14 th European Advanced Technology Workshop on Micropackaging and Thermal management

Transcription

1 ADVANCED PROGRAM AND REGISTRATION FORM 14 th European Advanced Technology Workshop on Micropackaging and Thermal management 6 & 7 February 2019 MERCURE OCEANIDE VIEUX PORT SUD Quai Louis Prunier La Rochelle France Tel : 33 (0) /Fax : 33 (0) H0569@accor.com. Hotel reservations will be made by the organizing committee Workshop arrival day: Tuesday, 5 February 2019 WORKSHOP COMMITTEE: Conference chairman: France: Jean-Yves SOULIER (ZODIAC AEROSPACE) Technical Program Committee: France: Jacques FAVRE (apsi 3D ) Jean-Pierre FRADIN (ICAM Toulouse) Sandrine LELONG-FENEYROU (ZODIAC AEROSPACE) Bruno LEVRIER (BL Expertises) Claude SARNO (THALES AVIONICS) Raphael SOMMET (XLIM Limoges) Germany: USA: Mohamad ABO RAS (BERLINER NANOTEST) Thomas HARDER (ECPE) Dave SAUMS (DS&A LLC) Thermal management remains a crucial constraint in electronics packaging and is a mandatory aspect in every industry aerospace, automotive, consumer, industrial, military - technology roadmap worldwide. The upcoming workshop will present some latest improvements in thermal management solutions at system level, in power electronics, in materials, in modelling and in techniques for characterizing and testing materials. It will also present some innovative cooling solutions. Early Registration ends on 12 December 2018 Final Registration ends on 30 January 2019 Organized by: International Microelectronics Assembly and Packaging Society France 17 rue de l Amiral Hamelin Paris, France Tel: + 33 (0) imaps.france@imapsfrance.org

2 CONFERENCE SCHEDULE 6 FEBRUARY 2019 (Wednesday) am Opening address & table tops presentation Jean-Yves Soulier, Conference chairman SESSION 1: THERMAL MANAGEMENT SOLUTIONS Chairs: Claude Sarno (Thales Avionics)/Jean-Yves Soulier (Zodiac Aerospace)/ am CRIOS, a PCM Based Thermal Retardant for Embedded Power Electronics A. Mutabazi, AREELIS Technologies (France) am Enhanced Two-Phase and Air-Side Thermal Management A. Glezer, Georgia Institute of Technology, Atlanta (United States) am Coffee Break / Table Top Exhibition am Pitot Probes Heating using Additive Layer Manufacturing and Loop Heat Pipes R. Hodot 1, N. Szulga, C. Sarno 1, S. Clément 1, C. Zilio 2, S. Mancin 2, THALES AVIONICS Valence (France), 2 University of Padova (Italy) pm What are the coming Challenges in Defence and Aerospace in regard to Performance/Reliability/robustness/ Lifetime on an electronic System and How Does Henkel Electronics Address those? H. Schuh, Henkel Electronics Düsseldorf (Germany) am Refresh your Ideas about Thermal Management JC Duisit, STAUBLI, Faverges (France) SESSION 2: POWER ELECTRONICS Chairs: Chairs: Jean-Yves Soulier (Zodiac Aerospace) am Thermal Analysis and Construction Optimization of Magnetic Components in High Frequency Power Converters B. Wiecek, R. Kasikowski, Technical University of Lodz (Poland), TT Electronics Norwich (United Kingdom) am Improving Coefficient of Thermal Expansion for Bottom Terminal Components (BTC) M. Walmsley, MICROSS Components (United Kingdom) am pm Lunch SESSION 3: CHARACTERIZATION & TESTS Chairs: Mohamad Abo Ras (Berliner Nanotest und Design GmbH) pm State-of-the-art and Novel Measurement Methods to Meet Current and Upcoming Challenges in Thermal Material Characterization T. Von Essen, C. Grosse, M. Abo Ras, Berliner Nanotest und Design GmbH, Berlin (Germany) am Isothermal Vending vs Thermal Cycling Tests: Accelerated Stress testing and Lifetime Modelling of Sintered Silver Die-Attach for Power Electronics Applications J. Heilmann, TU Chemnitz (Germany), pm Development of a Mechanical Cycling Reliability Test Program and Evaluation Results for Thermal Interface Materials for Semiconductor Test Requirements D. Saums, DS & A LLC (United States) M. Abo Ras, Berliner Nanotest (Germany) pm Quality Inspection of Large-area Silver-sinter Layers in Power Modules by Pulsed Infrared Thermography D. Wargulski, Berliner Nanotest (Germany) pm pm Coffee Break / Table Top Exhibition SESSION 4: MATERIALS (PART 1) Chairs: Jacques Favre (apsi 3D ) pm Fabrication of Silver/carbon composite Materials with Adaptive Thermal and Thermomechanical Properties B. Thomas 1,2, G. Lacombe 2, JF. Silvain 1, 1 ICMCB-CNRS, 2 Composite Innovation SAS Pessac (France)

3 04.30 pm Influence of Structural Design on Thermal Performance of Copper Diamond Sandwich Substrates D. Grech, E. Neubauer, M. Kitzmantel, RHP Technology (Austria) pm Investigation of Thermal Control Systems Operation: Thermohydraulic Characterization of Additive Manufactured Two-phase Heat Exchangers C. Septet 1,2, O. Le Metayer 2, Georges El Achkar 3, JM. Hugo 1, 1 TEMISTh SAS, 2 IUSTI Laboratory, Marseille (France), 3 Tianjin Key Laboratory of Refrigeration Technology, Tianjin (China) pm pm End of 1st day Sessions / Table top Exhibition pm Social Event Conference dinner

4 7 FEBRUARY 2019 (Thursday) SESSION 4: MATERIALS (PART2) Chairs: Jacques Favre (apsi 3D ) pm An Investigation into the Difference in Surface Finish between Conventional Manufacturing Methods and Additive Manufacturing Methods, and its Impact on the Pressure Drop and Heat Transfer Performance of Air-Cooled Heatsinks D. Olds, LYTRON (United States) pm Practical Evaluation of thermally-conductive Plastics for Thermal Component Design G. Wagner, Electronic Cooling Solutions Inc., D. Saums, DS&A LLC (United States) pm Innovative Liquid Metal Interface Technology for TIM2 Applications T. Jensen, Indium Corporation (United States) pm Thermal and Thermomechanical properties of graphite flakes and carbon fiber reinforced aluminum matrix composites N. Chamroune 1, Y. Lu 2, JF Silvain 1,2, 1 ICMCB-CNRS (Pessac), 2 Laser Assisted Nano- Engineering Lab Department of Electrical and Computer engineering University of Nebraska, Lincoln (United States) am am Coffee Break/ Table top Exhibition SESSION 5: INNOVATIVE COOLING SOLUTIONS Chairs: Jean-Yves Soulier (Zodiac Aerospace) am Performance Evaluation of Integrated Jet Impingement Heat Exchanger for PCB Embedded Power Modules Using Dielectric Coolant J. Schnur, A. Bhushan Sharma, N. Haag, T. Kuwan, T. Huesgen, Electronics Integration Laboratory of Applied Science, Kempten (Germany) pm The Dual Piezoelectric Jet Flow Characterization for Cooling Performance of Microelectronics Components in Confined Environment C. Cadile 1,2, R. Mathis 2, G. Debenest 2, JP Fradin 1, D. Lo Jacono 2, 1 ICAM, 2 IMFT, Toulouse (France) am pm Lunch 1.40pm Electrical Pumping of a Fluid in a Diphasic Loop Using ElectroHydroDynamic (EHD) Effects for Electronic Cooling L. Blanc, MBDA (France) 2.05 pm New Micro-Evaporator Design for Electronics Cooling A. Marie 1, L. Lachassagne 1, M. Miscevic 2, P. Lavieille 2, V. Dupont 1, 1 IRT Saint Exupéry, 2 LAPLACE, Toulouse (France). SESSION 6: MODELLING Chairs: Bruno Levrier (BL Expertises)/Jean-Pierre Fradin (ICAM) pm Model Order Reduction for Thermal FE Analysis and Global Electrothermal Approach R. Sommet, JC. Nallatamby, E. Ngoya, S. Mons, XLIM Limoges (France) pm Compact Thermal Modelling for Fast Simulating Consequences of Pump Defect: Application to Power Module with Double Efficient Cooling A. Cassou, P. Tounsi, CNRS LAAS Toulouse, JP Fradin, ICAM Toulouse (France) pm End of Conferences/Closing address: J-Y Soulier, Conference Chairman pm pm Final coffee break and farewell NEXT 2019 EVENT : MiNaPAD 2019, 22 & 23 May 2019, WTC Grenoble, FRANCE

5 REGISTRATION FORM ATW THERMAL MANAGEMENT Early Registration ends on 12 December 2018 Final Registration ends on 30 January 2019 RETURN REGISTRATION FORM ADDRESS: IMAPS France Florence Vireton 17 rue de l Amiral Hamelin Paris, France Tel: + 33 (0) imaps.france@imapsfrance.org Web site: WORKSHOP FEES INCLUDE: Hotel, lunches and dinners from 5 February 8 pm to 7 February 4 pm. SPEAKERS 520 VAT excluded (624 * VAT) CHAIRS/TECHNICAL COMMITTEE 520 VAT excluded (624 * VAT) Before 12 December, CONFERENCE ATTENDEES 2 DAYS IMAPS MEMBER (...) 590 VAT * excluded 708 *VAT included IMAPS NON MEMBER 680 VAT * excluded 816 *VAT included After 12 December, IMAPS MEMBER (...) 660 VAT* excluded 792 *VAT included IMAPS NON MEMBER 760 VAT* excluded 912 *VAT included Special Diet: Vegetarian Other CONFERENCE ATTENDEES 1 DAY 200 VAT * excluded 240 *VAT included (lunch is included, no hotel room) Please confirm your attendance to the first day dinner to be held on 5 February by ticking the box Note: not ticking the box implies that you will not attend the dinner. Reservations to the first day dinner must be submitted by 30 January 2019, latest TOTAL FEES VAT included : *No refund in case of cancellation. *For foreign companies, VAT will not be charged. VAT excluded PAYMENT: By bank transfer or by cheque to IMAPS or by credit card or even on line: IMAPS BANK REFERENCES BANK CODE AGENCY CODE ACCOUNT NUMBER RIB KEY BANK ADDRESS : G 25 IBAN FR G25 BIC CRLYFRPP LCL CREDIT LYONNAIS VERSAILLES ST LOUIS 16 RUE ROYALE VERSAILLES France ATTENDEE INFORMATION NAME FIRST NAME COMPANY/ORGANIZATION YOUR VAT NUMBER FUNCTION _ ADDRESS Zip City Country Phone INVOICE ADDRESS (if different of above)