WLCSP Accelerometer. MEMS report by Audrey LAHRACH March rue la Noue Bras de Fer NANTES - FRANCE

Transcription

1 mcube MC3672 WLCSP Accelerometer MEMS report by Audrey LAHRACH March rue la Noue Bras de Fer NANTES - FRANCE info@systemplus.fr by System Plus Consulting mcube MC3672 Accelerometer 1

2 Table of Contents 3 o Executive Summary o Reverse Costing Methodology Company Profile 8 o mcube o MC3672 Characteristics 14 o o Synthesis of the Methodology o Package 17 Package Views & Dimensions Package Pin Out Package Overview Package Cross-Section Package Bottom view and Overview Package Opening o MEMS Cap 30 o MEMS Sensing Area View, Dimensions & Marking Main Blocks Identification o ASIC Die 44 View, Dimensions & Marking Delayering Main Blocks Identification Process Characteristics o Cross-Section 50 o MEMS Structure 70 Physical Comparison 73 o mcube Accelerometers Evolutions o Comparison with competitors o Package Comparison with Bosch BMA o Global Overview o IC Front-End Process o IC Wafer Fabrication Unit o MEMS Process Flow o MEMS Wafer Fabrication Unit o Packaging Process Flow o Package Assembly Unit 103 o Synthesis of the cost analysis o Yields Explanation & Hypotheses o ASIC Front-End Cost o MEMS Front-End Cost o MEMS Front-End Cost per process steps o Total Front-End Cost o WLCSP Package Cost o WLCSP Package per process steps o Component Wafer & Die o Component Cost Estimated Price Analysis 120 Company services by System Plus Consulting mcube MC3672 Accelerometer 2

3 Executive Summary o Executive Summary o Reverse Costing Methodology o Glossary With the MC3672, mcube has released the industry s smallest WLCSP ultra-low power accelerometer for wearables, enabling significantly extended battery life and very small form factors. This new component should increase the company s market share. One target is earbud applications, like Apple s AirPods, where power consumption is a major parameter and the space is very limited. Unlike its main competitors, Bosch Sensortec and STMicroelectronics, mcube provides monolithic sensor integration for consumer electronics in a WLCSP package. This uses only wafer level steps to assemble the ASIC, MEMS sensor, MEMS cap and package. Mainly produced by TSMC, which made great efforts to provide complete platforms for MEMS manufacturing, the component is elegantly designed and better integrated than most of its competitors. After Bosch Sensortec released a WLCSP 3-axis accelerometer, mcube chose a different approach, although it still uses a Via-Middle TSV process for the package integration. Two TSV processes are used in this component, including for connecting the MEMS sensor to the IC electronics. The final size is smaller compared than Bosch s device, at 1.1mmx1.3mmx0.74mm. This is a 45% footprint and 21% thickness reduction compared to the previous 1.6mmx1.6mmx0.94mm mcube MC3635 LGA package and a 64% footprint reduction compared to the present 2mmx2mm LGA package. The report includes a complete overview of the evolution of mcube s MEMS accelerometers since the second generation. It also features a detailed technology and cost comparison with leading edge accelerometers from Bosch Sensortec and STMicroelectronics and a process comparison with Bosch s WLCSP accelerometer by System Plus Consulting mcube MC3672 Accelerometer 3

4 0.74 mm 1.09 mm Package View & Dimensions: MC3672 o Synthesis o Package o MEMS Die o IC Die o Cross-Section o Structure o Comparison Package: WLCSP Dimensions: 1.09 x 1.29 x 0.74mm Pin Pitch: mm 1.29 mm Marking: GM6 or Y4T.YE.WE Package Top View Package Bottom View Package Side View 2017 by System Plus Consulting mcube MC3672 Accelerometer 4

5 Package Cross-Section o Synthesis o Package o MEMS Die o IC Die o Cross-Section o Structure o Comparison Package Bottom View Package Cross-Section SEM View 2017 by System Plus Consulting mcube MC3672 Accelerometer 5

6 MEMS Sensing Area o Synthesis o Package o MEMS Die o IC Die o Cross-Section o Structure o Comparison MEMS Sensing Area SEM View 2017 by System Plus Consulting mcube MC3672 Accelerometer 6

7 ASIC Front-End Cost o Synthesis o Supply o Yields o IC Wafer Cost o MEMS Wafer Cost o Packaging Cost o Back-End Cost o Component Cost 2017 by System Plus Consulting mcube MC3672 Accelerometer 7

8 MEMS Front-End Cost o Synthesis o Supply o Yields o IC Wafer Cost o MEMS Wafer Cost o Packaging Cost o Back-End Cost o Component Cost 2017 by System Plus Consulting mcube MC3672 Accelerometer 8

9 WLCSP Packaging Cost o Synthesis o Supply o Yields o IC Wafer Cost o MEMS Wafer Cost o Packaging Cost o Back-End Cost o Component Cost 2017 by System Plus Consulting mcube MC3672 Accelerometer 9

10 Component Wafer & Die Cost o Synthesis o Supply o Yields o IC Wafer Cost o MEMS Wafer Cost o Packaging Cost o Back-End Cost o Component Cost 2017 by System Plus Consulting mcube MC3672 Accelerometer 10

11 mcube MC3672 Estimated Manufacturer Price o Manufacturer Price 2017 by System Plus Consulting mcube MC3672 Accelerometer 11

12 Related Reports o Company services o Feedbacks o Contact o Legal REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MEMS ACCELEROMETER Safran Colibrys VS1000 Series mcube MC Axis Accelerometer Bosch Sensortec BMA250E 3-Axis Accelerometer mcube MC Axis Accelerometer Bosch Sensortec BMA355 3-Axis Accelerometer MEMS IMU 6-Axis OIS IMUs: STMicroelectronics & InvenSense InvenSense ICM Axis Sensor Hub BOSCH Sensortec BMF055 6-Axis Sensor Hub MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT MEMS & SENSORS 3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update Sensors for Cellphones and Tablets 2016 Sensors for Wearable Electronics & Mobile Healthcare 2017 by System Plus Consulting mcube MC3672 Accelerometer 12

13 COMPANY SERVICES 2017 by System Plus Consulting mcube MC3672 Accelerometer 13

14 Business Models Fields of Expertise o Company services o Feedbacks o Contact o Legal Custom Analyses (>130 analyses per year) Reports (>40 reports per year) Costing Tools Trainings 2017 by System Plus Consulting mcube MC3672 Accelerometer 14

15 Contact PHOENIX YOLE Inc. FRANKFURT/MAIN Europa Sales Office NANTES Headquarter LYON YOLE HQ TOKYO YOLE KK o Company services o Feedbacks o Contact o Legal GREATER CHINA YOLE Headquarters 21 rue La Noue Bras de Fer Nantes FRANCE sales@systemplus.fr Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY llevenez@systemplus.fr America Sales Office Steve LAFERRIERE Phoenix USA laferriere@yole.fr Asia Sales Office Takashi ONOZAWA Tokyo JAPAN onozawa@yole.fr Mavis WANG GREATER CHINA wang@yole.fr 2017 by System Plus Consulting mcube MC3672 Accelerometer 15