EMC VNXe. Adding input/output modules to a disk processor enclosure REV 03. July, 2015

Transcription

1 EMC VNXe Adding input/output modules to a disk processor enclosure REV 03 July, 2015 This document describes how to add input/output (I/O) modules to a DPE (disk processor enclosure). The printed circuit board (CPU board) in each SP in the DPE has one slot for an I/O module. You must add I/O modules in pairs of the same type of module. One module in a pair is for SP A and the other module in the pair is for SP B. To add an I/O module to an SP, you must remove the SP assembly from the enclosure, and then remove its cover to gain access to CPU board components. You add new I/O modules from the rear of the enclosure. This procedure involves storage processor (SP) reboots coordinated to ensure that at least one SP is running at all times. During an SP reboot, data will be unavailable to front- or back-end connections that are not duplicated on the peer SP. Topics include: Before you start...2 Handling I/O modules...2 Summary of tasks for adding I/O modules...5 Preparing the storage processor (SP) for service...6 Installing the upgrade... 7 Verifying the operation of a new I/O module... 13

2 Before you start Before you begin this procedure, ensure that you have received the new part and have correctly identify its intended location in the system. Refer to your Unisphere online help (Servicing your system > Adding or replacing faulted hardware components > Replace a faulted hardware component) for instructions on how to identify failures, order new parts and handle hardware components. This procedure involves storage processor (SP) reboots coordinated to ensure that at least one SP is running at all times. During an SP reboot, data will be unavailable to frontor back-end connections that are not duplicated on the peer SP. Handling I/O modules You must handle I/O modules in the same way that you handle other replaceable units. This section describes the precautions that you must take and the general procedures that you must follow when removing, installing, and storing any replaceable unit. Avoiding electrostatic discharge (ESD) damage When replacing or installing hardware units, you can inadvertently damage the sensitive electronic circuits in the equipment by simply touching them. Electrostatic charge that has accumulated on your body discharges through the circuits. If the air in the work area is very dry, running a humidifier in the work area will help decrease the risk of ESD damage. Follow the procedures below to prevent damage to the equipment. Read and understand the following instructions: Provide enough room to work on the equipment. Clear the work site of any unnecessary materials or materials that naturally build up electrostatic charge, such as foam packaging, foam cups, cellophane wrappers, and similar items. Do not remove replacement or upgrade units from their antistatic packaging until you are ready to install them. Before you begin service, gather together the ESD kit and all other materials you will need. Once servicing begins, avoid moving away from the work site; otherwise, you may build up an electrostatic charge. Use ESD anti-static gloves or an ESD wristband (with strap). If using an ESD wristband with a strap: Attach the clip of the ESD wristband to the ESD bracket or bare metal on a cabinet/rack or enclosure. Wrap the ESD wristband around your wrist with the metal button against your skin. If a tester is available, test the wristband. If an emergency arises and the ESD kit is not available, follow the procedures in Emergency procedures (without an ESD kit) on page 3. 2 EMC VNXe

3 Adding input/output modules to a disk processor enclosure Emergency procedures (without an ESD kit) In an emergency when an ESD kit is not available, use the following procedures to reduce the possibility of an electrostatic discharge by ensuring that your body and the subassembly are at the same electrostatic potential. Hardware acclimation times These procedures are not a substitute for the use of an ESD kit. Follow them only in the event of an emergency. Before touching any unit, touch a bare (unpainted) metal surface of the cabinet/rack or enclosure. Before removing any unit from its antistatic bag, place one hand firmly on a bare metal surface of the cabinet/rack or enclosure, and at the same time, pick up the unit while it is still sealed in the antistatic bag. Once you have done this, do not move around the room or touch other furnishings, personnel, or surfaces until you have installed the unit. When you remove a unit from the antistatic bag, avoid touching any electronic components and circuits on it. If you must move around the room or touch other surfaces before installing a unit, first place the unit back in the antistatic bag. When you are ready again to install the unit, repeat these procedures. Systems and components must acclimate to the operating environment before applying power. This requires the unpackaged system or component to reside in the operating environment for up to 16 hours in order to thermally stabilize and prevent condensation. Table 1 Hardware acclimation times (systems and components) If the last 24 hours of the TRANSIT/STORAGE environment was this: and the OPERATING environment is this: then let the system or component acclimate in the new environment this many hours: Temperature Humidity Nominal F (20-22 C) Nominal 40-55% RH Nominal F (20-22 C) 40-55% RH 0-1 hour Cold <68 F (20 C) Dry <30% RH <86 F (30 C) 4 hours Cold <68 F (20 C) Damp 30% RH <86 F (30 C) 4 hours Hot >72 F (22 C) Dry <30% RH <86 F (30 C) 4 hours Hot >72 F (22 C) Humid 30-45% RH <86 F (30 C) 4 hours Humid 45-60% RH <86 F (30 C) 8 hours Emergency procedures (without an ESD kit) 3

4 Table 1 Hardware acclimation times (systems and components) (continued) If the last 24 hours of the TRANSIT/STORAGE environment was this: Humid 60% RH and the OPERATING environment is this: <86 F (30 C) then let the system or component acclimate in the new environment this many hours: 16 hours Unknown <86 F (30 C) 16 hours If there are signs of condensation after the recommended acclimation time has passed, allow an additional eight (8) hours to stabilize. Systems and components must not experience changes in temperature and humidity that are likely to cause condensation to form on or in that system or component. Do not exceed the shipping and storage temperature gradient of 45 F/hr (25 C/hr). Do NOT apply power to the system for at least the number of hours specified in Table 1 on page 3. If the last 24 hours of the transit/storage environment is unknown, then you must allow the system or component 16 hours to stabilize in the new environment. Removing, installing, or storing replaceable units Use the following precautions when removing, handling, or storing replaceable units: CAUTION Some replaceable units have the majority of their weight in the rear of the component. Ensure that the back end of the replaceable unit is supported while installing or removing it. Dropping a replaceable unit could result in personal injury or damage to the equipment. 4 EMC VNXe For a module that must be installed into a slot in an enclosure, examine the rear connectors on the module for any damage before attempting its installation. A sudden jar, drop, or even a moderate vibration can permanently damage some sensitive replaceable units. Do not remove a faulted replaceable unit until you have the replacement available. When handling replaceable units, avoid electrostatic discharge (ESD) by wearing ESD anti-static gloves or an ESD wristband with a strap. For additional information, see: Avoiding electrostatic discharge (ESD) damage on page 2. Handle a replaceable unit gently. A sudden jar, drop, or vibration can permanently damage some replaceable units. Avoid touching any exposed electronic components and circuits on the replaceable unit. Never use excessive force to remove or install a replaceable unit. Take time to read the instructions carefully.

5 Adding input/output modules to a disk processor enclosure Store a replaceable unit in the antistatic bag and the specially designed shipping container in which you received it. Use the antistatic bag and special shipping container when you need to return the replaceable unit. Replaceable units must acclimate to the operating environment before applying power. This requires the unpackaged component to reside in the operating environment for up to 16 hours in order to thermally stabilize and prevent condensation. Refer to Hardware acclimation times on page 3 to ensure the replaceable unit has thermally stabilized to the operating environment. Your storage system is designed to be powered on continuously. Most components are hot swappable; that is, you can replace or install these components while the storage system is running. However, the system requires that: Front bezels should always be attached to ensure EMI compliance. Make sure you reattach the bezel after replacing a component. Each slot should contain a component or filler panel to ensure proper air flow throughout the system. Unpacking a part 1. Wear ESD gloves or attach an ESD wristband to your wrist and the enclosure in which you are installing the part. 2. Unpack the part and place it on a static-free surface. 3. If the part is a replacement for a faulted part, save the packing material to return the faulted part. Summary of tasks for adding I/O modules To add I/O modules you must complete the tasks below in the order listed. This document provides instructions for completing each task. 1. Add one I/O module to SP A: a. Prepare the SP A for service. b. Remove the SPA assembly. c. Remove the top cover from the SP A assembly. d. Remove the I/O filler module from the SP A assembly. e. Unpack the I/O module. f. Install the I/O module. g. Replace the top cover on the SPA assembly. h. Reinstall the SP A assembly. i. Reboot the SP A. j. Verify that the system recognizes the I/O module. 2. Add one I/O module to SP B: a. Prepare the SP B for service. b. Remove the SP B assembly. Unpacking a part 5

6 c. Remove the top cover from the SP B assembly. d. Remove the I/O filler module from the SP B assembly. e. Unpack the I/O module. f. Install the I/O module. g. Replace the top cover on the SP B assembly. h. Reinstall the SP B assembly. i. Reboot the SP B. j. Verify that the system recognizes the I/O module. 3. Commit the I/O modules. 4. Verify that the new I/O module on each SP is recognized by your system, and operating correctly. Preparing the storage processor (SP) for service To protect your VNXe system from accidental data loss during this maintenance activity, you must prepare the SP for service. You prepare an SP for service by putting it in Service mode. Both SPs must NOT be in Service mode at the same time. 1. Open Unisphere and select Settings, then Service System. 2. Log in with your service password. 3. In the System Components column, select the storage processor with the part you are replacing (SP A or SP B). 4. Under Service Actions, select Enter Service Mode, then Execute service action. 5. In the Service Confirmation dialog box click OK. Putting an SP into Service mode takes about 10 minutes to complete. 6. Wait until the SP fault LED is flashing alternating amber and blue before continuing to the next task. The storage processor fault LED will flash alternating amber and blue while the SP remains in Service mode and is receiving active power (Figure 1 on page 6). Figure 1 SP fault LED _03 HDMI 6 EMC VNXe

7 Adding input/output modules to a disk processor enclosure Installing the upgrade Removing an SP assembly Before you begin Ensure that you have completed all of the preparation tasks presented earlier in this procedure. Before you begin Locate the faulted SP assembly with the flashing alternating amber and blue Fault LED. Figure 2 Location of SP assembly fault LED _03 HDMI DO NOT REMOVE an SP assembly while the "Unsafe to remove SP" LED shown below is lit. Refer to Figure 3 on page 8 while performing the procedure that follows. 1. Disconnect the network and all other cables from the back of the SP assembly; label the cables with the port numbers from which you removed them. Do not remove any cables from the other SP assembly. CAUTION The SP assembly comes completely out of the enclosure. In addition to holding the latches, be prepared to support the SP assembly to avoid dropping it. 2. Squeeze the orange levers on the latches on the sides of the SP assembly to release the latches, and then pull the latches outward. 3. Pull out the latches until they are fully extended and the SP assembly is released from the enclosure. 4. Use the latches to slide the SP assembly about half-way out of the enclosure. 5. Use both hands to support the SP assembly and pull it fully out of the enclosure. 6. Place the SP assembly on a clean, flat static-free work surface. Installing the upgrade 7

8 Figure 3 Removing an SP assembly 1 2 CL5231 Removing the SP top cover 7. Wait for all LED indicators on the removed SP to turn OFF before continuing. This will occur in about 60 seconds. Refer to Figure 4 on page 8 while performing the procedure that follows. 1. Press the blue button on the cover. 2. Push the cover straight back 1/4 inch. 3. Lift the cover up. Figure 4 Removing the SP top cover CL5233 Removing the I/O filler module Refer to Figure 5 on page 9 while performing the procedure that follows. 1. Lift the blue latch carefully until it ejects the filler module from the connector. 8 EMC VNXe

9 Adding input/output modules to a disk processor enclosure 2. Lift the module out and away from the canister and place it on a static free surface. Figure 5 Removing the I/O filler module 1 2 CL5235 Installing the I/O module Refer to Figure 6 on page 10 while performing the procedure that follows. 1. Angle the I/O module slightly so it fits into the canister and align it with the blue and gray alignment pins. Do not attempt to seat the module into the CPU connector while you are holding the module at an angle. Doing so will damage the connections. The module should be flat before you attempt to seat it in the connector. 2. With the I/O module aligned and parallel to the CPU board, press the blue latch down to fully seat the module in the connector. Installing the I/O module 9

10 Figure 6 Installing the I/O module 1 2 CL5236 Replacing the SP top cover Refer to Figure 7 on page 10 while performing the procedure that follows. 1. Align the cover tabs with the notches in the canister. 2. Slide it forward 1/4 inch until the tab secures the cover. Figure 7 Replacing the SP top cover CL5234 Installing an SP assembly 10 EMC VNXe Refer to Figure 8 on page 11 while performing the procedure that follows. 1. Pull out the latches on each side of the SP assembly and make sure they stay in the open position. 2. Align the SP assembly with the enclosure opening and push it straight into the enclosure. The latches begin to close when they contact the enclosure edges.

11 Adding input/output modules to a disk processor enclosure 3. Close the right and left latches to fully seat the SP assembly in the enclosure. An audible click indicates that the latches are secure. Figure 8 Installing an SP assembly 1 2 CL Ensure that the SP assembly starts powering up after installation. If not, reseat the SP assembly. 5. Reconnect the cables to the back of the SP assembly being sure to connect all cables to the same ports from which you removed them. Rebooting an SP When you have returned the SP assembly to the enclosure, reboot the recently serviced SP to ensure that it leaves Service mode using the procedure that follows. 1. From Unisphere, select Settings, then Service System. 2. Log in with your service password. 3. In the System Components column, select the storage processor currently in Service mode (SP A or SP B). 4. Under Service Actions, select Reboot, then Execute service action. It may take up to 12 minutes for the system to complete its reboot to return to normal mode. 5. Either refresh your browser or follow the on-screen instructions to bring the software out of service mode and restore full-function Unisphere. Verifying that the new I/O module is recognized Verify that the new I/O module is recognized by your system and is not faulted using the procedure that follows. Do not attempt to commit the new I/O module at this time. Wait until directed later in this procedure for the appropriate point to commit both new I/O modules. Rebooting an SP 11

12 1. Open Unisphere and select System, then System Health. 2. Select the new I/O module in the System Components list or the graphical view: In the System Components list, the new module should be marked with a yellow Warning status icon because it has not been committed yet In the graphical view, the module should be highlighted yellow. If the system health monitor shows the module as faulted, contact your service provider. Adding the I/O module to SP B You have completed the addition of the I/O module to SP A. Now you are ready to add the other I/O module to SP B by repeating the following tasks that you just performed for SP A: 1. Preparing the SP for service. 2. Removing the SP assembly. 3. Removing the SP top cover. 4. Removing the I/O filler module. 5. Unpacking the I/O module. 6. Installing the I/O module. 7. Replacing the SP top cover. 8. Installing the SP assembly. 9. Rebooting the SP. Committing the new I/O modules 10. Verifying that the I/O is recognized by the system. Before you begin Before you commit the new I/O modules both storage processors and the system software need to be fully operational. If you attempt to commit the new I/O modules before the storage processors have completely booted into normal mode, then the commit will fail. You must commit the new I/O modules before they can be used. 1. In Unisphere, click select System, then System Health. 2. Select the DPE in the System Components list. 3. In the Component Description window, click Commit I/O Modules. Note Committing I/O modules requires multiple reboots of the SPs and may take up to an hour to complete. You can find I/O module commit and SP reboot status details on System > Logs. During these reboots you will temporarily lose Unisphere connectivity. 12 EMC VNXe After this process completes, the new I/O modules have been successfully committed into the system.

13 Adding input/output modules to a disk processor enclosure If the commit of the new I/O module fails, please wait 15 minutes for the system to fully boot and then re-attempt the commit process. Verifying the operation of a new I/O module Verify that the new I/O module is recognized by your system and operating correctly using the procedure that follows. 1. In Unisphere, select System > System Health. 2. Select the part in the System Component list or the graphical view. Note To verify the status of a part contained within the storage processor, like a battery backup unit, for example, you must locate the part in the System Component list. In the System Component list, the part should be marked with a status OK icon: Note If the part does not appear, refresh your browser by closing it, re-logging in to Unisphere, and navigating to the System Component page. In the graphical view, the part should be highlighted green. If the system health monitor shows the part as faulted, contact your service provider. Verifying the operation of a new I/O module 13

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