Electronic Costing & Technology Experts

Size: px
Start display at page:

Download "Electronic Costing & Technology Experts"

Transcription

1 Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer Nantes France Phone : +33 (0) info@systemplus.fr March 2016 Version 1 Written by Stéphane ELISABETH DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners by SYSTEM PLUS CONSULTING, all rights reserved. 1

2 Glossary 1. Overview / Introduction 4 Executive Summary Observations Reverse Costing Methodology 2. Company Profile 8 NXP Freescale Radar Chips WLSCP & RCP 3. Physical Analysis 16 Synthesis of the Physical Analysis Module Analysis 18 Module Views, Dimensions Redistributed Chip Package Analysis 21 View, Dimensions & Marking Chipset package Overview RCP Cross-Section RCP redistribution Layer Summary of physical Data Rx Analysis MR2001RVK die 38 View, Dimensions & Marking Die RF Main Blocks ID Die Delayering & Digital/Analog Main Blocks ID Rx Details Function Rx Module Overview Buffer Tx Analysis MR2001TVK die 51 View, Dimensions & Marking Die RF Main Blocks ID Die Delayering & Digital/Analog Main Blocks ID VCO Analysis MR2001VVK die 58 View, Dimensions & Marking Die RF Main Blocks ID Die Delayering & Digital/Analog Main Blocks ID 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 2 VCO Details Function Frequency Divider Die Common Module Analysis 67 State Machine Module Analysis SPI Module Analysis Voltage Regulation Analysis Die Cross-Section 72 SiGe:C xhbt Transistor Cross-Section Resistors & Capacitors Cross-Section Process Characteristics 4. Manufacturing Process Flow 84 Chip Fabrication Unit RCP Fabrication Unit & Reconstitution Flow 5. Cost Analysis 96 Main steps of economic analysis Yields Hypotheses SiGe Die Cost Analysis 101 SiGe Wafer Front-End Cost SiGe die Front-End Cost RCP Cost Analysis 106 RCP Wafer Front-End Cost Component Cost 6. Estimated Price Analysis 113 Manufacturer Financial Ratios Estimated Selling Price Chipset Estimated Selling Price 7. Radar Chipset Comparison 117 Rx/Tx/VCO Comparison Package Comparison Cross-Section Chipset Comparison Contact 127

3 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 3

4 Package: RCP 85-ball (10x11 array) Dimensions: 6.0 x 6.0 x 0.65 mm Pin Pitch: 0.5 mm 6.0 mm Marking: PC33 MR2001RVK 6.0 mm Module top view Module bottom view 0.65 mm Module Side View The four sides show the same shape. Two pieces of copper in the molding. It s seems to be cut in the singularity step for the packaging by SYSTEM PLUS CONSULTING, all rights reserved. 4 On-Board Side View Freescale Rx/Tx/VCO Radar Chipset

5 (1) 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 5 Freescale Rx/Tx/VCO Radar Chipset

6 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 6 Freescale Rx/Tx/VCO Radar Chipset

7 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 7 Freescale Rx/Tx/VCO Radar Chipset

8 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 8 Freescale Rx/Tx/VCO Radar Chipset

9 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 9 Freescale Rx/Tx/VCO Radar Chipset

10 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 10 Freescale Rx/Tx/VCO Radar Chipset

11 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 11 Freescale Rx/Tx/VCO Radar Chipset

12 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 12

13 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 13

14 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 14

15 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 15

16 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 16

17 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 17

18 Freescale Radar Chipset Cross-Section 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 18

19 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 19

20 Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated). These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 20

21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) website :

21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) website : 21 rue La Nouë Bras de Fer - 44200 Nantes - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr November 2012 - Version 1 Written by: Romain FRAUX DISCLAIMER :

More information

21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) website :

21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) website : 21 rue La Nouë Bras de Fer - 44200 Nantes - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr August 2012- Version 1 Written by: Maher SAHMIMI DISCLAIMER : System

More information

IMU for OIS. InvenSense 6-Axis OIS IMU & STMicroelectronics LSM6DSM. MEMS report by Stéphane ELISABETH November 2016

IMU for OIS. InvenSense 6-Axis OIS IMU & STMicroelectronics LSM6DSM. MEMS report by Stéphane ELISABETH November 2016 InvenSense 6-Axis OIS IMU & STMicroelectronics LSM6DSM IMU for OIS MEMS report by Stéphane ELISABETH November 2016 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr

More information

Electronic Costing & Technology Experts

Electronic Costing & Technology Experts Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes France Phone : +33 (0) 240 180 916 email : info@systemplus.fr www.systemplus.fr June 2016 Version 1 Written by Audrey Lahrach

More information

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website : 9 rue Alfred Kastler - BP 10748-44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr August 2011 - Version 1 Written by: Sylvain HALLEREAU

More information

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website : 9 rue Alfred Kastler - BP 10748-44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr May 2011 - Version 2 Written by: Sylvain HALLEREAU DISCLAIMER

More information

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website : 9 rue Alfred Kastler - BP 10748-44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr October 2011 - Version 1 Written by: Romain FRAUX DISCLAIMER

More information

Electronic Costing & Technology Experts

Electronic Costing & Technology Experts Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes France Phone : +33 (0) 240 180 916 email : info@systemplus.fr www.systemplus.fr DISCLAIMER : System Plus Consulting provides

More information

Samsung s Galaxy S7 Processor Packages: Qualcomm/Shinko s MCeP vs. Samsung s PoP

Samsung s Galaxy S7 Processor Packages: Qualcomm/Shinko s MCeP vs. Samsung s PoP Samsung s Galaxy S7 Processor Packages: Qualcomm/Shinko s MCeP vs. Samsung s PoP Comparison of both Samsung Galaxy S7 processor packages: Qualcomm Snapdragon 820 MSM8996 with MCeP packaging technology

More information

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website : 9 rue Alfred Kastler - BP 10748-44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr June 2012 - Version 1 written by : Maher SAHMIMI DISCLAIMER

More information

WLCSP Accelerometer. MEMS report by Audrey LAHRACH March rue la Noue Bras de Fer NANTES - FRANCE

WLCSP Accelerometer. MEMS report by Audrey LAHRACH March rue la Noue Bras de Fer NANTES - FRANCE mcube MC3672 WLCSP Accelerometer MEMS report by Audrey LAHRACH March 2017 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr 2017 by System Plus Consulting

More information

Bosch LRR4 Long and Short Range 77GHz Radar

Bosch LRR4 Long and Short Range 77GHz Radar Bosch LRR4 Long and Short Range 77GHz Radar System report by David Le Gac April 2017 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr 2017 by System

More information

LG LA080WVA-SD01 8 Inch Automotive Display with Touchscreen

LG LA080WVA-SD01 8 Inch Automotive Display with Touchscreen LG LA080WVA-SD01 8 Inch Automotive Display with Touchscreen Display Report by Audrey Lahrach & Farid Hamrani June 2017 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr

More information

AMD Radeon Vega Frontier Edition

AMD Radeon Vega Frontier Edition AMD Radeon Vega Frontier Edition 2.5D & 3D Packaging SPIL CoW last Samsung HBM2 Adv. Packaging report by Romain FRAUX November 2017 Version 1 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18

More information

Camera Module 2017 Physical Analyses Overview

Camera Module 2017 Physical Analyses Overview Camera Module 2017 Physical Analyses Overview Imaging report by Audrey LAHRACH November 2017 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr 2017

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

PNP 500 ma, 50 V resistor-equipped transistor; R1 = 2.2 kω, R2 = open

PNP 500 ma, 50 V resistor-equipped transistor; R1 = 2.2 kω, R2 = open PNP 500 ma, 50 V resistor-equipped transistor; R1 = 2.2 kω, R2 = open Rev. 4 8 November 2010 Product data sheet 1. Product profile 1.1 General description 500 ma PNP Resistor-Equipped Transistor (RET)

More information

Broadband system applications i.e. WCDMA, CATV, etc. General purpose Voltage Controlled Attenuators for high linearity applications

Broadband system applications i.e. WCDMA, CATV, etc. General purpose Voltage Controlled Attenuators for high linearity applications Rev. 2 6 March 2012 Product data sheet 1. Product profile 1.1 General description Quad PIN diode in a SOT753 package. 1.2 Features and benefits 4 PIN diodes in a SOT753 package 300 khz to 4 GHz High linearity

More information

NVIDIA Tesla P100 GPU with HBM2

NVIDIA Tesla P100 GPU with HBM2 NVIDIA Tesla P100 GPU with HBM2 2.5D & 3D Packaging TSMC CWS Samsung HBM2 Adv. Packaging reprt by Rmain FRAUX August 2017 Versin 1 21 rue la Nue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 inf@systemplus.fr

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

Working around ERR7026 according to application needs

Working around ERR7026 according to application needs Freescale Semiconductor Document Number: EB795 Engineering Bulletin Rev. 0, 08/2013 Working around ERR7026 according to application needs by: Automotive and Industrial Solutions Group 1 Introduction This

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

S12VR Hardware Design. Guidelines. 1 Introduction. 2 Hardware Design. Guidelines. 2.1 Voltage regulator. Freescale Semiconductor

S12VR Hardware Design. Guidelines. 1 Introduction. 2 Hardware Design. Guidelines. 2.1 Voltage regulator. Freescale Semiconductor Freescale Semiconductor Document Number: AN4643 Application Note Rev 1, 10/2013 S12VR Hardware Design Guidelines by: Carlos Aceff 1 Introduction This document lists the required external components and

More information

Table of Contents 1 Typical Applications General Description Block Diagram Pinout System Connections Typical A

Table of Contents 1 Typical Applications General Description Block Diagram Pinout System Connections Typical A Data Sheet: Product Preview Rev 0.3, 3/2014 Xtrinsic 3-Axis Digital Angular Rate Gyroscope is a small, low-power, yaw, pitch, and roll angular rate gyroscope. The full-scale range is adjustable from ±250

More information

SL2ICS5311EW/V7. Name Description. Diameter: 8 Thickness: Material: ground + stress releave. Roughness: R t max. 5 μm. Chip size: 940 x 900 μm 2

SL2ICS5311EW/V7. Name Description. Diameter: 8 Thickness: Material: ground + stress releave. Roughness: R t max. 5 μm. Chip size: 940 x 900 μm 2 Wafer addendum Rev. 3.0 8 May 2008 Product data sheet 131030 PUBLIC 1. General description 2. Ordering information This specification describes the electrical, physical and dimensional properties of Au-bumped

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

SPI topics: watchdog, serial output and parity check

SPI topics: watchdog, serial output and parity check NXP Semiconductors Application Note Document Number: AN5106 Rev. 1.0, 7/2016 SPI topics: watchdog, serial output and parity check for the dual SOIC 24 V high-side switch family 1 Introduction This application

More information

300 V, 100 ma PNP high-voltage transistor

300 V, 100 ma PNP high-voltage transistor SOT89 Rev. 6 27 September 2011 Product data sheet 1. Product profile 1.1 General description PNP high-voltage transistor in a medium power and flat lead SOT89 (SC-62) Surface-Mounted Device (SMD) plastic

More information

i.mx 6ULL Product Usage Lifetime Estimates

i.mx 6ULL Product Usage Lifetime Estimates NXP Semiconductors Document Number: AN5337 Application Note Rev. 1, 03/2017 i.mx 6ULL Product Usage Lifetime Estimates 1. Introduction This document describes the estimated product lifetimes for the i.mx

More information

SiGe:C Low Noise High Linearity Amplifier

SiGe:C Low Noise High Linearity Amplifier Rev. 2 21 February 212 Product data sheet 1. Product profile 1.1 General description The is a low noise high linearity amplifier for wireless infrastructure applications.the LNA has a high input and output

More information

MMPF0100 Errata for Mask 1N47F and 1N18J

MMPF0100 Errata for Mask 1N47F and 1N18J Freescale Semiconductor Errata (or Chip Errata) Document Number: MMER Rev. 5.0, 4/2014 MM Errata for Mask 1N47F and 1N18J Introduction Device Revision Identification This errata document applies to the

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

High Volume Pressure Sensor for Disposable Applications

High Volume Pressure Sensor for Disposable Applications Freescale Semiconductor Data Sheet: Technical Data Pressure Rev 9, 10/2012 High Volume Pressure Sensor for Disposable Applications Freescale Semiconductor has developed a low cost, high volume, miniature

More information

MPXH6300A, 20 to 300 kpa, Absolute, Integrated, Pressure Sensor

MPXH6300A, 20 to 300 kpa, Absolute, Integrated, Pressure Sensor Freescale Semiconductor Document Number: Data Sheet: Technical Data Rev. 6.0, 09/2015, 20 to 300 kpa, Absolute, Integrated, Pressure Sensor Freescale's series sensor integrates on-chip, bipolar op amp

More information

Heterojunction Bipolar Transistor Technology (InGaP HBT) High Efficiency/Linearity Amplifier

Heterojunction Bipolar Transistor Technology (InGaP HBT) High Efficiency/Linearity Amplifier Freescale Semiconductor Technical Data Heterojunction Bipolar Transistor Technology (InGaP HBT) High Efficiency/Linearity Amplifier The MMA20312B is a 2--stage high efficiency, Class AB InGaP HBT amplifier

More information

Additional Slides for Lecture 17. EE 271 Lecture 17

Additional Slides for Lecture 17. EE 271 Lecture 17 Additional Slides for Lecture 17 Advantages/Disadvantages of Wire Bonding Pros Cost: cheapest packages use wire bonding Allows ready access to front side of die for probing Cons Relatively high inductance

More information

Low forward voltage Ultra small SMD plastic package Low capacitance Flat leads: excellent coplanarity and improved thermal behavior

Low forward voltage Ultra small SMD plastic package Low capacitance Flat leads: excellent coplanarity and improved thermal behavior Rev. 02 15 January 2010 Product data sheet 1. Product profile 1.1 General description Planar Schottky barrier triple diode with an integrated guard ring for stress protection. Three electrically isolated

More information

Mechanical Differences Between the 196-pin MAP-BGA and 196-pin PBGA Packages

Mechanical Differences Between the 196-pin MAP-BGA and 196-pin PBGA Packages Freescale Semiconductor Engineering Bulletin EB360 Rev. 1, 10/2005 Mechanical Differences Between the 196-pin MAP-BGA and 196-pin PBGA Packages This document describes the differences between the 196-pin

More information

NCR402T. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data

NCR402T. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data 16 October 2015 Product data sheet 1. General description LED driver consisting of a resistor-equipped PNP transistor with two diodes on one chip in a small SOT23 plastic package. 2. Features and benefits

More information

i.mx 6UltraLite Product Usage Lifetime Estimates

i.mx 6UltraLite Product Usage Lifetime Estimates NXP Semiconductors Document Number: AN5198 Application Notes Rev. 2, 08/2016 i.mx 6UltraLite Product Usage Lifetime Estimates 1. Introduction This document describes the estimated product lifetimes for

More information

ORDERING INFORMATION # of Ports Pressure Type Device Name

ORDERING INFORMATION # of Ports Pressure Type Device Name Freescale Semiconductor Data Sheet: Technical Data High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and

More information

DATA SHEET. BGA2031/1 MMIC variable gain amplifier DISCRETE SEMICONDUCTORS. Product specification Supersedes data of 2000 Mar 02.

DATA SHEET. BGA2031/1 MMIC variable gain amplifier DISCRETE SEMICONDUCTORS. Product specification Supersedes data of 2000 Mar 02. DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage MBD128 BGA231/1 Supersedes data of 2 Mar 2 21 Feb 5 BGA231/1 FEATURES High gain Excellent adjacent channel power rejection Small SMD package Low dissipation.

More information

EM8D-100L EMI FILTER/TVS ARRAY DESCRIPTION DFN-16 PACKAGE FEATURES APPLICATIONS MECHANICAL CHARACTERISTICS CIRCUIT DIAGRAM & PIN CONFIGURATION

EM8D-100L EMI FILTER/TVS ARRAY DESCRIPTION DFN-16 PACKAGE FEATURES APPLICATIONS MECHANICAL CHARACTERISTICS CIRCUIT DIAGRAM & PIN CONFIGURATION EMI FILTER/TVS ARRAY DESCRIPTION The is a DFN-16, 8 line low pass filter array with integrated TVS diodes. The is designed to suppress unwanted EMI/RFI signals and provide ESD protection for high-speed

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

LCD-1 Peripheral Board Technical Manual

LCD-1 Peripheral Board Technical Manual LCD-1 Peripheral Board Technical Manual Document Revision: 1.03 Date: 22 April, 2003 BiPOM Electronics, Inc. 16301 Blue Ridge Road, Missouri City, Texas 77489 Telephone: 1-713-283-9970. Fax: Fax: 1-281-416-2806

More information

WPR1500-LDO MP Receiver V2.1 Reference Design User s Guide

WPR1500-LDO MP Receiver V2.1 Reference Design User s Guide NXP Semiconductors User s Guide Document Number: WPR1500LDOMPUG Rev. 0, 09/2016 WPR1500-LDO MP Receiver V2.1 Reference Design User s Guide 1 Introduction This document describes how to use the WPR1500-LDO

More information

Freescale Semiconductor Data Sheet: Technical Data

Freescale Semiconductor Data Sheet: Technical Data Freescale Semiconductor Data Sheet: Technical Data High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and

More information

KIT34901EFEVB Evaluation Board

KIT34901EFEVB Evaluation Board Freescale Semiconductor, Inc. User s Guide Document Number: KT34901UG Rev. 1.0, 2/2014 KIT34901EFEVB Evaluation Board Featuring the MC34901 High Speed CAN Transceiver Contents Figure 1. KIT34901EFEVB Evaluation

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

i.mxrt1050 Product Lifetime Usage Estimates

i.mxrt1050 Product Lifetime Usage Estimates NXP Semiconductors Document Number: AN12170 Application Note Rev. 0, 04/2018 i.mxrt1050 Product Lifetime Usage Estimates 1. Introduction This document describes the estimated product lifetimes for the

More information

KIT33972AEWEVBE Evaluation Board

KIT33972AEWEVBE Evaluation Board Freescale Semiconductor, Inc. User s Guide Document Number: KT33972UG Rev. 1.0, 7/2013 KIT33972AEWEVBE Evaluation Board Featuring the MC33972A Multiple Switch Detection Interface IC Contents Figure 1.

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

MPXHZ6130A, 15 to 130 kpa, Absolute, Integrated Pressure Sensor

MPXHZ6130A, 15 to 130 kpa, Absolute, Integrated Pressure Sensor Freescale Semiconductor Document Number: Data Sheet: Technical Data Rev. 1.2, 06/2015, 15 to 130 kpa, Absolute, Integrated Pressure Sensor The series sensor integrates on-chip, bipolar op amp circuitry

More information

Total power dissipation: 500 mw Small plastic package suitable for surface-mounted design Wide working voltage range Low differential resistance

Total power dissipation: 500 mw Small plastic package suitable for surface-mounted design Wide working voltage range Low differential resistance Rev. 01 27 January 2010 Product data sheet 1. Product profile 1.1 General description General-purpose Zener diodes in a SOD123F small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features

More information

Dual back-to-back Zener diode

Dual back-to-back Zener diode Rev. 01 28 January 2008 Product data sheet 1. Product profile 1.1 General description in a SOD323 (SC-76) very small Surface-Mounted Device (SMD) plastic package. 1.2 Features Non-repetitive peak reverse

More information

Single Chip Module (SCM) Package-on- Package (PoP) Assembly Guide

Single Chip Module (SCM) Package-on- Package (PoP) Assembly Guide Freescale Semiconductor, Inc. Document Number: AN5247 Application Notes Rev. 0, 01/2016 Single Chip Module (SCM) Package-on- Package (PoP) Assembly Guide 1. Introduction Freescale Single Chip Modules (SCM)

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

Quick Start Guide TRK S12ZVFP64. S12 MagniV MCU for Automotive Heating, Ventilation and Air Conditioning (HVAC) Applications

Quick Start Guide TRK S12ZVFP64. S12 MagniV MCU for Automotive Heating, Ventilation and Air Conditioning (HVAC) Applications Quick Start Guide TRK S12ZVFP64 S12 MagniV MCU for Automotive Heating, Ventilation and Air Conditioning (HVAC) Applications 2 Quick Start Guide Get to Know the TRK S12ZVFP64 Potentiometer Potentiometer

More information

Processor Expert Software for i.mx Processors Version 1.0

Processor Expert Software for i.mx Processors Version 1.0 Release Notes Processor Expert Software for i.mx Processors Version 1.0 1 Overview Processor Expert Software for i.mx processors is a suite of configuration tools for i.mx family processors. This file

More information

Flash Core Voltage Supply Requirements and Considerations

Flash Core Voltage Supply Requirements and Considerations Freescale Semiconductor Application Note Document Number: AN4758 Rev. 1, 6/2013 Flash Core Voltage Supply Requirements and Considerations by: David Paterson 1 Introduction The voltage supply for Freescale

More information

Three-Phase Power Meter Hardware Design Reference Manual

Three-Phase Power Meter Hardware Design Reference Manual Freescale Semiconductor, Inc. Document Number: DRM146 Design Reference Manual Rev. 0, 03/2014 Three-Phase Power Meter Hardware Design Reference Manual by: Albert Chen and Shawn Shi 1 Overview Freescale

More information

MP3V5050V, -50 to 0 kpa, Gauge Pressure Sensor

MP3V5050V, -50 to 0 kpa, Gauge Pressure Sensor Freescale Semiconductor Document Number: Data Sheet: Technical Data Rev. 3.0, 09/2015, -50 to 0 kpa, Gauge Pressure Sensor The piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned,

More information

KIT33988CEVBE evaluation board

KIT33988CEVBE evaluation board NXP Semiconductors User s Guide Document Number: KT33988UG Rev. 2.0, 7/2016 KIT33988CEVBE evaluation board KIT33982CEVBE Figure 1. KIT33988CEVBE evaluation board Table of Contents 1 Kit contents / packing

More information

UM User manual for the BGU MHz LNA evaluation board. Document information

UM User manual for the BGU MHz LNA evaluation board. Document information User manual for the BGU7003 868MHz LNA evaluation board Rev.1.0 06 December 2011 User manual Document information Info Content Keywords 868MHz LNA, BGU7003. Application Board ordering info: Abstract This

More information

PMEG3015EH; PMEG3015EJ

PMEG3015EH; PMEG3015EJ Rev. 03 13 January 2010 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for

More information

TechSearch International, Inc.

TechSearch International, Inc. On the Road to 3D ICs: Markets and Solutions E. Jan Vardaman President TechSearch International, Inc. www.techsearchinc.com High future cost of lithography Severe interconnect delay Noted in ITRS roadmap

More information

How to setup pre-build steps in CodeWarrior for Microcontrollers v10.x

How to setup pre-build steps in CodeWarrior for Microcontrollers v10.x Freescale Semiconductor Application Note Document Number: AN4910 How to setup pre-build steps in CodeWarrior for Microcontrollers v10.x 1. Introduction This document outlines the steps for setting up userdefined

More information

Generating a Quick and Controlled Waveform With the DAC

Generating a Quick and Controlled Waveform With the DAC Freescale Semiconductor Document Number: AN4978 Application Note Rev 0, 08/2014 Generating a Quick and Controlled Waveform With the DAC by: Arpita Agarwal 1 Overview This application note describes how

More information

PMEG1030EH; PMEG1030EJ

PMEG1030EH; PMEG1030EJ Rev. 04 15 January 2010 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for

More information

Emulating Dual SPI Using FlexIO

Emulating Dual SPI Using FlexIO Freescale Semiconductor, Inc. Document Number: AN5242 Application Note Rev. 0, 01/2016 Emulating Dual SPI Using FlexIO 1. Introduction This application note discusses one example of how to use FlexIO module

More information

FRDM-K64F Board Errata

FRDM-K64F Board Errata Freescale Semiconductor, Inc. Document Number: FRDMK64F_ERRATA Board Errata Rev. 2.0, 06/2014 FRDM-K64F Board Errata by: Freescale Semiconductor, Inc. 2014 Freescale Semiconductor, Inc. 1 Errata Title:

More information

HVP-MC56F82748 User s Guide

HVP-MC56F82748 User s Guide Freescale Semiconductor, Inc. User s Guide Document Number: HVPMC56F82748UG Rev. 0, 12/2014 HVP-MC56F82748 User s Guide by: Ivan Lovas 1 High voltage controller cards overview This document supports the

More information

Electronic Coin Toss

Electronic Coin Toss 1 Electronic Coin Toss Why this circuit? This circuit was not designed for people who can make up their mind nor have a coin to use for a heads or tail coin toss. This circuit can also be used to ask it

More information

MF1ICS General description. Functional specification. 1.1 Key applications. 1.2 Anticollision. Energy. MIFARE card contacts La, Lb.

MF1ICS General description. Functional specification. 1.1 Key applications. 1.2 Anticollision. Energy. MIFARE card contacts La, Lb. Rev. 1.1 29 January 2008 Product data sheet 132211 PUBLIC 1. General description NXP has developed the MIFARE to be used in a contactless smart card according to ISO/IEC 14443 Type A. The MIFARE IC is

More information

3D systems-on-chip. A clever partitioning of circuits to improve area, cost, power and performance. The 3D technology landscape

3D systems-on-chip. A clever partitioning of circuits to improve area, cost, power and performance. The 3D technology landscape Edition April 2017 Semiconductor technology & processing 3D systems-on-chip A clever partitioning of circuits to improve area, cost, power and performance. In recent years, the technology of 3D integration

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

Interconnect Challenges in a Many Core Compute Environment. Jerry Bautista, PhD Gen Mgr, New Business Initiatives Intel, Tech and Manuf Grp

Interconnect Challenges in a Many Core Compute Environment. Jerry Bautista, PhD Gen Mgr, New Business Initiatives Intel, Tech and Manuf Grp Interconnect Challenges in a Many Core Compute Environment Jerry Bautista, PhD Gen Mgr, New Business Initiatives Intel, Tech and Manuf Grp Agenda Microprocessor general trends Implications Tradeoffs Summary

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

Kinetis USB-KW41Z Wireless Protocol Sniffer Quick Start Guide

Kinetis USB-KW41Z Wireless Protocol Sniffer Quick Start Guide NXP Semiconductors Document Number: MKW41ZSNIFFERQSG User's Guide Rev. 2, 09/2016 Kinetis USB-KW41Z Wireless Protocol Sniffer Quick Start Guide This document describes the usage of the USB- KW41Z evaluation

More information

XBee Grove Development Board. User Guide

XBee Grove Development Board. User Guide XBee Grove Development Board User Guide Revision history 90001457-13 Revision Date Description A June 2016 Converted files to new format and completed minor updates to screens and content. B October 2017

More information

TABLE OF CONTENTS III. Section 1. Executive Summary

TABLE OF CONTENTS III. Section 1. Executive Summary Section 1. Executive Summary... 1-1 Section 2. Global IC Industry Outlook and Cycles... 2-1 IC Insights' Forecast Methodology... 2-1 Overview... 2-1 Worldwide GDP... 2-1 Electronic System Sales... 2-2

More information

DSP Co-Processing in FPGAs: Embedding High-Performance, Low-Cost DSP Functions

DSP Co-Processing in FPGAs: Embedding High-Performance, Low-Cost DSP Functions White Paper: Spartan-3 FPGAs WP212 (v1.0) March 18, 2004 DSP Co-Processing in FPGAs: Embedding High-Performance, Low-Cost DSP Functions By: Steve Zack, Signal Processing Engineer Suhel Dhanani, Senior

More information

I/O232-A User s Guide

I/O232-A User s Guide rmv electronics I/O232-A User s Guide DISCLAIMER: RMV ELECTRONICS INC. does not assume any liability arising from the application and/or use of the product/s described herein, nor does it convey any license.

More information

MC13853 Tri-Band Low Noise Amplifiers with Bypass Switches Device

MC13853 Tri-Band Low Noise Amplifiers with Bypass Switches Device Freescale Semiconductor Technical Data Document Number: MC18 Rev. 1.8, 8/2008 MC18 MC18 Tri-Band Low Noise Amplifiers with Switches Device Package Information Plastic Package (QFN) Ordering Information

More information

KIT33887EKEVB Evaluation Board

KIT33887EKEVB Evaluation Board Freescale Semiconductor, Inc User s Guide Document Number: KT33887UG Rev 20, 4/2013 KIT33887EKEVB Evaluation Board Featuring the MC33887EK 50 A H-Bridge IC Contents Figure 1 KIT33887EKEVB Evaluation Board

More information

QCVS Frame Distributor Wizard User Guide

QCVS Frame Distributor Wizard User Guide NXP Semiconductors Document Number: QCVS_FDW_User_Guide User's Guide Rev. 4.x, 02/2017 QCVS Frame Distributor Wizard User Guide Contents Contents Chapter 1 Frame Distributor Wizard...3 1.1 Introduction...

More information

Integrate TWR-EPD Software with MQX RTOS Based on the TWR-K21F120M Platform

Integrate TWR-EPD Software with MQX RTOS Based on the TWR-K21F120M Platform Freescale Semiconductor, Inc. Application Note Document Number: AN5069 Rev. 0, 01/2015 Integrate TWR-EPD Software with MQX RTOS Based on the TWR-K21F120M Platform 1 Introduction This application note describes

More information

Mixed-Signal. From ICs to Systems. Mixed-Signal solutions from Aeroflex Colorado Springs. Standard products. Custom ASICs. Mixed-Signal modules

Mixed-Signal. From ICs to Systems. Mixed-Signal solutions from Aeroflex Colorado Springs. Standard products. Custom ASICs. Mixed-Signal modules A passion for performance. Mixed-Signal solutions from Aeroflex Colorado Springs Standard products Custom ASICs Mixed-Signal modules Circuit card assemblies Mixed-Signal From ICs to Systems RadHard ASICs

More information

Problem 2 If the cost of a 12 inch wafer (actually 300mm) is $3500, what is the cost/die for the circuit in Problem 1.

Problem 2 If the cost of a 12 inch wafer (actually 300mm) is $3500, what is the cost/die for the circuit in Problem 1. EE 330 Homework 1 Fall 2016 Due Friday Aug 26 Problem 1 Assume a simple circuit requires 1,000 MOS transistors on a die and that all transistors are minimum sized. If the transistors are fabricated in

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device (SMD) plastic package.

General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device (SMD) plastic package. Rev. 2 29 July 2011 Product data sheet 1. Product profile 1.1 General description General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device (SMD) plastic package.

More information

Using the MPC5777M MCAN Module to Exchange CAN FD Messages

Using the MPC5777M MCAN Module to Exchange CAN FD Messages Freescale Semiconductor Document Number: AN5045 Application Note Rev. 0, 11/2014 Using the MPC5777M MCAN Module to Exchange CAN FD Messages by: Graham Rice 1 Introduction A CAN network (Controller Area

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

Packaging of Selected Advanced Logic in 2x and 1x nodes. 1 I TechInsights

Packaging of Selected Advanced Logic in 2x and 1x nodes. 1 I TechInsights Packaging of Selected Advanced Logic in 2x and 1x nodes 1 I TechInsights Logic: LOGIC: Packaging of Selected Advanced Devices in 2x and 1x nodes Xilinx-Kintex 7XC 7 XC7K325T TSMC 28 nm HPL HKMG planar

More information

Using the Asynchronous DMA features of the Kinetis L Series

Using the Asynchronous DMA features of the Kinetis L Series Freescale Semiconductor Document Number:AN4631 Application Note Rev. 0, 12/2012 Using the Asynchronous DMA features of the Kinetis L Series by: Chris Brown 1 Introduction The power consumption of devices

More information

i.mx 6Solo/6DualLite Product Lifetime Usage Estimates

i.mx 6Solo/6DualLite Product Lifetime Usage Estimates Freescale Semiconductor, Inc. Application Note Document Number: AN4725 Rev. 2, 02/2015 i.mx 6Solo/6DualLite Product Lifetime Usage Estimates This document describes the estimated product lifetimes for

More information

HVP-KV10Z32 User s Guide

HVP-KV10Z32 User s Guide Freescale Semiconductor, Inc. User s Guide Document Number: HVPKV10Z32UG Rev. 0, 12/2014 HVP-KV10Z32 User s Guide by: Ivan Lovas 1 High voltage controller card HVP-KV10Z32 This document supports the HVP-MC3PH

More information