CHILISIN ELECTRONICS CORP. Company Presentation 2013

Transcription

1 CHILISIN ELECTRONICS CORP. Company Presentation 2013

2 Outline Corporate Overview Product Introduction Product Roadmap Leading Brand in China 2

3 Company Milestones Established A Local Ferrite Producer Business Expansion Major Domestic Player World-class Company K $USD Acquired Belkin Int l Revenue 120, ,000 80,000 60,000 40,000 Company established Developed Mn-Zn and Iron Core Established second plant Formed strategic alliance with Yageo Developed SMD Power Inductor Developed Wire- Wound and Multilayer Established China DongGuan plant Public listing on TWSE Developed High- Frequency Chip Inductor Established ChinaSuZhou office Expanded China DongGuan plant Developed Molding and Thin-Film Technology Established U.S. office Established China Henan plant Established Korea office Constructed Hukou new HQ and plant Year 3

4 ($USD 000) Chilisin Growth vs. Global Market ($USD Million) $3,500 $3,158 $3,000 Global Value $2,500 $2,580 $2,216 $2,479 $2,218 $2,408 $2,000 $1,500 $1,000 $500 $ F 2009~2012 Global Revenue Growth 94.2% -14.0% CAGR 24.8% -4.9% Source: Paumanok Publications, Inc. 4

5 Sales Breakdown 2012 By Region

6 Sales Breakdown 2012 By Market Segment

7 PC / Systems Major Customers Telecommunication Consumer Electronics OEMs / EMSs Automotives *Any trademarks or logos used throughout this presentation are the property of their respective owners, Chilisin does not claim ownership or distribution rights of the above logos

8 Global Network & Support Factory Henan, China Factory Suzhou, China Branch Office Aanyang, Korea Chilisin HQ and Factory Hukou, Taiwan Branch Office San Jose, USA Manufacturing sites with sales offices Sales offices Distributors and agents Factory Dongguan, China Powder Factory Touliu, Taiwan 8

9 Factory Overview Headquarter Hukou, Taiwan Factory Dongguan, China Factory Henan, China Factory Suzhou, China Est Employee: 751 Est Employee: 1,199 Est Employee: 518 Est Employee: All factories are ISO 9001 and TS certified Wire-Winding Molding Multi-layering Thin-film Through-hole Manufacture Site Finished Products Inventory 9

10 Diversified Applications Computing / Mobile LED Home Appliances Server Display DSC Automotive Mother Board Game Console Set Top Box Alternative Energy Graphic Card

11 Outline Corporate Overview Product Introduction Product Roadmap Leading Brand in China Appendix 11

12 Product Line and Technology Wire-winding Molding Multi-layering Thin-film Process Power Inductor Power Inductor Bead Chip Inductor Chip Inductor Wide range for power solution DIP type for motherboard High frequency Downsize from 0402 to 0201 for handset Magnetic-resin Power Inductor 2016~3030 size for mobile phone 4040~5050 size for tablet PC 6060~8080 size for TV/audio Power Inductor SMD type for notebook & tablet PC Power Inductor SMD (miniature) type for handset & ultrabook New Products Power Inductor Common Mode Choke New Products Common Mode Choke Chip Inductor Ferrite core for power line Ceramic core for signal line & RF matching Common Mode Choke for USB2.0/3.0/HDMI Core Formation In-house Powder Mixing Technology Powder Formula 12

13 Comprehensive Product Portfolio SMD Series Multilayer Power Inductor Multilayer Chip Inductor 0805 USB3.0 CMM 0805 USB2.0 CMM SMD Power Inductor SMD Power Bead Multilayer Chip Bead 0805 HDMI CMM SMD Molding Choke Multilayer 0805 USB2.0 CMM Chip Wire-wound Inductor Thin Film RF Inductor Coil Series Power Line EMI Filter Data Line EMI Filter Toroidal Coil RF Choke Leaded Power Inductor Leaded Molding Choke Soft Ferrite Core Series Ni-Zn Series EMI Filter Iron/Ferrite Toroid In-house Ferrite Core Comparable with Murata, TDK, Taiyo Yuden, Sumida, Vishay, Coilcraft, Pulse, Wurth. 13

14 (Million Pcs/month) Multi-layering Production Capacity Molding Wire-winding Total: 2,600 Total: 85 Chip Inductor Total: 120 Common Mode Total: 30 Thin-film Through-hole Power Inductor Total: 160 Total: 40 Total:

15 Product Development Trend High Current 60A 40A Green Compliance 20A Miniaturization REACH HF RoHs <10m 1.5mm <5m 1.0mm < 2m Low Rdc 0.5mm Low Profile 15

16 Outline Corporate Overview Product Introduction Product Roadmap Leading Brand in China Appendix 16

17 CMM Chip bead Photo Tech Traditional Power Inductor Photo Tech Traditional UPB ~120Ω (BLM18SG_TN) UPB1005 (BLM15PX) UPB0603 (BLM03PX) PBY1005 (BLM15AX) UPB ~330Ω (BLM18SG_TN) 33~80Ω UPB1005 (BLM15PX) 180~220Ω ~22Ω UPB0603 (BLM03PX) ~1000Ω Product Roadmap SBJ0603 (BLM03BD) ~600Ω UPB1005 (BLM15PX) ~600Ω 80Ω CMF1210+ESD (CMM0504+ESD) CMF Ω/120Ω (CMM0504) 1.0uH/150mΩ MPx A/1.6A (MPx201610) MPx (LQM2HPN_G) HFJ0603 (BLM03HD) 600Ω/1000Ω HFY0603 (BLM03HG) 600Ω/1000Ω PBY0603 (BLM03AX) 600Ω/1000Ω UPB0603 (BLM03PX) 1.0uH/48mΩ 2.5A/2.9A 2013 Q Q Q Q Q1 120Ω 90Ω/120Ω Multilayer Type 17

18 AME (DFE252010) 4.7uH 250mΩ 1.6A/1.2A AME (DFE201612) 4.7uH 200mΩ 1.9A/1/5A Product Roadmap AME (DFE201610) 1.0uH 80mΩ 2.7A/2.3A AME (DFE201610) 2.2uH 170mΩ 1.9A/1.4A AME (DFE252012) 10uH 400mΩ 1.3A/1.0A MHCD2016 MHCD ~4.7uH MHCD uH MHCC Amorphous powder for core material to enhance electrical characteristics Molding Type 2013 Q Q Q Q Q1 18

19 MDSC/MRSC25201x Shielded, Metal SCID3010 Shielded, Coupled Inductor SCID3015 Shielded, Coupled Inductor HP0603 High Irms 1.8x1.15x1.0 CM x0.5x0.45 CS0201 Product Roadmap 3.0x3.0x x3.0x x2.0x1.0/1.2 PM0603 High Irms PM0402 High Irms LVF Shielded LVF Shielded 1.8x1.15x x0.5x x0.5x x1.0x x1.0x1.0 Wire-wound Type 2013 Q Q Q Q Q1 19

20 Product Roadmap Thin-film + Molding Power Inductor TFP (TFM201210) TFP (TFM201610) 1.0uH 60mΩ 2.9A/2.2A 1.0uH 140mΩ 2.2A/1.3A Thin-film Commonmode choke CMF0806 (CMM0302) 90Ω Thin-film Inductor TFL0603 (TFL0201) ~22nH Thin-film Type 2013 Q Q Q Q Q1 20

21 Outline Corporate Overview Product Introduction Product Roadmap Leading Brand in China Appendix 21

22 Certificates and Awards Best Partner Award from Coolpad (2012) Best Cooperate To Win Award from Lenovo (2011) Outstanding Supplier Award from SerNet (2011) Best Supplier Award from New Kinpo (2010) Best Supplier Award from Asus (2005)(2007) Best Supplier Award from Solectron (2007) Best Supplier Award from Zyxel (2006)(2007) TS16949 Certification (Since 2005) Samsung Eco-Partner Certificate (Since 2005) ISO Certification (Since 2004) Sony Green Partner Certificate (Since 2003) 22

23 Value-added Service Work Frame for Engineering Support Customer Design-in Technical Seminar Teams: EE & Material R/L/C Know-how Circuit Simulation Product Development Material Research & Developmet 23

24 Competitive Products Trustworthy Supplier Full Range of Magnetics Series Sufficient Capacity Support World-class Quality Cost Competitiveness Quick Delivery Flexible Logistic Support Value-added Service Professional Engineering Support Concurrent Product Innovation Design-in Capability Total Solution Provider 24