Automotive Product Portfolio Update

Transcription

1 Automotive Product Portfolio Update EUF-IND-T0590 JUNE.2014 TM External Use

2 Increased Microcontroller Content in Electronics Systems Hybrid/EV Powertrain Stop/Start Regenerative Braking Driver Information Infotainment Telematics Theater Quality Multimedia Powertrain Control Engine Control Gasoline Management Fuel Injection Chassis Breaking Systems Electronic Power Steering Active Suspension Safety Airbags with Faster Impact Detection Electronic Stability Program Collision Avoidance and Adaptive Cruise Control Body Electronics Body Control Module Seat, Door, and Window Control Remote Control HVAC Control Lighting Control/Bending/Leveling Automotive Networking/ Communication CAN LIN FlexRay Ethernet MOST External Use 1

3 Vehicle Architectural Trends Today Future Dynamics Sensors Brakes Dampers ADAS Airbags Tensioners Steering (Radar,Camera) Ped. Protection ECU ECU ECU ECU OBD Gateway Vehicle Dynamics & Safety Navigation Instruments Multimedia/ Telematics Entertainment Driver Interface (HMI) Driver Controls Body, Security Lighting Torque Management Distributed Electronic Control Units One ECU per mechanical function- Connected by multiple CAN and LIN interfaces Up to 80 individual ECUs Local and proprietary network structures Increasing software complexity Increasing cabling weight Increasing... everything Seats Mirrors Doors Lighting Distributed Computing Engine Transmission Electric Motor Generator Major computing nodes on a high performance network organized by domains which control zones Increasing data traffic Ethernet as the backbone Central Gateway will have an Ethernet Switch Lower power: Partial/pretended networking Autosar 4.0 External Use 3

4 Overview Car Network (w/o Ethernet) Various network protocols in the car: CAN, LIN, PSI5, MOST, FlexRay, etc. Different characteristics per network: data rate, latency, communication direction (peer-to-peer, single master, multi-master, etc.), quality of service, determinism, etc. Driving force: cost optimization (cable, plug, number of pins, silicon area, etc.) Lights Electric motors Electric motors Electric motors Sensors LIN LIN LIN LIN PSI5, DSI Lighting Seats Air condition Doors Airbag Squibs External Use 4 CAN Engine mgmt CAN, OBD Central ECU, Gateway CAN, FlexRay Gear box FlexRay Vehicle dynamics Wheel nodes Instrument cluster, dash board CAN, MOST Audio/Video player Navigation Video disp. Speaker Telephone Simplified example

5 Overview Car Network (w/ Ethernet) Various network protocols in the car: CAN, LIN, PSI5, MOST, FlexRay, Ethernet Different characteristics per network: data rate, latency, communication direction (peer-to-peer, single master, multi-master, etc.), quality of service, determinism, etc. Driving force: cost optimization (cable, plug, number of pins, silicon area, etc.) Bandwidth to program (flash) the car Lights Electric motors Electric motors Electric motors Sensors LIN LIN LIN LIN PSI5, DSI Lighting Seats Air condition Doors Airbag Squibs External Use 5 CAN Engine mgmt Ethernet OBD Central ECU, Gateway Switch Gear box FlexRay Ethernet Vehicle dynamics Wheel nodes Instrument cluster, dash board CAN, Ethernet Audio/Video player Cameras Switch Navigation Video disp. Speaker Telephone Simplified example

6 Body Solutions Freescale Portfolio Overview BCM and Gateway Door, Window, Seat, HVAC, Other Body Motor Control, Lighting, etc. S08 8-bit Microcontroller Families S12 16-bit Microcontroller Families S12 MagniV 16-bit with Analog ASSP/MCUs Qorivva 32-bit Single-Core Microcontr. Families Qorivva 32-bit Dual-Core Microcontr. Families System Basis Chip (SBC), Network Interconnect High Side Switches (extreme Switch), H-Bridges, Switch Monitoring External Use 6

7 Kinetis for Automotive 32-Bit ARM MCU External Use 7 ARM is a registered trademark of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved.

8 Kinetis 32-Bit ARM MCU Comes to Automotive Kinetis E Auto provides an automotive grade scalable 32-bit portfolio with ARM 32-bit M0+ and M4 optimized for high performance and low power 8K to 2M embedded flash, pin to pin compatible Peripherals including CAN, LIN(SCI), SPI, IIC AEC Q100 certificated, automotive IP on board Ta = -40 C to 125 C Vdd = V, 3.3V or 5V convenience Start your design easily today! Complete ARM ecosystem Massive options of development tools, SW and HW references Samples and Evaluation Boards (8K to 128KB) available now! More info on Kinetis Auto External Use 8 ARM is a registered trademark of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved.

9 KEA Block Diagram - KEA128 Applications: Automotive general purpose Operating Characteristics Voltage range: 2.7 to 5.5 V Temperature range (ambient): -40 to 125 C Key Features: ARM Cortex M0+ core Up to 128K embedded flash Up to 16K RAM External OSC and internal ICS for clock System functions: LVD, WDG, CRC, SWD, BITBAND, BME, LP modes Communication interfaces: SPI, SCI, IIC, CAN Multiple timers: FTM, PWM, PIT, PWT, RTC 12-bit ADC and ACMP Packages: 16TSSOP, 24QFN, 32LQFP, 64LQFP, 80LQFP Pin compatible within KEA family System PMC V Ext Osc (1-20M, 32K) Int R/C OSC (~32KHz 2%) Int LP Osc (1KHz) FLL Clk Mult LVD POR 1xWDT 1-Cycle GPIO BME (1) 6+2+2ch 2 12ch, 1 Analog bit Flex RTC 12bit ADC Timer (2) MSCAN Comparators w/8 FIFO SPI I2C Open- Drain IO, KBI, GPIO 1 PWT Debug SWD Debugger 1 PIT RAM >16KB (1) Support bit operation in RAM (2) Faster timer running 2 x core clock ARM Cortex M0+ 48MHz Core Freq Peripheral Bus Flash >128KB 1-CY MUL NVIC Peripheral Bridge Communications I/O System 3 SCI (LIN) 2 KBI External Use 9

10 Applications: Infotainment connection module GPS/Radio companion MCU Motorcycle CDI/EFI Pump/Fan controller Passive keyless Push Start BCM/HVAC Windows/Door/Sun-roof Seats/Mirror/Wiper Ambient lighting DC/BLDC Motor control Reference Solutions: Fan controller with DC motor control Pump controller with BLDC motor control HVAC BLDC blower motor control Vehicle Ambient lighting Low power LIN/CAN nodes and gateway Motor cycle CDI/EFI External Use 10

11 Functional Safety for Automotive & Industrial External Use 11

12 Functional Safety Simplified Functional safety is the absence of unreasonable risk due to hazards caused by malfunctioning behavior of electrical/electronic systems Simplifies the process of system compliance Solutions designed to address the requirements of automotive and industrial functional safety standards Reduces the time and complexity required to develop safety systems Comply with ISO and IEC standards Supports the most stringent Safety Integrity Levels (SILs) Enabling designers to build with confidence Zero defect methodology From design to manufacturing to ensure our products meet the stringent demands of safety applications More info functional Safety External Use 12

13 Functional Safety for Automotive & Industrial Applications Qorivva MPC574xP( 2x e200z4 200MHz, 2.5M Flash) 32bit Power Architecture Processor MPC574xP meets highest functional safety Built around safety concept, targeting ISO ASIL D Safety architecture with cores, DMA in delayed lock step End-to-end error correction coding (e2eecc), Duplicated periphery, start-up self-test (LBIST and MBIST) Voltage regulator redundancy and supply monitoring ADC self-test, and a fault collection unit (FCCU) Sample available now! Targeted Applications Automotive Electric Power Steering (EPS) Electronic stability control Vehicle dynamic and chassis control Safety domain control Adaptive Cruise Control Blind spot detection Industrial Aerospace and Defense Non-Automotive Transportation Factory Automation External Use 13

14 MPC574xP 2.5 MB Block Diagram Core Dual up to 200MHz PowerTM ISA e200 zen4 core ( Z420) 32 bit Reg File, 64 bit BIU with E2E ECC, 64kB RAM of D-LMEM with MPU for fast context switch + local data 8KB 2-way I-cache / 4KB 2-way D-Cache 1x Scalar FPU (compiler supported) per core Safety enhanced Cores VLE only No Signal processing unit extension + NO MMU Delayed Lock Step configuration only Memory 2.5 MBytes NVM with ECC (with add. Safety measure for address). 64kB EEE (Data Flash) available incl. ECC Up to 384 Kbyte global system SRAM with ECC (Addr + Data) I/O 3 x FlexCAN (64+2x32 message buffers) 1 x FlexRay (Dual Channel 64 msg. buffers) 2 x LINFlex (Uart/Lin protocol driver) 4 x DSPI (4 cs each) 2x FlexPWM (2x 12ch for 2 independent Motors Controlled) 3 x etimer modules (18 channel total) 4 x SAR ADC 1MS/s target 5V input capable 2 x Cross-triggering unit for motor control automatism 2x SENT System Interprocessor I/F SIPI ( approx 300Mbaud) Safe DMA Fault Collection unit, WDG, T-sens, & CRC computing unit Nexus debug interface Aurora Dual-PLL (Peripheral + System Core) 3.3 V Single supply: internal regulator with external power stage or External supply 3.3 V I/Os (ADC 5 V capable) 144 LQFP / 257 MAPBGA 0.8 mm pitch / Tj = 150 C. Extended Temperature at 165 C Option (separate P/N) External Use 14

15 Case study MPC574xP & PowerSBC Functional Safety interactions Battery Mngt Sense : AMUX Own FSM supply Vcore supply OV, UV detection Independent checker Vcca PowerSBC10 MC33907 Boost Driver Vpre 440kHz Buck Battery sense Voltage Supervisor Vcore 2.4MHz 1.2 to 3.3V configurable VI/O / 5.0V Vcca / 5.0V Vcan - 5.0V System integration MPC574xP Data & Instruction System e200z4 CPU SPE Lock Step Mode Dual core self check fit for ASILD Interrupt error informed diagnostic Analog Mux 2.5V reference Battery Sense Temperature I/Os Independant FS state Machine Configurable I/Os (6) Fail Safe Inputs Analog & Digital BIST CAN Physical Layer Energy Management State Machine Fail Safe State Machine Analog Multiplexer 2.5 V Ref. Temp. Fail Safe Inputs FCCU monitoring bistable protocol INT SecuredSPI RST MCU Challenger Fail Safe Inputs Fail Safe Output Fail Safe Outputs Safety output driver in case of MCU lock ABIST safety check Communications Timed I/O System Fault Collection and Control Unit Challenger algorithm of WD refresh RST counter LBIST Secured SPI 8-bit check parity register read back Reset config timing error generator diagnostics ABIST checks External Use 15

16 New Integration, Low Power, Security & Safety Unprecedented Integration Single-chip solution offering multicore architecture and advanced networking protocols for next generation communication requirements while reducing the quantity of body control/gateway ECUs Low Power Management New low-power modes, analog comparators, and pretended networking support help meet stringent next generation power budgets and ensure greener vehicles External Use 16 Functional Safety and Security Security modules protect ECUs against various attack scenarios and Safety modules ensure robust operation per ISO 26262

17 MPC5748C/G - Development Device and High End Gateway/BCM Solution System VReg 8-40MHz Osc FMPLL 32KHz Osc 16MHz IRC 128KHz IRC RTC/API SIUL 16xPIT+RTI 3xSWT 3xSTM SSCM FCCU BAF/BAR STCU (MBIST/LBIST) 16xSemaphore DMA MUX CTU emios 96ch Debug JTAG 3x Nexus Class 3+ Flash controller 6M Flash incl EE emulation (with ECC) 1 CRC e200z4 Core CROSSBAR SWITCH Memory Protection Unit (MPU) 32ch* ATD 12bit Crossbar Masters e200z4 Core 256k 256k 256k SRAM SRAM SRAM (with ECC) (with ECC) (with ECC) 48ch* ATD 10bit e200z2 Core Communications I/O System 3 Analog Comparators Ethernet 4 DSPI 6 SPIs X Ethernet Peripheral Bridge 4 I2C, 3 SAI MLB SDHC 8 CAN HSM FlexRay 2x USB LIN Flex 32ch edma Low Power Unit Interface Applications: High end Gateway and Body Modules Key Characteristics: 2x e200z4 + 1x z2 cores, FPU on z4 cores 160 MHz max for z4s and 80 MHz on z2 HSM Security Module option supports both SHE and EVITA low/medium standard Media Local Bus supports MOST communication 2 x USB 2.0 (1 OTG and 1 Host module) support interfacing to 3G modem and infotainment domain 2x Ethernet 10/100 Mbps RMII, MII, +1588, AVB Ethernet switch CAN module optionally supports CAN FD SDHC provides standard SDIO interface Low Power Unit provides reduced CAN, LIN, SPI, ADC functionality in low power mode Designed to ISO26262 process for use in ASIL B -40 to +125C (ambient) 3.0V to 5.5V Packages: 176 LQFP, 256 BGA, 324 BGA 5747C 5748C 5747G 5748G Cores Flash 4M 6M 4M 6M *Mixture of internal and external channels Features available depend on package and device version External Use 18 RAM 512k 768k 768k 768k MLB N N Y Y USB N N Y Y

18 Performance Analog Portfolio System Power Management Embedded System Power Management (PF0100/0200) System Basis Chips (SBC): power mgmt + comm + safety CAN bus and LIN connectivity transceivers Battery & Energy Management System Management & Automation Power Drivers Power Analog Switches Battery Monitoring System (BMS): 12V Pb, 14V Li-ion, 24V+ Alternator Regulator Chip Stop/Start MOSFETs Li-Ion Linear Battery Charger Engine Management Braking: ABS, ESC, WSS control Airbag: power mgmt + comm + safety, squib drivers Millimeter Wave Radar: 77GHz transmit & receive DSI sensor Interfaces High & low voltage H-Bridge drivers Low side drivers Programmable solenoid controllers H-Bridge and 3-phase motor pre-drivers Intelligent Distributed Controllers (IDC) 18V & 36V/24A extreme Switches: High side FET w/ smart control Multi-Switch Detect Interface (MSDI) Mini/Micro Hi-Speed USB2.0 Switch Interface External Use 19

19 One Page Overview MC33662 LIN 2.1 / J Physical Layer Key characteristics Bus Type Data Rate I Q Low Power Mode LIN ESD/150pF, 330Ω Operating voltage Operating temp. LIN 2.1 / J kb or 20kb / >100kb 6 µa ±15kV 5.5V - 27V -40 C<Tamb<125 C Features Pin-to-pin compatible with MC33399 & Excellent EMI performance thanks to bus active wave shaping High EMC immunity and ESD robustness Very low emissions: 50dBµV max in low frequency 7dBµV max in high frequency Fast slew rate selectable (>100kb) J2602 / LIN2.1 options part number selectable Automatic compatibility w 3.3 and 5.0V MCUs Low sleep current 6µA) Short to ground proof Single battery supply (no 5.0 Vdd required) Dedicated dual edge sensitive wake-up input Control of external voltage regulator through INH Tx permanent dominant timeout Target Market All LIN Nodes 8 SOIC-NB External Use 20

20 Freescale SBC Solutions Features Table Overview Part Number xG S 33903D S 33905D Product Status QS PPAP PPAP PPAP PPAP PPAP PPAP PPAP PPAP VMCU (Vdd) - 5.0V 110mA - 5.0V/3.3V 100mA+/ 2% 5.0V/3.3V 150mA+/ 2% 5.0V/3.3V 150mA+/ 2% 5.0V/3.3V 150mA+/ 2% 5.0V/3.3V 150mA+/ 2% 5.0V/3.3V 150mA+/ 2% VMCU Pw Sharing Yes/+300mA Yes/+300mA Yes/+300mA Yes/+300mA Yes/+300mA Vaux (ballast) /3.3V 5.0/3.3V 5.0/3.3V Vcan - - 5V/100mA 5V/100mA 5V/100mA 5V/100mA 5V/100mA 5V/100mA 5V/100mA CAN HS P/L LIN2.1 / J2602 P/L I/Os LowQ Voff/Von 6µA 33µA 15µA 15/25 µa 15/25 µa 15/25 µa 15/25 µa 15/25 µa 15/25 µa Battery sense - Yes - - Yes Yes Yes Yes Yes AMUX - Yes - - Yes Yes Yes Yes Yes Fail Safe Yes Yes Yes Yes Yes Watch Dog - Yes - Yes / Adv Yes / Adv Yes / Adv Yes / Adv Yes / Adv Yes / Adv SPI - 8b pseudospi 16b / Safe 16b / Safe 16b / Safe 16b / Safe 16b / Safe 16b / Safe Package SO8 LQFP32 SO14 SOIC32eP SOIC32eP SOIC32eP SOIC32eP SOIC32eP SOIC54eP Attach strategy MCU Supply - SO8 S12XS Low end SO8 SO8 S12XS S12XE S12XE MPC5604B MPC5604P MPC5634M S12XE MPC5604B MPC5604P MPC5634M S12XE MPC5604B MPC5604P MPC5634M S12XE MPC5604B MPC5604P MPC5634M S12XE MPC5604B MPC5604P MPC5634M External Use 21

21 Motor Control Integrated Solutions External Use 22

22 Introduction to MagniV S12ZVM BLDC, PMSM & DC Motor Control Innovative single chip MCU with HV Analog LL18UHV Technology: Low leakage 180nm + 40V UHV NVM, EEPROM, S12Z core, SCI/SPI, A/D, Timers Low-High Side, Relay/MOSFET Drivers, Voltage Reg, LIN/CANPhy Accelerate your design, save on cost Reduced BOM Improved Quality Lower power consumption Reduced PCB Size Build a demo in record time No need to be a motor control expert S12ZVM provides unique combination of hardware integration and a complete tools and software ecosystem. S12ZVM enables extremely compact and sophisticated 12V motor control solutions with Ta up to 150 C S12ZVM Complete Enablement External Use 23

23 Motor Control with MagniV S12ZVM Integrated solution for BLDC, PMSM & DC Motor Control Target Application: Fuel Water Oil Pump HVAC Blower Wipers AC Compressor Sliding Doors Powered Liftgate Benefits: Compact Performance Scalable Single chip saves PCB space Lower power/ noise High temp (Ta 150 C) Sensorless 32 to 128K Flash CAN & LIN HW & SW re-use Enablement: Hardware Software Libraries Eval Board MC Development Kit Mini Eval Board Development Production Compiler, Debugger Optimized Math & Motor Control algorithms TM External Use 24

24 S12ZVM Concept : Replace up to 5 IC Discrete Solution VREG (8pin) LIN phy (8pin) MCU or DSC (48pin) Op-amps 20+ Gate Driver (48pin) 4cm ~1 ½ in. S12ZVM Solution: ~ 50 fewer solder joints - 4 to 6 cm2 PCB space 64pin External Use 25

25 Product Summary - S12ZVM Family BLDC/PMSM motor control Digital Components MCU Core and Memories 5V Analogue Components High-Voltage Components Key Features: S12Z 50MHz bus speed LIN/HV -PHY SCI 1 SCI 0 Pierce Osc. RCosc. +/-1.3% PLL Temp Sense 12-Bit LADC 12-Bit LADC 6ch Gate Drive Unit (GDU) with nC total Gate Charge drive capability, incl charge pump for High-Side, Bootstrap diodes for charging external bootstrap capacitors Embedded VREG with switchable 5V/20mA sensor supply LIN PHY, LIN2.1 / 2.2 / J2602 compliant Dual 12bit list-based ADC (LADC), synch with PWM through Programmable Trigger Unit (PTU) G P I O SPI MSCAN BDM BDC KWU Win Wdog TIM 16b 4ch 6ch PMF (PWM) 1# EVdd 2ch PTU S12Z 50MHz Bus KB Flash (ECC) 512B EEPROM (ECC) 2-8kB RAM (ECC) Current Sense (2 x Op-Amp) Bootstrap Diodes GDU 6ch MOS-FET-Predriver Charge Pump Vreg Vsup sense 2x Op-amp for current sensing Target applications: Sensorless BLDC or PMSM motor control Bidirectional DC motors (H-Bridge) Various pumps (oil, fuel, water, vacuum) Cooling fan and HVAC blower Options: Package: 64-LQFP-EP, 48 LQFP-EP Memory: 16kB / 32kB / 64kB / 128kB Flash Option -L with LIN phy Option -C with 2nd Vreg for external CAN phy Temperature: V / M / W (up to 150 C Ta per AEC-Q100 Grade 0) External Use 26

26 S12ZVL - family Integrated General Purpose LIN Node - Summary Digital Components MCU Core and Memories 5V Analogue Components High-Voltage Components Key Features: S12Z-core (up to 32MHz bus frequency) compatible within MagniV On chip 12V Vreg with Supply-capability: 70mA total (170mA with ext. Ballast) LIN-PHY, LIN2.x / J2602 compliant On chip RC Oscillator; trimmed to +/- 1,3% tolerance over full temperature range Robust 12V inputs Vsup-sense & HVI (with ADC) 1x E-Vdd (20mA source capability) 1-3x N-GPIO (25 ma sink capability) 5x5mm footprint 32QFN-package optional ASIL-A compliancy Target Applications: Any kind of automotive LIN-node LIN-sensors / actuators LIN switchpanel / userinterface LIN RGB LED lighting Ultrasonic sensors G P I O LIN-PHY SCI 1 SCI 0 SPI IIC BDM BDC KWU Win Wdog TIM 16b 6+2ch PWM 8ch 8b or 4ch 16b 1# E-Vdd Family options: 1-3# NGPIO RCosc. +/-1.3% S12Z 32MHz Bus 8-32KB Flash (ECC) 128B EEPROM (ECC) Pierce Osc. HV Input PLL 1kB RAM (ECC) KNOX Temp Sense 10-Bit ADC Vreg Vsup sense 70, or up to 170mA with ext. Ballast Flexible Memory Options: 8kB to 32kB Flash version 32-LQFP, 48-LQFP or 32QFN-Packaging C / V / M Temperature options (up to 125 C Ta) S12ZVL S12ZVLS Application orientation generic small sensors Package 48LQFP 32LQFP 32QFN Flash Memory (ECC) 32/16/8 kb 32/16/8 kb 32/16 kb NGPIO (GPIO with 25mA NMOS) Bit ADC 10ch 6ch 6ch External Use 27

27 Target Applications LIN-Sensors LIN-switchpanels LIN-Actuator Product Function Hooking up sensors into automotive LIN-Network (with signal preconditioning Market Requirements LIN-PHY, 12V-Vreg, MCU Small formfactor (QFN) ADC, SPI Product Function Reading multiple switchpositions and feeding into LIN-network Market Requirements LIN-PHY, 12V-Vreg, MCU Multiple GPIOs ADC Product Function Converting LINcommand into an activity (eg driving LEDs) Market Requirements LIN-PHY, 12V-Vreg, MCU Drivers (3x25mA drive strength in case of RGB- LED) ADC External Use 28

28 High Temperature and Automotive Qualification External Use 29

29 Automotive Grade for Challenging Environment Largest portfolio with automotive qualification grade High temperature for space constraint applications Fuel, oil, water pumps, sensor and actuators AEC Q C 150 C Low PPM All Freescale Automotive MCU are certified AEC Q100 All Freescale Automotive MCU support up to 125 C ambient temperature Extended temperature up to 150 C ambient on several product lines (S08SG, S12G, S12ZV, Qorivva) Benefit of one of the lowest PPM level in the industry External Use 30

30 Software and Enablement External Use 31

31 Prototype in 24 Hours: Typical Development Flow 1 choose your hardware Demo boards Reference solutions USB Starter Kits 2 Install Development Suite Initialisation / autocoding Compiler Debug 3 Prototype with Demo Code Low-level drivers: CAN, LIN, Flash Demo code: CAN wakeup, LIN comms Peripheral enhancement routines External Use 32

32 Software Products Overview by Segment Body Chassis/Safety Powertrain Autosar 3.x MCAL OS 560xB/C/D, 564xB/C, 5668G 560xB/C/D, 564xB/C, 5668G MCAL OS 560xP, 564xL, 567xK 560xP, 5604E, 564xL, 567xK MCAL OS 563xM, 564xA, 567xF 563xM, 564xA, 567xF Autosar 4.0 MCAL OS 560xB/C/D, 564xB/C 574xB/C/G 560xB/C/D, 564xB/C 574xB/C/G MCAL OS 560xP, 564xL, 567xK 560xP, 564xL MCAL OS 564xA, 5676R 563xM, 564xA, 567xF Non-Autosar Ethernet/AVB Camera Appl SW 5604E 5604E Motor Ctrl TB 564xL, 567xK Math & MC Lib Math & MC Lib Instruction Set Self Test (Power Arch e200 cores) e200 Power Arch MCUs Initialization RAPPID for 560xP, 564xL, 567xK External Use 33

33 Development Tools (expl. MPC5646B/C) Part number Price Description XPC56xxMB2 $375 generic motherboard with connectors for Mini- Modules XDC564B256BSB3M $120 Mini Module with 256MAPBGA socketed silicon XDC564B208QSB3M $120 Mini Module with 208LQFP socketed silicon XDC564B176QSB3M $120 Mini Module with 176LQFP socketed silicon XKT564B256BSB3M $497 Motherboard + 256MAPBGA mini module + CW CD + wiggler + debugger + doc. Free permanent Compiler/debugger license limited to 128KB code. XKT564B208QSB3M $497 Motherboard + 256MAPBGA mini module + CW CD + wiggler + debugger + doc. Free permanent Compiler/debugger license limited to 128KB code. XKT564B176QSB3M $497 Motherboard + 256MAPBGA mini module + CW CD + wiggler + debugger + doc. Free permanent Compiler/debugger license limited to 128KB code. CodeWarrior Compiler Free Free permanent license limited to 128KB code. Rappid pin wizzard Free I/O allocation tool with graphical interfaces, and outputs documentation, saves engineers a few hours. U-MULTILINK $119 USB interface to PC, Universal Multilink USB Multilink (P&E) Development Interface U-MULTILINK-FX $399 USB interface to PC, Universal Multilink FX High- USB Multilink (P&E) Speed Development Interface CYCLONE_MAX $899 Programming tool, see options and add-ons on P&E website (eg automatisation for series prod, Ethernet extension ) CYCLONE_MAX_PE $899 powerful stand-alone in-circuit programmer and debugger for Freescale s high-end architectures External Use 34

34 Making the World a Smarter Place. External Use 35

35 Freescale Semiconductor, Inc. External Use