IMU for OIS. InvenSense 6-Axis OIS IMU & STMicroelectronics LSM6DSM. MEMS report by Stéphane ELISABETH November 2016

Transcription

1 InvenSense 6-Axis OIS IMU & STMicroelectronics LSM6DSM IMU for OIS MEMS report by Stéphane ELISABETH November rue la Noue Bras de Fer NANTES - FRANCE info@systemplus.fr System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 1

2 Table of Contents 4 o Executive Summary o Reverse Costing Methodology Company Profile 7 o InvenSense o iphone 7 Plus Teardown 13 o Synthesis of the o Methodology o Package 16 Package Views & Dimensions Package Pin Out Package Opening Wire Bonding Process Package Cross-Section o ASIC Die 27 View, Dimensions & Marking Delayering Main Blocks Identification Cross-Section Process Characteristics o MEMS Die 37 View, Dimensions & Marking Cap Removed & Cap Details Sensing Areas Details Cross-Section (Sensor, Cap & Sealing) Process Characteristics 57 o Global Overview o ASIC Front-End Process o ASIC Wafer Fabrication Unit o MEMS Process Flow o MEMS Wafer Fabrication Unit o Packaging Process Flow o Package Assembly Unit 76 o Synthesis of the cost analysis o Yields Explanation & Hypotheses o ASIC Die 81 ASIC Front-End Cost ASIC Back-End 0 : Probe Test & Dicing ASIC Wafer & Die Cost o MEMS Die 84 MEMS Front-End Cost MEMS Back-End 0 : Probe Test & Dicing MEMS Front-End Cost per process steps MEMS Wafer & Die Cost o Component 90 Back-End : Packaging Cost Back-End : Packaging Cost per Process Steps Back-End : Final Test Cost 6-Axis OIS IMU Component Cost Estimated Price Analysis 95 Company services System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 2

3 Executive Summary o Executive Summary o Reverse Costing Methodology o Glossary This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the 6-Axis IMU supplied by InvenSense and found in the Apple iphone 7 Plus. The IMU is a custom version of InvenSense 6-Axis device (3-Axis gyroscope + 3-Axis Accelerometer) made for Apple and integrated in the iphone 7 Plus. It s an high performance 6-Axis motion tracking optimized for optical image stabilization with enhanced Electronic Image stabilization support. With dimensions of 3.0 x 3.0 x 0.75 mm, it can be applied to mobile, IOT, Drone, Wearable or imaging. It uses the same process as InvenSense s previous generation generation 6-axis device found in the iphone 6 and iphone 6 Plus System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 3

4 Executive Summary o Executive Summary o Reverse Costing Methodology o Glossary This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the LSM6DSM 6-Axis IMU supplied by STMicro. By keeping the same footprint and decreasing considerably the power consumption compared to ST s previous generation IMU, the LSM6DSM is ready to attack the mobile market where the competition on price is stronger than ever. The IMU is the most advanced of STMicroelectronics 6-Axis port-folio device (3-Axis gyroscope + 3-Axis Accelerometer) made for motion tracking and optimized for optical image stabilization with enhanced Electronic Image stabilization support. It s directly targeting the market of the OIS IMU from InvenSense found in the iphone 7 Plus. But with dimensions of 3.0 x 2.5 x 0.82 mm, it can be applied to mobile, IOT, Drone, Wearable or imaging. The report includes a detailed technology and cost comparison with ST s previous generation LSM6DS3, the latest ST s IMU LSM6DSL and with leading edge 6-Axis OIS IMU from InvenSense found in the iphone 7 Plus System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 4

5 Reverse Costing Methodology o Executive Summary o Reverse Costing Methodology o Glossary The reverse costing analysis is conducted in 3 phases: Teardown analysis Package is analyzed and measured The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking Setup of the manufacturing process. Costing analysis Setup of the manufacturing environment Cost simulation of the process steps Selling price analysis Supply chain analysis Analysis of the selling price 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 5

6 Synthesis of the o Synthesis o Package o ASIC Die o MEMS Die 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 6

7 Synthesis of the o Synthesis o Package o ASIC Die o MEMS Die 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 7

8 0.75 mm 3.0 mm o Synthesis o Package o ASIC Die o MEMS Die Package View & Dimensions Package: LGA 16-pin Dimensions: 3.0 x 3.0 x 0.75 mm Pin Pitch: 0.5 mm 3.0 mm Marking: E 7944 CE7 Package Top View Package Bottom View Package Side View 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 8

9 0.82 mm 2.5 mm o Synthesis o Package o ASIC Die o MEMS Die Package View & Dimensions Package: LGA 14-pin Dimensions: 3.0 x 2.5 x 0.82 mm Pin Pitch: 0.5 mm 3.0 mm Marking: SF 627 Package Top View Package Bottom View Package Side View 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 9

10 Package Cross-Section o Synthesis o Package o ASIC Die o MEMS Die 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 10

11 Package Cross-Section o Synthesis o Package o ASIC Die o MEMS Die 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 11

12 MEMS Sensing Area Gyroscope o Synthesis o Package o ASIC Die o MEMS Die 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 12

13 MEMS Sensing Area Gyroscope o Synthesis o Package o ASIC Die o MEMS Die 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 13

14 Comparison with MP67B & ICM o Synthesis o Package o ASIC Die o MEMS Die 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 14

15 Comparison with LSM6DS3 & LSM6DSL o Synthesis o Package o ASIC Die o MEMS Die 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 15

16 MEMS Front-End Process Flow o Global Overview o ASIC Front-End Process o MEMS Front-End Process o Packaging Process 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 16

17 MEMS Sensor Process Flow 1/2 o Global Overview o ASIC Front-End Process o MEMS Front-End Process o Packaging Process 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 17

18 ASIC Front-End Cost o Synthesis o Supply o Yields o ASIC Wafer & Die Cost o MEMS Wafer & Die Cost o Back-End Cost o Component Cost 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 18

19 MEMS Wafer & Die Cost o Synthesis o Supply o Yields o ASIC Wafer & Die Cost o MEMS Wafer & Die Cost o Back-End Cost o Component Cost 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 19

20 Component Cost o Synthesis o Supply o Yields o ASIC Wafer & Die Cost o MEMS Wafer & Die Cost o Back-End Cost o Component Cost 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 20

21 Comparison with the OIS IMU from InvenSense o Financial Ratios o Manufacturer Price 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 21

22 COMPANY SERVICES 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 22

23 Business Models a Fields of Expertise o Company services o Feedbacks o Contact o Legal Custom Analyses (>130 analyses per year) Reports (>40 reports per year) Costing Tools Trainings 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 23

24 Feedbacks o Company services o Feedbacks o Contact o Legal Dear Customer, Thank you for giving us the opportunity to serve you better. Please help us by taking only a few seconds to give us your thoughts about the Reverse Costing Report that you have received. We appreciate to work with you and want to make sure we meet your expectations. Sincerely, Wilfried THERON Quality Manager Click below to access to our online Customer Satisfaction Survey System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 24

25 Contact PHOENIX YOLE Inc. FRANKFURT/MAIN Europa Sales Office NANTES Headquarter LYON YOLE HQ TOKYO YOLE KK o Company services o Feedbacks o Contact o Legal GREATER CHINA YOLE Headquarters 21 rue La Noue Bras de Fer Nantes FRANCE sales@systemplus.fr Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY llevenez@systemplus.fr America Sales Office Steve LAFERRIERE Phoenix USA laferriere@yole.fr Asia Sales Office Takashi ONOZAWA Tokyo JAPAN onozawa@yole.fr Mavis WANG GREATER CHINA wang@yole.fr 2016 System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 25

26 Legal o Company services o Feedbacks o Contact o Legal DISCLAIMER System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. Reverse Costing is a deposed brand, by System Plus Consulting. SERVICES Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. These results are open for discussion. We can reevaluate this circuit with your information System Plus Consulting InvenSense 6-Axis-IMU OIS in Apple iphone 7 Plus 26