Tiny Chips and New Materials: Enabling Technologies for Smart Things

Transcription

1 Tiny Chips and New Materials: Enabling Technologies for Smart Things Rich Fletcher Visiting Scientist MIT Media Lab

2 The MIT Media Lab Information Technology:! Digital Multi-Media! Software Agents! Human/Machine Interface Design! I/O Devices, Sensors (c) R. Fletcher MIT

3 In The Beginning... (groupware) (c) R. Fletcher MIT

4 In The Present Just clever enough to intrude everywhere (c) R. Fletcher MIT

5 Sustainable Development Observations: increasing number of peripherals (wireless doesn t help) increasing number of software layers increasingly heavy development environments and install files Question: Where is this trend leading? (c) R. Fletcher MIT

6 Sustainable Development MS Word install file size Number of useful features Mb (c) R. Fletcher MIT

7 The Future? (c) R. Fletcher MIT

8 The Future? Advantages of a book: boots instantly is shock-proof has a high-contrast display permits fast random-access searches provides instant visual and tactile feedback on its state requires no maintenance The user interface of a book is well matched to our sensory and motor abilities (c) R. Fletcher MIT

9 The Post-PC Era A change for the better... (c) R. Fletcher MIT

10 Undesirables Many Buttons Batteries Cables Passwords Disks Adapters Power supplies Cartridges Connectors Manuals (c) R. Fletcher MIT

11 Smarter Things Medication shelf (MIT / Becton- Dickinson) (c) R. Fletcher MIT

12 Embedded Identification Navigation for visually-impaired reader antenna MIT Media Lab, Physics & Media Group 12

13 RFID (c) R. Fletcher MIT

14 Smart Labels barcodes chip chipless IC MANUFACTURE IC TESTING ANTENNA MANUFACTURE ANTENNA/IC ASSEMBLY CONVERSION TO LABEL/ PACKAGE today tomorrow fab print costly auto stamp/ form/ print pick & place stamp/ print self-assembly MIT Media Lab, Physics & Media Group 14

15 Embedded Computation Wearable computers Micro displays (c) R. Fletcher MIT

16 Wearable Electronics (c) R. Fletcher MIT

17 Electronic Textiles (c) R. Fletcher MIT

18 Sewable Components (c) R. Fletcher MIT

19 Embedded Displays (c) R. Fletcher MIT

20 Embedded Sensors Diaper sensors to monitor events Baby crib sensors (c) R. Fletcher MIT

21 Things That Think? Embedded intelligence, sensing Communications/Networking Distributed computing Enable new applications Enhance people s abilities; help with disabilities Achieve seamless integration of the physical and digital worlds (c) R. Fletcher MIT

22 Bill of Thing s Rights Objects have the right to: Have an identity Know their location Detect the nature of their environment Access other objects (c) R. Fletcher MIT

23 User s Bill of Rights You have the right to: Have information available when you want it, where you want it, and in the form you want it Be protected from sending or receiving information that you don t want to Use technology without attending to its needs (no batteries, configuration files, connectors, ) (c) R. Fletcher MIT

24 Enabling Technologies (c) R. Fletcher MIT

25 Tiny Chips $0.1 $1,000,000 $100,000 $10,000 $1,000 $100 $10 $1 Supercomputer Mainframe Workstation Personal Computer PDA Watch Smart Card Nano Chips MIT Media Lab, Physics & Media Group 25

26 The Challenge of Small IC s FEATURE SIZE WAFER COST FEATURE SIZE (um) WAFER COST ($) YEAR FEATURE SIZE (um) Fabrication and handling of small chips is a new challenge (c) R. Fletcher MIT

27 Self-Assembly Sarma, et al, MIT (c) R. Fletcher MIT

28 Fluidic Self-Assembly Alien Technology (c) R. Fletcher MIT

29 Nano-Blocks Software control of all major display functions Charge pump & counter electrode Number of NanoBlock ICs and Display elements Direct connection to any ISO 7816 Smartcard Integrated Power Converter World s smallest high voltage power supply No external components Drives cholesteric, EP, PDLC displays Interface Logic Tolerates all ISO 7816 clocks Software programmable Simple four lead interface Integrated ESD protection (c) R. Fletcher MIT

30 Smart Card Display Element (c) R. Fletcher MIT

31 Smart Card Displays Alien Technology Smart Card with Flexible Display (c) R. Fletcher MIT

32 Printed Logic Printed Low Temperature pn junction Printed Tunneling Structures Bulk V aristor Voltage Current (ua) Curr ent Prin ted V aristor Voltage (V) 0 (c) R. Fletcher MIT Current (A) V oltag e (V )

33 Web-Processing for Electronics Scalable Multi-layer printing Roll-to-roll (c) R. Fletcher MIT

34 Printed Polymer Transistors Many players: Plastic Logic Lucent Philips Research Rolltronics Motorola Seiko Epson (c) R. Fletcher MIT

35 Smart Materials $0.01 $0.1 $1,000,000 $100,000 $10,000 $1,000 $100 $10 $1 Supercomputer Mainframe Workstation Personal Computer PDA Watch Smart Card RFID Chip materials Plenty of room at the bottom for interesting research & applications MIT Media Lab, Physics & Media Group 35

36 Materials Evolution Ohm s Law SIMPLE HOMOGENEOUS MATERIALS Piezoelectrics UNUSUAL NATURAL MATERIALS ENGINEERED MATERIALS Composites Semiconductors Biosensors NATURAL BUT NON-HOMOGENEOUS MATERIALS (c) R. Fletcher MIT

37 Information in Materials READER MATERIAL S f, t (c) R. Fletcher MIT

38 Chipless Concept analog information S DIGITAL CODE f, t WAVEFORM DETECTION FEATURE EXTRACTION FEATURE DECODING (c) R. Fletcher MIT

39 1-Bit of ID: EAS Tags MIT Media Lab, Physics & Media Group 39

40 Multi-Resonant Structures Design Evolution MIT Media Lab, Physics & Media Group 40

41 Chipless RFID Resonant frequencies of tag Peaks in magnitude response (~5 peaks) Bits of information (~2 bits/peak) (c) R. Fletcher MIT

42 Chipless Temperature Sensor Wireless temperature sensor : Signal layer Bias magnet layer (optional) µ(t) modulation layer Tag signal layer can be harmonic or resonant material MIT Media Lab, Physics & Media Group 42

43 Sensor Data FREQUENCY SHIFT, 2625MB FREQUENCY sensor tag with u layer without u layer control TEMPERATURE (C) MIT Media Lab, Physics & Media Group 43

44 Cooking Pot Demo sensor tag control (c) R. Fletcher MIT

45 Materials for Displays Electronic Ink (c) R. Fletcher MIT

46 Micro-Encapsulated E-Ink (c) R. Fletcher MIT

47 Radio-Paper Row Electrode E paper Column Electrode Electronic Ink Data Transceiver Block On Board Logic Power Block RF Receiver w/ Printed Elements Semiconductive Photo ElectroChemical Cell/Fuel Cell (c) R. Fletcher MIT

48 Materials for Power Piezo-electrics Printed solar cells (c) R. Fletcher MIT

49 Printed Batteries Power Paper, Inc. Infinite Power Solutions, Inc. (c) R. Fletcher MIT

50 Materials for Security (Advanced Coding Systems) (TSSI) MIT Media Lab, Physics & Media Group 50

51 Printed Security Fiber Fingerprint (Escher) (c) R. Fletcher MIT

52 Authentication Must be: Low-cost Secure Robust (c) R. Fletcher MIT

53 Physical ID Concept glass microspheres in epoxy laser speckle pattern ID Code Probability that identifiers derived from 2 randomly chosen speckle patterns agree is less than See Pappu et al Science, (c) R. Fletcher MIT

54 Coming Attractions (c) R. Fletcher MIT

55 Information in Molecules MIT NMR Envision, Quantum Magnetics MIT Media Lab, Physics & Media Group 55

56 NMR/NQR Instrumentation MIT Media Lab, Physics & Media Group 56

57 RF Biology Nanotags: = f 1 = f 2 MIT Media Lab, Physics & Media Group 57

58 Conclusions Advances in chip-assembly, polymer electronics, and new materials are enabling a wide variety of new applications and functionality including: Identification Display Sensing Computing Communication Low-cost, mass-produced things (e.g. credit cards, packaging, shoes, ) can now be intelligent, too Lots of opportunities MIT Media Lab, Physics & Media Group 58