49 board Initialization / autocoding Compiler Debug Low-level drivers: CAN, LIN, Flash Demo code: CAN wakeup, LIN comms Peripheral enhancement routines External Use 71

72 Kinetis Automotive: The Development Portal StarterTRAK $49 boards, available Feb for Alpha ctms Code Warrior Compiler Processor Expert initialization tool Reference Solutions On-board opensda debugging and programming circuit LIN/CAN communications interface Analog interface with ambient light sensor 4 high efficiency LEDs 2 Push buttons Development Hardware order Automotive lighting LCM Green AutoNet - CAN-LIN gateway BLDC motor control engine control for 2W Keil Samples project IAR compiler tips app notes, schematics, design / EMC guides reference manual, electrical specs (local lang) download Dev Software & Docs Runtime Software drivers: CAN, LIN, Flash, PWM demo code: boot-loader, CAN wakeup Example shown: integrated hw & sw solution for HVAC External Use 72 Libraries: motor control Peripheral enhancement routines

73 Automotive Microcontroller Portfolio Powertrain Safety & Chassis Body DIS 32-bit ARM 32-bit Power Architecture 8-16-bit S08 / S12 / MagniV External Use 73

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