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1 Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer Nantes France Phone : +33 (0) info@systemplus.fr March 2016 Version 1 Written by Stéphane ELISABETH DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners by SYSTEM PLUS CONSULTING, all rights reserved. 1
2 Glossary 1. Overview / Introduction 4 Executive Summary Observations Reverse Costing Methodology 2. Company Profile 8 NXP Freescale Radar Chips WLSCP & RCP 3. Physical Analysis 16 Synthesis of the Physical Analysis Module Analysis 18 Module Views, Dimensions Redistributed Chip Package Analysis 21 View, Dimensions & Marking Chipset package Overview RCP Cross-Section RCP redistribution Layer Summary of physical Data Rx Analysis MR2001RVK die 38 View, Dimensions & Marking Die RF Main Blocks ID Die Delayering & Digital/Analog Main Blocks ID Rx Details Function Rx Module Overview Buffer Tx Analysis MR2001TVK die 51 View, Dimensions & Marking Die RF Main Blocks ID Die Delayering & Digital/Analog Main Blocks ID VCO Analysis MR2001VVK die 58 View, Dimensions & Marking Die RF Main Blocks ID Die Delayering & Digital/Analog Main Blocks ID 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 2 VCO Details Function Frequency Divider Die Common Module Analysis 67 State Machine Module Analysis SPI Module Analysis Voltage Regulation Analysis Die Cross-Section 72 SiGe:C xhbt Transistor Cross-Section Resistors & Capacitors Cross-Section Process Characteristics 4. Manufacturing Process Flow 84 Chip Fabrication Unit RCP Fabrication Unit & Reconstitution Flow 5. Cost Analysis 96 Main steps of economic analysis Yields Hypotheses SiGe Die Cost Analysis 101 SiGe Wafer Front-End Cost SiGe die Front-End Cost RCP Cost Analysis 106 RCP Wafer Front-End Cost Component Cost 6. Estimated Price Analysis 113 Manufacturer Financial Ratios Estimated Selling Price Chipset Estimated Selling Price 7. Radar Chipset Comparison 117 Rx/Tx/VCO Comparison Package Comparison Cross-Section Chipset Comparison Contact 127
3 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 3
4 Package: RCP 85-ball (10x11 array) Dimensions: 6.0 x 6.0 x 0.65 mm Pin Pitch: 0.5 mm 6.0 mm Marking: PC33 MR2001RVK 6.0 mm Module top view Module bottom view 0.65 mm Module Side View The four sides show the same shape. Two pieces of copper in the molding. It s seems to be cut in the singularity step for the packaging by SYSTEM PLUS CONSULTING, all rights reserved. 4 On-Board Side View Freescale Rx/Tx/VCO Radar Chipset
5 (1) 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 5 Freescale Rx/Tx/VCO Radar Chipset
6 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 6 Freescale Rx/Tx/VCO Radar Chipset
7 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 7 Freescale Rx/Tx/VCO Radar Chipset
8 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 8 Freescale Rx/Tx/VCO Radar Chipset
9 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 9 Freescale Rx/Tx/VCO Radar Chipset
10 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 10 Freescale Rx/Tx/VCO Radar Chipset
11 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 11 Freescale Rx/Tx/VCO Radar Chipset
12 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 12
13 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 13
14 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 14
15 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 15
16 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 16
17 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 17
18 Freescale Radar Chipset Cross-Section 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 18
19 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 19
20 Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated). These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 20
21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) website :
21 rue La Nouë Bras de Fer - 44200 Nantes - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr November 2012 - Version 1 Written by: Romain FRAUX DISCLAIMER :
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21 rue La Nouë Bras de Fer - 44200 Nantes - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr August 2012- Version 1 Written by: Maher SAHMIMI DISCLAIMER : System
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