Electric Energy Systems Education to Reform Power Semiconductor Manufacturing Industry

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1 Electric Energy Systems Education to Reform Power Semiconductor Manufacturing Industry Krishna Shenai Principal Electrical Engineer, Energy Systems Division Argonne National Laboratory Presented at the UMN PE Workshop, Napa, CA February 9, 2013 Acknowledgments: Campbell, Mohan, Robbins (UMN); Christou and McCluskey (UMD); Ang, Mantooth, Balda and McCann (UARK); Krein (UIUC); Motaleb and Zinger (NIU); and, WEMPEC Faculty (UW-Madison)

2 Power Electronics Applications Need WBG power devices HVDC and FACTS 200 Electric utility & strategic applications Silicon Power Converters are: 10 6k Bulky Inefficient Costly

3 Why Wide Bandgap (WBG) Semiconductors? 50,000 cm 3 18 kg Silicon Power Switch Shenai s Figure of Merit - Q F2 = λσ A E M 2400x improvement SiC or GaN Power Switch 4,500 cm kg 10 kw Power Supply 50 khz to 75 khz = 50% reduction in size Shenai et al, IEEE TED, pp , 1989 The result is more efficient, reliable and compact power converters

4 Workshop Objectives Argonne hosted two workshops (one at Argonne, one co-hosted with the University of Maryland) to address WBG issues and develop a path forward The Workshop objectives were: Establish a framework and perspective on the stateof-the-art for WBG semiconductors Identify the technical issues and challenges that are limiting the market opportunities and realization of the potential for WBG semiconductors Initiate a dialog on a path forward (including development of an R&D agenda) to address these issues and challenges Elicit the need for a collaborative research consortium to execute an R&D agenda Identify organizational issues/constraints relative to the formation of a research consortium Workshop at Argonne Sep. 11,2012 Workshop at Univ. of Maryland Oct. 23,

5 Workshop Attendees included Industry, Academia, National Labs and Government ABB, Inc. Agilent Technologies, Inc. Analytic Services, Inc. APEI, Inc. BCT Power Boeing Chrysler Group, LLC CREE, Inc. Delta Products Corp. Delphi Automotive Systems, LLC Emerson Network Power ESI North America, Inc. Fairchild Semiconductor GE Global Research General Motors Honeywell ACS Labs HRL Laboratories, LLC Infineon Technologies North America Intel International Rectifier II-VI, Inc. Johnson Controls, Inc. Kyma Technologies, Inc.. Magna E-Car Systems MEMC Electronic Materials, Inc. NextEnergy Northrop Grumman Electronic Systems Powerex, Inc. RF Micro Devices RCT Systems, Inc. RF Micro Devices SAIC SEMIKRON, Inc. Semisouth Labs. Sensor Electronic Technology, Inc. SiC Power Electronics Starline DC Solutions Division Sundstrand Corporation (UTAS) Teledyne Scientific & Imaging United Technologies Research Center (UTRC) UNIVERSAL Electric Corp. Veeco Instruments Auburn University Clemson University Cornell University Northern Illinois University Purdue University Rensselaer Polytechnic Institute Stony Brook University U of I at Urbana-Champagne U of Maryland University of Minnesota University of South Carolina University of Wisconsin-Madison Argonne National Laboratory Army Research Laboratory Los Alamos National Laboratory National Inst. Of Standard & Technology National Renewable Energy Lab. Naval Research Laboratory Oak Ridge National Laboratory Sandia National Laboratory NASA Glenn Research Center Electric Power Research Inst. U.S. Air Force U.S. DoD U.S. DOE National Science Foundation 5

6 End-User Needs Demonstrate Field-Reliability Reduce Cost (< 2x silicon) Improve Performance Widely Available Improved Application Knowledge 6

7 Today s Power Converter Design Approach AMBIENT OEM Power Converter Power Module Chip T jmax Miniaturization requires high-frequency power electronics switching.

8 Power Semiconductor Supply Chain Power Converters and Amplifiers, Sensors, LED, Lasers, and Solar Cells Raw Semiconductor Wafer Communications / Data Processing Electronic Equipment and Systems Semiconductor Chip Process Equipment Industrial and Medical Transportation Utility and Aerospace Processed Semiconductor Wafer Semiconductor Power Chips Power Semiconductors 8

9 WBG Power Technology Roadmap REPETITIVE SWITCHING CURRENT (AMPS) Current commercial applications Lateral GaN Switch GaN/Si & GaN/SiC POL Converters Power Management Automotive Lighting Computing Communication Vertical devices Vertical SiC Switch Automotive Lighting Computing Motor Control Power Grid Integration ,200 1,700 BLOCKING VOLTAGE (VOLTS) SiC and GaN power devices will make converters more compact and energy efficient, and will enable new applications SiC Emerging highvoltage and High-power applications 9

10 Bridge Digital Divide in Energy Systems Education Suggested Curriculum CUSP Curriculum Materials & Fabrication Technology (3 cr + 1 cr) Power Semiconductor Devices (3 cr + 1 cr) Power Electronics (3 cr + 1 cr) UG Power Electronics (3 cr + 1 cr) Power Systems (3 cr + 1 cr) Electric Machines and Drives (3 cr + 1 cr) Advanced Materials & Fabrication Technology Advanced Power Semiconductor Devices Advanced Power Electronics Device Modeling and Application Engineering Advanced Power Magnetics and Passives Thermal Management, Power Packaging, and Cooling Reliability Engineering Renewable Energy Generation & Utilization Electric Machines and Drives: Modeling and Control Power Systems GRADUATE Advanced Power Electronics Advanced Power Systems HVDC Transmission Systems Electric Machines and Drives: Modeling & Control Power Generation, Operation and Control Designing Electric Machines Power System Protection Wind Energy Essentials Power/Energy Trading Energy Markets

11 Discussion 11

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